JPS5837986B2 - Iso Souchi - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component transfer device, and particularly to a device for transferring pellets during semiconductor pellet bonding.

Manufacturing the semiconductor integrated circuit device 1C (in this case, a pellet bonding process is required to connect IC pellets with metal tabs, etc.).

This pellet bonding is performed by picking up individual pieces of pellets separated from a wafer using a vacuum suction tool, transferring them onto a metal tab, and directly connecting them to the metal tab. Alignment for feeding pellets is done manually or automatically.

In this case, it is difficult to align the pellets with high precision, and any deviation in the alignment directly leads to deviation in the pellet attachment position.

In addition, even when performing automatic alignment, heat is generated during pellet bonding, so the vacuum suction tool is heated, and when the pellets are adsorbed with the vacuum suction tool, the pellets are placed at regular intervals. There was a problem in that the tape was heated and thermally expanded, resulting in the pellets being misaligned.

As a method to solve this problem, we filed our own patent application, Patent Application No. 12158, filed on December 6, 1972.
1, and in this company's earlier application, as shown in Figure 3, the pellet is placed in a different position, and after being aligned with the alignment device, the pellet is placed in another vacuum suction tool. This is a method of adsorbing the metal tabs and connecting them with six metal tabs.

According to this, even if there is some error in manual alignment, the pellet can be properly aligned by the alignment device and then fed to the vacuum suction tool for pellet connection, so the pellet connection position can be accurately determined. You can decide.

However, according to this method, the vacuum suction tool is moved along a single circular arc, so when adjusting the position of the vacuum suction tool and the head of the alignment device, it is necessary to adjust the angle of the pellet between the initial and after connection. Therefore, it has become clear that it is difficult to visually grasp the rotation angle to be adjusted, and as a result, the position cannot always be easily and accurately adjusted.

The above-mentioned alignment device is as described in Japanese Patent Application No. 121-58-1 1982,
A pair of positioning members having rVJ-type claws that directly contact the side edges of the semiconductor pellet are provided.

The positioning member is extended in six directions of linear force, and the rVl type pawls are opposed to each other.

The positioning members are biased toward each other by a tension spring.

Furthermore, the ends of these positioning members that do not have the "■"-shaped pawls are slidably supported by the support members.

Furthermore, an engaging piece is provided near the rVl-shaped pawl of the positioning member, and is protruded in the force direction perpendicular to the extension force direction of the member. It is possible to engage with a stopper previously provided on one side of the positioning member near the position where they are to be combined.

Next, to explain the method of positioning a semiconductor pellet in such an apparatus, first, a movable device (not shown) is activated to move the vacuum chuck to a predetermined location, and a predetermined semiconductor pellet placed there is sucked. In this case, Since the end face of the vacuum chuck is flat, the semiconductor pellet is tightly attracted to the vacuum chuck.

Therefore, in this state, the vacuum chuck is again moved to a predetermined position on the lead frame by the movable device 6.

At this time, the positioning member is pulled in the opposite force direction by the movable device against the tension of the tension spring.

Therefore, at this time, the interval between the rVJ type claws of the positioning member is determined to include a space that can sufficiently accommodate the semiconductor pellet.

Next, the semiconductor pellet is held by the rVJ type claw of the positioning member while being attracted to the vacuum chuck.

In this case, the force exerted by the predetermined movable device is released, and the positioning members move in the direction of sandwiching the semiconductor pellet by the tension of the tension spring.

Therefore, the semiconductor pellet is the "■" of each positioning member.
When the mold jaws are attracted to the vacuum chuck in a shape different from the shape formed when they come into contact with each other, the pellet slides on the tapered surface of the qrVJ type jaws as the positioning member mentioned above comes into contact with the pellet. As soon as it moves in the XY force direction, G is corrected to a predetermined arrangement state.

After correction, it is returned by a movable device.

The semiconductor pellet whose position has been corrected in this manner is moved downward (towards the lead frame) by operating the movable device while being attracted to the vacuum chuck.

When the semiconductor pellet reaches the lead frame, the vacuum chuck stops attracting it and is lifted upward by the movable device.

