JPS5841288B2 - Photoinsolubilizable resin composition - Google Patents
Photoinsolubilizable resin compositionInfo
- Publication number
- JPS5841288B2 JPS5841288B2 JP12323181A JP12323181A JPS5841288B2 JP S5841288 B2 JPS5841288 B2 JP S5841288B2 JP 12323181 A JP12323181 A JP 12323181A JP 12323181 A JP12323181 A JP 12323181A JP S5841288 B2 JPS5841288 B2 JP S5841288B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- resin
- photocrosslinkable
- composition
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 title claims description 10
- 239000011347 resin Substances 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 51
- 239000002253 acid Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- 150000007522 mineralic acids Chemical class 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- 125000005504 styryl group Chemical group 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 claims description 2
- 229940106681 chloroacetic acid Drugs 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 2
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 description 26
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 12
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 9
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- -1 cinnamoyl groups Chemical group 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 206010034972 Photosensitivity reaction Diseases 0.000 description 7
- 230000036211 photosensitivity Effects 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 6
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- 150000003248 quinolines Chemical class 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical group 0.000 description 3
- 235000012141 vanillin Nutrition 0.000 description 3
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 3
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- DXYYSGDWQCSKKO-UHFFFAOYSA-N 2-methylbenzothiazole Chemical compound C1=CC=C2SC(C)=NC2=C1 DXYYSGDWQCSKKO-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- MUDSDYNRBDKLGK-UHFFFAOYSA-N 4-methylquinoline Chemical compound C1=CC=C2C(C)=CC=NC2=C1 MUDSDYNRBDKLGK-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- SMUQFGGVLNAIOZ-UHFFFAOYSA-N quinaldine Chemical compound C1=CC=CC2=NC(C)=CC=C21 SMUQFGGVLNAIOZ-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHBKJSBTRATHKT-UHFFFAOYSA-N hexane;methyl acetate Chemical compound COC(C)=O.CCCCCC BHBKJSBTRATHKT-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010898 silica gel chromatography Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
Description
【発明の詳細な説明】
本発明は新規な光不溶化性樹脂組成物、特に光架橋性残
基としてスチI) )し系含窒素複素環残基を分子中に
有する感光性樹脂と酸とから成る光不溶化性樹脂組成物
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a novel photoinsolubilizable resin composition, particularly a photosensitive resin having a nitrogen-containing heterocyclic residue in its molecule as a photocrosslinkable residue, and an acid. The present invention relates to a photoinsolubilizable resin composition.
感光性樹脂は印刷版製造材料、フォトエツチング、フォ
トミリングなどのフオイレジストとして、また塗料や印
刷インキなどの感光性ビヒクルとして実用されている。Photosensitive resins are used as printing plate manufacturing materials, photoresists for photoetching, photomilling, and the like, and as photosensitive vehicles for paints, printing inks, and the like.
それらの実用化されている感光性樹脂としては、アジド
基、シンナモイル基、アクリロイル基などを光架橋性残
基とするものが代表的なものとして知られている。Typical photosensitive resins that have been put into practical use include those having photocrosslinkable residues such as azide groups, cinnamoyl groups, and acryloyl groups.
しかし、これらの光架橋性残基は、基幹ポリマーにかな
り多量に導入することが実用上必要であり、なおかつこ
れらの感光性樹脂に増感剤が混合併用されているのが実
情である。However, it is practically necessary to introduce these photocrosslinkable residues into the base polymer in a fairly large amount, and the reality is that these photosensitive resins are mixed with a sensitizer.
例えば、もつとも代表的な感光性樹脂であるシンナモイ
ル基が導入されたポリ桂皮酸ビニルは、感光性樹脂とし
て実用に供されるには、光架橋性残基であるシンナモイ
ル基が基幹ポリマー中に多量に導入されていなげればな
らない(M、 Tsuda : J、 Po1y、 S
ci 、 A、 、 2.290464参照)。For example, polyvinyl cinnamate into which cinnamoyl groups have been introduced, which is a typical photosensitive resin, must have a large amount of cinnamoyl groups, which are photocrosslinkable residues, in the base polymer in order to be put to practical use as a photosensitive resin. (M, Tsuda: J, Poly, S
ci, A, 2.290464).
しかも実用に際しては、増感剤を約lO重量%程度併用
しなげればならない。Moreover, in practical use, it is necessary to use a sensitizer in an amount of about 10% by weight.
このことは、従来使用されているこれらの感光性樹脂が
、その樹脂成分原料に比べてはるかに高価な光架橋性残
基を導入するための原料を大量に必要とすること及びこ
のように大量の光架橋性残基が導入されることにより基
幹ポリマーがもつ本来の諸性質、例えば基板への密着性
、現像性、耐薬品性や印刷適性などが変わり、通常それ
らの性質は低下ないし悪化するので、使用目的に応じて
選択されねばならず、著しく用途制限を受ける不利があ
った。This means that these conventionally used photosensitive resins require a large amount of raw material for introducing photocrosslinkable residues, which is much more expensive than the resin component raw material, and that The introduction of photocrosslinkable residues changes the original properties of the base polymer, such as adhesion to substrates, developability, chemical resistance, and printability, and these properties usually decrease or worsen. Therefore, it has to be selected depending on the purpose of use, which has the disadvantage of severely limiting its use.
このような実用上の不都合を改善するために、これまで
、特殊の光架橋性残基を導入した感光性樹脂、例えばス
チリル系四級塩型残基を導入したポリビニルアルコール
が提案されている(特公昭56−5761号公報、特開
昭56−11906号公報)。In order to improve these practical disadvantages, photosensitive resins with special photocrosslinkable residues have been proposed, such as polyvinyl alcohol with styryl quaternary salt residues ( (Japanese Patent Publication No. 56-5761, Japanese Unexamined Patent Publication No. 11906/1982).
