JPS5914560B2 - Barrel plating device - Google Patents
Barrel plating deviceInfo
- Publication number
- JPS5914560B2 JPS5914560B2 JP12794776A JP12794776A JPS5914560B2 JP S5914560 B2 JPS5914560 B2 JP S5914560B2 JP 12794776 A JP12794776 A JP 12794776A JP 12794776 A JP12794776 A JP 12794776A JP S5914560 B2 JPS5914560 B2 JP S5914560B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- drum
- cylindrical body
- barrel plating
- plating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
この発明はサイズの小さな機械部品、アクセサ5 りー
類をめつきする場合に用いられるバレルめつき装置に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a barrel plating device used for plating small-sized mechanical parts and accessories.
従来、この種のバレルめつき装置として、被めつき物を
収容し、周壁に多数の小孔を穿設した六面筒状のドラム
をめつき浴中に浸漬させ、該ドラ10 ム内に陰極リー
ド線を導入するとともに、該ドラムの両側に陽極を配置
させた装置が知られている。Conventionally, in this type of barrel plating device, a hexagonal cylindrical drum containing the object to be plated and having a large number of small holes in the peripheral wall is immersed in a plating bath, and a drum 10 is placed inside the drum. Devices are known in which a cathode lead wire is introduced and anodes are placed on both sides of the drum.
この場合、ドラムはゆつくわ回転(3〜5に、p、m)
され、これによつて被めつき物も回転しながらゆつくわ
めつきされる(0.1〜1A/ d771″程度)。1
5このような従来のバレルめつき装置はサイズの小さな
部品等を一度に数多くめつきできるという利点があるが
、以下のような問題点がある。In this case, the drum rotates slowly (from 3 to 5, p, m)
As a result, the covered object is also rotated and subjected to a gentle vibration (approximately 0.1 to 1 A/d771").1
5. Although such conventional barrel plating devices have the advantage of being able to plate many small-sized parts at once, they have the following problems.
すなわち、1めつき時間が引掛け法に較べて数倍長くな
る、2めつき層の厚みむらが大きくなる、3め20つき
不完全な部分が生じ収率が悪い、4高電圧の割には低電
流であり液抵抗が大きい、5液抵抗のため、めつき時に
浴温の上昇がみられ電着条件が変化する、6ドラム内で
発生したガスを抜くことが困難となる。25このような
問題のため、従来のバレルめつきの利用分野は厚みむら
をそれほど気にしなくてよいアクセサリ−類、針、ネジ
類の装飾めつき、下地めつき等に限られていた。Namely, the first plating time is several times longer than that of the hooking method, the second plating layer becomes more uneven in thickness, the third plating layer has incomplete parts and the yield is poor, and the fourth method is high voltage. Because of the low current and high liquid resistance, the bath temperature rises during plating and the electrodeposition conditions change, and it is difficult to remove the gas generated in the drum. 25 Because of these problems, the fields of application of conventional barrel plating have been limited to decorative plating of accessories, needles, screws, etc., and base plating, where thickness unevenness is not a big concern.
この発明は上述のような従来のバレルめつき装3装置の
諸欠点を除去することを目的としてなされたもので、内
壁に陽極層を被着した外側筒体と、該筒体内壁との間に
空隙を形成するようにして該外側筒体内に同軸的に設け
られ、周壁および両端にめつき液を通過させる多数の小
孔を有する、被め35つき物を収容するための内側筒体
とからなるドラムと;上記内側筒体内に導入され、被め
つき物と接触するようにした陰極部材と;該ドラムを回
転させる手段と:めつき液をドラム内に通過させる輸液
手段とを具備することを特徴とするバレル装置を提供す
るものである。This invention was made for the purpose of eliminating the various drawbacks of the conventional barrel plating device 3 as described above, and the present invention is aimed at eliminating the various drawbacks of the conventional barrel plating device 3 as described above. an inner cylindrical body for accommodating an object with a cover 35, which is coaxially provided in the outer cylindrical body so as to form a void therein, and has a large number of small holes in the peripheral wall and both ends through which plating liquid passes; a drum consisting of; a cathode member introduced into the inner cylindrical body and brought into contact with the object to be plated; means for rotating the drum; and an infusion means for passing plating liquid into the drum. The present invention provides a barrel device characterized by the following.
以下、この発明を図示の具体例に基づいて説明する。Hereinafter, the present invention will be explained based on specific examples shown in the drawings.
