JPS5911385B2 - flux supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for supplying flux to 15 soldering points prior to soldering.

Conventionally, in the automatic soldering process, various methods have been used to apply flux to the soldering points, such as spraying and roller coating methods. There are problems such as changes in flux concentration, contamination of the working environment, and difficulty in maintenance management.

The present invention proposes a new and effective flux supply device devised to solve these conventional problems.

The present invention will be described in detail below with reference to embodiments shown in the drawings.

In Figure 1, 1 is a flux storage tank x, which is filled with flux F3 using an alcoholic solvent (for example, isopropyl alcohol) as a solvent, but this flux F8 is volatile. Therefore, it is sealed with a lid 2 as shown in the figure.

Reference numeral 3 denotes a cylindrical body provided on a portion 35 of the lid 2, and forms the opening 4 of the flux reservoir tank 1.

5 is a flux storage tank, and its upper lid 6 has an extremely small hole 7 with a diameter of about IU;
The holes 7 allow outside air to enter the space 8 as the internal flux Fl gradually moves downward, thereby preventing a drop in the air pressure in the space 8 and smoothing the dripping of the flux, which will be described later.

On the other hand, in this storage tank, since the holes 7 are small, volatilization of the flux is avoided. Flux F1 in storage tank 5
is dripped into the flux storage tank 1 through the first and second dripping devices 9 and 10 and the pipe 11. A stopper (not shown) is disposed at the joint between the first drip device 9 and the second drip device 10, so it is necessary to keep this stop open during use. The diameter of the pipe 12 for dripping from the storage tank 5 to the first drip device 9 is relatively large, and the diameter of the pipe 13 for dripping to the second drip device 10 is small. accumulates. On the other hand, regarding the second drip device 10, the diameter of the pipe 13 is small and the pipe 11 leading to the flux storage tank 1 is
Due to the large diameter, flux does not accumulate. When the amount in the flux storage tank 1 exceeds a certain level, 14 overflows the flux into the overflow tank 15.
Flux F4 accumulated in tank 15
is reused after adjusting its viscosity.

Reference numeral 16 is a flux application pin that deposits an appropriate amount of flux in the varnish storage tank 1 and brings it out to the outside. There is.

One end of this spring 18 is fixed to the guide 17, and the other end is fixed to the guide 17. By being fixed to the top of the ring 16,
The aforementioned biasing force is exerted on the pin 16. 19
is a bundle for adjusting the fixed position of the guide 17. By loosening this bundle, the guide 17 can be removed), and the vertical position of the guide 17 can be changed, and by tightening the bundle, the guide 17 can be adjusted. It can be fixed.

The position adjustment of the guide 17 corresponds to the adjustment of the tip position of the pin 16 placed in the flux storage tank 1. and pin 16
The amount of flux brought out (therefore, the amount of flux applied to the soldering area) changes depending on the depth a (see Figure 2) into which the flux F is immersed.Then, the position of the guide 17 is adjusted. is used to adjust the amount of flux applied. Reference numeral 20 is a cover means provided in the middle of the pin 16, and this cover means 20 serves to close the upper end of the cylinder 3. 16 is inserted into the tank 1, evaporation of the flux F in the tank 1 can be prevented.

This lid means 20 has an umbrella shape, for example, as shown in FIG. Therefore, in addition to the advantage of absorbing variations in dimensions and strokes, there is also the advantage that there is no risk of swelling due to flux. On the other hand, if the lid means is made of metal, it cannot absorb the stroke, so when adjusting the release of the flux applying pin 16 to the flux 1 using the handle 19, the position where it hits the cylinder 3 is Since there is a possibility that the lid cannot be moved further toward the tank 1 side, in that case, it is necessary to attach the lid means 20 to the pin 16 so that its position can be changed. Reference numeral 21 denotes a movable body that holds the guide 17, etc., and is movable in the vertical direction, and also movable in the horizontal direction when the pin 16 is taken out from the flux storage tank 1. As shown in FIG. 1, the tip of the pin 16 is guided to the soldering position of the printed circuit board 23 so that flux F can be applied.

Therefore, the upper side of the shaft 22 constituting the moving body 20 is connected to an air cylinder (not shown). According to the present invention, the flux F2 is dripped into the 7lux storage tank 1 from a drip device, and the flux F2 in the tank is
, exceeds a certain level, this is transferred to the overflow tank 15.
The flux F in the flux storage tank is guided to
Since it is configured to always maintain a constant amount of flux, by setting the tip of the flux application pin at a predetermined position, a constant amount of flux can always be taken out from the flux storage tank 1. The variation in coating amount can be made extremely small compared to the flux supply device shown in FIG.

Further, according to the present invention, an opening 4 is provided in the flux storage tank 1, and a flux application pin 16 is moved to attach a small amount of flux F3 in the tank for soldering and to carry it out from the tank. Since the device is provided with a lid means for closing the opening when inserting the device, volatilization of the flux in the flux storage tank 1 is prevented.
The effect is particularly great when not in use (for example, at night in a factory).

Therefore, the flux concentration does not change (particularly, the effect is further enhanced by using the dripping device and overflow means as described above), so the viscosity of the flux is kept constant and maintenance is easy. Therefore, if adopted in automatic soldering equipment, it can greatly contribute to stabilizing soldering quality.

[Brief explanation of drawings]

The drawings are all related to the present invention; - Figure 1 is a schematic diagram of a flux supply device implementing the present invention, Figure 2 is an explanatory diagram thereof, and Figure 3 is a drawing showing the main parts. be. 1...Flux storage tank, 3...
Cylindrical body, 4... Opening, 9... First drip device, 10... Second drip device, 15...
・Overflow tongue length 16...Flux application pin, 18...Spring, 20...
Lid means, 21... moving body, Fl, F2, F3,
F4...Flux.

Claims (1)

[Claims] 1. Dripping flux from a dripping device into a flux storage tank, and when the flux in the tank exceeds a certain level, guides the flux to an overflow tank to maintain the flux in the flux storage tank at a constant level. The flux storage tank is configured to have an opening, and when inserted into a flux application pin which is moved to deposit a small amount of flux in the tank and bring it out of the tank for soldering. A flux supply device provided with a lid means for covering the opening. 2. The flux supply according to claim 1, wherein the opening has a cylindrical body, and the lid means is configured to lock onto the upper end of the cylindrical body when a flux application pin is inserted. Device. 3. The flux according to claim 1, wherein the flux application pin is supported by a movable body that can move vertically and also move horizontally when pulled out from the tank. Feeding device. 4. The flux supply device according to claim 3, wherein the application pin is urged downward by a spring. 5. The flux supply device according to claim 4, wherein the lid means is made of fluorine rubber.