JPS5873188A - Device for automatically removing electronic part from printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to printed board package manufacturing equipment, and is applied to a device for removing a flat lead-child component from a printed board.

Electronic circuit modules that are mounted in an assembly factory to form the C1 structure of an electronic device are supplied as a bullet board package. And Mukuro Densuke Ayu Mojiru? To make MK paulownia, the printed circuit board package is assembled into a self-sufficient flat lead sink, and electronic components such as circuits are placed onto patterned pads configured to correspond to the flat leads. Increasingly, a configuration is being adopted in which 14VB is installed and each flat lead and pattern pad are soldered. Then, it becomes necessary to select and replace the special number for maintenance and inspection of the electronic device having logic 1g4 of 1 with such a configuration, and the multiple part numbers and synonyms of the electronic component, and this parts removal is necessary. Previously, the installation was done manually by soaking in a small trowel and removing it for half a day. Such a method has the drawback that it lacks workability and often causes heat damage to electronic components mounted on the printer due to heating of the print a, which impairs the freshness of the device.

The present invention addresses the sales drawbacks and provides a new method for improving the efficiency and reliability of selectively removing one roe of noodles from a printed board.
The aim was to create a self-portrait consisting of the following.

The uninvented device for removing electronic components from printed boards is
A work head comprising a III lead-capable air suction nozzle, a compatible hot air nozzle unit disposed around the nozzle, a hot air generation koji, etc., and a nuclear work head as desired. A means for direct firing to the position of the base point and moving it up and down, and an X-Y table on the base that is capable of positioning a predetermined electronic component on the mounted printed board at the position of the position! 101I [2 Each pressing side of the work head and k
The apparatus is equipped with a control device for continuously operating the x-y table in a pre-programmed predetermined sequence cycle. When the work head is dismounted, the suction nozzle is pressed against the back surface of the electronic component at a certain temperature, which has been positioned in advance on the X-Y table, and the hot air nozzle unit is attached to the work head. When I specified the hot air of the flat lead from the head, I squirted it to the neck, and then when I raised the work head, the electronic parts were installed. It is equipped with a sensor that detects whether the Ry is on the rise or not, and when it detects the intake of an electronic component, it moves to the sequence cycle of the next component to be removed. The present invention is characterized by the addition of a function that repeats the one-distance jump-up cycle until a predetermined time limit when non-adsorption of a dead body part is detected.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing the mechanical part of the automatic electronic component removal device according to the present invention, and FIG. 1 is the sail shadow base, 21j overhang column,
8 is ih = ram, 4 is X-Y table, 5 is Tarumuram koji 1 outline, 6 is work head, 7 is hot air nozzle unit,
8 is the wrinkle nozzle, 9 is the foot pedal, 10 is the heat@@,
11 is the sky, 12 is the compressed air source, 1B is the seat positioning device, 14 is the sequence controller, 15 is the timer interface device 1111, 16 is the vacuum sensor, 17 is the printed board, 18 is the flat lead electronic component, '11%
Vlfu indicates an automatic two-way switching valve, the 2m solid line indicates air piping, and the nominal line indicates l+1iliIn path.

The mechanical part of the automatic electrical manufacturing system of the present invention has an over/S leg column 2 on top of the desk ik stand l, as shown in Fig. When engaged, the vertical ram is configured to be slidable in an arbitrary stroke by a vertical ram sliding STM consisting of a toggle joint 51 and a cylinder 52. Then, the suction nozzle b (J) installed at the lower end of the ram 8 is set to the work head 6 with a hot air nozzle unit 7 or the main body 1, and the position of the nozzle unit is set at the ag' so that the X-l table 4 facing the nozzle unit is
It is treated on top. Furthermore, on the right side of the desk, there is provided a foot pedal 9 which can interrupt any one set of the sequence 5ilI described in . And hot air nozzle knee 1
-7 The configuration of the 7B is as shown in Fig. 2.The suction nozzle 8 is provided with a hole 71 and a link cape 72 in the center. The sleeve 74 is made to pass straight through to the 92-inch hole 72, and is fixed to the workpiece 6 by means compatible with the sleeve 74. In addition, this equipment includes a hot air nozzle 10 built into the ram IO, a vacuum collected in the base, a hot air nozzle 11, and a high pressure air chamber 12, as shown by the dotted line in the middle of the ink drawing. 7 and heat 1 source 10. Airship P2 Two-way switching automatic valve Vl, V1 that mutually clips a load such as a vehicle type piping route and an island release between each of the cylinder U and the Aa air whale 12! However, he further caressed the grade printed board 17, and printed the pattern of the Mukuro printed board 171.
The electronic component 18 to which the flat lead 181 is soldered is to be positioned, and the automatic two-way switching valve vI, #7Vu and the empty sensor 16 are sequence-controlled at a predetermined timing. a power sequence control device 1114 and a timer interface device k that determines one finger time in a predetermined sequence stage.
15, and a control means shown by a dotted line is arranged between these control electrical production units and related functional units.

