JPS5847259B2 - Rhizokuchiyuzoyoukanagatanoseizouhohou - Google Patents
RhizokuchiyuzoyoukanagatanoseizouhohouInfo
- Publication number
- JPS5847259B2 JPS5847259B2 JP5815975A JP5815975A JPS5847259B2 JP S5847259 B2 JPS5847259 B2 JP S5847259B2 JP 5815975 A JP5815975 A JP 5815975A JP 5815975 A JP5815975 A JP 5815975A JP S5847259 B2 JPS5847259 B2 JP S5847259B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- mold
- layer
- nickel
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 94
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 229910052759 nickel Inorganic materials 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 25
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 17
- 238000009749 continuous casting Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 150000002815 nickel Chemical class 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 238000004070 electrodeposition Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910000570 Cupronickel Inorganic materials 0.000 description 5
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000208195 Buxaceae Species 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- -1 Nickel sulfur amino acid Chemical class 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011328 necessary treatment Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Continuous Casting (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Electroplating Methods And Accessories (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Description
【発明の詳細な説明】
本発明は連続鋳造用金型の製造方法に関し、特に連続鋳
造用金型の内壁面に強度の耐摩耗性が要求される場合に
、硬質クロムメッキ層を被着せしめて製造される連続鋳
造用金型の製造方法の改良に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a continuous casting mold, and in particular, when a strong wear resistance is required on the inner wall surface of the continuous casting mold, a hard chromium plating layer is applied. This invention relates to an improvement in the manufacturing method of continuous casting molds manufactured by the same method.
既に出願人はこの種金型に於て、熱伝導性が良好で、か
つ熱応力と機械的摩耗に耐え得る、冷却性並びに耐久性
に勝れた鋳型の提供を目的として特公昭48−2825
5号に係る発明を提案したところである。The applicant has already published a patent application for this type of mold in 1982-2825 with the aim of providing a mold that has good thermal conductivity, can withstand thermal stress and mechanical wear, and has excellent cooling performance and durability.
We have just proposed the invention related to No. 5.
而して、当該方法は銅製の鋳型本体を形成後、これの鋳
込み中空部の内面にニッケルメッキを施して製造するこ
とを要旨とするものであるが、かかるニッケルメッキ層
から耽る内壁面に更に強度の耐摩性を得る目的を以てこ
のニッケルメッキ層上にHV硬度900〜1000程度
の硬質クロムメッキを50μ程度施して製造する場合が
ある。The gist of this method is to form a copper mold body and then apply nickel plating to the inner surface of the hollow part of the casting mold. For the purpose of obtaining strong wear resistance, hard chromium plating with an HV hardness of about 900 to 1000 is sometimes applied to a thickness of about 50 microns on this nickel plating layer.
しかるにかkる金型の製造に当っては電気メッキの一般
的現象により、鋳込み中空部の長さ方向あるいは断面、
例えば多角形のものの場合にはコーナーと辺部に膜厚の
偏差が生じ鋳型の寸法精度を得るために、前記硬質クロ
ムメッキを予め60μ程度電着し、これを研摩すること
により寸法精度をだしつつ50μに仕上げることを常と
して居る。However, when manufacturing such molds, due to the general phenomenon of electroplating, the length direction or cross section of the casting hollow part,
For example, in the case of a polygonal item, there is a deviation in film thickness at the corners and sides, and in order to obtain dimensional accuracy of the mold, the hard chrome plating is electrodeposited in advance to about 60 μm, and this is polished to achieve dimensional accuracy. I always try to finish it at 50μ.
従って、この研摩作業には熟練した研摩技術と多くの時
間が掛り、作業性並びに価格性に乏しい欠点を有するも
のである。Therefore, this polishing operation requires a skilled polishing technique and a lot of time, and has the disadvantage of poor workability and cost.
そこで本発明者等は前記従来の製造技術に対して電気鋳
造技術を応用してこの種金型の製造を実施することによ
り、前記欠点を解決せしめることに成功したのである。Therefore, the inventors of the present invention have succeeded in solving the above-mentioned drawbacks by manufacturing this type of mold by applying electroforming technology to the conventional manufacturing technology.
