JPS587462B2 - Manufacturing method of coating sheet and copper clad laminate - Google Patents
Manufacturing method of coating sheet and copper clad laminateInfo
- Publication number
- JPS587462B2 JPS587462B2 JP53145035A JP14503578A JPS587462B2 JP S587462 B2 JPS587462 B2 JP S587462B2 JP 53145035 A JP53145035 A JP 53145035A JP 14503578 A JP14503578 A JP 14503578A JP S587462 B2 JPS587462 B2 JP S587462B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- cyanate ester
- copper
- manufacturing
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
本発明は、熱硬化可能な変性ポリエチレン樹脂シートに
シアン酸エステル系樹脂組成物を被覆した熱硬化可能な
新規なシアン酸エステル被覆シート、およびそのシート
を用いた積層板の製造法であり、特に銅箔との接着力に
すぐれ、かつ銅箔をエッチング除去した基板面の電気特
性も保持された積層板を提供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a novel thermosetting cyanate ester-coated sheet in which a thermosetting modified polyethylene resin sheet is coated with a cyanate ester resin composition, and a laminate using the sheet. This manufacturing method provides a laminate that has particularly excellent adhesive strength with copper foil and retains the electrical properties of the substrate surface from which the copper foil has been etched away.
熱硬化可能に変性されたポリエチレン樹脂をガラス布基
材に融着させて得た複合シートと銅箔とを重ねて、積層
成形して、ポリエチレン樹脂の優れた誘電特性、耐湿性
などを備えた銅張積層板を製造することが試みられた。A composite sheet obtained by fusing heat-curable modified polyethylene resin to a glass cloth base material and copper foil are layered and laminated to form a composite sheet that has the excellent dielectric properties and moisture resistance of polyethylene resin. Attempts have been made to produce copper clad laminates.
しかし、通常の熱硬化可能な変性ポリエチレン樹脂を用
いた場合には、銅箔との接着力が不十分であり、銅箔と
の接着力を増大さすために例えば架橋剤を大量に用いる
と銅箔をエッチングで除去した基板面は灰色ないし黒灰
色となり電気特性は全く損なわれたものであった。However, when ordinary thermosetting modified polyethylene resin is used, its adhesion to copper foil is insufficient, and if a large amount of crosslinking agent is used to increase the adhesion to copper foil, The surface of the substrate from which the foil had been removed by etching was gray or blackish-gray, and the electrical properties were completely impaired.
本発明は、銅箔との接着力を大巾に高め、かつエッチン
グにより銅箔を除去した基板面の電気特性も損なわれな
い銅張積層板の製造方法について鋭意研究した結果完成
したものである。The present invention was completed as a result of intensive research into a method for manufacturing copper-clad laminates that greatly increases the adhesive strength with copper foil and does not impair the electrical properties of the substrate surface from which the copper foil has been removed by etching. .
すなわち、本発明は
熱硬化可能な変性ポリエチレン樹脂シート(以下、単に
シートと称す)にシアン酸エステル系樹脂組成物を被覆
した熱硬化可能なシアン酸エステル被覆シート(以下、
シアン酸エステル被覆シートと称す)
および
前記シアン酸エステル被覆シート、基材、および銅箔を
重層して積層成形することを特徴とする銅張積層板の製
造法
である。That is, the present invention provides a thermosetting cyanate ester-coated sheet (hereinafter simply referred to as a sheet) in which a thermosetting modified polyethylene resin sheet (hereinafter simply referred to as a sheet) is coated with a cyanate ester resin composition.
This is a method for producing a copper-clad laminate, characterized in that the cyanate ester coated sheet (referred to as a cyanate ester coated sheet), the base material, and the copper foil are layered and laminated and molded.
