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JPS5915985B2 - Decomposed species selective ion beam deposition method - Google Patents
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JPS5915985B2 - Decomposed species selective ion beam deposition method - Google Patents

Decomposed species selective ion beam deposition method

Info

Publication number
JPS5915985B2
JPS5915985B2 JP56099578A JP9957881A JPS5915985B2 JP S5915985 B2 JPS5915985 B2 JP S5915985B2 JP 56099578 A JP56099578 A JP 56099578A JP 9957881 A JP9957881 A JP 9957881A JP S5915985 B2 JPS5915985 B2 JP S5915985B2
Authority
JP
Japan
Prior art keywords
species
decomposed
ion beam
substrate
decomposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56099578A
Other languages
Japanese (ja)
Other versions
JPS583973A (en
Inventor
昌司 古川
俊明 香川
信雄 松本
督郎 大町
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP56099578A priority Critical patent/JPS5915985B2/en
Publication of JPS583973A publication Critical patent/JPS583973A/en
Publication of JPS5915985B2 publication Critical patent/JPS5915985B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221Ion beam deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は、良質な薄膜を作製するための蒸着方法、特に
原材料ガスの分子イオン状態の分解種の種類による円軌
道半径の相違を利用して所望イオンのみを選択して基板
上に蒸着させる分解種選択イオンビーム蒸着方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention is a vapor deposition method for producing a high-quality thin film, and in particular, selects only desired ions by utilizing the difference in circular orbit radius depending on the type of decomposed species in the molecular ion state of a raw material gas. The present invention relates to a selective ion beam deposition method for selectively decomposed species, in which the decomposed species is deposited on a substrate.

′ 従来、この種の薄膜成長用装置としては、スパッタ
並びにプラズマCVD装置がある。アモルファスシリコ
ンの薄膜成長を例にとると、アモルファスの場合は単結
晶と異なD数多くのタンクリングボンドが存在し、これ
がため膜質が良好ではな: く、かつ、より再現性を得
ることが困難であつた。そこで、通常は、薄膜成長時に
水素ガスを導入し、タンクリングボンドを減少させてい
た。ところが、その場合には、電気的・光学的にみた膜
厚は、分子イオン状態の分解種、例えばSi−Hおよび
フ /HSiなどの存在比に大きく影響される。
' Conventionally, this type of thin film growth equipment includes sputtering and plasma CVD equipment. Taking the growth of a thin film of amorphous silicon as an example, in the case of amorphous, unlike single crystal, there are many tank ring bonds, which makes the film quality poor and it is difficult to obtain reproducibility. It was hot. Therefore, hydrogen gas is usually introduced during thin film growth to reduce tank ring bonds. However, in this case, the film thickness from an electrical and optical perspective is greatly influenced by the abundance ratio of decomposed species in the molecular ionic state, such as Si-H and F/HSi.

他方、\H従来のスパッタおよびプラズマCVD法によ
る薄膜成長法では、基板温度やrfパワー並びに真空度
などにより膜質をある程度制御できるが、i / Hこ
れら分解種Si−HおよびSiなどの存在\H比を制御
することが困難であるという欠点があつた。
On the other hand, in conventional thin film growth methods using sputtering and plasma CVD, the film quality can be controlled to some extent by controlling the substrate temperature, RF power, degree of vacuum, etc.; The disadvantage was that it was difficult to control the ratio.

そこで、本発明の目的は、薄膜構成原子と不純フ 物と
の結合を適切に制御することにより良質な薄膜を作製す
ることのできる分解種選択イオンビーム蒸着方法を提供
することにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a decomposed species-selective ion beam evaporation method that can produce a high-quality thin film by appropriately controlling the bonds between the atoms constituting the thin film and impurities.