しかしながら、このようなポリビニルアルコールを基幹
ポリマーとした感光性樹脂は、親水性が犬であり、現像
液として水もしくは水を含有する水性有機溶剤しか用い
ることができないという欠点がある。However, such photosensitive resins using polyvinyl alcohol as a backbone polymer have a disadvantage in that they are extremely hydrophilic and can only use water or an aqueous organic solvent containing water as a developer.
本発明者は、スチリル系四級塩の優れた光架橋性を利用
し、感光速度は低下するが四級化されていないスチリル
系含窒素複素環を側鎖に有するものの優れた溶解性と四
級化することによって得られるより高い感度特性とを兼
ね備えた感光性樹脂を開発すべく鋭意研究を重ねた結果
、四級化されていないスチリル系含窒素複素環を側鎖に
有する高分子化合物に酸を添加した組成物が優れた感光
性樹脂材料となることを見出した。The present inventor took advantage of the excellent photo-crosslinking properties of styryl quaternary salts, and discovered that although the photosensitivity is lowered, the non-quaternized styryl nitrogen-containing heterocycles have excellent solubility and quaternary salts in their side chains. As a result of extensive research to develop a photosensitive resin that combines the higher sensitivity characteristics that can be obtained by grading, we have developed a polymer compound with a non-quaternized styryl nitrogen-containing heterocycle in its side chain. It has been found that a composition to which an acid is added can be an excellent photosensitive resin material.
すなわち、本発明は、光架橋性残基として、−※般式
(式中、R1は水素原子又はアルコキシ基を示し、Zは
芳香族性複素環を形成する原子団を示す)で表わされる
スチリル系含窒素複素環残基を少なくとも0,2モル%
の量で含有する光不溶化性樹脂と、該樹脂の含有する上
記含窒素複素環残基に基づき0.5〜10倍モルの有機
酸又は無機酸とから戒る光不溶化性樹脂組成物を提供す
るものである。That is, the present invention uses styryl represented by the general formula -* (wherein R1 represents a hydrogen atom or an alkoxy group, and Z represents an atomic group forming an aromatic heterocycle) as a photocrosslinkable residue. At least 0.2 mol% of nitrogen-containing heterocyclic residues
Provided is a photo-insolubilizable resin composition containing a photo-insolubilizable resin in an amount of 0.5 to 10 times the molar amount of an organic or inorganic acid based on the nitrogen-containing heterocyclic residue contained in the resin. It is something to do.
本発明で樹脂中に導入される二重結合と共役した芳香族
性の上記一般式(I)に含まれる複素環としては、次の
ような例を挙げることができる。Examples of the aromatic heterocycle contained in the above general formula (I) conjugated with a double bond introduced into the resin in the present invention include the following examples.
これらの環は、アルキル基、アルコキシ基又は水酸基に
よって核置換されていてもよい。These rings may be nuclearly substituted with an alkyl group, an alkoxy group or a hydroxyl group.
スチリル系含窒素複素環が導入される基幹ポリマーとし
ては、特に制限はないが、酢酸ビニルの重合体又は共重
合体の加水分解物、オレフィンの重合体又は共重合体、
アクリル酸又はメタクリル酸の重合体又は共重合体など
が好適である。The base polymer into which the styryl nitrogen-containing heterocycle is introduced is not particularly limited, but includes hydrolyzates of vinyl acetate polymers or copolymers, olefin polymers or copolymers,
Polymers or copolymers of acrylic acid or methacrylic acid are suitable.
本発明で用いる光不溶化性樹脂には、上記一般式(I)
で表わされる構造の光架橋性残基が少なくとも0.2モ
ル%導入されていることが必要である。The photoinsolubilizable resin used in the present invention has the above general formula (I).
It is necessary that at least 0.2 mol% of a photocrosslinkable residue having the structure represented by is introduced.
0.2モル%未満では、実用に供しうる光不溶化性樹脂
組成物が得られないし、また光架橋性残基の導入率があ
まり太きすぎても樹脂の望ましい諸性質に悪影響を与え
、かつ材料コストが著しく増大するので好ましくない。If it is less than 0.2 mol%, a practically usable photoinsolubilizable resin composition cannot be obtained, and if the introduction rate of the photocrosslinkable residue is too high, it will adversely affect the desired properties of the resin, and This is not preferred because the material cost increases significantly.
この光不溶化性樹脂は、分子量2000〜1ooooo
o程度のものが実用的で、2000未満のものは不溶化
のために著しく長い照射時間を必要とするので好ましく
ない。This photo-insolubilizable resin has a molecular weight of 2000 to 1oooooo
A value of approximately 0 is practical, while a value of less than 2,000 is not preferred because it requires a significantly long irradiation time for insolubilization.
また、分子量1000000以上のものは粘度が著しく
増大するので、作業性又は適用性に難がある。Further, those having a molecular weight of 1,000,000 or more have a marked increase in viscosity, and therefore have difficulty in workability or applicability.
好ましい分子量範囲は10000〜300000程度で
ある。The preferred molecular weight range is about 10,000 to 300,000.
一般式(I)に含まれる含窒素複素環の塩基性は、その
種類により多少変動するが、通常pKaで0.6〜7程
度の範囲にある。The basicity of the nitrogen-containing heterocycle contained in general formula (I) varies somewhat depending on its type, but is usually in the range of about 0.6 to 7 in terms of pKa.
