JPS5915088B2 - How to cut glass - Google Patents
How to cut glassInfo
- Publication number
- JPS5915088B2 JPS5915088B2 JP52032485A JP3248577A JPS5915088B2 JP S5915088 B2 JPS5915088 B2 JP S5915088B2 JP 52032485 A JP52032485 A JP 52032485A JP 3248577 A JP3248577 A JP 3248577A JP S5915088 B2 JPS5915088 B2 JP S5915088B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- cutting
- cut
- glass plate
- reflective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
【発明の詳細な説明】
本発明は相対せる上下ガラス板の一刀のみを、他に何ら
損傷を与えることなく切断できるようにしたガラスの切
断力法ζこ関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glass cutting force method that allows only one blade of opposing upper and lower glass plates to be cut without causing any damage to the others.
従来、ガラスの切断力法としては、種々の方法が提案さ
れている。Conventionally, various methods have been proposed as cutting force methods for glass.
即ち、■9機械的切断
(1)ガラスの引張り強度が弱いという機械的性質を利
用して表面に傷を入れ、傷の部分に引張り応力を与える
ことにより切断する方法。That is, (9) Mechanical cutting (1) A method of cutting by making scratches on the surface by making use of the mechanical property of glass, which has low tensile strength, and applying tensile stress to the scratched area.
(2)ダイヤモンド、カーホランダム、コランダム、金
剛砂等の砥粒を使用して切断する方法。(2) A cutting method using abrasive grains such as diamond, carholundum, corundum, and diamond sand.
2、火炎切断
(1)ガラスに傷をつけ、傷の部分を力り熱することに
よりクラックを進行させて切断する方法(クラックオフ
法)。2. Flame cutting (1) A method in which the glass is scratched and the crack is progressed by applying force to the scratched area and then cutting the glass (crack-off method).
(2)燃焼ガス等の熱源を利用してガラスを溶融あるい
は切断する方法(溶断法)
(3)レーザー、プラズマ、電子ビーム等の高熱源でガ
ラスを溶断する方法などがある。(2) A method of melting or cutting glass using a heat source such as combustion gas (fusion cutting method) (3) A method of melting or cutting glass using a high heat source such as a laser, plasma, or electron beam.
しかし、上述の方法はガラス一枚を切断したり或いは数
枚を重ね合せて同時に切断したり、ガラスチューブの切
断、アンプルの溶融等に利用することができるが1.接
着あるいは固定により一体化された二枚のガラスの中、
一方のガラスを全く損傷することなく他方のガラスを切
断する事は極めて困難であった。However, the above-mentioned method can be used to cut a single sheet of glass, cut several sheets of glass at the same time, cut glass tubes, melt ampoules, etc. Inside two pieces of glass that are glued or fixed together,
It was extremely difficult to cut one glass without damaging the other at all.
本発明は上記の点に鑑みてなされたもので、相対せる上
下ガラス板の一方のみを、他に伺ら損傷を与えることな
く切断できるガラスの切断方法を提供することを目的と
する。The present invention has been made in view of the above points, and it is an object of the present invention to provide a glass cutting method that can cut only one of the opposing upper and lower glass plates without causing any damage to the other glass plates.
以下、本発明の一実施例を図面を参照して説明する。Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第1図乃至第3図は共に本発明の一実施例を示し、図に
於てaはガラス切断前、bはカラス切断後の状態を表わ
す。1 to 3 show an embodiment of the present invention, and in the figures, a shows the state before the glass is cut, and b shows the state after the glass is cut.
又各図に於て同一部分には同一符号を以って示す。In each figure, the same parts are designated by the same reference numerals.
第1図に於て、1は上ガラス板、2は下ガラス板、3は
切断しないガラス板2内面に形成される反射膜で、この
反射膜はレーザー装置の光共振器の反射鏡に使用される
反射膜もしくは高純度のアルミニウム、金、銀等の金属
を蒸着した反射膜が用いられる。In Figure 1, 1 is an upper glass plate, 2 is a lower glass plate, and 3 is a reflective film formed on the inner surface of the uncut glass plate 2. This reflective film is used as a reflecting mirror of an optical resonator of a laser device. A reflective film made of aluminum, or a reflective film deposited with a high-purity metal such as aluminum, gold, or silver is used.
4は有機化合物もしくは低融点ガラス・フリット等の接
着剤で、この接着剤を用いて上下ガラス板1,2を一体
化する。4 is an adhesive such as an organic compound or a low melting point glass frit, and this adhesive is used to integrate the upper and lower glass plates 1 and 2.
又接着剤以外の何らかの固定手段を用いて上下ガラス板
を一体化しても良いことはもちろんである。It goes without saying that the upper and lower glass plates may be integrated using some fixing means other than adhesive.