即ち、母型の表面に硬質クロムメッキを施すことにより
、その後段に於て形成される銅製の金型本体の鋳込み中
空部の寸法製度は母型の成形精度によって、その精度を
向上せしめることが可能であり、前記方法におけるクロ
ムメッキ層の電着による寸法精度の向上阻止理由を解決
することができるものである。In other words, by applying hard chrome plating to the surface of the mother mold, the dimensional accuracy of the casting hollow part of the copper mold body formed in the subsequent stage can be improved depending on the molding accuracy of the mother mold. This method is possible, and can solve the reason why the dimensional accuracy cannot be improved by electrodeposition of the chromium plating layer in the method described above.
また、金型に要求される耐摩耗性に応じてクロムメツキ
層の膜厚をコントロールすることが必要な場合には、前
記方法によるときには厚メッキが困難、即ち膜厚の偏差
が、クロムメッキを厚くすればする程、顕著に現出する
ため不可能に近いものであるが、本発明によれば、との
膜厚のコントロールも、母型にクロムメッキを施す場合
における膜厚の偏差は鋳型本体の内面寸法精度には全く
関係たいので、勢い厚メッキが可能であり、必要に応じ
て膜厚を自由に選定することができるものである。In addition, if it is necessary to control the thickness of the chrome plating layer according to the wear resistance required for the mold, it is difficult to achieve thick plating using the above method. However, according to the present invention, it is possible to control the thickness of the film by controlling the deviation in film thickness when applying chrome plating to the mold body. Since it has no bearing on the internal dimensional accuracy of the plate, thick plating is possible, and the film thickness can be freely selected as required.
しかも、本発明により製造した鋳型本体の内面寸法精度
は優れているために、連鋳作業に於ける鋳込み中空部の
鋳片の引き抜きの際のオツシレイションによる摩擦を小
さくし、鋳型の寿命を長くすることができる。Moreover, since the mold body manufactured according to the present invention has excellent internal dimensional accuracy, the friction caused by oscillation when pulling out the slab from the casting hollow part during continuous casting work is reduced, and the life of the mold is extended. can do.
更に本発明方法に於てはクロムメッキ層上へのニッケル
メッキ層の電着に先き立ってニッケルフラッシングメッ
キを施すとともにニッケルメッキ層上への銅メッキ層の
電着に先き立って銅−ニッケルメッキ層を施し、且つこ
れに熱処理を施すことによって前記ニッケルメッキ層と
銅メツキ層間に於ける拡散層の形成を助長せしめ、各電
着層間に於ける密着性を堅固なものとすることができ、
勢い鋳型の鋳金を更に長くすることができるものである
。Furthermore, in the method of the present invention, nickel flashing plating is performed prior to electrodeposition of the nickel plating layer on the chromium plating layer, and copper-plating is performed prior to electrodeposition of the copper plating layer on the nickel plating layer. By applying a nickel plating layer and subjecting it to heat treatment, it is possible to promote the formation of a diffusion layer between the nickel plating layer and the copper plating layer, and to make the adhesion between each electrodeposition layer firm. I can do it,
It is possible to further lengthen the casting metal of the momentum mold.
特にニッケルメッキ層と銅メツキ層間に銅−ニッケルメ
ッキ層を介層することにより、同層を介層せずに実施し
た場合に比較して、その製造時間を大いに短縮すること
ができることを以下の実施例によって知見したところで
ある。In particular, by interposing a copper-nickel plating layer between the nickel plating layer and the copper plating layer, the manufacturing time can be greatly shortened compared to the case where the same layer is not interposed. This has been discovered through examples.
即ち単にニッケルメッキ層上に銅メッキを施したものの
場合には700℃にて4〜6時間熱処理して100μの
拡散層しか得られないのに対して、ニッケルメッキ層と
銅メツキ層間に銅・ニッケルメッキの合金層を介層した
場合には700℃にて30〜60分にて600μの拡散
層を得ることができ、所期の目的を極めて単時間にて達
成できることが明らかである。In other words, if copper is simply plated on a nickel plating layer, only a 100μ diffusion layer can be obtained by heat treatment at 700°C for 4 to 6 hours. When a nickel-plated alloy layer is used as an intervening layer, a diffusion layer of 600 μm can be obtained in 30 to 60 minutes at 700° C., and it is clear that the desired objective can be achieved in a very short time.