本発明の熱硬化可能な変性ポリエチレン樹脂とは低密度
乃至高密度ポリエチレンに、架橋剤としてt−ブチルク
ミルパーオキサイド、ジクミルパーオキサイド、α・α
′−ビス(t−ブチルペルオキシ)−p−ジイソプロビ
ルベンゼン、ナトの有機過酸化物を0.1〜10wt%
、好ましくは1〜5wt%添加し、必要に応じてアンチ
モン化合物、ハロゲン化化合物、リン化合物、およびこ
れらを組合せたものなどの難燃剤を添加したものに、銅
害防止剤、ハロゲン吸収剤などの安定剤類、およびアミ
ン類、酸無水物類、エポキシ樹脂、ジアリルフタレート
樹脂、無機充填剤類、顔料、染料などを適宜添加してな
るものである。The thermosetting modified polyethylene resin of the present invention is low-density to high-density polyethylene, t-butylcumyl peroxide, dicumyl peroxide, α・α as a crosslinking agent, etc.
'-bis(t-butylperoxy)-p-diisopropylbenzene, 0.1 to 10 wt% organic peroxide
, preferably 1 to 5 wt%, and optionally flame retardants such as antimony compounds, halogenated compounds, phosphorus compounds, and combinations thereof, as well as copper damage inhibitors, halogen absorbers, etc. Stabilizers, amines, acid anhydrides, epoxy resins, diallyl phthalate resins, inorganic fillers, pigments, dyes, and the like are appropriately added.
本発明のシアン酸エステル系樹脂組成物とは、シアン酸
エステル類を含有した熱硬化性の樹脂組成物であり、分
子中にシアナート基(−O−C≡N)を1ヶ以上、好ま
しくは2ヶ以上含有する有機化合物類、そのプレポリマ
ーなどのシアン酸エステル樹脂組成物、これらと分子中
にマレイミド基を1ヶ以上、好ましくは2ヶ以上含有す
る有機化合物類との混合物もしくは予備反応物、または
エポキシ樹脂との混合物もしくは予備反応物などで代表
される熱硬化性の樹脂組成物である。The cyanate ester resin composition of the present invention is a thermosetting resin composition containing cyanate esters, and preferably has one or more cyanate groups (-O-C≡N) in the molecule. Organic compounds containing two or more maleimide groups, cyanate ester resin compositions such as prepolymers thereof, mixtures or pre-reaction products of these with organic compounds containing one or more maleimide groups, preferably two or more maleimide groups in the molecule. , or a thermosetting resin composition typified by a mixture with an epoxy resin or a pre-reacted product.
具体的に例示すれば、ジシアナートベンゼン、ビス(シ
アナートフエニル)エーテル、ビス(シアナートフエニ
ル)プロパン、ポリシアナート化フェノールノボラツク
、ハロゲン化ビス(シアナートフエニル)プロパンなど
およびそのプレポリマーなどのシアン酸エステル樹脂組
成物、これらとビス(マレイミドフェニル)メタン、ビ
ス(マレイミドフエニル)エーテル、マレイミドフエニ
ルージマレイミドフエニルメタンなどのマレイミド類と
の混合物もしくは予備反応物、またはビスフェノールA
型エポキシ樹脂、ハロゲン化ビスフェノールA型エポキ
シ樹脂、フェノールノボラック型エポキシ樹脂などのエ
ポキシ樹脂との混合物もしくは予備反応物などである。Specific examples include dicyanatobenzene, bis(cyanatophenyl) ether, bis(cyanatophenyl)propane, polycyanated phenol novolak, halogenated bis(cyanatophenyl)propane, etc. Cyanate ester resin compositions such as polymers, mixtures or pre-reacted products of these with maleimides such as bis(maleimidophenyl)methane, bis(maleimidophenyl)ether, maleimidophenyl dimaleimidophenylmethane, or bisphenol A
These include mixtures or preliminary reactants with epoxy resins such as type epoxy resins, halogenated bisphenol A type epoxy resins, and phenol novolac type epoxy resins.
