JPS5845807B2 - Manufacturing method of non-polar solid electrolytic capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a non-polar solid electrolytic capacitor, and particularly to a method for manufacturing a small non-polar solid electrolytic capacitor with good workability and at low cost.

Conventionally, non-polar solid electrolytic capacitors are manufactured by connecting anode leads 2 or cathode leads 3 of an organic capacitor element 1 manufactured by a general method to each other by welding or the like, as shown in FIGS. 1A to 1C. By connecting the anode leads 2 or cathode leads 3 to each other in the same manner as described above, the polar solid electrolytic capacitor 5 is sealed in the case 4 or manufactured by a general method and made into a finished product. It was manufactured.

However, in such a method, when manufacturing a small non-polar solid electrolytic capacitor, the capacitor element 1. Since the solid electrolytic capacitor 5 is small,
Connecting these anode leads 2 or cathode leads 3 together by welding or the like requires very high processing precision, and it is very difficult to manufacture them at low cost with good workability.

The present invention eliminates such conventional drawbacks,
The details of the method for manufacturing a nonpolar solid electrolytic capacitor according to the present invention will be explained below.

First, a method of manufacturing a non-polar solid electrolytic capacitor according to an embodiment of the present invention shown in FIGS. 2 to 4 will be explained.

The method of manufacturing a nonpolar solid electrolytic capacitor shown in FIGS. 2 to 4 is a case where a tantalum substrate is used as an anode body.

As shown in Figure 2 A and H, the thickness is 0.1 to 1.0 mm.
A plurality of anode bodies 11 obtained by punching out high-purity tantalum plates into rectangular shapes according to the desired capacitance and working voltage are cut into a diameter of 0.
．． The anode body 11 is electrically and mechanically connected to a tantalum wire 12 having a length of 2 to 0.5 mm by welding at an appropriate interval so as to be perpendicular to the tantalum wire 12 at the center of the anode body 11 .

The tantalum wire 12 to which the plurality of anode bodies 11 are connected serves to hold the plurality of anode bodies 11 during the manufacturing process, and also serves as a conductive wire when forming an anodic oxide film on the surface of the anode body 11. .

In addition, in order to make a non-polar 0 capacitor, it is necessary to prevent a semiconductor layer such as manganese dioxide from adhering to the central part of the anode body 11 where it is connected to the tantalum wire 12. Taking advantage of the property that the semiconductor layer is difficult to adhere to, the central part of the anode body 11 is removed and an abrasive material such as emery or a blasting material is sprayed onto both surfaces on which the semiconductor layer is to be applied to roughen the surfaces on both sides. become a face.

This surface roughening treatment is performed before or after connecting the tantalum wire 12 to the anode body 11.

Next, an anodic oxide film is formed on the surface of the anode body 11 connected to the tantalum wire 12. At this time, it is necessary to form the film over the entire surface of the anode body 11. A commonly used chemical conversion method by immersing it in a chemical conversion solution such as an aqueous solution; one stranded tankle wire 12 is used as a current carrying wire to pass a direct current to form an anodic oxide film on the surface of the anode body 11. .

Thereafter, semiconductor layers such as manganese dioxide are formed on the anodic oxide films on both the left and right sides, leaving the central part of the anode body 11 intact.

This semiconductor layer may be formed by thermally decomposing a general manganese nitrate solution, or by electrolytic electrodeposition.

Thereafter, a cathode layer made of carbon, silver paint, etc., and a conductive terminal layer made of solder are successively laminated on the semiconductor layer to form the capacitor element 13.

At this time, care must be taken to prevent the cathode layer and conductive terminal layer from coming into direct contact with the anodic oxide film.

After constructing the capacitor element 13, either separate the capacitor element 13 from the tantalum wire 12 as shown in FIG. 3A, or cut the tantalum wire 12 on both sides of the capacitor element 13 as shown in FIG. 3B. to separate each capacitor element 13.

FIGS. 4A and 4B show a nonpolar solid electrolytic capacitor constructed in this manner.

