JPS5919338B2 - semiconductor light emitting display device - Google Patents
semiconductor light emitting display deviceInfo
- Publication number
- JPS5919338B2 JPS5919338B2 JP51139508A JP13950876A JPS5919338B2 JP S5919338 B2 JPS5919338 B2 JP S5919338B2 JP 51139508 A JP51139508 A JP 51139508A JP 13950876 A JP13950876 A JP 13950876A JP S5919338 B2 JPS5919338 B2 JP S5919338B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- display device
- semiconductor light
- resin
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
本発明は数字表示・文字表示用の半導体発光表示装置の
改良に関するもので、特に装置の部品で光反射体の構造
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in semiconductor light emitting display devices for displaying numbers and characters, and particularly to the structure of a light reflector as a component of the device.
一般にGaPやGaAsPなどの化合物半導体発光素子
を使つた数字表示、文字表示用装置はトランシーバや時
計電卓などに広く用いられている。In general, numeric and character display devices using compound semiconductor light emitting elements such as GaP and GaAsP are widely used in transceivers, clock calculators, and the like.
この数字表示、文字表示用装置の構造を第1図a、bに
示すと、セラミックやガラスエポキシ基板上に導体配線
されたステム基板1に導電性樹脂や半田ろう材などによ
り半導体発光素子ペレット2を複数個(図の例では8個
を日字に沿つて)を固着し、さらに25〜30φμの金
属細線(AuAl)でペレット2とステム1とを結線す
る。The structure of this numerical display and character display device is shown in FIGS. 1a and 1b. Semiconductor light emitting element pellets 2 are formed by conductive resin, solder brazing material, etc. on a stem substrate 1 which has conductor wiring on a ceramic or glass epoxy substrate. A plurality of (in the example shown in the figure, eight pieces are attached along the Japanese letters) are fixed, and the pellet 2 and the stem 1 are further connected with a thin metal wire (AuAl) of 25 to 30 φμ.
このマウントボンデングされたステム基板1に文字形成
と輝度の向上を兼ねた光反射体3を組合せる。この光反
射は光反射率の良い白色ノリル樹脂やA−B−S(アク
リルニトリルブタジエン)樹脂やこれら樹脂にAu、A
g、All等のメッキを施したものから成り、第2図に
示す様に裏面から突き出たガイドピン13とステム表面
の凹部とで一体に組合せられる。又、表面の数字形状8
字に沿つて光の通路が内部に形成せられている。第1図
bに示す様に発光素子2から出た光はこの内部通路の曲
線で反射しながら進み表面の8字の線に沿つて放出され
る。(破線の部分)次にこれと発光分布の均一化のため
に光散乱フィルム4とを、光透過性樹脂(アクリル樹脂
など)で成型されたケース5に順次収納してステム1の
裏面とケース5の間を封止用樹脂6で固着して製品とな
る。A light reflector 3, which serves both to form characters and improve brightness, is combined with the mounted and bonded stem substrate 1. This light reflection is caused by white noryl resin, A-B-S (acrylonitrile butadiene) resin, which has good light reflectance, and Au, A
As shown in FIG. 2, the guide pin 13 protruding from the back surface and the concave portion on the surface of the stem are combined into one body. Also, the number shape 8 on the surface
A light path is formed inside along the letters. As shown in FIG. 1b, the light emitted from the light emitting element 2 travels while being reflected by the curve of this internal passage and is emitted along the figure 8 line on the surface. (Dotted line part) Next, this and the light scattering film 4 are sequentially placed in a case 5 made of a light-transmitting resin (acrylic resin, etc.) in order to make the luminescence distribution uniform. 5 is fixed with a sealing resin 6 to form a product.