このような本発明の樹脂組成物は、通常その樹脂成分を
溶解する溶剤に溶かし、これに酸を添加することにより
製造されるが、樹脂中に導入される光架橋性残基の導入
率が、例えば1モル%以下の少ないものでも従来市販さ
れ実用されている感光性材料よりも遥かに優れた高感度
の光子溶性樹脂材料を提供することができる。Such a resin composition of the present invention is usually produced by dissolving the resin component in a solvent and adding an acid thereto, but the introduction rate of photocrosslinkable residues introduced into the resin is Even if the content is as small as, for example, 1 mol % or less, it is possible to provide a highly sensitive photon-soluble resin material that is far superior to conventionally commercially available and practically used photosensitive materials.
本発明組成物は、上記一般式で表わされるスチリル系含
窒素環残基を基幹ポリマーに少なくとも0.2モル%の
割合で含有させた樹脂に、該樹脂の含有する含窒素複素
環に対して0.5〜10倍モルの有機酸又は無機酸を添
加することによって調製される。The composition of the present invention includes a resin containing a styryl nitrogen-containing ring residue represented by the above general formula in a proportion of at least 0.2 mol% based on the nitrogen-containing heterocycle contained in the resin. It is prepared by adding 0.5 to 10 times the molar amount of organic or inorganic acid.
その添加量が0.5倍モル未満では感度改善効果が不十
分であるし、10倍モルを超えると感度の改善効果がむ
しろ低下する上に、樹脂の性質に悪影響を及ぼすので望
ましくない。If the amount added is less than 0.5 times the mole, the effect of improving sensitivity will be insufficient, and if the amount added exceeds 10 times the mole, the effect of improving the sensitivity will be rather reduced and will have an adverse effect on the properties of the resin, which is not desirable.
好ましい添加配合量は、1〜5倍モルである。The preferred addition amount is 1 to 5 times the mole.
このように酸の添加により、樹脂自体の有する感光感度
が、市販のものに比べて、かなり低い場合でも、市販の
ものの感度よりも高い感度が得られたことは全く予想外
のことであった。It was completely unexpected that by adding an acid, a sensitivity higher than that of the commercially available product was obtained, even though the resin itself had a considerably lower photosensitivity than the commercially available product. .
この酸添加による大巾な感度向上の理由は明確ではない
が、酸含有樹脂組成物が、例えば一般式
(式中、R1及びZは前記と同じ意味を有し、X は有
機酸又は無機酸残基を示す)
で表わされる四級化構造に変じ感光感度が増大するもの
と推定される。The reason for this drastic improvement in sensitivity due to the addition of acid is not clear, but it is clear that the acid-containing resin composition has a general formula (wherein R1 and Z have the same meanings as above, and It is presumed that the photosensitivity increases due to the change to the quaternized structure represented by (representing the residue).
本発明の組成物に用いられる酸としては、例えば塩酸、
過塩素酸、リン酸、硫酸、硝酸などの無機酸類や酢酸、
クロル酢酸、乳酸、酒石酸、安息香酸、ニトロ安息香酸
、ベンゼンスルホン酸、ナフタリンスルホン酸、p−1
−ルエンスルホン酸、メタンスルホン酸などの有機酸類
を代表的に挙げることができる。Examples of acids used in the composition of the present invention include hydrochloric acid,
Inorganic acids such as perchloric acid, phosphoric acid, sulfuric acid, nitric acid, acetic acid,
Chloroacetic acid, lactic acid, tartaric acid, benzoic acid, nitrobenzoic acid, benzenesulfonic acid, naphthalenesulfonic acid, p-1
- Organic acids such as luenesulfonic acid and methanesulfonic acid are representative examples.
これらの酸類は単独で用いてもよいし、また2種以上を
混合して用いることもできる。These acids may be used alone or in combination of two or more.
また、樹脂が水溶性で、水を溶剤として用いるときは、
無機酸でも有機酸でもよいが、有機溶剤を用いた場合は
有機酸を用いる方が有利である。In addition, when the resin is water-soluble and water is used as a solvent,
Although an inorganic acid or an organic acid may be used, it is more advantageous to use an organic acid when an organic solvent is used.
さらにまた、添加される酸の種類及び量は、前記したよ
うな光架橋性残基の複素環の塩基性に依存し、例えばピ
リジン環のような強塩基(pKa−5,23)の場合に
は、強酸が有利に使用でき、その使用量も等モル程度で
十分であるが、弱酸では2〜5倍モル程度が使用される
。Furthermore, the type and amount of the acid added depends on the basicity of the heterocycle of the photocrosslinkable residue as described above; for example, in the case of a strong base (pKa-5, 23) such as a pyridine ring, A strong acid can be advantageously used, and an equimolar amount is sufficient, whereas a weak acid is used in an amount of about 2 to 5 times the molar amount.
本発明の組成物において、感光性樹脂は、露光により2
個の光架橋性残基が三量化反応してシクロブタン環を形
成し、高分子の直鎖間に架橋を生じて溶剤に対し不溶化
する。In the composition of the present invention, the photosensitive resin has a
The photocrosslinkable residues undergo a trimerization reaction to form a cyclobutane ring, which creates crosslinks between linear chains of the polymer, making it insolubilized in solvents.
光を照射して架橋不溶化した樹脂を含むフィルムは、通
常感光性樹脂の溶剤で現像され、露光されなかった樹脂
は溶解して映像が残存形成される。A film containing a resin that has been crosslinked and insolubilized by irradiation with light is usually developed with a photosensitive resin solvent, and the resin that has not been exposed to light is dissolved to form a residual image.