かかる目的を達成するために、本発明では、薄膜成長原
材料となるガスをグロー放電により分解ヌ し、さらに
イオン化して分子イオン状態の分解種を得、得られた分
子イオン状分解種を電界により加速した段階で磁界を印
加して原材料ガスの分解種の種類による円軌道の半径の
相違を利用して質量分析をすることによつて所望の分解
種のみを選択し、その選択された分解種を、かかる分解
種の堆積される基板が損傷を受けず、かつその分解種の
成長が円滑に行われるような低エネルギーレベルに一様
に減速してから基板上に到達させて堆積することによつ
て蒸着を行う。
In order to achieve such an object, in the present invention, a gas that is a raw material for thin film growth is decomposed by glow discharge, further ionized to obtain decomposed species in a molecular ionic state, and the obtained molecular ionic decomposed species are decomposed by an electric field. At the accelerated stage, a magnetic field is applied and mass spectrometry is performed using the difference in the radius of the circular orbit depending on the type of decomposition species of the raw material gas to select only the desired decomposition species, and the selected decomposition species is uniformly decelerated to a low energy level such that the substrate on which the decomposed species is deposited is not damaged and the decomposed species can grow smoothly before being deposited on the substrate. Then, vapor deposition is performed.

以下に図面を参照して本発明を詳細に説明する。The present invention will be described in detail below with reference to the drawings.

第1図は本発明の1実施例を示し、ここで、1は薄膜成
長原材料ガスを導入する石英管、2はその原材料ガスを
ブラズマ化、すなわちグロー放電によリ分解し、さらに
イオン化するために石英管1の外周面に巻回した高周波
コイル、3は得られたプラズマを加速するための電極、
4は加速されたプラズマ中の複数種類の分子イオン状態
の分解種から所望の分解種を選択するための質量分析装
置、5は質量分析装置4で選択された分解種を基板4に
衝突させる際の速度を減少させるための減速電極である
。この装置を動作するには、まず石英管1に薄膜成長原
材料となり得るガス、例えばアモルフアスシリコン薄膜
を作製するためにはシラン(SiH4)ガスを導入する
FIG. 1 shows one embodiment of the present invention, in which 1 is a quartz tube for introducing the raw material gas for thin film growth, and 2 is for plasmaizing the raw material gas, that is, decomposing it by glow discharge and further ionizing it. 3 is a high frequency coil wound around the outer circumferential surface of the quartz tube 1; 3 is an electrode for accelerating the obtained plasma;
Reference numeral 4 denotes a mass spectrometer for selecting a desired decomposition species from the decomposition species of multiple types of molecular ion states in the accelerated plasma, and 5 a mass spectrometer for colliding the decomposition species selected by the mass spectrometer 4 with the substrate 4. It is a deceleration electrode to reduce the speed of. To operate this apparatus, first, a gas that can be used as a raw material for growing a thin film, such as silane (SiH4) gas for producing an amorphous silicon thin film, is introduced into the quartz tube 1.

石英管1に導入されたガスは、この石英管1内で分解さ
れるが、この中には中性およびイオン状態の両者がある
。このとき、分解パワーを上昇させることにより、多量
の分子状プラズマを生成させることができる。石英管1
の下流部分(図示の左側部分)へ到達したプラズマ中の
分解種は電極3により加速される。加速された分解種は
質量分析装置4へ導入される。この質量分析装置4では
、加速された分解種に磁界を印加し、分解種の種類によ
る円軌道の半径の相違を利用して、複数種類の分解種か
ら所望の分解種のみを選択する。選択された分解種は減
速電極5に導入され、基板6が損傷を受けないで、かつ
分解種の成長が円滑に行われるような低エネルギーレベ
ル、例えば数百EV以下に一様に減速される。減,速さ
れたイオンは基板6上に到達して堆積・成長する。以上
説明したように、本発明によれば、イオン化した分解種
のすべてが基板上に到達せず、所望の分解種のみが選択
されて基板に到達するので、により膜質が大きく左右さ
れるアモルフアスシリコン膜などについては非常に良質
なものを作製することができる。
The gas introduced into the quartz tube 1 is decomposed within the quartz tube 1, and the gas is in both a neutral and ionic state. At this time, a large amount of molecular plasma can be generated by increasing the decomposition power. Quartz tube 1
The decomposed species in the plasma that have reached the downstream part (the left part in the figure) of the plasma are accelerated by the electrode 3. The accelerated decomposed species are introduced into the mass spectrometer 4. In this mass spectrometer 4, a magnetic field is applied to the accelerated decomposed species, and only a desired decomposed species is selected from a plurality of types of decomposed species by utilizing the difference in the radius of the circular orbit depending on the type of decomposed species. The selected decomposition species are introduced into the deceleration electrode 5 and uniformly decelerated to a low energy level, for example, below several hundred EV, such that the substrate 6 is not damaged and the growth of the decomposition species is smooth. . The reduced and accelerated ions reach the substrate 6, where they are deposited and grown. As explained above, according to the present invention, all of the ionized decomposition species do not reach the substrate, and only the desired decomposition species are selected and reach the substrate. Very high quality silicon films can be produced.