In the above method, the semiconductor pellet is positioned after being adsorbed to the vacuum chuck and adapted to the upper force of the lead frame, but this positioning of the semiconductor pellet may be performed before being adsorbed to the vacuum chuck. It goes without saying that this may be performed while the vacuum chuck is positioned above the lead frame after suction.

Therefore, an object of the present invention is to provide a device that can easily detect the deviation of a component in the rotational direction when transferring the component, and another object of the present invention is to provide a device that can easily detect the adjustment of the transfer device. It is in.

According to one embodiment of the present invention for achieving the above object, in the transfer device, means for transferring the transferred component to the position adjustment section, means for adjusting the position of the transferred component to the position adjustment section, and means for transporting the part from the adjustment section to another position, and the part transporting means is configured to transport the part in a straight line.

The present invention will be explained below using actual cases.

1 and 2 show an embodiment of the present invention.

Two vacuum suction tools 1 and 2 are arranged in parallel on a straight line X.

Then, the vacuum suction tool 1 suctions one of the pellets 4 arranged on the tape 3, and at the same time, the vacuum suction tool 2 suctions the belen 4a positioned by the position adjustment section 5.

(See FIG. 1) Next, the pellets 4 and 4a are transferred by the vacuum suction tools 1 and 2, and the pellet 4 is placed on the position adjustment section 5 and the pellet 4a is placed on the metal tab 6.

Then, at the same time as the pellet 4 is aligned by the positioning device 7, the belen 4a is connected onto the metal tab 6 by the vacuum suction tool 2.

(See Figure 2) As can be easily understood from the drawing, the positioning device 7 is equipped with a pair of positioning members having "■-shaped claws that directly contact the side edges of the pellet 4. The rVl-shaped claws are opposite to each other.

The positioning members can be brought close to each other, and the spacing between the rVJ-type pawls of the positioning members is determined to include a space that can sufficiently accommodate the pellets.

When the pellet is placed in this space, the positioning member moves in a direction to sandwich the pellet, and the pellet is placed in a shape different from the shape formed when the rVJ type claws of the positioning member come into opposing contact. In this case, as the positioning member mentioned above comes into contact with the pellet, the "V" shaped claws will slide, and the pellet will be moved in the X and Y directions by the "■" shaped claws, gradually correcting it to the predetermined arrangement state. As a result, even if there is a slight deviation in the position of the pellet, the position can be adjusted by the positioning device 7 in the position adjustment section 5.

This series of operations is then repeated.

According to the present invention, the transport of pellets takes place directly.

Therefore, the displacement of the pellet in the direction of rotational force can be easily confirmed, and the mutual positional adjustment of the vacuum suction tools 1 and 2 positioning device 7 can be easily performed.

Of course, when feeding the arranged pellets 4 to the vacuum suction tool 1, even if there is a slight deviation in the position of the pellets 4, the position can be adjusted accurately by using the positioning unit 5G and the positioning device 7. This allows the positioned pellets 4a to be bonded.

Therefore, it is possible to reliably avoid a decrease in yield due to positional deviation.

The present invention is extremely effective not only for bonding IC pellets, LED pellets, and other semiconductor pellets, but also for transporting small parts without shifting their positions.

[Brief explanation of drawings]

1A and 2B and FIGS. 2A and 2B show an example of the present invention in the order of operation of the device, where a is a plan view and b is a sectional view, respectively. FIGS. 3a and 3b are plan views showing a conventional example. 1, 2...Vacuum suction tool, 3...Tape, 4...Pellet, 4a...Aligned pellet, 4b...・Connected pellet, 5...Position adjustment section, 6...Tab, 7
・・・・・・Positioning device.

Claims (1)

[Claims] 1 The pellets divided from the semiconductor wafer are individually sucked and transferred by a vacuum suction tool, and the pellets are placed on the pellet position adjustment section, and the pellets are moved up and down and reciprocated in a straight line. a vacuum suction tool; a positioning device that positions the pellet at a predetermined position by moving the pellet in the XY force direction of the pellet position adjustment section;
The pellet positioned at a predetermined position is sucked and transferred by a second vacuum suction tool, and the pellet is made to correspond to a predetermined pellet attachment portion of a substrate, and the pellet is connected to the substrate, and the pellet is connected to the substrate by vertical movement and linear movement. and a second vacuum suction tool that reciprocates the pellets and connects the pellets to the substrate.