本発明の被覆シートの製造方法としては、.適尚な溶媒
で希釈したシアン酸エステル系樹脂組成物に複合シート
を浸漬して塗布する方法、ロールコーターなどによる方
法など通常の塗布方法でよく、又、乾燥は変性ポリエチ
レン樹脂の軟化点以下の温度で行う。The method for manufacturing the covering sheet of the present invention includes: Any ordinary coating method may be used, such as dipping the composite sheet into a cyanate ester resin composition diluted with an appropriate solvent, or using a roll coater, or drying at a temperature below the softening point of the modified polyethylene resin. Do it at temperature.
尚、被覆は、銅箔と接着される面がなされていればよく
必ずしも両面が行なわれている必要はないが、更にスル
ーホール積層板などに用いる場合には両面とも被覆され
たものの方が好ましい。It should be noted that the coating only needs to be applied to the side that will be bonded to the copper foil, and it is not necessary that both sides be coated, but when used for through-hole laminates, it is preferable that both sides be coated. .
シアン酸エステル系樹脂組成物の被覆量は、該複合シー
トの片面lmあたり1〜100g、好ましくは3〜60
gの範囲である。The coating amount of the cyanate ester resin composition is 1 to 100 g, preferably 3 to 60 g per 1 m on one side of the composite sheet.
g range.
1g/m2未満では被覆する効果がでないし、100g
/m2を超えて用いても変性ポリエチレン樹脂の利点で
ある電気特性などがほとんど失なわれるので好ましくな
い。If it is less than 1g/m2, the coating will not be effective, and if it is less than 100g
/m2 is not preferable because the advantages of modified polyethylene resin, such as electrical properties, are almost completely lost.
以上の如くして本発明のシアン酸エステル被覆シートを
得る。The cyanate ester coated sheet of the present invention is obtained in the manner described above.
この被覆シートは基材および銅箔と組合せて銅張積層板
を製造する積層材として極めて有用なものである。This covering sheet is extremely useful as a laminate material for manufacturing copper-clad laminates when combined with a base material and copper foil.
次に、本発明のシアン酸エステル被覆シートを用いた積
層板の製造方法を説明する。Next, a method for manufacturing a laminate using the cyanate ester-covered sheet of the present invention will be explained.
まず、本発明の基材とは、エポキシシラン、アミノシラ
ン、有機チタネートなど各種カップリング剤で表面処理
されたガラス布;ガラスペーパーなど、全芳香族ナイロ
ン布など耐熱性にすぐれた有機繊維布などであり、又、
銅箔とは通常の積層板用の銅箔である。First, the base material of the present invention is glass cloth surface-treated with various coupling agents such as epoxysilane, aminosilane, and organic titanate; glass paper, and organic fiber cloth with excellent heat resistance such as fully aromatic nylon cloth. Yes, also
Copper foil is ordinary copper foil for laminated boards.
次に図面に基づいて、本発明のシアン酸エステル被覆シ
ート、基材、および銅箔を重層した積層板製造の配置例
を説明する。Next, an example of the arrangement for manufacturing a laminate in which the cyanate ester coated sheet of the present invention, a base material, and copper foil are laminated will be explained based on the drawings.
第1図は両面シアイ酸エステル被覆シ一ト2,2の間に
基材3を、両外に銅箔1,1を重層した例であり、第2
図は両面被覆シ一ト220両側に基材23,23及び銅
箔21,21を配置した例である。Figure 1 shows an example in which a base material 3 is layered between double-sided sialic acid ester coated sheets 2, 2, and copper foils 1, 1 are layered on the outside of both sheets.
The figure shows an example in which base materials 23, 23 and copper foils 21, 21 are arranged on both sides of a double-sided coating sheet 220.