この際、現像溶剤中に塩基性物質を添加しておけば一層
容易となる。At this time, it will be easier if a basic substance is added to the developing solvent.
あるいは樹脂を溶解しない溶剤に塩基性物質を添加し、
露光した感性塗膜を浸したのち、溶解性溶剤による現像
処理を行なってもよい。Alternatively, add a basic substance to a solvent that does not dissolve the resin,
After the exposed sensitive coating film is immersed, it may be developed using a soluble solvent.
このような現像処理において溶剤に添加使用される塩基
性物質としては、例えば、水酸化ナトリウム、水酸化カ
リウム、水酸化リチウム、重炭酸ナトリウム、炭酸ナト
リウム、アンモニアなどの無機物質類やピリジン、トリ
エチルアミン、ジメチルアミン、ジエチルアミンなどの
有機塩基物質類を挙げることができる。Examples of basic substances added to the solvent in such development processing include inorganic substances such as sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium bicarbonate, sodium carbonate, and ammonia, as well as pyridine, triethylamine, Organic basic substances such as dimethylamine and diethylamine can be mentioned.
さらに、弱い塩基性物質としては、ジメチルホルムアミ
ド、ホルムアミド、ジメチルアセトアミド、N−メチル
ピロリドン、テトラメチル尿素、ジメチルスルホキシド
が挙げられる。Furthermore, examples of weak basic substances include dimethylformamide, formamide, dimethylacetamide, N-methylpyrrolidone, tetramethylurea, and dimethylsulfoxide.
また、塩基性ではないが、メタノール、エタノール、メ
トキシエタノール、エトキシエタノール、アセトン、テ
トラヒドロフラン、ジオキサン、水なども有効な場合が
多く、塩基性物質の中に包含させてよいであろう。Although not basic, methanol, ethanol, methoxyethanol, ethoxyethanol, acetone, tetrahydrofuran, dioxane, water, etc. are often effective and may be included in the basic substances.
弱い塩基性物質や水などは感光基の複素環の塩基性が弱
い場合に好都合に使用される。Weak basic substances, water, etc. are conveniently used when the heterocycle of the photosensitive group has weak basicity.
本発明の光子溶性樹脂組成物は、印刷版用材料、レジス
ト用材料として使用できることはもちろん、印刷インキ
や塗料基剤としても用いることができる。The photon-soluble resin composition of the present invention can be used not only as a material for printing plates and a material for resists, but also as a base for printing inks and paints.
また本発明の組成物は長波長領域で優れた感度で光不溶
化するので、その特性を利用することにより、レーザー
用感光材料、拡大複写材料として極めて有用である。Furthermore, since the composition of the present invention is photoinsolubilized with excellent sensitivity in the long wavelength region, by utilizing this property, it is extremely useful as a photosensitive material for lasers and an enlarged copying material.
次に、本発明を実施例により、さらに詳細に説明する。Next, the present invention will be explained in more detail with reference to Examples.
実施例 1〜4
4−メチルキノリン26.73Pとバニリン31.25
fを無水酢酸62.91中で1夜還流し、反応混合物を
アルカリで処理したのち、得られた生成物をブチルセロ
ソルブから再結晶して、mp217〜219℃の4−(
2−(4−ヒドロキシ−3−メトキシフェニル)エチニ
ル〕キノリン29fを得た。Examples 1-4 4-methylquinoline 26.73P and vanillin 31.25
After refluxing f in 62.91 acetic anhydride overnight and treating the reaction mixture with alkali, the resulting product was recrystallized from butyl cellosolve to give 4-(
2-(4-hydroxy-3-methoxyphenyl)ethynyl]quinoline 29f was obtained.
この化合物0.55f、トリエチルアミンL75?、メ
タクリル酸クロリド1.66P及びジメチルアセトアミ
ド16cdからmp 134〜135℃の4−〔2−(
4−メタクロイルオキシ−3−メトキシフェニル)エチ
ニル〕キノリン4.70f(収率80.3%)を得た。This compound 0.55f, triethylamine L75? , 4-[2-(
4-Methacroyloxy-3-methoxyphenyl)ethynyl]quinoline 4.70f (yield: 80.3%) was obtained.
これを酢酸エチルより再結晶し、赤外線吸収スペクトル
及び元素分析によりその構造を確認した。This was recrystallized from ethyl acetate, and its structure was confirmed by infrared absorption spectrum and elemental analysis.
得られたキノリン誘導体をメタクリル酸メチル(MMA
)と第1表に示した条件で共重合させ、その共重合液を
メタノール中に加え樹脂を析出分離した。The obtained quinoline derivative was mixed with methyl methacrylate (MMA
) under the conditions shown in Table 1, and the copolymerization solution was added to methanol to precipitate and separate the resin.
これらの樹脂類はいずれも335 nmに吸収極大を示
した。All of these resins showed an absorption maximum at 335 nm.
このようにして得られた4−〔2−(4−メタクリロイ
ルオキシ−3−メトキシフェニル)エチニル〕キノリン
とMMAとの共重合体を、1・2ジクロルエタンに溶解
し、スピンナで7 /L/ミニウム板に塗布し、キセノ
ン灯を光源に用いてグレースケール法により感光度を測
定した。The copolymer of 4-[2-(4-methacryloyloxy-3-methoxyphenyl)ethynyl]quinoline and MMA thus obtained was dissolved in 1.2 dichloroethane, and the copolymer was dissolved in 1.2 dichloroethane at 7/L/min with a spinner. It was applied to a plate, and the photosensitivity was measured by the grayscale method using a xenon lamp as a light source.
