JPS5915379B2 - Molecular beam epitaxial growth equipment - Google Patents
Molecular beam epitaxial growth equipmentInfo
- Publication number
- JPS5915379B2 JPS5915379B2 JP4124677A JP4124677A JPS5915379B2 JP S5915379 B2 JPS5915379 B2 JP S5915379B2 JP 4124677 A JP4124677 A JP 4124677A JP 4124677 A JP4124677 A JP 4124677A JP S5915379 B2 JPS5915379 B2 JP S5915379B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular beam
- ejection cell
- epitaxial growth
- source material
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
本発明は、成分元素を噴出セルから分子線の形で噴出さ
せ、所定温度に熱した基板にあてて付着堆積させ結晶層
をエピタキシャル成長させるのに用いる分子線エピタキ
シャル成長装置の改良に関する。Detailed Description of the Invention The present invention relates to a molecular beam epitaxial growth apparatus used for epitaxially growing a crystal layer by ejecting component elements in the form of molecular beams from an ejection cell and depositing them on a substrate heated to a predetermined temperature. Regarding improvements.
従来、〒般に用いられている分子線エピタキシャル成長
装置としては、分子線を水平方向の前方べ噴出させる横
型と、分子線を垂直方向の上方へ噴出させる縦型とに大
別される。Conventionally used molecular beam epitaxial growth apparatuses are roughly divided into horizontal types that eject molecular beams horizontally forward and vertical types that eject molecular beams upwards in the vertical direction.
ところで、前記横型の分子線エピタキシャル成・ 長装
置は、取扱いの容易性等、その機能上で多くの特長を有
しているが、その反面、縦型では考えられない欠点を持
つている。By the way, the horizontal type molecular beam epitaxial growth apparatus has many functional features such as ease of handling, but on the other hand, it has drawbacks that cannot be considered with the vertical type.
即ち、噴出セルからの分子線強度は、噴出セルを加熱す
る温度が一定であれば、ソース物質の枯o 渇がない限
り、経時的な変化はない筈であるが、実際には、均熱型
と呼ばれている装置、例えば噴出セルの周囲に均等に加
熱ヒータを巻回したものであつても分子線強度の経時変
化を生じ、また、一旦降温して次なるエピタキシャル成
長を行なう5 為、前回と同じ設定温度まで昇温しても
分子線強度が同一にならない場合が生ずる。In other words, if the temperature at which the ejection cell is heated is constant, the molecular beam intensity from the ejection cell should not change over time unless the source material is depleted. Even with a device called a mold, such as one in which a heater is evenly wound around an ejection cell, the molecular beam intensity changes over time, and the temperature must be lowered before the next epitaxial growth5. Even if the temperature is raised to the same set temperature as the previous time, the molecular beam intensity may not be the same.
このような事が起ると、当然のことながら、エピタキシ
ャル成長させた結晶層の深さ方向及び面内方向の組成、
或いは結晶層の厚さ、或いは不純物濃度等に関す・0
る均一性、再現性を損なう結果になる。このような分子
線強度の変化に対して種々実験を行なつた結果、次のこ
とが判つた。従来、均熱型として知られている第1図a
に見られる如き装置、即ち、噴出セル1の周囲に加熱’
5 ヒータ2を均等に巻回したものの温度分布は同図b
に見られる如く、実際には均一にならず、中央部分が最
も高く、次いで後部、前部の順になつていて、オリフィ
スIAが在る前部が最も低くなつている。Naturally, when this happens, the composition in the depth direction and in-plane direction of the epitaxially grown crystal layer,
Or regarding the thickness of the crystal layer or the impurity concentration, etc.
This results in loss of uniformity and reproducibility. As a result of conducting various experiments on such changes in molecular beam intensity, the following was found. Figure 1a, conventionally known as the soaking type
A device like the one seen in
5 The temperature distribution of heater 2 evenly wound is shown in Figure b.
As can be seen in Figure 2, it is actually not uniform; the central part is the highest, followed by the rear, then the front, and the front, where the orifice IA is located, is the lowest.