実験例 1
母型の表面に下記メッキ浴と条件により1.5朋のニッ
ケルメッキ屑イを施すとともに4.5〜6.5泪の銅メ
ツキ層口を施した後(第1図参照)、これを700℃に
て4〜6時間熱処理することにより、上記ニッケルメッ
キ屑イと銅メツキ層日間に100μの拡散層へを形成す
ることができた(第2図参照)。Experimental Example 1 After applying 1.5 mm of nickel plating scrap to the surface of the mother mold using the following plating bath and conditions, and applying a layer of 4.5 to 6.5 mm of copper plating (see Figure 1), By heat treating this at 700 DEG C. for 4 to 6 hours, a 100 micron diffusion layer could be formed between the nickel plating scraps and the copper plating layer (see FIG. 2).
ニッケルメッキ
メッキ浴
スルフアミノ酸ニッケル 450g/lホウ酸
30 g/l
ラウリル硫酸ソーダ 0.1g/lメッキ
条件
陰極電流密度 4 Mdrr?浴
温 60°CPH0・4
攪 拌 カソードロッカー空気攪拌併用銅メッキ
メッキ浴
硫酸銅 200 、!9/l!
硫 酸 50 g/i!メッ
キ条件
陰極電流密度 5 A/drr?浴
温 20〜23°C攪 拌
カソードロッカー空気攪拌併用実験例 2
母型の表面に上記実険例1と同様の条件によりニッケル
メッキ屑イな電着するとともに、このニッケルメッキ屑
イ上に下記メッキ浴と条件により50〜60μの銅・ニ
ッケル合金メッキ層二(合成組成はニッケルー48〜8
6%、銅−14〜52係)を電着した後、この銅・ニッ
ケル合金メッキ層二上に上記実験例2と同様の条件にて
銅メツキ層口を電着しく第3図参照)、しかる後、これ
を700℃にて30〜60分熱処理することにより、ニ
ッケルメッキ屑イと銅メツキ層日間に600μの拡散層
ホを形成することができた(第4図参照)。Nickel plating plating bath Nickel sulfur amino acid 450 g/l Boric acid 30 g/l Sodium lauryl sulfate 0.1 g/l Plating conditions Cathode current density 4 Mdrr? bath
Temperature 60°CPH0.4 Stirring Cathode rocker Copper plating bath with air stirring Copper sulfate 200,! 9/l! Sulfuric acid 50 g/i! Plating conditions Cathode current density 5 A/drr? Bath temperature 20-23°C Stirring Cathode rocker with air stirring Experimental example 2 Nickel plating waste was electrodeposited on the surface of the mother mold under the same conditions as in Practical Example 1 above, and the following was applied on the nickel plating waste. Depending on the plating bath and conditions, a copper/nickel alloy plating layer of 50-60 μm (synthetic composition is nickel-48-8
After electrodepositing 6% copper (copper-14 to 52), a copper plating layer was electrodeposited on this copper-nickel alloy plating layer 2 under the same conditions as in Experimental Example 2 (see Figure 3). Thereafter, by heat treating this at 700 DEG C. for 30 to 60 minutes, a 600 micron diffusion layer was formed between the nickel plating scraps and the copper plating layer (see FIG. 4).
銅・ニッケルメッキ
メッキ浴
硫酸銅 0.79/1
硫酸ニッケル 10g/lクエン酸
50fl//1シアン化ソーダー
L5g/11アンモニア 少
量
メッキ条件
電流密度 0.5〜2.5A/d??Z2浴 温
40〜80℃PHアルカリ
実施例
母型はステンレス角棒(横8011L11L、縦801
1!7I!、長さ800ii)にテーパー角度O11°
をつげ表面を鏡面研摩したものを用いる。Copper/nickel plating plating bath Copper sulfate 0.79/1 Nickel sulfate 10g/l citric acid
50fl//1 cyanide soda
L5g/11 Ammonia Small amount Plating conditions Current density 0.5-2.5A/d? ? Z2 bath warm
40-80℃ PH alkaline example The matrix is a stainless steel square bar (width: 8011L, height: 801L)
1!7I! , length 800ii) with taper angle O11°
Use boxwood with a mirror-polished surface.
