JPS5917850B2 - automatic wire bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic wire bonder that stores bonding coordinate data of chips and packages in advance in a storage device and performs bonding in a wire bonding process of a semiconductor device assembly process.

Conventionally, an automatic wire bonder has been used as a method for electrically connecting the electrodes of a chip of a semiconductor device and the lead terminals of a package using wires.

In this case, the bonding coordinate data of the chip and the package are stored in the same storage device (E-ROMIC), but this method requires one storage device for each combination of the chip and the package. Furthermore, even if the coordinate positions differ somewhat from manufacturing rod to manufacturing rod, a storage device is required for each combination of chip and package. If it were possible to rationalize and reduce the number of storage devices that are required in large quantities in this way, it would be extremely advantageous in terms of manufacturing costs. The present invention was devised based on this request. Therefore, in the present invention, in an automatic wire bonder that stores the bonding coordinate data of the chip and the package in a storage device and reads this data during bonding work for bonding, the bonding coordinate data of the chip and the package are stored separately. It is characterized by being stored in the device.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

The automatic ear bonding apparatus shown in FIG. 1 consists of a mechanical device section A for performing ear bonding and a computer section B for driving it.

A rotating table 3 which is rotationally driven by a pulse motor 2 is attached to the PET 1 of the mechanical device A, and a sample mounting table 5 supporting a package 4 with a chip to be wire bonded is mounted on this rotating table 3. installed. Further, a bonding tool 6 for performing wire bonding is supported by an ultrasonic horn 7 and supported by a bonding device 5 and a fern head body 11 together with a wire spool 8, a bonding tool driving section 9, a spotlight 10, and the like. This bonding head body 11 is attached to an XY table 14 driven vertically and horizontally by pulse motors 12 and 13, and furthermore, this XY table 14 is connected to a manual handle 1.
5 can be moved vertically and horizontally by bed 1
It is attached on top of the manipulator section 16 attached to. Further, the manual handle 15 that moves the manipulator section 16 is attached with a pulse encoder IT that converts the movement into pulses, and the pulses are sent to the signal output section 18 of the computer section B. Section B includes a signal person output section 18 and an internal storage section 1.
9, a data calculation section 20, and an electrical control section 21, and the data storage sections 22 and 23 are connected to the signal input/output section 18. The operation of this device configured in this way will be explained next.

First, the chip-side data storage device 22 and the package-side data storage device 23, which store chip and package bonding coordinate data, respectively, are connected to the signal input/output section 18. Next, the package 4 is fixed to the sample stage 5, and the manipulator section 16 is moved by the manual handle 15 to align the initial bonding position of the package 4 with the bonding tool 6. Next, when an instruction to start automatic bonding is given to the computer section, the data calculation section 20 of the computer section reads the data stored in the chip data storage device 22 and the package data storage device 23, and moves the bonding tool 6 and the rotary table 3. The amount is calculated and the pulse motors 2 and 12 are controlled through the electric control unit 21.
, 13. At the same time, a signal is also sent to the drive section 9 of the bonding tool 1 to perform bonding. Although the operation as described above is performed, conventionally, regarding the chip and package data storage device described above, chip and package data are stored in one storage device. In other words, one storage device is required for each type. For example, if there are 10 types of chips and 10 packages, and all the combinations constitute one type, 100 storage devices are required. However, according to the device of the present invention, chip data and package data can be stored in separate storage devices and used in combination, so that only 20 storage devices are needed. As described above, the apparatus of the present invention greatly streamlines the assembly of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the automatic wire bonder according to the present invention and a block diagram of its computer section. 1... Head, 2, 12, 13... Pulse motor, 3... Rotating table, 5... Sample mounting table, 6... Bonding tool , 14...
...XY table, 15...manual handle,
16... Manipulator section, 17... Pulse computer, 18... Signal input/output section, 1
9...Internal storage unit, 20...Data calculation unit, 21...Electrical control unit, 22...
Chip data section, 23...Package data storage section.

Claims (1)

[Claims] 1. An automatic wire bonder that stores the bonding coordinate data of the chip and the package in a storage device and reads this data during bonding work for bonding, characterized in that the bonding coordinates of the chip and the package are stored in separate storage devices. Automatic wire bonder.