図中1はドラムであり、第2図に示すように断面円形の
外側筒体2と断面六角形状の内側筒体3とからなり、こ
れら筒体間に空隙4が形成されている。外側筒体2はた
とえば塩化ビニル樹脂のような非導電性材料からなり、
その内壁にたとえばチタンのような陽極層5が被着され
ている。符号6は陽極の接点であつて、リング状をなし
陽極層と導通している。内側筒体3の周壁にはめつき液
を通過させる多数の小孔7(直径1〜5m0が設けられ
ている。なお、内側筒体3の内面は不溶性の陽極層、た
とえば白金めつきを施してもよく、その場合、陰極との
絶縁を図るため通気性非導電材料8、たとえばナイロン
布(厚さ1〜10!NOをその内側に施す。内側筒体の
両端には格子状(Ia,9bが設けられめつき液力咄在
に通過し得るようになつている。これら格子部材9a,
9bの中央を介して、対の陰極リード線10が内側筒体
3内に導入され、内側筒体3内に収容された被めつき物
11と接触するようになつている。In the figure, reference numeral 1 denotes a drum, and as shown in FIG. 2, it consists of an outer cylinder 2 with a circular cross section and an inner cylinder 3 with a hexagonal cross section, and a gap 4 is formed between these cylinders. The outer cylinder 2 is made of a non-conductive material such as vinyl chloride resin,
An anode layer 5, for example titanium, is applied to its inner wall. Reference numeral 6 is a contact point of the anode, which has a ring shape and is electrically connected to the anode layer. A large number of small holes 7 (1 to 5 m in diameter) are provided in the peripheral wall of the inner cylinder 3 to allow the plating liquid to pass through.The inner surface of the inner cylinder 3 is coated with an insoluble anode layer, such as platinum plating. In that case, a breathable non-conductive material 8, such as nylon cloth (thickness 1 to 10!NO), is applied on the inside to insulate the cathode. are provided so that the lattice members 9a,
A pair of cathode lead wires 10 are introduced into the inner cylindrical body 3 through the center of the inner cylindrical body 3 and come into contact with a plating object 11 housed within the inner cylindrical body 3.
ドラム1は両端部が支持部材12によつて軸支されてい
て、モータ13によつて回転し得るようになつている。
すなわち、複数の歯車14,15,16によつてドラム
1は適当速度で回転されるのである。ドラム1の両端に
はめつき液をドラム1内に導人し、またドラム1から排
出させるためのパイプ17,18がそれぞれ設けられて
いる。さらにドラム1のめつき液導入側には截頭円錐形
の分流管19が設けられていて、内側筒体3の周壁に設
けられた小孔7からのめつき液の噴出効果を促進するよ
うに考慮されている。このような構成からなるバレルめ
つき装置を用いてめつきをおこなう場合の操作について
以下説明する。The drum 1 is pivotally supported at both ends by support members 12 and can be rotated by a motor 13.
That is, the drum 1 is rotated at an appropriate speed by the plurality of gears 14, 15, and 16. Pipes 17 and 18 are provided at both ends of the drum 1, respectively, for guiding the plating liquid into the drum 1 and discharging it from the drum 1. Furthermore, a truncated conical branch pipe 19 is provided on the plating liquid introduction side of the drum 1 to promote the spouting effect of the plating liquid from the small hole 7 provided in the peripheral wall of the inner cylinder 3. is taken into account. The operation for plating using the barrel plating device having such a configuration will be described below.
まず、第3図に示すように、装置傾斜機構20によつて
、バレルめつき装置のめつき液排出側を上昇させる。First, as shown in FIG. 3, the plating liquid discharge side of the barrel plating device is raised by the device tilting mechanism 20.
