JPS5855677B2 - Atsumakushi Yuuseki Kaironoseizouhouhou - Google Patents

Description

[Detailed description of the invention] The present invention relates to a method for manufacturing thick film integrated circuits.

Conventionally, thick film circuits have been manufactured by forming a circuit network by screen printing and then firing it.

In recent years, thick film circuits have been required to be ultra-precision multilayer circuits and larger in size. However, with conventional technology, there are problems such as changes in pattern dimensions due to screen groaning, thickening of pattern width due to sagging edges during printing, short circuits, Yields are reduced due to jagged edges, wire breakage due to mesh, dust, and clogging, and as the size increases, this effect becomes even more difficult, making manufacturing difficult.

Further, if a metal mask is used, the above-mentioned problems can be alleviated to some extent, but if there are multiple layers, the unevenness of the printing surface becomes severe, making it difficult to manufacture.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a thick film integrated circuit with high pattern dimensional accuracy and extremely high quality.

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, 11 is a screen for printing the conductive paste on the substrate 12, and 13 is the part where the emulsion of the printing part on the screen 1 noon 11 has been removed.

Further, 14 is a solid surface printed by the screen 11.

In this way, the conductive paste is printed on the minimum necessary area to cover the desired pattern on the surface of the substrate 12, dried, and a laser source is used to draw and bake the pattern as shown in FIG. A desired pattern 16 is drawn using an automatic drawing machine (not shown).

That is, the laser source 15 is freely moved in the X direction and the Y direction by the automatic drawing machine, and the desired pattern 16 is drawn on the dry conductive paste on the solid printing surface 14 of the substrate 13 by the laser beam emitted from the laser source 15. Printing is done at the same time as drawing.

After this process is completed, the unnecessary conductor paste that is simply dried without baking is dissolved and washed with a solvent to complete the thick film integrated circuit.

As described above, according to the present invention, since the pattern is not formed by screen printing, there is no change in the pattern dimensions due to the waviness of the screen, and there is no sagging of pattern edges, thickening of the pattern width, etc.

Furthermore, we provide a method for manufacturing thick film integrated circuits that has extremely large effects, such as preventing the effects of mesh and disconnection due to clogging of dust when printing fine patterns because the initial printing is solid printing. can.

[Brief explanation of the drawing]

1 and 2 are perspective views showing one embodiment of the present invention. 11... Screen, 12... Board,
Solid printing surface, 15... Laser source. 14...

Claims (1)

[Claims] 1. A screen for printing conductive paste onto a substrate to the minimum necessary width that covers the desired pattern, a laser source for forming a pattern on the conductive paste printed solidly on the substrate, and this laser source. and an automatic drawing device that moves the conductive paste vertically and horizontally, and after printing the conductive paste on the board, the automatic drawing device is activated to draw a desired pattern with a laser beam emitted from a laser source. Features: A method for manufacturing thick film integrated circuits.