この封止用樹脂6には一般に粘度が3000〜1000
0CPSのエポキシ樹脂などが使われる。ここで光反射
体3は従来は第2図の様な直方体の形状で、上述の装置
の組立上位置出しなどの関係からその寸法がケース5の
内側寸法より0.3〜0.571m程度少さく成つてい
る。従つて第3図に示す様ケース5の内壁と光反射体3
の側壁が近接しているため封止用樹脂6での固着に際し
、毛細管現象を呈し、樹脂6がケース5内に流れ込みや
すく場合によつては注入樹脂が表面部のフィルム4とケ
ース5との間に流れ込み文字、数字を不完全なものにし
てしまう欠点が存在した。又ガイドピンの出ている面が
全面においてステム1の表面と接触するため、第3図に
示す様にステム1の裏面へ出ている外部端子リード7の
表面で半田付けされている頭部(約0.1〜0.5驕の
突起)によつて光反射体3が浮きやすく、横からの光の
漏れや文字などを併発しやすい欠点もある。なを光反射
体とステムとの間が50μ以上になると光の横漏れが発
生する。実際上、これらによる欠点は5〜10%の不良
品を発生させ製造上大きな問題であつた。本発明はこれ
らの欠点を簡単なる方法で除く事を目的とするものであ
る。This sealing resin 6 generally has a viscosity of 3000 to 1000.
Epoxy resin with 0 CPS is used. Here, the light reflector 3 conventionally has a rectangular parallelepiped shape as shown in FIG. 2, and its dimensions are about 0.3 to 0.571 m smaller than the inner dimensions of the case 5 due to the positioning of the device mentioned above. It is well established. Therefore, as shown in FIG. 3, the inner wall of the case 5 and the light reflector 3
Because the side walls of the film 4 and the case 5 are close to each other, a capillary phenomenon occurs when the sealing resin 6 is fixed, and the resin 6 tends to flow into the case 5. In some cases, the injected resin may flow between the surface film 4 and the case 5. There was a drawback that characters and numbers were mixed in between and became incomplete. In addition, since the surface of the guide pin is in full contact with the surface of the stem 1, as shown in FIG. The light reflector 3 tends to float due to the protrusions of about 0.1 to 0.5 height, which also has the drawback of easily causing light leakage from the sides and characters. If the distance between the light reflector and the stem is 50μ or more, side leakage of light will occur. In practice, these defects caused 5 to 10% of defective products and were a major problem in manufacturing. The present invention aims to eliminate these drawbacks in a simple manner.
そのため本発明は第7図に示す様に毛細現象を呈す原因
となる光反射体とケースの内壁の間隔の幅を変えずに解
決すべく封止用樹脂が流れ込んで来る道すじに一定の空
間14を設けるものである。Therefore, as shown in FIG. 7, the present invention solves the problem of capillary phenomenon without changing the width of the gap between the light reflector and the inner wall of the case by creating a certain space 14 along the path where the sealing resin flows. It is intended to provide
これは、毛細現象によつて流れ込んできた封止用の樹脂
が、この空間14にまで達すると毛細管現象が弱まると
共に、表面張力現象によつて止まり、又樹脂がこの空間
に引き込まれ留位されるためである。さらに第6図に示
す様に上記の空間を外部端子リードの内部頭部(0.1
WI−0.57H11の容器)に対する逃げとしても利
用するものである。This is because when the sealing resin that has flowed in due to capillary phenomenon reaches this space 14, the capillary phenomenon is weakened and stopped due to the surface tension phenomenon, and the resin is drawn into this space and remains there. This is for the purpose of Furthermore, as shown in Figure 6, the above space is filled with the internal head of the external terminal lead (0.1
It is also used as an escape for the WI-0.57H11 container).
従つて本発明では、ケースとステムと光反射体とが接す
る部分に上述した空間を装置の構造を変える事なく簡単
に得るために第4図に示した様にガイドピンが突き出て
いる光反射体のステム表面と接触する面の周辺角部を段
状14に削られた形に成型するものである。Therefore, in the present invention, in order to easily obtain the above-mentioned space at the part where the case, stem, and light reflector contact each other without changing the structure of the device, a light reflector having a protruding guide pin as shown in FIG. The peripheral corner of the surface that contacts the stem surface of the body is formed into a stepped shape 14.
なおこの段状14の高さ幅はそれぞれ171i1!t程
度あれば充分であり、これらの値は封止に使う樹脂の粘
度や装置の大きさによつては充分少さくする事も可能で
あります。The height and width of each step 14 is 171i1! t is sufficient, and these values can be made sufficiently small depending on the viscosity of the resin used for sealing and the size of the device.