第3図は第1図又は第2図の内層の組合せを複数組とし
た場合であり、厚みを自由に調節できるものであり、第
4図は、第3図の中間層にあたる部分(第4図の44に
該当)を他の積層材、例えばエポキシ樹脂プリプレグ、
硬化基板などとした例である。Fig. 3 shows a case where a plurality of combinations of the inner layers shown in Fig. 1 or Fig. 2 are used, and the thickness can be freely adjusted. (corresponding to 44 in the figure) to other laminated materials, such as epoxy resin prepreg,
This is an example of a hardened substrate.
第1図〜第4図は、いずれも両面銅張積層板の製造用の
配置例であるが、むろん片面銅張積層板、薄層板、厚肉
板の配置として製造できるものである。1 to 4 are arrangement examples for manufacturing double-sided copper-clad laminates, but of course single-sided copper-clad laminates, thin laminates, and thick plates can also be manufactured.
積層成形の条件は、温度 120〜250℃、好ましく
は150〜200℃、圧力 5〜200kg/cm2、
好ましくは10〜50kg/cm2で0.2〜8時間、
好ましくは0.5〜3時間であり、必要に応じて更に2
00〜250℃の温度で後硬化を行なってもよい。The conditions for lamination molding are: temperature 120 to 250°C, preferably 150 to 200°C, pressure 5 to 200 kg/cm2,
Preferably at 10-50 kg/cm2 for 0.2-8 hours,
Preferably 0.5 to 3 hours, and further 2 hours if necessary.
Post-curing may be carried out at a temperature of 00-250°C.
以上、詳細に説明した本発明の方法を実施することによ
り、ポリエチレン樹脂のすぐれた誘電特性、耐湿性など
を備え、外観もよく、銅箔の接着力のある腰のある銅張
積層板が得られる。By carrying out the method of the present invention described in detail above, a copper-clad laminate can be obtained that has the excellent dielectric properties and moisture resistance of polyethylene resin, has a good appearance, and has the adhesive strength of copper foil and is stiff. It will be done.
以下、実施例および比較例を示す。Examples and comparative examples are shown below.
実施例 1
高密度ポリエチレン 85重量部、デカブロモジフエニ
ルエーテル 12重量部、三酸化アンチモン 3重量部
、ジクミルパーオキサイド0.85重量部を120〜1
30℃の熱ロール中で混練後、シート状に加工して、厚
さ0.28mmのシ一ト■を得た。Example 1 85 parts by weight of high-density polyethylene, 12 parts by weight of decabromodiphenyl ether, 3 parts by weight of antimony trioxide, and 0.85 parts by weight of dicumyl peroxide were added to 120 to 1 parts by weight of dicumyl peroxide.
After kneading in a heated roll at 30°C, the mixture was processed into a sheet to obtain a sheet (2) with a thickness of 0.28 mm.
このシ一ト■を、有機チタネート処理を施したガラス布
■に熱圧着させて、樹脂含量 58wt%の複合シート
■を得た。This sheet (2) was thermocompressed onto a glass cloth (2) treated with organic titanate to obtain a composite sheet (2) having a resin content of 58 wt%.
前述のシート■にメチルエチルケトン 75重量部に2
・2−ビス(4−シアナートフエニル)プロパン 20
重量部、ビス(4−マレイミドフエニル)メタン 5重
量部、オクチル酸亜鉛0.2重量部を溶解させたシアン
酸エステル溶液を含浸させ、120℃、10分間乾燥し
て、シアン酸エステル被覆シート(付着量:18g/m
2)■を得た。Add 2 to 75 parts by weight of methyl ethyl ketone to the sheet ■ mentioned above.
・2-bis(4-cyanatophenyl)propane 20
parts by weight, 5 parts by weight of bis(4-maleimidophenyl)methane, and 0.2 parts by weight of zinc octylate were impregnated with a cyanate ester solution and dried at 120°C for 10 minutes to obtain a cyanate ester-coated sheet. (Amount of adhesion: 18g/m
2) ■ was obtained.