そして、横型では縦型に比較し、位置関■0 係の僅か
なずれで噴出セル内のソース物質が容易に移動し、しか
も、溶融した場合には、当初、噴出セルの後部に在つた
ものが、前記温度分布の影響でオリフィスIAの近傍に
熱的に輸送されてしまう。噴出セル内でソース物質の占
める位置が後35部、中央部分、前部と変化したのでは
、当然、その都度分子線強度も変化する。特に、ソース
物質がオリフィスIA近傍に滞留した場合には、通常、
オリフイス1Aに対する法線方向のやや下方に最も高い
強度を有する分子線強度分布が変つてしまい、全く予想
がつかなくなる。本発明は、分子線エピタキシヤル成長
装置に簡単な改変を加えることに依り分子線強度を常に
一定に維持きせるようにするものであり、以下これを詳
細に説明する。In the horizontal type, compared to the vertical type, the source material inside the ejection cell can easily move due to a slight deviation in the positional relationship, and when it melts, the source material that was initially at the rear of the ejection cell can move easily. is thermally transported to the vicinity of the orifice IA due to the influence of the temperature distribution. If the position occupied by the source material in the ejection cell changes from the rear 35 part to the center part to the front part, naturally the molecular beam intensity also changes each time. In particular, when the source material remains near the orifice IA,
The molecular beam intensity distribution having the highest intensity slightly below the normal direction to the orifice 1A changes, making it completely unpredictable. The present invention makes it possible to maintain the molecular beam intensity constant by adding simple modifications to the molecular beam epitaxial growth apparatus, and this will be explained in detail below.
本発明では、先ず、分子線噴出セル内で固体であると液
体であるとを問わずソース物質が移動することを抑止し
、特にオリフイスの近傍、即ち、噴出セルの前部には移
動しないようにすること、また、噴出セルの温度分布を
従来どは逆に噴出セル前部を高めに採り、後部が最低に
なるようにすることが基本FfCなつている。In the present invention, first, the source material, whether solid or liquid, is prevented from moving within the molecular beam ejection cell, and is particularly prevented from moving near the orifice, that is, at the front of the ejection cell. In addition, the basic FfC is to set the temperature distribution of the ejection cell to be higher at the front of the ejection cell and lowest at the rear, contrary to the conventional method.
そして、このようにすることに依り、オリフイスから噴
出される分子線の強度は、定常温度に於いて、ソース物
質が枯渇しない限り略一定になる。さて、噴出セル内の
ソース物質を移動させないようにする為には、噴出セル
の構造に若干の改変を施すことに依り容易に達成するこ
とができる。By doing this, the intensity of the molecular beam ejected from the orifice becomes approximately constant at a steady temperature unless the source material is depleted. Now, preventing the source material from moving within the ejection cell can be easily achieved by making some modifications to the structure of the ejection cell.
第2図a−dは前記目的を達成する為の噴出セルを例示
するもので第1図に関して説明した部分と同部分を同記
号で指示してある。aは噴出セル1の内壁1Bに傾斜を
附し、ソース物質が後部にとどまるようにした例である
。FIGS. 2a to 2d illustrate an ejection cell for achieving the above object, and the same parts as those explained in connection with FIG. 1 are indicated by the same symbols. Figure a is an example in which the inner wall 1B of the ejection cell 1 is sloped so that the source material remains at the rear.
bは噴出セル1の内壁に段差1Cを形成したものである
。cは噴出セル1の内壁適所に突条1D!!:形成した
ものである。b is one in which a step 1C is formed on the inner wall of the ejection cell 1. c is a protrusion 1D on the inner wall of the ejection cell 1! ! : It was formed.
dは噴出セル1内にソース物質を収容するボート3を配
置したもので、このボート3は噴出セル1の後壁部分1
Eを脱着することに依り挿入、離脱するようにしてある
。d shows a boat 3 accommodating the source material arranged in the ejection cell 1, and this boat 3 is attached to the rear wall portion 1 of the ejection cell 1.
It can be inserted and removed by attaching and detaching E.
次に、溶融されたソース物質が熱的に輸送されることを
防止するVCは、噴出セル1の軸方向に意識的に温度勾
配を持たせるが、これは極めて容易であつて、例えば、
第3図AflC見られる如く、噴出セル1の周囲に巻回
する加熱ヒータ2を、噴出セル1の前部に対応する部分
を密に、後部に対応する部分を粗に巻回してやれば良い
。Next, the VC, which prevents the molten source material from being thermally transported, intentionally creates a temperature gradient in the axial direction of the ejection cell 1, but this is extremely easy, and for example,
As shown in FIG. 3 AflC, the heater 2 wound around the ejection cell 1 may be wound tightly around the front part of the ejection cell 1 and loosely around the rear part thereof.