現像液として1・2−ジクロルエタンを用いたときの感
度を、市販されているTPR(東京応化社製)の示す値
に対して求めた相対的結果を第2表に示す。Table 2 shows the relative results of the sensitivity when 1,2-dichloroethane was used as the developer with respect to the value shown by commercially available TPR (manufactured by Tokyo Ohka Co., Ltd.).
なお、実験においては、これらの樹脂を1・2ジクロル
エタンに溶解し、光架橋性残基1モルに対して1〜lO
モル当量のp−)ルエンスルホン酸をそれぞれ添加した
液を用いて、上記と同様にして感光度を測定し、それら
の結果をもまとめて第2表に示した。In addition, in the experiment, these resins were dissolved in 1.2 dichloroethane, and 1 to 1 O was added per mole of photocrosslinkable residue.
The photosensitivity was measured in the same manner as above using the liquids to which molar equivalents of p-)luenesulfonic acid were added, and the results are also summarized in Table 2.
コノ族から、p−)ルエンスルホン酸を添加スることに
より、樹脂自体の感光感度を大巾に向上させ得ることが
分る。It has been found that the photosensitivity of the resin itself can be greatly improved by adding p-)luenesulfonic acid from the Kono group.
また、光架橋性残基の導入率は低い方(2モル%)がむ
しろ優れた感度を示している。Furthermore, the lower the introduction rate of photocrosslinkable residues (2 mol %), the better the sensitivity.
実施例 5
γ−ピコリン20.C1とp−ヒドロキシベンズアルデ
ヒド26.2fとを無水酢酸65.8f中で反応させて
得られた4−1:2−(4−ヒドロキシフェニル)エチ
ニル〕ヒリシン21を10Cr/lのジメチルアセトア
ミドに溶解し、さらにトリエチルアミン1.23 Pを
添加してから、水冷しつつメタクリル酸クロリド1.3
4Pを滴下した。Example 5 γ-picoline 20. 4-1:2-(4-hydroxyphenyl)ethynyl]hyrisine 21 obtained by reacting C1 with 26.2f of p-hydroxybenzaldehyde in 65.8f of acetic anhydride was dissolved in 10Cr/l dimethylacetamide. , further added 1.23 P of triethylamine, and then added 1.3 P of methacrylic acid chloride while cooling with water.
4P was added dropwise.
反応終了後、水を加えて結晶を析出させて沢別した。After the reaction was completed, water was added to precipitate crystals and separated.
酢酸エチル−ヘキサンの混合溶媒を用いてこれを再結晶
し、4−〔2−(4−メタクリロイルオキシフェニル)
エチニル〕ヒリシン2.16f(収率80%)を得た。This was recrystallized using a mixed solvent of ethyl acetate and hexane to give 4-[2-(4-methacryloyloxyphenyl)
Ethynyl]hyricin 2.16f (yield 80%) was obtained.
結晶のmpは156〜158℃であった。The crystal mp was 156-158°C.
得られたピリジン誘導体398rn9とMMA2.85
′?とをベンゼン3洲に加え、AIBN15■を加えて
、脱気封管中で60℃に加温重合させた。The obtained pyridine derivative 398rn9 and MMA2.85
′? were added to 3 ml of benzene, 15 ml of AIBN was added, and the mixture was polymerized by heating at 60° C. in a degassed sealed tube.
反応終了後、生成物をメタノール中に注ぎ樹脂を沈殿析
出させた。After the reaction was completed, the product was poured into methanol to precipitate the resin.
この樹脂は前記市販のTPRの約1/20の感光度しか
示さないが、塩化水素ガスの雰囲気中にその薄膜を置く
ことにより、TPRの0.8倍まで感度が向上した。Although this resin exhibits only about 1/20 the photosensitivity of the commercially available TPR, by placing the thin film in an atmosphere of hydrogen chloride gas, the sensitivity was improved to 0.8 times that of TPR.
さらにこの樹脂の1・2−ジクロルエタン溶液に、光架
橋性残基に対して等モルのp−トルエンスルホン酸を添
加した樹脂組成物の感度はTPRとほぼ同程度であった
。Furthermore, the sensitivity of a resin composition prepared by adding p-toluenesulfonic acid in an equimolar amount to the photocrosslinkable residue to a 1,2-dichloroethane solution of this resin was almost the same as that of TPR.
実施例 6
実施例1と同様にして、2−メチルベンゾチアゾール9
.77’if、バニリン9.97P及び無水酢酸16.
72fとから、2−〔2−(3−メトキシ4−ヒドロキ
シ)エチニル〕ベンゾチアゾールを得た。Example 6 In the same manner as in Example 1, 2-methylbenzothiazole 9
.. 77'if, vanillin 9.97P and acetic anhydride 16.
72f, 2-[2-(3-methoxy4-hydroxy)ethynyl]benzothiazole was obtained.
これを実施例1と同様な方法でメタクリロイル化し、収
率80%で2−(2−(3−メトキシ−4−メタクリロ
イルオキシ)エチニル〕ベンゾチアゾールを得た。This was methacryloylated in the same manner as in Example 1 to obtain 2-(2-(3-methoxy-4-methacryloyloxy)ethynyl)benzothiazole in a yield of 80%.
この化学構造は赤外線吸収スペクトル及び元素分析によ
り確認同定された。This chemical structure was confirmed and identified by infrared absorption spectroscopy and elemental analysis.