すなわち、本発明分解種選択イオンビーム蒸着方法には
、膜質の電気的および光学的性質を大きく左右する構成
原子と不純物原子の結合を自由に制御でき、良質な薄膜
を得ることができるという利点がある。
In other words, the decomposed species-selective ion beam deposition method of the present invention has the advantage that it is possible to freely control the bonds between constituent atoms and impurity atoms, which greatly affect the electrical and optical properties of the film, and to obtain a high-quality thin film. be.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の1実施例を示す線図である。 1・・・石英管、2・・・コイル、3・・・加速電極、
4・・・質量分析装置、5・・・減速電極、6・・・基
板。
FIG. 1 is a diagram showing one embodiment of the present invention. 1... Quartz tube, 2... Coil, 3... Accelerating electrode,
4...Mass spectrometer, 5...Deceleration electrode, 6...Substrate.

Claims (1)

【特許請求の範囲】[Claims] 1 薄膜成長原材料ガスをグロー放電により分解 し、
さらにイオン化して分子イオン状態の分解種を得、得ら
れた分子イオン状態の分解種を電界により加速した段階
で磁界を印加して前記原材料ガスによる分解種の質量を
分析して所定の分解種のみを選択し、その選択された分
解種を該分解種の 堆積される基板が損傷を受けず、か
つその分解種の成長が円滑に行なわれるような低エネル
ギーレベルに一様に減速してから当該基板上に到達させ
て堆積させることを特徴とする分解種選択イオンビーム
蒸着方法。
1 The raw material gas for thin film growth is decomposed by glow discharge,
Furthermore, the decomposed species in the molecular ionic state are obtained by ionization, and the obtained decomposed species in the molecular ionic state are accelerated by an electric field. At this stage, a magnetic field is applied to analyze the mass of the decomposed species caused by the raw material gas, and a predetermined decomposed species is determined. The selected decomposition species is uniformly decelerated to a low energy level such that the substrate on which the decomposition species is deposited is not damaged and the growth of the decomposition species is smooth. A method for selectively decomposed ion beam deposition, characterized in that the ion beam is deposited by reaching the substrate.
JP56099578A 1981-06-29 1981-06-29 Decomposed species selective ion beam deposition method Expired JPS5915985B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56099578A JPS5915985B2 (en) 1981-06-29 1981-06-29 Decomposed species selective ion beam deposition method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56099578A JPS5915985B2 (en) 1981-06-29 1981-06-29 Decomposed species selective ion beam deposition method

Publications (2)

Publication Number Publication Date
JPS583973A JPS583973A (en) 1983-01-10
JPS5915985B2 true JPS5915985B2 (en) 1984-04-12

Family

ID=14250979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56099578A Expired JPS5915985B2 (en) 1981-06-29 1981-06-29 Decomposed species selective ion beam deposition method

Country Status (1)

Country Link
JP (1) JPS5915985B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088245B2 (en) * 1990-09-28 1996-01-29 株式会社島津製作所 Focused ion beam etching system

Also Published As

Publication number Publication date
JPS583973A (en) 1983-01-10

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