これに依り、温度分布は、例えば第3図bに見られる如
き特性にすることができる。尚、このような温度分布を
得るには、前記の如き加熱ヒータ2の巻回粗密に依存す
るのみでなく、複数のヒータを用いて、その数を変える
等、適宜の手段を採つて艮い。以上の説明で判るように
、本発明に依れば、ソース物質が後部にのみ保持される
構造の分子線噴出セルに、その前部の温度が高く、そし
て、後部の温度が低くなるように加熱するヒータを組合
せることに依り、分子線強度が常に一定になるよう安定
化し、また再現性を高めることができるので、分子線エ
ピタキシヤル成長に依る結晶層の組成、厚さ、不純物濃
度等が分布を持TSないように均一化するのに卓効があ
る。尚、前記実施例では、噴出セルとして円筒形のもの
を例示したが、これに限らず、例えば角筒形のものでも
良く、また、材質も、グラフアイト、石英、パイロリチ
ツク・ボロン・ナイトライド等、任意のものを選択して
良いThereby, the temperature distribution can be made into a characteristic as seen, for example, in FIG. 3b. In order to obtain such a temperature distribution, it is necessary not only to depend on the winding density of the heater 2 as described above, but also to take appropriate measures such as using a plurality of heaters and changing the number of heaters. . As can be seen from the above explanation, according to the present invention, a molecular beam ejection cell having a structure in which the source material is held only at the rear part has a structure in which the temperature at the front part is high and the temperature at the rear part is low. By combining heaters, the molecular beam intensity can be stabilized to be constant and the reproducibility can be improved, so the composition, thickness, impurity concentration, etc. of the crystal layer due to molecular beam epitaxial growth can be improved. It is extremely effective in making the distribution uniform so that the TS does not have a uniform distribution. In the above embodiment, a cylindrical ejection cell was used as an example, but the ejection cell is not limited to this, and may be, for example, a prismatic cell, and the material may be graphite, quartz, pyrolytic boron nitride, etc. , select any one you like
第1図aは従来例の説明図、第1図bは従来例の温度分
布を表わす線図、第2図a−dは本発明に於ける分子線
噴出セルの説明図、第3図aは本発明に於ける加熱ヒー
タを例示する説明図、第3図Bll$温度分布を表わす
線図である。
図に於いて、1は噴出セル、2はヒータ、3はボート、
1Aはオリフイス、1Bは傾斜を有する内壁、1Cは段
差、1Dは突条をそれぞれ示す。Fig. 1a is an explanatory diagram of the conventional example, Fig. 1b is a diagram showing the temperature distribution of the conventional example, Fig. 2 a to d is an explanatory diagram of the molecular beam ejection cell in the present invention, Fig. 3 a FIG. 3 is an explanatory diagram illustrating the heater according to the present invention, and FIG. 3 is a diagram showing the temperature distribution. In the figure, 1 is an ejection cell, 2 is a heater, 3 is a boat,
1A is an orifice, 1B is an inclined inner wall, 1C is a step, and 1D is a protrusion.
Claims (1)
る分子線噴出セルと、該分子線噴出セルのオリフィスが
在る前部を高温に且つソース物質を保持している後部を
低温に加熱するヒータとを備えてなることを特徴とする
分子線エピタキシャル成長装置。1. A molecular beam ejection cell that holds the north substance, whether solid or liquid, only at the rear, and the front part of the molecular beam ejection cell where the orifice is located is heated to a high temperature, and the rear part that holds the source material is heated to a low temperature. A molecular beam epitaxial growth apparatus characterized by comprising a heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4124677A JPS5915379B2 (en) | 1977-04-11 | 1977-04-11 | Molecular beam epitaxial growth equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4124677A JPS5915379B2 (en) | 1977-04-11 | 1977-04-11 | Molecular beam epitaxial growth equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53126262A JPS53126262A (en) | 1978-11-04 |
| JPS5915379B2 true JPS5915379B2 (en) | 1984-04-09 |
Family
ID=12603072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4124677A Expired JPS5915379B2 (en) | 1977-04-11 | 1977-04-11 | Molecular beam epitaxial growth equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5915379B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694730A (en) * | 1979-12-28 | 1981-07-31 | Nec Corp | Preparation method of compound semiconductor thin film |
| JPS5992996A (en) * | 1982-11-16 | 1984-05-29 | Nec Corp | Molecular beam source for growing crystal using molecular beam |
| US4646680A (en) * | 1985-12-23 | 1987-03-03 | General Electric Company | Crucible for use in molecular beam epitaxial processing |
| JP2008247673A (en) * | 2007-03-30 | 2008-10-16 | Rohm Co Ltd | Material feeder |
-
1977
- 1977-04-11 JP JP4124677A patent/JPS5915379B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53126262A (en) | 1978-11-04 |
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