得られた重合能を有するベンゾチアゾール誘導体125
.51ngをMMAl、01’とともに、1.51のベ
ンゼンに加え、51n9のAIBN触媒により脱気封管
中で60℃の温度条件下に重合させた。Obtained benzothiazole derivative 125 having polymerization ability
.. 51 ng was added to 1.5 l of benzene together with MMAl, 01', and polymerized using a 51n9 AIBN catalyst in a degassed sealed tube at a temperature of 60°C.
重合後内容物をメタノール中に注ぎ、析出沈でんさせ、
分離乾燥した。After polymerization, the contents were poured into methanol to precipitate and settle,
Separated and dried.
この樹脂はクロロホルム中で3481mに吸収極大値を
示した。This resin showed an absorption maximum value at 3481 m in chloroform.
得られた樹脂を実施例1〜4と同様にして感度を測定し
たところ、TPRの2倍の感度を示した。When the sensitivity of the obtained resin was measured in the same manner as in Examples 1 to 4, it showed twice the sensitivity of TPR.
この樹脂のクロロホルム溶液に光架橋性残基に対して2
倍モルのp−トルエンスルホン酸を添加した組成物の感
度はTPRの約10倍に向上した。In a chloroform solution of this resin, 2
The sensitivity of the composition to which twice the molar amount of p-toluenesulfonic acid was added was improved to about 10 times that of TPR.
実施例 7及び8
2−メチルキノリン34.41’とバニリン36.51
を無水酢酸61.341中で16時間還流下に反応させ
たのち、酢酸50cr/1を留去した。Examples 7 and 8 2-methylquinoline 34.41' and vanillin 36.51
was reacted in 61.341 ml of acetic anhydride under reflux for 16 hours, and then 50 cr/1 of acetic acid was distilled off.
残留物に3N塩酸250c!を加えて1時間加熱し、冷
却して析出結晶を沢別した。Add 250c of 3N hydrochloric acid to the residue! was added, heated for 1 hour, cooled, and the precipitated crystals were separated.
この結晶をアンモニア水に懸濁させ、1時間攪拌して結
晶から塩化水素を除き、脱塩化水素結晶を再度沢過して
集めた。The crystals were suspended in aqueous ammonia and stirred for 1 hour to remove hydrogen chloride from the crystals, and the dehydrochlorinated crystals were filtered again and collected.
これを2−エトキシエタノールから再結晶して、2−(
2−(4−ヒドロキシ−3−メトキシフェニル)エチニ
ル〕キノリンを収率63%で得た。This was recrystallized from 2-ethoxyethanol and 2-(
2-(4-hydroxy-3-methoxyphenyl)ethynyl]quinoline was obtained in a yield of 63%.
得られたキノリン誘導体2.771をジメチルアセトア
ミド5cr!、に溶解してからメタクリル酸グリシジル
1.42Pとテトラブチルアンモニウムクロリドo、i
oyを加え、90〜100℃で5時間加熱反応させた。2.771 of the obtained quinoline derivative was mixed with 5 cr of dimethylacetamide! , and then dissolve glycidyl methacrylate 1.42P and tetrabutylammonium chloride o, i
oy was added, and the mixture was heated and reacted at 90 to 100°C for 5 hours.
反応物に水を加え、分離した油状物を酢酸エチルで抽出
したのち、十分に水洗して乾燥した。Water was added to the reaction mixture, and the separated oil was extracted with ethyl acetate, thoroughly washed with water, and dried.
溶剤を留去後シリカゲルクロマトグラフィーで分離精製
することにより50%の収率で2−(2−C3−メトキ
シ−4−(2−ヒドロキシ−3−メタクリロイルオキシ
プロピルオキシ)フェニル〕エチニル)キノリンを得た
。After distilling off the solvent, 2-(2-C3-methoxy-4-(2-hydroxy-3-methacryloyloxypropyloxy)phenyl]ethynyl)quinoline was obtained by separating and purifying with silica gel chromatography in a yield of 50%. Ta.
これを酢酸メチル−ヘキサンを用いて再結晶することに
より、mpH9℃の純品が得られた。By recrystallizing this using methyl acetate-hexane, a pure product with mpH of 9°C was obtained.
これを元素分析及び赤外線吸収スペクトルにより上記化
学物質であることが確認された。This was confirmed to be the above chemical substance by elemental analysis and infrared absorption spectrum.
得られた高純度キノリン誘導体をMMAと共重合させて
、359Hmに吸収極太を有する感光性樹脂を製造した
。The obtained high-purity quinoline derivative was copolymerized with MMA to produce a photosensitive resin having an extremely thick absorption at 359 Hm.
キノリン誘導体とMMAの量を変えた2種の樹脂の製造
条件を下掲第3表に、またそれぞれの樹脂及びそれぞれ
の樹脂に、その樹脂中の光架橋性残基に対して2倍モル
のp−)ルエンスルホン酸を添加した組成物のTPRの
感度に対する相対感度を第4表にまとめて示した。The production conditions for two types of resins with different amounts of quinoline derivative and MMA are shown in Table 3 below. Table 4 summarizes the relative sensitivities to the TPR sensitivities of the compositions to which p-)luenesulfonic acid was added.
なお、該酸を添加した組成物の場合には少量のジメチル
ホルムアミドを含有する1・2−ジクロルエタンで現像
した。In the case of a composition containing the acid, development was performed using 1,2-dichloroethane containing a small amount of dimethylformamide.
なお、 重合媒体に3caのベンゼンを用いた。In addition, 3 ca of benzene was used as the polymerization medium.