なお、この場合、パイプ18とドラム1との連結をとり
はずし、かつ格子9bと内側筒体3との嵌合をとりはず
しておこなわれる。ついで、被めつき物11を適当量、
内側筒体3内に収容したのち、再び格子9bを内側筒体
3に装着し、バレルめつき装置を水平に戻し、パイプ1
8をドラム1と連結させる。つぎに、ポンプ22を始動
させてめつき液をパイプ17を介してドラム1内に導入
するとともにモータ13によつてドラム1を回転させる
。同時に接点6および陰極りード線9に通電する。ポン
プ22から送られるめつき液は分流管19によつて分流
され、一部は空隙4を通り、小孔7からドラム1中央へ
噴流する。この噴流めつき液によつて被めつき物21へ
絶えず新しいめつき液が供給される。そのため、高電流
密度での操業が可能となるとともに、めつき液の均一な
攪拌が生じ、これによつて電着むらがなくなわ、めつき
不良のおそれもなくなる。またドラム1の中央部を流れ
るめつき液は電解で生じたガスおよび電解によつて金属
イオン濃度が低下した噴流めつき液をパイプ18方向へ
排除し、ドラム1中央部近傍の被めつき物11の表面部
の撹拌効果を高める。めつき操作が終了したのち、第4
図に示すように送液パイプ17側を上昇させ格子9bを
取りはずせば、被めつき物11を容易に取り出すことが
できる。In this case, the connection between the pipe 18 and the drum 1 is removed, and the fitting between the lattice 9b and the inner cylindrical body 3 is removed. Next, apply an appropriate amount of the covering material 11,
After housing the pipe 1 in the inner cylinder 3, the grid 9b is attached to the inner cylinder 3 again, the barrel plating device is returned to the horizontal position, and the pipe 1 is
8 is connected to drum 1. Next, the pump 22 is started to introduce the plating liquid into the drum 1 through the pipe 17, and the drum 1 is rotated by the motor 13. At the same time, the contact 6 and the cathode lead wire 9 are energized. The plating liquid sent from the pump 22 is divided by the flow dividing pipe 19, and a portion passes through the gap 4 and is jetted from the small hole 7 to the center of the drum 1. This jet of plating liquid constantly supplies new plating liquid to the object 21 to be plated. Therefore, operation at high current density is possible, and the plating solution is uniformly stirred, thereby eliminating uneven electrodeposition and eliminating the risk of poor plating. In addition, the plating liquid flowing through the center of the drum 1 removes the gas generated by electrolysis and the jet plating liquid whose metal ion concentration has been reduced by the electrolysis toward the pipe 18, and removes the plating liquid near the center of the drum 1. The stirring effect of the surface portion of No. 11 is enhanced. After the plating operation is completed, the fourth
As shown in the figure, by raising the liquid feeding pipe 17 side and removing the grid 9b, the stuck object 11 can be easily taken out.
なお、この装置では不溶性の陽極を用いているため、電
鋳が進行するにつれ、電解液のPHおよび金層イオンが
低下することがある。そのような場合は予備槽23に必
要な調整試薬を供給すればよい。この発明に係わる装置
において、ドラム1の回転速度は5〜10r.p.m程
度が適当であり、回転速度が遅すぎると電着ムラ、また
、速すぎるとめつき不良の原因となる。Note that since this device uses an insoluble anode, as electroforming progresses, the pH of the electrolyte and the gold layer ions may decrease. In such a case, the necessary adjustment reagent may be supplied to the preliminary tank 23. In the apparatus according to the present invention, the rotational speed of the drum 1 is 5 to 10 rpm. p. A suitable rotation speed is about m. If the rotation speed is too slow, it will cause uneven electrodeposition, and if it is too fast, it will cause poor plating.
電流密度は従来法の数十倍とすることが可能であり、貴
金層めつきの場合は1〜5A/DmZニツケル、銅等に
ついては5〜20A/dイ程度である。ドラムへ送り込
むめつき液の流速はドラム中央部で0.5〜5m/Se
cl程度が好ましい。ドラム内に導入される陰極りード
線の本数については特に制限はなく、内側筒体の容積の
大きさに応じて適宜決定すればよい。なお、バレルめつ
き装置を傾斜させる手段としては第3図、第4図に示す
ものに限らず、その他任意の手段を適宜選択し得る。こ
の発明に係わるバレルめつき装置はバレル槽内に急速流
(0.5〜5m/Sec)でめつき液を送り込む方式を
採用しているので、従来のようにバレルめつき装置をめ
つき液中に浸漬させる必要がない。The current density can be several tens of times higher than that of the conventional method, and is about 1 to 5 A/DmZ for precious metal plating, and about 5 to 20 A/d for copper. The flow velocity of the plating liquid sent to the drum is 0.5 to 5 m/Se at the center of the drum.
