JPS5846003B2 - Manufacturing method of liquid crystal element - Google Patents
Manufacturing method of liquid crystal elementInfo
- Publication number
- JPS5846003B2 JPS5846003B2 JP54139165A JP13916579A JPS5846003B2 JP S5846003 B2 JPS5846003 B2 JP S5846003B2 JP 54139165 A JP54139165 A JP 54139165A JP 13916579 A JP13916579 A JP 13916579A JP S5846003 B2 JPS5846003 B2 JP S5846003B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal element
- resin
- substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【発明の詳細な説明】
本発明は液晶素子の製造方法に関し、更に詳述すると、
配向制御膜となる絶縁物の形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a liquid crystal element, and more specifically,
The present invention relates to a method for forming an insulator that becomes an orientation control film.
従来、液晶基板表面(こ所定形状の配向制御膜を形成す
る方法として、あらかじめメタルマスク或いは印刷され
た樹脂で配向制御膜の必要としない部分を被った上で残
余部分に配向制御膜となる絶縁物を形成する方法が用い
られる。Conventionally, as a method of forming an alignment control film in a predetermined shape on the surface of a liquid crystal substrate, the parts that do not require the alignment control film are covered with a metal mask or printed resin in advance, and the remaining parts are insulated to become the alignment control film. A method of forming things is used.
このメタルマスクは基板の温度(こよらない、指向性の
ある電子ビーム蒸着法などに適し、印刷された樹脂は膜
形成法として比較的基板温度の低い、指向性の少ない、
例えは溶液含浸塗布法(ディップ法)などに適している
。This metal mask is suitable for directional electron beam evaporation, which does not depend on the substrate temperature, and the printed resin has a relatively low substrate temperature, has little directivity, and is suitable for film formation methods.
For example, it is suitable for a solution impregnation coating method (dip method).
ところがCVD法やスパッタ法のよう(こ基板温度が高
くなり指向性の少ない絶縁物形成法に対しては、石油系
樹脂はクロロセンで溶解剥離が困難になる欠点がある。However, unlike the CVD method and the sputtering method (in which the substrate temperature is high and the directionality is low), petroleum-based resins have the disadvantage that they are difficult to dissolve and peel due to chlorocene.
本発明の目的は、石油系樹脂を用いて配向制御膜となる
絶縁物を形成する場合、その絶縁物が高温度にさらされ
る前に樹脂表面に微細な凹凸を施こして、あとの溶剤に
よる溶解剥離処理を容易にする液晶素子の製造方法を提
供することにある。The purpose of the present invention is to form fine irregularities on the surface of the resin before the insulator is exposed to high temperatures when forming an insulator that will become an orientation control film using a petroleum resin. An object of the present invention is to provide a method for manufacturing a liquid crystal element that facilitates dissolution and peeling treatment.
本発明は、液晶素子の基板上の絶縁膜を必要としない部
分に、スクリーン印刷法により石油系樹脂を被ったのち
、その石油系樹脂表面に選択プラズマエツチング法等に
より微細な凹凸を施し、次に、スパッタ蒸着法など任意
の方法で基板全面に絶縁膜を形成し、次に、溶剤により
石油系樹脂を溶解剥離することを特徴としている。In the present invention, parts of the substrate of a liquid crystal element that do not require an insulating film are coated with a petroleum-based resin using a screen printing method, and then fine irregularities are formed on the surface of the petroleum-based resin using a selective plasma etching method. The method is characterized in that an insulating film is formed on the entire surface of the substrate by any method such as sputter deposition, and then the petroleum-based resin is dissolved and peeled off using a solvent.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
第1図に示すように、液晶基板3上に透明導電体により
電極パターン2を形成し、その上に、スクリーン印刷に
よりマスクレジスト1を塗布する。As shown in FIG. 1, an electrode pattern 2 is formed from a transparent conductor on a liquid crystal substrate 3, and a mask resist 1 is applied thereon by screen printing.
このマスクレジストの塗布されたものを、02ガス或い
は02ガスとCF、ガスの混合ガスにより選択プラズマ
エツチングすれは、第2図に示すように、基板又は電極
のエツチングを防ぎマスクレジスト1の表面が微細な凹
凸状となる。Selective plasma etching of the coated mask resist with 02 gas or a mixed gas of 02 gas and CF gas prevents etching of the substrate or electrodes and flattens the surface of the mask resist 1, as shown in FIG. It becomes finely uneven.
このような微細凹凸処理を施したのちに、第3図に示す
ようにその表面全面に絶縁膜4を設ける。After performing such fine unevenness treatment, an insulating film 4 is provided over the entire surface as shown in FIG.
次に、クロロセン(こよりマスクレジスト1を溶解剥離
すると第4図に示すようfこ所定個所のみに絶縁物4′
が形成される。Next, when the mask resist 1 is dissolved and peeled off using chlorocene, an insulating layer 4' is formed only in predetermined areas as shown in FIG.
is formed.