上表より、キノリン誘導体−MMA共重合体において、
光架橋性残基導入率が2モル%のものは、単独ではTP
Rに比べ感度は弱いが、光架橋性残基に対して2倍モル
量のp−)ルエンスルホン酸を添加した組成物の感度は
4倍以上に増大し、また、光架橋性残基導入率5モル%
のものは、市販品の光架橋性残基導入率より遥かに少な
いにもかかわらず、それ自体で同等以上、酸添加により
10倍の感度に向上することがわかる。From the above table, in the quinoline derivative-MMA copolymer,
Those with a photocrosslinkable residue introduction rate of 2 mol% are TP alone.
Although the sensitivity is weaker than that of R, the sensitivity of the composition in which p-)luenesulfonic acid is added in twice the molar amount relative to the photocrosslinkable residue increases to more than four times, and the sensitivity of the composition increases by more than four times. rate 5 mol%
It can be seen that although the photocrosslinkable residue introduction rate is far lower than that of the commercially available product, it is equivalent or more sensitive by itself, and the sensitivity is improved 10 times by addition of an acid.
また、光架橋性残基導入率5モル%の上記試料樹脂に、
該光架橋性残基に対し10倍モルの酢酸を添加し、これ
をスピンナでアルミニウム板に塗布したものは、TPR
に比べて6倍の感度を示した。In addition, in the above sample resin with a photocrosslinkable residue introduction rate of 5 mol%,
TPR was obtained by adding 10 times the molar amount of acetic acid to the photocrosslinkable residue and applying this to an aluminum plate using a spinner.
It showed 6 times the sensitivity compared to .
実施例 9
実施例7で用いた2〜(2−(3−メトキシ−※※4−
(2−ヒドロキシ−3−メタクリロイルオキシプロピル
オキシ)フェニル〕エチニル)キノリン77.6rI1
9をメタクリル酸メチル3901n9とメタクリル酸n
−ブチル750■とともにベンゼン1♂中で、重合開始
剤としてAIBN51n9を用いて重合させた。Example 9 2-(2-(3-methoxy-※※4-
(2-Hydroxy-3-methacryloyloxypropyloxy)phenyl]ethynyl)quinoline 77.6rI1
9 with methyl methacrylate 3901n9 and methacrylic acid n
Polymerization was carried out in 1♂ of benzene with 750 μl of -butyl using AIBN51n9 as a polymerization initiator.
重合は上記混合物を脱気封管中で、60〜65℃の温度
下に20時間保って行なった。Polymerization was carried out by keeping the above mixture at a temperature of 60 to 65° C. for 20 hours in a degassed sealed tube.
重合後管を振りまぜてから内容物をメタノールに注ぎ樹
脂を析出沈殿させ単離した。After polymerization, the tube was shaken and the contents were poured into methanol to precipitate and isolate the resin.
この樹脂はTPRに比べて1/20の感度しか示さない
が、塩化水素ガス雰囲気にさらすことにより、TPRの
約3の感度を示した。This resin showed only 1/20 the sensitivity of TPR, but when exposed to a hydrogen chloride gas atmosphere, it showed a sensitivity of about 3 that of TPR.
実施例 10及び11
2−(2−[3−メトキシ−4−(2−ヒドロキシ−3
−メタクリロイルオキシプロピルオキシ)フェニル〕エ
チニル)キノリンをMMA及びアクリロニトリル(AN
)と共重合させ、第5表に示す組成の2種の三元共重合
体を製造した。Examples 10 and 11 2-(2-[3-methoxy-4-(2-hydroxy-3
-methacryloyloxypropyloxy)phenyl]ethynyl)quinoline with MMA and acrylonitrile (AN)
) to produce two types of terpolymers having the compositions shown in Table 5.
なお、重合は1.5iのベンゼンを反応媒体として用い
、AIBNはいずれも2−51n9使用した。In the polymerization, 1.5i benzene was used as a reaction medium, and 2-51n9 AIBN was used in both cases.
得られた樹脂及び該樹脂にその光架橋性残基に対して2
倍モルのp−)ルエンスルホン酸を添加した組成物につ
いて、それぞれTPRに対する相対感度をしらべた。2 for the resulting resin and its photocrosslinkable residues.
The relative sensitivity to TPR of each composition to which twice the molar amount of p-)luenesulfonic acid was added was examined.
その結果を第5表に併記した。いずれの樹脂も酸を加え
ないで優れた相対感度(6倍)を有するが、酸添加によ
りTPRの約60倍もの高感度が得られている。The results are also listed in Table 5. Both resins have excellent relative sensitivity (6 times) without addition of acid, but with the addition of acid, a sensitivity approximately 60 times higher than that of TPR is obtained.
実施例 12〜14
2−(2−(3−メトキシ−4−(2−ヒドロキシ−3
−メタクリロイルオキシプロピルオキシ3フエニル〕エ
チニル)キノリン38.8■をメタクリル酸メチル79
0■および第6表に示したアクリル系モノマーとベンゼ
ン中で4時間ラジカル重合させ、第6表に示す組成の三
元共重合体を製造した。Examples 12-14 2-(2-(3-methoxy-4-(2-hydroxy-3
-Methacryloyloxypropyloxy3phenyl]ethynyl)quinoline 38.8■ to methyl methacrylate 79
A terpolymer having the composition shown in Table 6 was produced by radical polymerization in benzene for 4 hours with the acrylic monomer shown in Table 6.
このとき、感光基成分が1モル%になるように仕込み量
を調節した。At this time, the amount charged was adjusted so that the photosensitive group component was 1 mol %.
得られた樹脂の光架橋性残基に対し2倍モルのp−トル
エンスルホン酸を添加した組成物について、それぞれT
PRに対する相対感度をしらべた。Regarding the composition in which p-toluenesulfonic acid was added in twice the molar amount relative to the photocrosslinkable residue of the obtained resin, T
The relative sensitivity to PR was investigated.