About cl is preferable. The number of cathode lead wires introduced into the drum is not particularly limited, and may be appropriately determined depending on the volume of the inner cylinder. Note that the means for tilting the barrel plating device is not limited to those shown in FIGS. 3 and 4, and any other means may be selected as appropriate. Since the barrel plating device according to the present invention adopts a method of feeding the plating liquid into the barrel tank with a rapid flow (0.5 to 5 m/Sec), the barrel plating device is No need to soak it in.
したがつて従来のように、バレルめつき槽引上げ時にめ
つき液を汲み出すことがなくなり、めつき液の損失を防
止することができる。また、めつき液の一部をバレル槽
(ドラム)中央に流し、めつき液の一部をドラム周壁部
より噴出させるようにしたから、被めつき物への金属イ
オンの供給を十分におこなうことができ、高電流密度で
の操業が可能となV1さらにめつき液の十分な攪拌作用
がもたらされ、めつき層も均一な厚みのものとなる。ま
た、ドラム中央部を流れるめつき液の平行流は疲労した
めつき液、発生ガスを除去促進するので、めつき効率を
高めることができる。さらにドラム内壁に陽極を配置し
、極間距離を小さくしたため、電解液を急速に流すこと
と相俟て液抵抗を小にし、高電流密度での操業を可能に
し、めつき不良等の防止を図ることができる。なお、こ
の発明によれば、めつき速度は前述の従来のものよりも
5〜20倍に高めることができる。そのほか、この発明
によれば陽極面積を大きくすることができるので、一度
に大量のめつき処理することもできる。この発明の適用
できるめつきの種類としては従来同様、金、銀、白金、
ロジウム、クロム、ニツケル等であり。Therefore, the plating solution does not have to be pumped out when the barrel plating tank is pulled up, unlike in the prior art, and loss of the plating solution can be prevented. In addition, a portion of the plating liquid is flowed into the center of the barrel tank (drum), and a portion of the plating liquid is ejected from the peripheral wall of the drum, ensuring a sufficient supply of metal ions to the object to be plated. V1, which enables operation at high current density, provides sufficient agitation of the plating solution, and provides a uniform thickness of the plating layer. Further, the parallel flow of the plating liquid flowing through the center of the drum promotes the removal of tired plating liquid and generated gas, so that the plating efficiency can be improved. In addition, the anode is placed on the inner wall of the drum to reduce the distance between the electrodes, which allows the electrolyte to flow rapidly, reduces liquid resistance, enables operation at high current density, and prevents defects such as plating. can be achieved. In addition, according to this invention, the plating speed can be increased 5 to 20 times as compared to the above-mentioned conventional method. In addition, according to the present invention, since the anode area can be increased, a large amount of plating can be performed at one time. The types of plating to which this invention can be applied are gold, silver, platinum,
Rhodium, chromium, nickel, etc.
各種装飾めつきのほか、寸法精度が要求される機能めつ
きにも適用することが可能である。実施例 1
ドラム容積1500Cfitの第1図ないし第4図に示
すバレルめつき装置を使用してしんちゆう材質のネクタ
イピンに酸性金めつき(シアン化金カリウム201/t
1クエン酸307/t1クエン酸カリウム190y/t
)を施した。In addition to various types of decorative plating, it can also be applied to functional plating that requires dimensional accuracy. Example 1 Acid gold plating (potassium gold cyanide 201/t) was applied to a necktie pin made of solid wood using a barrel plating device shown in FIGS. 1 to 4 with a drum capacity of 1500 Cfit.
1 citric acid 307/t1 potassium citrate 190y/t
) was applied.
なお、ネクタイピンは表面積が0.1dm”のものであ
り、これを40個、内側筒体3内に収容してめつきをお
こなつた。電着条件は筒体3中央部の流速1m/Sec
.ドラム回転速度5r.p.rn.電流密度2A/dイ
(効率95%)、PH5.2、浴温60℃、めつき厚さ
3μであつた。その結果を従来法と比較した結果、電流
密度は約20倍であり、めつき時間も20分10秒と著
るしく短縮することができ、か2従来のようなめつき不
良は全く見られず、収率は100%であつた。Note that the tie pins have a surface area of 0.1 dm, and 40 of them were housed in the inner cylinder 3 for plating.The electrodeposition conditions were a flow rate of 1 m/m/cm at the center of the cylinder 3. Sec
.. Drum rotation speed 5r. p. rn. The current density was 2 A/d (efficiency 95%), the pH was 5.2, the bath temperature was 60° C., and the plating thickness was 3 μm. Comparing the results with the conventional method, the current density was approximately 20 times higher, the plating time was significantly shortened to 20 minutes and 10 seconds, and (2) there were no plating defects as in the conventional method. The yield was 100%.