本発明における微細凹凸処理の方法として、上記実施例
で述べたプラズマエツチング法のほかに、粉末を乾燥不
十分な樹脂表面に付着させる方法、或いは、樹脂表面を
粉末噴射で衝突させる方法を用いることができる。In addition to the plasma etching method described in the above embodiments, as a method for processing fine irregularities in the present invention, a method in which powder is attached to an insufficiently dried resin surface, or a method in which the resin surface is bombarded with powder jet may be used. I can do it.
本発明によれば、印刷された樹脂表面が微細な凹凸状で
あるため、溶剤が浸透しやすく、溶解剥離が容易となり
、%(こ、CVD法やスパッタ法のように絶縁物を設け
る際に基板温度が高くなる場合に効果が太きい。According to the present invention, since the printed resin surface has fine irregularities, it is easy for the solvent to permeate and dissolve and peel off. The effect is greater when the substrate temperature increases.
また、プラズマエツチングにより微細凹凸処理を施す力
性は、基板1及び透明電極2の表面を清浄化する効果も
ある。Further, the ability to perform fine unevenness treatment by plasma etching also has the effect of cleaning the surfaces of the substrate 1 and the transparent electrode 2.
第1図乃至第4図は本発明実施例を経時的に説明する図
であって、いずれも液晶基板を模型的に示す拡大断面図
である。
1・・・・・・マスクレジスト、2・・・・・・電極、
3・・・・・・基板、4・・・・・・絶縁物。FIGS. 1 to 4 are diagrams for explaining the embodiments of the present invention over time, and each is an enlarged sectional view schematically showing a liquid crystal substrate. 1... Mask resist, 2... Electrode,
3...Substrate, 4...Insulator.
Claims (1)
クリーン印刷法により樹脂を被い、次にその樹脂表面に
微細な凹凸を施し、次に基板全面に絶縁膜を設け、次に
上記微細凹凸処理を施した樹脂を溶剤により溶解剥離し
て所定部分のみに絶縁膜を形成することを特徴とする液
晶素子の製造方法。1. Cover parts of the substrate of a liquid crystal element that do not require an insulating film with resin using a screen printing method, then apply fine irregularities to the surface of the resin, then provide an insulating film over the entire surface of the substrate, and then apply the above-mentioned fine irregularities. A method for manufacturing a liquid crystal element, which comprises dissolving and peeling a resin that has been subjected to an uneven treatment using a solvent to form an insulating film only on predetermined portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54139165A JPS5846003B2 (en) | 1979-10-26 | 1979-10-26 | Manufacturing method of liquid crystal element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54139165A JPS5846003B2 (en) | 1979-10-26 | 1979-10-26 | Manufacturing method of liquid crystal element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5662226A JPS5662226A (en) | 1981-05-28 |
| JPS5846003B2 true JPS5846003B2 (en) | 1983-10-13 |
Family
ID=15239087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54139165A Expired JPS5846003B2 (en) | 1979-10-26 | 1979-10-26 | Manufacturing method of liquid crystal element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846003B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141834U (en) * | 1984-08-20 | 1986-03-17 | マツダ株式会社 | rotary piston engine |
-
1979
- 1979-10-26 JP JP54139165A patent/JPS5846003B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5662226A (en) | 1981-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3113896A (en) | Electron beam masking for etching electrical circuits | |
| KR900008504B1 (en) | Method and apparatus for manufacturing continuous web of insulated metal substrate | |
| EP1084445B1 (en) | Method for enhancing conductivity of display substrate electrodes with auxiliary metal layers | |
| US5147519A (en) | Method of manufacturing elastomers containing fine line conductors | |
| US3210214A (en) | Electrical conductive patterns | |
| US3377697A (en) | Method of terminating thin film components | |
| US3196043A (en) | Method for making an electrode structure | |
| JPH02253692A (en) | Pattern formation and manufacture of panel board | |
| JPS5846003B2 (en) | Manufacturing method of liquid crystal element | |
| US3839177A (en) | Method of manufacturing etched patterns in thin layers having defined edge profiles | |
| JPS5826121B2 (en) | Transparent conductive film precision pattern formation method | |
| JPS6261334A (en) | Pattern formation method | |
| US3309227A (en) | Wax masking process | |
| JP2750059B2 (en) | Method of forming transparent electrode | |
| JP2003523070A (en) | Method and apparatus for manufacturing thin-layer structure | |
| JPH0232590A (en) | Manufacture of copper-organic insulating film wiring board | |
| JPS61170738A (en) | Lift-off process by multi-layered resist | |
| JPH0770822B2 (en) | How to apply solder resist | |
| JP2001216843A (en) | Transparent conductive film and its manufacturing method | |
| JP3057714B2 (en) | Pattern formation method | |
| JPH0279207A (en) | Manufacturing method of thin film magnetic head | |
| JPH02222188A (en) | Resistor built-in circuit board and manufacture thereof | |
| JPH095796A (en) | Production of thin-film diode in liquid crystal display device | |
| JPH01112613A (en) | Method for forming transparent conductive film pattern | |
| JPS58199381A (en) | Manufacture of liquid crystal display element |