その結果を第6表に併記した。The results are also listed in Table 6.
Claims (1)
芳香族性複素環を形成する原子団を示す)で表わされる
スチリル系含窒素複素環残基を少なくとも0.2モル%
の量で含有する光不溶化性樹脂と、該樹脂の含有する上
記含窒素複素環残基に基づき0.5〜10倍モルの有機
酸又は無機酸とから成る光不溶化性樹脂組成物。 2 有機酸が、酢酸、クロル酢酸、安息香酸、ニトロ安
息香酸、ベンゼンスルホン酸、ナフタリンスルホン酸、
p−)ルエンスルホン酸及びメタンスルホン酸から選択
されたものである特許請求の範囲第1項記載の組成物。 3 無機酸が塩酸、過塩素酸、リン酸、硫酸及び硝酸か
ら選択されたものである特許請求の範囲第1項記載の組
成物。[Claims] 1. As a photocrosslinkable residue, a styryl group represented by the general formula (wherein R1 represents a hydrogen atom or an alkoxy group, and Z represents an atomic group forming an aromatic heterocycle) At least 0.2 mol% of nitrogen-containing heterocyclic residues
A photo-insolubilizable resin composition comprising a photo-insolubilizable resin contained in an amount of 0.5 to 10 times the mole of an organic or inorganic acid based on the nitrogen-containing heterocyclic residue contained in the resin. 2 The organic acid is acetic acid, chloroacetic acid, benzoic acid, nitrobenzoic acid, benzenesulfonic acid, naphthalenesulfonic acid,
A composition according to claim 1, wherein the composition is selected from p-)luenesulfonic acid and methanesulfonic acid. 3. The composition according to claim 1, wherein the inorganic acid is selected from hydrochloric acid, perchloric acid, phosphoric acid, sulfuric acid and nitric acid.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12323181A JPS5841288B2 (en) | 1981-08-06 | 1981-08-06 | Photoinsolubilizable resin composition |
| US06/404,719 US4444868A (en) | 1981-08-06 | 1982-08-03 | Photosensitive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12323181A JPS5841288B2 (en) | 1981-08-06 | 1981-08-06 | Photoinsolubilizable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5825317A JPS5825317A (en) | 1983-02-15 |
| JPS5841288B2 true JPS5841288B2 (en) | 1983-09-10 |
Family
ID=14855439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12323181A Expired JPS5841288B2 (en) | 1981-08-06 | 1981-08-06 | Photoinsolubilizable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841288B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59152891A (en) * | 1983-02-18 | 1984-08-31 | Yamada Kagaku Kogyo Kk | Color forming recording material |
| JPS62234149A (en) * | 1985-12-23 | 1987-10-14 | ゼネラル・エレクトリック・カンパニイ | Photoresist recording medium |
-
1981
- 1981-08-06 JP JP12323181A patent/JPS5841288B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5825317A (en) | 1983-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3170613B2 (en) | Benzoselenazoline vinyl spiropyran compounds and polymers containing the compounds | |
| US5359085A (en) | Fulgimide derivatives | |
| US4696990A (en) | Novel photocrosslinkable liquid crystalline polymers | |
| HK1004553A1 (en) | Titanocenes, their use and n-substituted fluoroanilines | |
| HK1004553B (en) | Titanocenes, their use and n-substituted fluoroanilines | |
| JPWO1991013072A1 (en) | Benzoselenazolin-based vinyl spiropyran compounds and polymers containing said compounds | |
| US4444868A (en) | Photosensitive composition | |
| JPH11279227A (en) | Compound, copolymer, production of the copolymer, photoresist composition, formation of photoresist pattern using the composition and semiconductor element | |
| FI64863C (en) | PHOTO POLYMER SERIES MATERIAL EN LJUSKAENSLIG TRYCKPLAOT INNEHAOLLANDE DETSAMMA SAMT ETT FOERFARANDE FOER FRAMSTAELLNING AVRYCKPLAOTEN | |
| Ichimura et al. | Photosensitive poly (methacrylates) having styrylpyridinium and styrylquinolinium groups | |
| JP2000154380A (en) | Spirooxazine derivative containing optically active group and optical functional medium containing the same | |
| JPS5841288B2 (en) | Photoinsolubilizable resin composition | |
| JP4390237B2 (en) | Photosensitive compound and photosensitive resin | |
| JP2992424B2 (en) | Benzothiophene / indole-substituted maleimide derivative, photochromic material and optical recording material using the same | |
| JPS5939441B2 (en) | Method for producing photo-insolubilizable polyvinyl alcohol derivative | |
| JPS59199649A (en) | 4-hydroxy-4'-vinylbiphenyl derivative and its preparation | |
| JPS5824562A (en) | Novel polymerizable heterocyclic compound and its preparation | |
| US3849144A (en) | Light-sensitive compositions comprising polymers containing diarylcyclopropene moiety and process of using | |
| JPS5915328B2 (en) | Photoinsolubilizable polymer compound and method for producing the same | |
| US5041665A (en) | Process for preparing squarylium compounds | |
| JPS6221773B2 (en) | ||
| JPS6176514A (en) | Photochromic polymeric compound and its preparation | |
| JPS5825302A (en) | Photosensitive polymer compound and its production | |
| JPH05165142A (en) | Photosensitive body | |
| JPS62181285A (en) | Polyfunctional acylsilane photo-crosslinking agent, photo-crosslinked product containing said cross-linking agent and photo-crosslinking process using said crosslinking agent |