実施例 2
ドラム容積2000cTi1の第1図ないし第4図に示
すバレルめつき装置た使用して、しんちゆう材質のカメ
ラ部品の小ビス(長さ1.5m7!L)の下地光沢ニツ
ケルめつき(硫酸ニツケル3007/t1塩化ニツケル
70v/t1硼酸40f/t)をおこなつた。Example 2 Using the barrel plating device shown in FIGS. 1 to 4 with a drum volume of 2000 cTi1, glossy nickel plating was applied to the base of small screws (length 1.5 m7!L) of camera parts made of solid material. (Nickel sulfate 3007/t1 Nickel chloride 70v/t1 Boric acid 40f/t) was carried out.
電着条件は筒体3中央部の流速0.8m/Seclドラ
ム回転速度8r.p.m1電流密度12A/Dm”(効
率97%)、PH4O、浴温60℃、めつき厚さ10μ
であつた。このときの従来法(1A/Dm“程度)の約
12倍であり、めつき時間も従来よりも大巾に短縮され
、4分であつた。The electrodeposition conditions were a flow rate of 0.8 m/sec at the center of the cylinder 3 and a drum rotation speed of 8 r. p. m1 current density 12A/Dm" (efficiency 97%), PH4O, bath temperature 60℃, plating thickness 10μ
It was hot. The plating time was approximately 12 times that of the conventional method (approximately 1 A/Dm"), and the plating time was also significantly shortened to 4 minutes.
電着状?もニツケルの被着が不完全な不良品あるいは突
起状の電着もなく、均一なめつき層を得ることができた
。Electrodeposited? However, a uniform plated layer could be obtained without defective products with incomplete nickel deposition or with no protruding electrodeposition.
第1図はこの発明に係わるバレルめつき装置の断面図、
第2図は第1図の−線に沿う断面図、第3図および第4
図は第1図に示すバレルめつき装置の使用態様を示す側
面図である。
以下、図中に示す符号について説明する。
1・・・ドラム、2・・・外側筒体、3・・・内側筒体
、4・・・間隙、5・・・陽極層、7・・・小孔、8・
・・通気性非導電層、9a,9b・・・格子板、10・
・・陰極リード線、11・・・被めつき物、13・・・
モータ、14,15,16・・・歯車、17,18・・
・パイプ、19・・・分流管、20・・・傾斜機構、2
2・・・ポンプ。FIG. 1 is a sectional view of a barrel plating device according to the present invention;
Figure 2 is a sectional view taken along the - line in Figure 1, Figures 3 and 4.
This figure is a side view showing how the barrel plating device shown in FIG. 1 is used. The symbols shown in the figures will be explained below. DESCRIPTION OF SYMBOLS 1... Drum, 2... Outer cylinder, 3... Inner cylinder, 4... Gap, 5... Anode layer, 7... Small hole, 8...
... Breathable non-conductive layer, 9a, 9b... Grid plate, 10.
... Cathode lead wire, 11... Covering material, 13...
Motor, 14, 15, 16...Gear, 17, 18...
・Pipe, 19... Diversion pipe, 20... Incline mechanism, 2
2...Pump.
Claims (1)
の間に空隙を形成するようにして該外側筒体内に同軸的
に設けられ、周壁および両端にめつき液を通過させる多
数の小孔を有する、被めつき物を収容するための内側筒
体とからなるドラムと;上記内側筒体内に導入され、被
めつき物と接触するようにした陰極部材と;該ドラムを
回転させる手段と;めつき液をドラム内に通過させる輸
液手段とを具備することを特徴とするバレルめつき装置
。 2 内側筒体はその内面に不溶性陽極層が形成されてお
り、さらに通気性非導電性材料からなる陰極部との絶縁
層が形成されていることを特徴とする特許請求の範囲第
1項記載のバレルめつき装置。 3 内側筒体は少なくともその一端が着脱自在な多孔板
で構成されていることを特徴とする特許請求の範囲第1
あるいは2項記載のバレルめつき装置。 4 内側筒体はめつき液導入側端部に截頭円錐形の分流
管が設けられていることを特徴とする特許請求の範囲第
1、2あるいは3項記載のバレルめつき装置。 5 外側筒体は断面円形をなし、内側筒体は断面多角形
をなし、その角部が外側筒体の内壁と密着していること
を特徴とする特許請求の範囲第1、2、3あるいは4項
記載のバレルめつき装置。[Scope of Claims] 1. An outer cylindrical body having an anode layer coated on its inner wall, and an outer cylindrical body provided coaxially within the outer cylindrical body so as to form a gap between the anode layer and the inner wall of the cylindrical body. an inner cylindrical body for accommodating an object to be plated and having a large number of small holes through which a plating solution passes; a cathode introduced into the inner cylindrical body and brought into contact with the object to be plated; A barrel plating device comprising: a member; a means for rotating the drum; and an infusion means for passing a plating liquid into the drum. 2. Claim 1, characterized in that the inner cylinder has an insoluble anode layer formed on its inner surface, and further an insulating layer with the cathode part made of a breathable non-conductive material. barrel plating device. 3. Claim 1, wherein at least one end of the inner cylindrical body is composed of a removable perforated plate.