これら■、■、■をそれぞれ第4図におげる43,44
,42に対応させ、■を4枚用いて温度200℃、圧力
30kg/cm2で2時間積層成型し、厚さ1.6m
mの銅張積層板を得た。These ■, ■, and ■ are shown in Figure 443 and 44, respectively.
, 42, and laminated and molded 4 sheets of ■ at a temperature of 200℃ and a pressure of 30kg/cm2 for 2 hours to a thickness of 1.6m.
A copper-clad laminate with a diameter of m was obtained.
この積層板の物性を表1に示した。Table 1 shows the physical properties of this laminate.
実施例 2
高密度ポリエチレン 70重量部、パークロロペンタシ
クロドデカン 25重量部、三酸化アン3.5重量部を
120〜130℃の熱ロール中で混練後、シート状に加
工して、厚さ0.24mmのシート■を得た。Example 2 70 parts by weight of high-density polyethylene, 25 parts by weight of perchloropentacyclododecane, and 3.5 parts by weight of ammonium trioxide were kneaded in a heated roll at 120 to 130°C, and processed into a sheet with a thickness of 0. A sheet ■ of .24 mm was obtained.
このシート■に、アセトン 60重量部に2・2−ビス
(4−シアナートフエニル)プロパンのプレポリマー(
数平均分子量 500〜550)40重量部を溶解させ
たシアン酸エステル溶液を含浸させ、100℃、5分間
乾燥して、シアン酸エステル被覆シート(付着量:55
g/m2)■を得た。On this sheet ■, 60 parts by weight of acetone and a prepolymer of 2,2-bis(4-cyanatophenyl)propane (
A cyanate ester-coated sheet (adhering amount: 55
g/m2)■ was obtained.
かくして得られたシアン酸エステル被覆シ一ト■とエポ
キシシラン処理を施したガラス布■を、それぞれ第3図
における32,33に対応させ、6組用いて、温度 1
80℃、圧力 50kg/cm2で2時間積層成型し、
厚さ1.6mmの銅張積層板を得た。Six sets of the thus obtained cyanate ester-coated sheets (■) and epoxy silane-treated glass cloths (corresponding to numbers 32 and 33 in FIG. 3) were used at a temperature of 1.
Laminated molding was carried out for 2 hours at 80°C and a pressure of 50kg/cm2.
A copper-clad laminate with a thickness of 1.6 mm was obtained.
この積層板の物性を表1に示した。実施例 3
低密度ポリエチレン 70重量部、パークロロペンタシ
クロドデカン 25重量部、三酸化アンチモン 5重量
部、t−プチルジクミルパーオキサイド 2.1重量部
を110〜120℃の熱ロール中で混練後、シート状に
加工して、厚さ0.3mmのシート■を得た。Table 1 shows the physical properties of this laminate. Example 3 After kneading 70 parts by weight of low density polyethylene, 25 parts by weight of perchloropentacyclododecane, 5 parts by weight of antimony trioxide, and 2.1 parts by weight of t-butyl dicumyl peroxide in a heated roll at 110 to 120°C. , it was processed into a sheet shape to obtain a sheet (■) with a thickness of 0.3 mm.
このシート■に、アセトン95重量部に2・2−ビス(
4−シアナートフエニル)プロパン 5重量部を溶解さ
せたシアン酸エステル溶液を含浸させ、80℃、10分
間乾燥して、シアン酸エステル被覆シート(付着量:3
.2g/m2)■を得た。Add 2,2-bis(
It was impregnated with a cyanate ester solution in which 5 parts by weight of 4-cyanatophenyl)propane was dissolved and dried at 80°C for 10 minutes to form a cyanate ester-coated sheet (adhesion amount: 3
.. 2g/m2)■ was obtained.