The operating method and operation of this apparatus for selectively removing predetermined flat-lead electronic components mounted on a printed circuit board by automatic loading are as follows.

tlJ Place the printed board on the X-4 table and attach the hot air nozzle unit 7 corresponding to the electronic component to be removed to the work head 6.

(2) Transfer the electronic components to be removed in a predetermined order to the origin of the mth electric manufacturing machine in a predetermined order and install the sequence program chip in the first position.

(8) Bi-blow kill ("+) of Fy + constant temperature hot air, which is made to flow from the hot air nozzle 8 to the 1st, 2nd, and 8th timers (not shown) of the timer interface device, respectively, and a movable beat blower of 1M ]
(Set the limit special call (T8) for the total blow progress.

(4) With the production of Ashijima Petal 9, one of the following Sequences will be released. A: The first part 18 is placed on the X-Y table 4 at the line point 4s1. It is determined. B: As shown in Figure 2, the suction nozzle of the work head is in pressure contact with the back surface of the electronic head 18, and a predetermined cap is maintained between the tip of the nozzle sleeve 74 of the hot air nozzle unit 7 and the flat lead. Descend and pressurize. Ha: First blow #! darkness
゛Open Vll+ only by 1 and blow the solder with hot air blow, or after 1゜Huff T1 has elapsed, switch to Vl, and Hecht 6 starts to rise.I watched electronic component 18, and when I climbed up, I was thinking about vacuum sensor 16 or anti-fouling. Then, it continued to rise until it reached the take-off position. 2: If you don't take care of electronic parts 18, vacuum sensor 1
It detects the non-& position due to the decrease in the degree of vacuum at 6, and by switching Vll, it descends to the position 6 or the V & position explained in C above, and the cylinder 1 is returned to the revit blow (TI is a much shorter time than T). Vl.

opens and heats the solder. 2: Tg progress decay head 6
begins to rise, and if the vacuum sensor 16 or tiI2* is detected, move to c. If non-adsorption is detected, repeat the second operation until the limit time T8. If 16 detects l+ adsorption even if it passes the same time at T1, then move to c. is determined by the 10th take-off position. Ho:
After Tokoe's tick-off operation is completed, the next part removal sequence begins.

Automatic removal of electronic components from printed circuit boards with the above-mentioned configuration functions is limited to the heating for holding the solder or the th part, and the heating time can be limited to the minimum self-effective time, so electronic components can be easily removed. Heat treatment also reduces losses and has an effect on ^-axis propensity 1 and 1-axis propensity 1 in physical electronic mounting work.

[Brief explanation of drawings]

The first factor is a schematic sectional view illustrating the electronic part and automatic removal device according to the present invention, and Figure 2 is a schematic side sectional view illustrating the structure and function of the iron work head. In the above, l is a rolling stone, 2 is an overhang column, and 8
is M! Own ram, 4 is an X-Y table, 5 is a semi-ram sliding structure, 6 is a work head, 7 is a hot air nozzle unit, 8
is a suction nozzle, 9 is a foot pedal, 1O is a hot air source, 11
12 is a vacuum source, 12 is a Takasho air source, 18 is a seating position determination device, 14 is a sequence controller, 15 is a timer interface unit, 16 is an empty sensor, 17 is a printed board, and 18 is a flat lead electronic component. This is what is shown. 11th XI 5 21st 15 181

Claims (1)

[Claims] Printed board pattern pad + C flat liet half H
In automatic noodle making, in which a number of attached electronic parts are dialyzed and removed from one printed base, a vacuum suction nozzle capable of performing arbitrary number ζfilJ, a compatible hot air nozzle unit disposed around the nozzle, and A work head comprising a hot air generating device m, etc., a means for moving the work head up and down at once to a given origin at will, and a means for moving a predetermined electronic component on a mounted print V to the origin. Continuous control of the X-Y table on the base, the operation of each pole of the Nk work head, and the operation of the X-Y table in a pre-programmed sequence cycle.
1'. For the self-distribution work head, lower the work head #1 and press the installed slot to the back of the electronic component at the position 111 determined in advance on the b8c X-Y table, and apply When the hot air nozzle unit reaches the specified temperature @Kamenoll') when blowing the wind @
Equipped with a sensor that detects whether or not the electronic components rise while being absorbed when the work head is raised one step after the tie is ejected onto the upper surface of the frac lead, and In the above-mentioned downward inspection, if adsorption of the nuclear electronic part is detected, the sequence cycle will proceed to the next part to be removed, and if non-observation of the part is detected, it will be a violation of the regulations. A device for automatically removing electronic components from a print v, characterized by an additional function of returning the green button to the pick amp cycle.