Alternatively, the barrel plating device described in item 2. 4. The barrel plating device according to claim 1, 2 or 3, wherein a truncated conical branch pipe is provided at the end of the inner cylinder on the plating liquid introduction side. 5. Claims 1, 2, 3 or 5, wherein the outer cylinder has a circular cross section, the inner cylinder has a polygonal cross section, and the corners thereof are in close contact with the inner wall of the outer cylinder. Barrel plating device according to item 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12794776A JPS5914560B2 (en) | 1976-10-25 | 1976-10-25 | Barrel plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12794776A JPS5914560B2 (en) | 1976-10-25 | 1976-10-25 | Barrel plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5352246A JPS5352246A (en) | 1978-05-12 |
| JPS5914560B2 true JPS5914560B2 (en) | 1984-04-05 |
Family
ID=14972563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12794776A Expired JPS5914560B2 (en) | 1976-10-25 | 1976-10-25 | Barrel plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5914560B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124359U (en) * | 1987-02-09 | 1988-08-12 | ||
| JPS63140858U (en) * | 1987-03-06 | 1988-09-16 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7591437B2 (en) * | 2021-03-11 | 2024-11-28 | Tdk株式会社 | Plating barrel and barrel plating equipment |
-
1976
- 1976-10-25 JP JP12794776A patent/JPS5914560B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124359U (en) * | 1987-02-09 | 1988-08-12 | ||
| JPS63140858U (en) * | 1987-03-06 | 1988-09-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5352246A (en) | 1978-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4647345A (en) | Metallurgical structure control of electrodeposits using ultrasonic agitation | |
| US2549678A (en) | Method of and apparatus for electroforming metal articles | |
| US4529486A (en) | Anode for continuous electroforming of metal foil | |
| GB2198748A (en) | Plating a layer of platinum black | |
| JPS5914560B2 (en) | Barrel plating device | |
| US3878062A (en) | Electroplating apparatus and method | |
| US3915832A (en) | Electroplating apparatus for forming a nonuniform coating on workpieces | |
| JPS62133097A (en) | Apparatus for plating semiconductor wafer | |
| JPH06170648A (en) | Surface treating device for workpiece | |
| US4010083A (en) | Method of local electroplating of strip material | |
| US1322494A (en) | Electrolytic method | |
| JPH0441698A (en) | Electrolytic plating method and equipment and jigs used therein | |
| US3436322A (en) | Plating apparatus and process | |
| US3692638A (en) | Process for supporting and nonuniformly treating articles | |
| JP3884150B2 (en) | High speed plating apparatus and high speed plating method | |
| JP2004244693A (en) | Apparatus for manufacturing metallic fiber using electroforming technique and method for the same | |
| JP4378260B2 (en) | Wire saw manufacturing method and wire saw manufacturing apparatus | |
| JPS63195293A (en) | Method for removing adhered metal from conductor roll for horizontal electroplating equipment | |
| JPH03277475A (en) | Manufacture of electrodeposited grinding wheel | |
| JPH03134199A (en) | Method and device for plating wire | |
| JPS6339679B2 (en) | ||
| JPH0713312B2 (en) | Zinc electrolysis method and apparatus | |
| JP3275502B2 (en) | Method for manufacturing small objects by plating | |
| JPH0561359B2 (en) | ||
| JPH1192987A (en) | Plating liquid and electroplating method and articles using the same |