一方、前述のシ一ト■を、有機チタネート処理を施した
ガラス布に熱圧着させて、樹脂含量60wt%複合シー
ト■を得、この■を5枚重ねて、温度 170℃、圧力
10kg/cm2で2時間積層成型し、厚さ1.3m
mの積層板■※を得た。On the other hand, the above-mentioned sheet (■) was thermocompressed onto a glass cloth treated with organic titanate to obtain a composite sheet (2) with a resin content of 60 wt%, and five sheets of this (■) were stacked at a temperature of 170°C and a pressure of 10 kg/cm2. Laminated and molded for 2 hours to a thickness of 1.3m.
A laminated plate ■* of m was obtained.
この積層板■※の表面に、シアン酸エステル被覆シ一ト
■を配し、その上に銅箔を重ね、温度170℃、圧力
10kg/cm2で2時間成型し、厚さ1.6mmの銅
張積層板を得た。A cyanate ester-coated sheet ■ is placed on the surface of this laminated board ■※, and a copper foil is placed on top of it at a temperature of 170℃ and a pressure
Molding was carried out for 2 hours at 10 kg/cm2 to obtain a copper-clad laminate having a thickness of 1.6 mm.
この積層板の物性を表1に示した。Table 1 shows the physical properties of this laminate.
比較例 1
実施例20シート■、ガラス布■を、実施例2と同様に
してプレス成型を行い、厚さ1.6mmの銅張積層板を
得た。Comparative Example 1 Example 20 Sheet (1) and glass cloth (2) were press-molded in the same manner as in Example 2 to obtain a copper-clad laminate having a thickness of 1.6 mm.
この積層板の物性を表1に示す。※ JIS K−69
12による。Table 1 shows the physical properties of this laminate. *JIS K-69
According to 12.
表1に示した物性から、本発明の銅張積層板は、変性ポ
リエチレン樹脂積層板の特徴を損う事なく、その短所を
改善している事は明白である。From the physical properties shown in Table 1, it is clear that the copper-clad laminate of the present invention improves the disadvantages of the modified polyethylene resin laminate without impairing its characteristics.
第1図〜第4図は本発明の被覆シートを用いた積層板製
造の積層材の配置例である。
図中の番号はそれぞれ
1,21,31,41:銅箔、2,22,32,42:
両面被覆シート、3,23,33,43:基材、44:
積層材を示す。FIGS. 1 to 4 show examples of the arrangement of laminates in the production of laminates using the coating sheet of the present invention. The numbers in the figure are 1, 21, 31, 41: copper foil, 2, 22, 32, 42:
Double-sided coating sheet, 3, 23, 33, 43: Base material, 44:
Laminated material is shown.
Claims (1)
エステル系樹脂組成物を被覆してなる熱硬化可能なシア
ン酸エステル被覆シート。 2 前記シアン酸エステル被覆シート、基材、および銅
箔を重層して積層成形することを特徴とする銅張積層板
の製造法。[Scope of Claims] 1. A heat-curable cyanate ester-coated sheet comprising a heat-curable modified polyethylene sheet coated with a cyanate ester-based resin composition. 2. A method for manufacturing a copper-clad laminate, which comprises laminating and molding the cyanate ester-coated sheet, the base material, and the copper foil.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53145035A JPS587462B2 (en) | 1978-11-24 | 1978-11-24 | Manufacturing method of coating sheet and copper clad laminate |
| DE19792947112 DE2947112A1 (en) | 1978-11-22 | 1979-11-22 | Curable preimpregnate esp. for laminated printed circuit board mfr. - consists of curable polyethylene with thermosetting resin coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53145035A JPS587462B2 (en) | 1978-11-24 | 1978-11-24 | Manufacturing method of coating sheet and copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5571554A JPS5571554A (en) | 1980-05-29 |
| JPS587462B2 true JPS587462B2 (en) | 1983-02-09 |
Family
ID=15375889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53145035A Expired JPS587462B2 (en) | 1978-11-22 | 1978-11-24 | Manufacturing method of coating sheet and copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587462B2 (en) |
-
1978
- 1978-11-24 JP JP53145035A patent/JPS587462B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5571554A (en) | 1980-05-29 |
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