To explain the structure of the non-polar solid electrolytic capacitor shown in FIGS. 4A and 4H, in FIGS. 4A and 4B, 11 is a plate-shaped anode body made of a valve metal such as a tanker. As mentioned above, the thickness is about 0.1 to 1.0, which is a thickness taken into consideration from the viewpoints of price and strength.

14 is an anodic oxide film formed on the surface of this anode body 11;
Reference numeral 15 denotes a semiconductor layer made of manganese dioxide or the like formed on the anodic oxide film 14 on both the left and right sides, leaving the central part of the anode body 11. On this semiconductor layer 15, a cathode consisting of a carbon layer 16 and a silver paint layer 17 is formed. Conductive terminal layers 18 such as layers and solder are sequentially laminated to form the capacitor element 13.

FIG. 5 shows an electric circuit of the nonpolar solid electrolytic capacitor shown in FIGS. 4A and 4H.

Here, if the central part of the anode body 11 where the semiconductor layer 15 and the cathode conductive terminal layer 18 are not formed is covered with an insulating resin, sufficient mechanical strength can be obtained even when the anode body 11 is made thin. Since the anode body 11 can be kept thinner, the material cost can be reduced.

It also prevents moisture from entering from the center.
Characteristics can be stably maintained over a long period of time.

As is clear from the above description, the method for manufacturing the non-polar solid electrolytic capacitor of this embodiment involves a plurality of plate-shaped anode bodies 11 made of valve metal plates such as tantalum formed into a predetermined shape.
are electrically and mechanically connected to a valve action metal wire such as a tantalum wire 12 at an appropriate interval so as to be perpendicular to the valve action metal wire at the center thereof, and anodized on the surface of the anode body 11. A film 14 is formed, and semiconductor layers 15. A cathode layer and a conductive terminal layer 18 are sequentially laminated to form a capacitor element 13, and each capacitor element 13 is then separated from the valve metal wire. There is no process that requires high processing precision, such as connecting cathode leads together, and it is possible to manufacture small non-polar solid electrolytic capacitors with good workability and at low cost.

Furthermore, an anodic oxide film 14 is formed on the anode body 11. semiconductor layer 1
Since the 5° cathode layer and the conductive terminal layer 18 are sequentially formed, the shape of the finished capacitor itself is uniform, and the commercial value can be improved.

In the case of this embodiment, the anodic oxide film 14. is directly formed on the valve metal substrate. Semiconductor layer 15. Since the cathode layer and the conductive terminal layer 18 are sequentially formed, this is disadvantageous when obtaining an element with a large capacitance.

In order to solve these problems, a method of manufacturing a non-polar solid electrolytic capacitor according to another embodiment O of the present invention shown in FIGS. 6 to 8 will be described.

The manufacturing method shown in FIGS. 6 to 8 is a case in which a tank substrate having a tantalum layer formed on both surfaces by thermal spraying is used as an anode body.

As shown in FIGS. 6A and 6B, the central part of the tantalum plate 19 having a thickness of 0.1 to 1.0 mm in the longitudinal direction is masked, and the tantalum powder is sprayed onto the surface of the tantalum plate 19 by plasma spraying or the like. Tantalum layer 20 on both sides of plate 19
form.

Thereafter, the tantalum plate 19 is cut at predetermined intervals in the longitudinal direction to form a plurality of anode bodies 21.
Connect this Kunkle wire 1 to the tantalum wire 12 in the center of these
2 and electrically and mechanically connected by welding at appropriate intervals.

After this, the anodic oxide film 14 is formed on the surface of the anode body 21 in the same manner as in the above embodiment, and the semiconductor layer 15 is formed on the tantalum layer 20 of the anode body 21. The cathode layer and the conductive terminal layer 18 are sequentially laminated to form the capacitor element 13, and then each capacitor element 13 is separated from the tantalum wire 12.

FIG. 8 shows a non-polar solid electrolytic capacitor constructed in this manner.

In the case of this non-polar solid electrolytic capacitor, Kuntal plate 1
Since tantalum layers 20 are formed on both surfaces of 9,
A capacitor having a larger capacitance than the capacitor manufactured by the above embodiment can be obtained.