屯して第5図に示すように上記母型1を下記メッキ浴組
成から成るメッキ槽2中に吊下げてセットするとともに
下記メッキ条件下にクロムメッキを施して、母型1の表
面に50μのクロムメッキ層10を電着する。Then, as shown in FIG. 5, the mother mold 1 was suspended and set in a plating bath 2 having the following plating bath composition, and chrome plating was applied under the following plating conditions to coat the surface of the mother mold 1 with a thickness of 50 μm. A chromium plating layer 10 is electrodeposited.
このクロムメッキ層10の電着後、必要な処理を施し、
今後は下記メッキ浴組成並びにメッキ条件下にニッケル
フラッシングメッキを施した後(図示せず)、同電着層
上に上記実験例1のメッキ浴組成並びにメッキ条件下に
1.5山のニッケルメッキを施すとともに、このニッケ
ルメッキ層11上に50〜60μ銅−ニッケルメッキを
上記実験例2のメッキ浴組成並びにメッキ条件下に施し
、さらにこの銅−ニッケルメッキ層12上に上記実験例
1のメッキ浴組成並びにメッキ条件下に1田の銅メッキ
を施す。After electrodeposition of this chrome plating layer 10, necessary treatment is performed,
In the future, after performing nickel flashing plating under the following plating bath composition and plating conditions (not shown), nickel plating with 1.5 peaks will be applied on the same electrodeposited layer under the plating bath composition and plating conditions of Experimental Example 1. At the same time, 50 to 60 micron copper-nickel plating was applied on this nickel plating layer 11 under the plating bath composition and plating conditions of Experimental Example 2 above, and further, on this copper-nickel plating layer 12, the plating of Experimental Example 1 was applied. One layer of copper plating is applied under the bath composition and plating conditions.
さらに上記銅メッキ層13の電着後、700℃にて30
〜60分熱処理することにより、上記ニッケルメッキ層
11と銅メツキ層13間に拡散層を形成した後、第6図
に示す如く、予め製造すべき連続鋳造用金型に要求され
る外型寸法及び形状に形成された鋳型15内に設置し、
この鋳型15と銅メツキ層13間に溶融鋼あるいは真鍮
を鋳込むことにより、銅メッキ層13の外面に鋳造銅あ
るいは真鍮層14を形成することができる。Further, after the copper plating layer 13 is electrodeposited, the copper plating layer 13 is
After forming a diffusion layer between the nickel plating layer 11 and the copper plating layer 13 by heat treatment for ~60 minutes, the outer mold dimensions required for the continuous casting mold to be manufactured in advance are determined as shown in FIG. and installed in a mold 15 formed in the shape,
By casting molten steel or brass between the mold 15 and the copper plating layer 13, a cast copper or brass layer 14 can be formed on the outer surface of the copper plating layer 13.
従って、これの冷却後、鋳型15内より母型1を取り出
し、第7図に示す状態の連続鋳造用金型Aを製造するこ
とができ、これに所要の処理(外面の研削、研摩等の機
械加工を施す等)を施した後、前記母型1を適当な手段
に引き抜くことにより連続鋳造用金型を製造することが
できる。Therefore, after cooling, the mother mold 1 can be taken out from the mold 15 and the continuous casting mold A in the state shown in FIG. 7 can be manufactured. After machining, etc.), a mold for continuous casting can be manufactured by pulling out the mother mold 1 by an appropriate means.
伺、上記クロムメッキ後のニッケルフラッシングメッキ
に先き立っては、クロムメッキ層10に薄い酸化皮膜が
存在するため、このニッケルフラッシングメッキの密着
不良を惹起することになるので、陽極電解を行ない、ク
ロムメッキ層10上の薄い酸化皮膜を除去した後に実施
することが望ましい。However, prior to the nickel flashing plating after the chromium plating, there is a thin oxide film on the chromium plating layer 10, which will cause poor adhesion of the nickel flashing plating, so anodic electrolysis is performed. It is desirable to perform this after removing the thin oxide film on the chrome plating layer 10.
また母型1の引き抜きに当っては、化学的に母型を溶解
して実施することも可能で、この場合には、前記ステン
レス角棒に換えて、アルミニウムパイプを使#Jし、前
記各メッキ層並びに鋳込み層の形成後、苛性ソーダー溶
液中で母型のアルミニウムを溶解し、更に塩酸で亜鉛置
換膜を溶解することにより実施することも可能である。In addition, when drawing out the mother mold 1, it is also possible to melt the mother mold chemically. In this case, an aluminum pipe is used instead of the stainless steel square rod, and each of the above After forming the plating layer and the casting layer, it is also possible to dissolve the aluminum matrix in a caustic soda solution and further dissolve the zinc-substituted film in hydrochloric acid.
