JPS5841167B2 - Manufacturing method of inorganic board with embossed pattern - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing an inorganic plate with an embossed pattern, and particularly to a method for producing an embossed pattern on the surface of the inorganic plate by a roll embossing press molding method.

In general, inorganic boards are well known as noncombustible materials.
In particular, embossed patterned inorganic boards with embossed patterns formed on their surfaces are widely used as nonflammable interior and exterior materials.

Conventionally, such inorganic boards with embossed patterns are produced by forming a green board by forming and dewatering a suspension containing an inorganic material as a main ingredient and a reinforcing fiber material and other additives, and then embossing the surface of the green board. It is manufactured by embossing press molding using a roll or flat embossing plate, followed by curing and drying.

However, especially when using a roll embossing press forming method in which the surface of the raw board is embossed and press-formed with an embossing roll, variations in the thickness of the raw board, especially in the width direction, are dispersed throughout the board. Although there is not much of a problem, if there is a deviation from side to side, there is a tendency for the green board after embossing press molding to be taken out with a shift in the left and right direction.

In addition, since the surface of the under roll, which is installed opposite to the lower part of the embossing roll, is smooth, there is no friction during embossing press forming, so slipping is likely to occur, and as a result, the transfer speed of the upper and lower surfaces of the raw board is reduced. There is a problem in that this difference causes the layers of the raw board formed into layers to become separated, resulting in delamination and deterioration in strength.

Furthermore, since only the surface of the raw board is embossed and press-formed, there is a difference in density between the front and back sides of the raw board, which causes warping and cracks during drying. .

Moreover, when the surface of the raw board is embossed and press-molded, if the moisture content of the raw board is low, the bonding reaction between the laminated layers, which tends to separate, will not take place sufficiently, and the product will likely peel off. If it is too high, there is a problem that the green plate adheres to the embossing roll during press molding and is not easily released from the mold.

In particular, when an embossing roll is used, the pressurizing force of the embossing roll on the raw board moves in the direction opposite to the conveying direction with linear pressure, so if the water content of the raw board is too high, most of the excess water will be absorbed. is discharged to the outside of the system through the gap between the raw board stacks, which is an easy route with relatively low flow resistance, and as a result, there is a problem that delamination of the product is likely to occur.

Furthermore, when the surface of the green board is emboss press-molded with an embossing roll, the pressure applied to the green board via the embossing roll by the pressure cylinder of the roll press machine is not uniform depending on the inside of the green board and the diameter of the embossing roll.

Particularly when the diameter of the embossing roll is small, the pressure locally applied to the green plate tends to be excessive.

As a result, cracks may occur on the embossed surface of the raw board,
Alternatively, delamination may occur, causing a decrease in strength.

On the other hand, if the diameter of the embossing roll is large, the pressure applied to the green plate will be dispersed and the desired embossing depth will not be obtained.
There is a tendency that good emboss patterning cannot be achieved.

The present invention has been made in view of these points, and in the case of using the roll embossing press molding method as described above,
An anti-slip uneven part was formed on the surface of an under roll which was installed opposite to the embossing roll which had an uneven part for a desired embossed pattern on the surface, and the uneven part of the under roll prevented the back surface of the raw board from slipping. By appropriately setting the moisture content of the raw board and the pressing force of the embossing roll against the raw board, and performing embossing rollless forming,
The above-mentioned conventional drawbacks are eliminated at once, and a good embossed pattern can be obtained on the surface.

That is, the present invention involves forming a green board with a moisture content of 40 to 45% by weight by papermaking and dehydration of a suspension containing an inorganic material as a main ingredient and a reinforcing fiber material and other additives. is fed between an embossing roll and an under roll which is placed opposite to the embossing roll and has an uneven surface to prevent slipping, and the uneven part of the under roll prevents the back surface of the raw board from slipping. The surface of the raw board is emboss press-molded with an embossing roll at a linear pressure of 0.30 to 0.50 kg/crrL'-crri per unit α of the circumference of the embossing roll, followed by curing and drying. It is.

Hereinafter, the present invention will be explained in detail with reference to the drawings.

The inorganic boards targeted by the present invention include calcium silicate boards,
Cement calcium silicate boards, cement boards, pulp cement boards, magnesium carbonate boards, gypsum boards, etc., which are mainly made of inorganic materials and are made of materials mixed with reinforcing fiber materials and other additives.

The inorganic substances include magnesium carbonate, calcium silicate, gypsum, etc., and the reinforcing fiber substances and other additives include inorganic fibers such as asbestos, rock wool, and glass fiber, pulp,
Examples include organic fibers such as cotton, nylon, polyethylene, and polypropylene, and water repellents such as paraffin.

First, 80 to 95 parts by weight of such an inorganic substance and 20 to 5 parts by weight of reinforcing fiber substances and other additives are mixed and dispersed in an appropriate amount of water to create a suspension. The material is formed into a paper using a paper-making machine in a conventional manner, and dehydrated using, for example, a vacuum dehydrator attached to the paper-making machine, to form a green board having a moisture content of, for example, 40 to 45% by weight.

Note that the solid content concentration of the suspension is about 10% by weight or less.