5は下ガラス板2に設けた反射膜3に対向する上ガラス
板1の外方から照射されるレーザービームであり、この
レーザービーム5により上ガラス板1のみを溶融切断し
、下ガラス板2はレーサービーム5が反対膜3によって
反射されるため切断されず、従って上ガラス板1のみを
切断することができる。Reference numeral 5 denotes a laser beam irradiated from the outside of the upper glass plate 1 facing the reflective film 3 provided on the lower glass plate 2. This laser beam 5 melts and cuts only the upper glass plate 1, and the lower glass plate 2 Since the laser beam 5 is reflected by the opposite film 3, it is not cut, and therefore only the upper glass plate 1 can be cut.
切断した場合の状態図が第1図すに示される。A diagram of the state in the case of cutting is shown in FIG.
又ガラス切断用のレーザー装置として例えば炭酸ガスレ
ーザーなどが用いられる。Further, as a laser device for glass cutting, for example, a carbon dioxide laser is used.
第2図aは上下ガラス板1,2の内面に反射膜3を設け
た場合で、ガラス切断後の状態が同図すに示される。FIG. 2a shows a case where a reflective film 3 is provided on the inner surfaces of the upper and lower glass plates 1 and 2, and the state after the glass is cut is shown in the same figure.
第3図aは下ガラス板2の内面の2個所に反射膜3,3
を設けたもので、レーザービームにより切断されたガラ
ス切断後の状態が同図すに示される。Figure 3a shows reflective films 3, 3 on two places on the inner surface of the lower glass plate 2.
The figure shows the state of the glass after it has been cut by a laser beam.
上記したレーザービームはビームが細く切断位置が精確
で切断効果が極めて優れている。The above-mentioned laser beam has a narrow beam, accurate cutting position, and extremely excellent cutting effect.
以上説明した如く本発明ζこよれば、上下ガラス板の一
力のみを他力に何ら損傷を与えることなく切断できる様
にしたから、二枚のガラス板の中、−力のみを切断する
必要がある場合、例えば液晶、デジトロン、ECD(エ
レクトロミックディスプレイ)等の表示装置tこおいて
切断されないガラス板面に電極構造を形成する場合、あ
るいは切断されないガラス板面にLSIや回路配線部を
形成する場合等に採用して効果がある。As explained above, according to the present invention, it is possible to cut only one force of the upper and lower glass plates without causing any damage to the other force, so it is necessary to cut only the - force of the two glass plates. For example, when forming an electrode structure on the uncut glass plate surface of a display device such as a liquid crystal, digitron, or ECD (electromic display), or forming an LSI or circuit wiring part on the uncut glass plate surface. It is effective to use it in cases where
第1図a、bは本発明によるガラスの製造方法の一実施
例を示すガラス切断前及び切断後の側面図、第2図a、
bは同力法の他の実施例を示す側面図、第3図a +
bは同刀法の更に他の実施例を示す側面図である。
図中、1:上ガラス板、2:下ガラス板、3:反射膜、
4:接着剤、5:レーザービーム。1a and 1b are side views of the glass before and after cutting, showing an embodiment of the glass manufacturing method according to the present invention; FIGS. 2a and 2b are side views of the glass before and after cutting;
b is a side view showing another example of the same force method, Fig. 3a +
b is a side view showing still another embodiment of the same sword method. In the figure, 1: upper glass plate, 2: lower glass plate, 3: reflective film,
4: Adhesive, 5: Laser beam.
Claims (1)
し、上記上下ガラス板を接着剤又は固定手段を用いて一
体化し、上記反射膜に対向するガラス板の外力からレー
ザービームを照射して当該ガラス板を切断することを特
徴とするガラスの切断力法。1. Form a reflective film on the desired inner surfaces of the opposing upper and lower glass plates, integrate the upper and lower glass plates using adhesive or fixing means, and irradiate the reflective film with a laser beam from an external force on the glass plate facing the glass plate. A glass cutting force method characterized by cutting the glass plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52032485A JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52032485A JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53117010A JPS53117010A (en) | 1978-10-13 |
| JPS5915088B2 true JPS5915088B2 (en) | 1984-04-07 |
Family
ID=12360276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52032485A Expired JPS5915088B2 (en) | 1977-03-23 | 1977-03-23 | How to cut glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5915088B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215736A (en) * | 1988-02-20 | 1989-08-29 | Semiconductor Energy Lab Co Ltd | Cutting of thin glass plate |
| JP4742751B2 (en) * | 2005-08-30 | 2011-08-10 | セイコーエプソン株式会社 | Display panel, laser scribing method for display panel, and electronic device |
| JP4706570B2 (en) * | 2006-06-20 | 2011-06-22 | セイコーエプソン株式会社 | Substrate and method for dividing the same, electro-optical device and method for manufacturing the same, and electronic apparatus |
| JP4775313B2 (en) * | 2007-05-01 | 2011-09-21 | セイコーエプソン株式会社 | Laser cutting method |
-
1977
- 1977-03-23 JP JP52032485A patent/JPS5915088B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53117010A (en) | 1978-10-13 |
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