図中、3はメッキ浴、6は陽極、7は直流電源を夫々示
すものである。In the figure, 3 represents a plating bath, 6 represents an anode, and 7 represents a DC power source.
第1図は実験例1に於けるニッケルメッキ層並びに銅メ
ッキ層の拡大写真、第2図は同熱処理後の拡大写真、第
3図は実験例2に於けるニッケルメッキ層、銅−ニッケ
ルメッキ層並びに銅メッキ層の拡大写真、第4図は同熱
処理後の拡大写真、第5図は母型に対する各電着層の電
着状態を示す説明図、第6図は各電着層の電着後に、そ
れを鋳型内にセットし銅あるいは真鍮を鋳込んだ状態の
横断面図、第7図は鋳型より鋳込み後の母型を取り出し
て、母型引き抜き後の製造品を示す斜視図である。Figure 1 is an enlarged photograph of the nickel plating layer and copper plating layer in Experimental Example 1, Figure 2 is an enlarged photograph of the same heat treatment, and Figure 3 is an enlarged photograph of the nickel plating layer and copper-nickel plating in Experimental Example 2. Figure 4 is an enlarged photograph of the copper plating layer and the copper plating layer, Figure 4 is an enlarged photograph of the same heat treatment, Figure 5 is an explanatory diagram showing the state of electrodeposition of each electrodeposited layer on the matrix, and Figure 6 is an enlarged photograph of the electrodeposition of each electrodeposited layer. Figure 7 is a cross-sectional view showing the state in which the mold is set in the mold and copper or brass is cast into it, and Figure 7 is a perspective view showing the manufactured product after the mold is removed from the mold. be.
Claims (1)
求される連続鋳造用金型の製造方法に於て、母型の表面
に必要な厚さの硬質クロムメッキを施すとともにこの硬
質クロムメッキ層上にニッケルフラッシングメッキを施
した後ニッケルメッキを施し、更にこのニッケルメッキ
層上に銅・ニッケル合金メッキを施すとともにこの銅・
ニッケル合金メッキ層上に銅メッキを施し、これに熱処
理を施した後鋳型内に設置し、前記鋼メッキ層の外面に
溶融鋼あるいは真鍮を鋳込み、冷去後、前記母型を抜去
することにより製造することを特徴とする連続鋳造用金
型の製造方法。1. In the method of manufacturing continuous casting molds that requires a hard chrome plating layer on the inner wall surface of the continuous casting mold, hard chrome plating is applied to the surface of the mother mold to the required thickness, and this hard chrome plating is After applying nickel flashing plating on the layer, nickel plating is applied, and then copper/nickel alloy plating is applied on this nickel plating layer.
By applying copper plating on the nickel alloy plating layer, heat treating it, placing it in a mold, casting molten steel or brass on the outer surface of the steel plating layer, and removing the mother mold after cooling. 1. A method for manufacturing a continuous casting mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815975A JPS5847259B2 (en) | 1975-05-15 | 1975-05-15 | Rhizokuchiyuzoyoukanagatanoseizouhohou |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815975A JPS5847259B2 (en) | 1975-05-15 | 1975-05-15 | Rhizokuchiyuzoyoukanagatanoseizouhohou |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51133134A JPS51133134A (en) | 1976-11-18 |
| JPS5847259B2 true JPS5847259B2 (en) | 1983-10-21 |
Family
ID=13076200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5815975A Expired JPS5847259B2 (en) | 1975-05-15 | 1975-05-15 | Rhizokuchiyuzoyoukanagatanoseizouhohou |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847259B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5941145U (en) * | 1982-09-09 | 1984-03-16 | フランスベッド株式会社 | unit furniture |
-
1975
- 1975-05-15 JP JP5815975A patent/JPS5847259B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5941145U (en) * | 1982-09-09 | 1984-03-16 | フランスベッド株式会社 | unit furniture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51133134A (en) | 1976-11-18 |
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