In addition, the tantalum layer 20 is thermally sprayed into a strip-shaped tantalum plate 1.
After forming the tantalum plate 19 on the anode body 9, the anode body 21 is constructed by cutting the tantalum plate 19 at predetermined intervals, which is very simple and can be manufactured with good workability.

Also in this case, the semiconductor layer 5. The strength can be improved by covering the central part of the anode body 21, where the cathode layer and the conductive terminal layer 18 are not formed, with a resin.

Although tantalum was used as the valve metal in this example and the above examples, aluminum may also be used. If aluminum is used, the cost can be reduced and it is easier to process than tantalum. Because it is easy to use, it is very easy to process.

The anode body 11.21 is constructed by molding a valve metal plate into a predetermined shape, but as in the past, the anode body is constructed by molding and sintering a valve metal powder such as tantalum powder. In this case, since the entire anode body is porous, it is almost impossible to form semiconductor layers such as manganese dioxide on both the left and right sides except for the central part.

This is because since it is a porous material, manganese dioxide enters the inside of the pores, and the manganese dioxide becomes conductive inside.

Therefore, if the anode body 24 is constructed by embedding both sides of the valve action metal wire 22 in a sintered body 23 of valve action metal powder leaving the center part as shown in FIG. 9, the above-mentioned disadvantages can be avoided. It is possible in principle without any problem.

As described above, according to the method of manufacturing a non-polar solid electrolytic capacitor according to the present invention, a small non-polar solid electrolytic capacitor can also be manufactured at low cost with good workability and dimensional precision, which is of very high industrial value. It is.

[Brief explanation of drawings]

Figure 1A is a front view of a conventional non-polar solid electrolytic capacitor.
FIG. 1B is a cross-sectional view of another conventional non-polar solid electrolytic capacitor, FIG. 1 C is a cross-sectional view of another conventional non-polar solid electrolytic capacitor, and FIG. FIG. 2B is a front view of the solid electrolytic capacitor manufacturing method; FIGS. 3A and 3B are perspective views showing specific examples of the main steps of the manufacturing method; is an external perspective view of a non-polar solid electrolytic capacitor constructed by the same manufacturing method, FIG. 4B is a sectional view showing the internal structure of the same capacitor, and FIG. 5 is a non-polar solid electrolytic capacitor shown in FIGS. 4A and B. Electrical circuit diagram, Figure 6A. B and FIG. 7 are perspective views showing the main steps of a method of manufacturing a non-polar solid electrolytic capacitor according to another embodiment of the present invention, and FIG. 8 is a perspective view of a non-polar solid electrolytic capacitor constructed by the same manufacturing method. A sectional view showing the internal structure, and FIG. 9 is a front view of an anode body in a method of manufacturing a non-polar solid electrolytic capacitor according to another embodiment of the present invention. 11.2L24... Anode body, 12...
Tantalum wire (valve metal wire), 13...Capacitor element, 14...Anodized film, 15...
...Semiconductor layer, 16...Carbon layer, 1T.
... Silver paint layer, 18 ... Conductive terminal layer, 19 ... Tantalum plate (valve metal plate)
, 20... tantalum layer.

Claims (1)

[Scope of Claims] 1. A plurality of plate-shaped anode bodies made of a valve metal are electrically and mechanically connected to a valve metal wire at appropriate intervals so as to be orthogonal to the valve metal wire at their central portions. a capacitor element is constructed by forming an anodic oxide film on the surface of the anode body, and sequentially laminating a semiconductor layer, a cathode layer, and a conductive terminal layer on both sides of the anode body, leaving the center part. A method for manufacturing a non-polar solid electrolytic capacitor, characterized in that each capacitor element is separated from the valve metal wire. 2. Form a valve metal layer by thermally spraying valve metal powder on both longitudinal surfaces of a band-shaped valve metal plate, leaving the center part, and then cut the valve metal plate at predetermined intervals in the longitudinal direction. 2. The method of manufacturing a non-polar solid electrolytic capacitor according to claim 1, wherein the anode body is constructed by: 3. Manufacture of a non-polar solid electrolytic capacitor according to claim 1, characterized in that the central part of the anode body on which the semiconductor layer, cathode layer, and conductive terminal layer are not formed is covered with an insulating resin. Method.