又、第5図に示した様に光反射体上面のS字が形成され
た面にも上記段状14を形成すれば封止用樹脂の流れを
2重に防止できると共に装置組立に於けるケース内への
収納作業でガイドの役目をする事ができ装置組立を自動
化する場合の問題を解決するものである。In addition, if the step 14 is formed on the top surface of the light reflector where the S-shape is formed, as shown in FIG. 5, the flow of the sealing resin can be doubly prevented and the process of assembling the device can be prevented. It can serve as a guide during the work of storing the device in the case, and solves problems when automating device assembly.
これは、上記した様にケースの内壁と光反射体との間隔
が0.3〜0.51g1t程度幅で組立てられるため、
機械の位置ずれに防止に高度な精度が要求されていたも
のである。この様に本発明によつて光反射体の位置ずれ
による光のもれを防止するためのケースと光反射体との
間隔を変えることなく、封止用樹脂の流れを止め表示装
置の汚れを防止できる実際これによる不良率を1%以下
に抑える事ができると共に外部端子頭部による光反射体
の浮き上りを止め、光のもれを防止する事により装置全
体を輝度を増す効果がある。This is because, as mentioned above, the space between the inner wall of the case and the light reflector is approximately 0.3 to 0.51g1t, so
A high degree of precision was required to prevent machine misalignment. In this way, the present invention prevents the flow of the sealing resin and prevents stains on the display device without changing the distance between the case and the light reflector to prevent light leakage due to misalignment of the light reflector. In fact, the defect rate due to this can be suppressed to 1% or less, and the light reflector is prevented from floating due to the head of the external terminal, and light leakage is prevented, which has the effect of increasing the brightness of the entire device.
第1図aは半導体発光表示装置の構成図、bはその組立
断面図である。
第2図は従来の光反射体を示した図である。第3図は従
来の樹脂封止を示した図である。第4図、第5図は本発
明の光反射体を示した図である。第6図は本発明による
樹脂封止を示した図である。第7図は本発明の原理を示
した図である。1・・・・・・ステム、2・・・・・・
半導体発光素子ペレツト、3・・・・・・光反射体、4
・・・・・・光散乱フイルム、5・・・・・・ケース、
6・・・・・・封止用樹脂体、7・・・・・・外部端子
。FIG. 1a is a block diagram of a semiconductor light emitting display device, and FIG. 1b is an assembled sectional view thereof. FIG. 2 is a diagram showing a conventional light reflector. FIG. 3 is a diagram showing conventional resin sealing. FIG. 4 and FIG. 5 are diagrams showing the light reflector of the present invention. FIG. 6 is a diagram showing resin sealing according to the present invention. FIG. 7 is a diagram showing the principle of the present invention. 1... Stem, 2...
Semiconductor light emitting device pellet, 3... Light reflector, 4
...Light scattering film, 5...Case,
6... Resin body for sealing, 7... External terminal.
Claims (1)
ングされたステム1と、これを覆う透光性のケース5と
で、前記ステム1の裏面とケース5との間を樹脂封止6
した表示装置内部に、周辺部が段状14に削られた形状
の光反射体3が収納されている半導体発光表示装置。1 A stem 1 on which a semiconductor light emitting element pellet 2 is mounted and bonded, and a translucent case 5 that covers this, and a resin seal 6 is formed between the back surface of the stem 1 and the case 5.
A semiconductor light emitting display device in which a light reflector 3 having a stepped shape 14 at its periphery is housed inside the display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51139508A JPS5919338B2 (en) | 1976-11-22 | 1976-11-22 | semiconductor light emitting display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51139508A JPS5919338B2 (en) | 1976-11-22 | 1976-11-22 | semiconductor light emitting display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5364497A JPS5364497A (en) | 1978-06-08 |
| JPS5919338B2 true JPS5919338B2 (en) | 1984-05-04 |
Family
ID=15246917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51139508A Expired JPS5919338B2 (en) | 1976-11-22 | 1976-11-22 | semiconductor light emitting display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5919338B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2554059B2 (en) * | 1986-09-02 | 1996-11-13 | シャープ株式会社 | Thin-film EL display unit |
-
1976
- 1976-11-22 JP JP51139508A patent/JPS5919338B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5364497A (en) | 1978-06-08 |
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