Here, if the moisture content of the green board before roll embossing press forming is less than 40% by weight, the amount of water required for the bonding reaction between the green board laminates, which tends to be particularly detached during press forming with an embossing roll. If the amount exceeds 45% by weight, the delamination of the product tends to occur, the strength decreases, and cracks occur on the embossed pattern surface of the product, making it difficult to obtain a good embossed pattern. The amount of water required for the bonding reaction becomes excessive, and during press forming, most of this excess water is discharged from the system through the gap between the laminated green boards, which is an easy route for discharge, resulting in delamination of the product's layers. It is preferable to set the amount in the range of 40 to 45% by weight because it is easy to cause oxidation and the strength decreases, and the green plate adheres to and wraps around the surface of the embossing roll during press molding, making it difficult to release from the mold.

Next, as shown in the drawing, the green board 1 which has been formed by papermaking and dewatering as described above is placed on a conveyor belt 2, and an embossing roll 3 having a desired embossed pattern unevenness 3a on its surface and the embossing roll are placed on the conveyor belt 2. 3 and an under roll 4 having anti-slip uneven parts 4a on the surface, and the surface of the raw board 1 is applied with the embossing roll 3, for example, at a linear pressure per embossing roll of 0. 30
Emboss press molding at ~0.50 to 9/CrrL-cm.

In addition, in the drawing, 5 is a conveyance receiving plate. At that time, the above raw board 1
As described above, the surface of the raw board 1 is formed into a bottom shape using a roll embossing press by the embossed pattern unevenness 3a of the embossing roll 3, while the back surface of the raw board 1 is embossed and press-formed while being prevented from slipping by the anti-slip unevenness 4a of the under roll 4. be done.

As a result, even if there is variation in thickness in the width direction of the green board 1, the non-slip effect of the uneven portions 4a of the under roll 4 prevents the green board 1 from slipping and being taken out after embossing press forming. It is possible to prevent plate displacement and deformation.

Moreover, due to the anti-slip effect of the under roll 4, the raw board 1
Since the transport speeds of the upper and lower surfaces of the board are equal and no speed difference occurs, the layers of the raw board formed in layers do not shift and delamination can be prevented, and the strength can be improved. I can do it.

Furthermore, since both the front and back surfaces of the raw board 1 are emboss-pressed, there is no difference in density between the front and back surfaces, and it is possible to prevent warping and burrs from occurring during drying, which will be described later.

Here, the anti-slip uneven portion 4a of the under roll 4 is
If the depth of the unevenness is less than 0.2 mm, there will be no anti-slip effect, whereas if it exceeds 0.5 mm, the anti-slip effect will be saturated and the strength of the product will be reduced.
Therefore, it is preferable to set it in the range of 0.2 to 0.5 mm.

In addition, the linear pressure per embossing roll circumferential length unit α during the roll embossing press molding is 0.30 kg/cm-c
If it is less than 0.5 kg/cI, the embossing depth will be shallow and the embossed pattern will not be formed uniformly.
If rL@cm is exceeded, cracks are likely to occur on the embossed surface and delamination is likely to occur, resulting in a decrease in strength, so it is preferably set in the range of 0.30 to 0.50 kg/CrIL-me.

Thereafter, the raw board formed by roll embossed fresing as described above is cured in an autoclave at a pressure of 8 kg/crA for 8 to 12 hours, and then dried at 100°C for 20 hours to obtain an inorganic board with an embossed pattern. is manufactured.

The embossed patterned inorganic plate obtained in this way is
There is no misalignment, warping, cracking, etc. as in the past, and there is no delamination (because a good embossed pattern with a desired depth and uniformity is formed on the surface, it has excellent decorative design properties and has high strength. It will be excellent.

In this case, an embossed uneven pattern is also formed on the back surface of the inorganic plate, but this does not impair the decorative design of the product and does not impede workability.

As described above, according to the method of manufacturing an inorganic board with an embossed pattern of the present invention, even if there is variation in thickness in the width direction of the green board, it is possible to prevent the green board from shifting and deforming, and also to prevent delamination, warping, burrs, etc. It is possible to prevent this from occurring and form a good embossed pattern on the surface, thereby providing noncombustible interior and exterior materials that are excellent in decorative design and strength and have high commercial value.

[Brief explanation of the drawing]

The drawings are schematic illustrations illustrating embodiments of the invention. 1... Raw board, 2... Conveyor belt,
3... Emboss roll, 3a... Embossed pattern uneven portion, 4... Under roll, 4
a... Concave and convex portion for anti-slip, 5... Conveyance receiving plate.

Claims (1)

[Scope of Claims] 1. A suspension mainly composed of inorganic substances and mixed with reinforcing fiber substances and other additives is made into paper and dehydrated to have a moisture content of 40 to 40%.
After forming a 45% by weight green board, the green board is fed between an embossing roll and an under roll which is disposed facing below the embossing roll and has anti-slip unevenness formed on its surface. With the back surface of the raw board prevented from slipping by the uneven part of the under roll, the surface of the raw board is applied with an embossing roll at a linear pressure of 0.30 to 0.5 per unit of embossing roll circumference.
A method for manufacturing an inorganic plate with an embossed pattern, which is characterized by emboss press molding with a weight of 0 kg/α, followed by curing and drying. 2 Set the depth of the unevenness of the anti-slip unevenness of the under roll to 0.
．． A method for manufacturing an inorganic plate with an embossed pattern according to claim 1, wherein the thickness is set to 2 to 0.5 mm.