JPS5919462B2 - wire bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding device, and particularly to a support structure for a wire clamper mechanism.

Generally, bonding work using a wire bonding device involves positioning a tool at a first bonding point, bonding the wire fed out to the tip of the tool, and then moving the tool to a second bonding point to be connected next. This is carried out by repeatedly pulling out the wire, cutting the wire after the second bonding is completed, and then feeding the wire out again to the tip of the tool for the next operation. The wire cutting and wire feeding operations are performed by a wire clamper disposed near the tool. That is, the wire clamper is opened and closed as necessary to grip and release the wire, and at the same time, the wire clamper is reciprocated along the wire payout direction in accordance with the above-described series of operations. In this way, the wire clamper must always be located near the tool due to its function, so conventionally, the wire clamper mechanism equipped with the wire clamper was mounted on the bonding arm and moved together with the tool in the X, Y, and Z directions. I'm starting to do that. As described above, since the conventional wire bonding apparatus is placed on the bonding arm, the load of the wire clamper mechanism is applied to the bonding arm, and the inertia of the tool that hits the bonding surface increases accordingly. For this reason, the wire may be crushed even without applying ultrasonic waves to the horn provided on the bonding arm, resulting in a drawback that good bonding cannot be achieved. Therefore, in order to reduce the inertia of the tool, bonding has traditionally been performed at a reduced speed. Further, since the bonding is always performed by applying ultrasonic waves for a certain period of time regardless of the individual bonding conditions, it has not been possible to always obtain bonding of a constant quality. The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a wire bonding device that can perform good bonding even at high speeds. Hereinafter, the present invention will be explained with reference to illustrated embodiments.

A horn 11, to which a tool 10 is fixed, is fixed to one end of a bonding arm 12. The other end of the bonding arm 12 is rotatably supported on a support shaft 15 fixed to a support block 14 fixed on the bonding head 13. Further, the support shaft 15 has a bonding arm 1 extending upwardly from the bonding arm 12.
Wire clamper mechanism holding lever 16 extending in the same direction as 2
is rotatably supported. A clamper guide member 19 is fixed to the tip of the wire clamper mechanism holding lever 16 and supports the sliding rod 17 so as to be slidable along the direction in which the wire 18 is fed out. Here, the wire 18 extends from a spool (not shown) to the lower end of the seat tool 10. A clamper support member 2 has a wire clamper 20 and a clamper opening/closing electromagnetic solenoid 21 attached to the lower end of the sliding rod 17.
2 is fixed. The upper end of the sliding rod 17 is urged upward by a spring 26 so as to come into pressure contact with a follower 25 attached to a clamper operating lever 24 which is rotatably supported on the wire clamper mechanism holding lever 16 about a fulcrum 23. ing. Further, the wire clamper mechanism holding lever 16 is provided with a stopper 27 facing the clamper operating lever 24, and first and second electromagnetic solenoids 28 and 29 for moving the clamper on both sides thereof. These stoppers 27, first and second electromagnetic solenoids 28,
Stopper screws 30, 31, 32 are disposed on the clamper operating lever 24 facing the reciprocating rods 28a, 29a of 29, and the clamper operating lever 24 is biased toward the wire clamper mechanism holding lever 16 by a spring 33. ing.
Further, a wire clamper mechanism support lever 34 extends downward and is fixed to the lower surface of the clamper mechanism retention lever 24. A vertically movable lever 40 made of conductive material is disposed on the lower surface of the bonding arm 12 and the wire clamper mechanism support lever 34.
is supported.

A contact 41 is fixed to the bonding arm 12 at a portion that contacts the vertically movable lever 40. Both sides of the vertically movable lever 40 are fixed to connecting levers 43 made of an insulating material and fixed to both ends of a swing lever 42, respectively. The swing lever 42 is connected to the bonding head 13.
a support shaft 45 fixed to a support block 44 fixed above;
A cam follower 46 is attached to the other end of the swinging lever 42. A cam shaft 47 is mounted on the side frame of the bonding head 13, facing the cam follower 46, and is rotated by a drive source (not shown).
A Z-axis drive cam 48 is fixed to the Z-axis drive cam 48, and the cam follower 46 is pressed against the Z-axis drive cam 48 by a spring 4.
It is energized at 9. Further, the bonding head 13
is determined by the known XY drive mechanism 50. ) It can be moved in the X and Y directions. Next, the operation of the wire bonding apparatus having such a configuration will be explained.

First, the wire clamper 20 is in a state where the wire 18 is clamped, and in this state, the bonding head 13 is driven in the XY direction by the XY drive mechanism 50, and the tool 10 is moved above the first bonding point. At this time, the first and second electromagnetic solenoids 28 and 29 are in an ON state, and their reciprocating rods 28a and 29a are in a forward (protruding upward) state.
Next, the camshaft 47 rotates, and the swing lever 42 rotates counterclockwise about the support shaft 45 in accordance with the profile of the Z-axis drive cam 48. As a result, the vertically moving lever 40 is lowered via the connecting lever 43. Then, the bonding arm 12 descends around the support shaft 15 due to its own weight, and the tool 10 comes into pressure contact with the first bonding point. At the same time, the wire clamper mechanism support lever 33 is also lowered by its own weight together with the vertically movable lever 40, and the wire clamper mechanism holding lever 16 rotates counterclockwise around the support shaft 15 to maintain the clamper 20 in close proximity to the tool 10. and descend. From this state, the vertically movable lever 40 descends slightly, stops, and maintains that position. Here, when the tool 10 comes into pressure contact with the first bonding point, the vertically movable lever 40 separates from the contact point 41. At this time, the contact signal causes the clamper opening/closing electromagnetic solenoid 21 to operate, and the wire clamper 20 opens. At the same time, the horn 11 oscillates, and the ultrasonic vibration causes the wire 18 to be bonded to the first bonding point via the tool 10. Next, the Z-axis drive cam 48 moves the swing lever 42 in the opposite direction to the above.
rotates clockwise, and the vertical lever 40 rises.

As a result, the bonding arm 12 and the wire clamper mechanism support lever 34 rise, and the tool 10 and the clamper 20 rise together. Thereafter, or while the tool 10 and clamper 20 are being raised, the tool 10 is
moves above the second bonding point. This tool 1
0 moves above the second bonding point, the first electromagnetic solenoid 28 becomes 0FF), the reciprocating rod 28a retreats and swings the clamper operating lever 24 clockwise, thereby causing the sliding rod 17 to move to the follower 25. The wire clamper 20 slides along the wire 18 by a certain amount. Next, the vertical movement lever 40 is moved by the Z-axis drive cam 48 in the same way as the bonding operation at the first bonding point described above.
is lowered, and the tool 10 is brought into pressure contact with the second bonding point to perform bonding. At this time, the vertical movement lever 40 is at the contact point 4.
It is located slightly further down than 1. Thereafter, the clamper opening/closing electromagnetic solenoid 21 becomes OFF, and the wire clamper 20 closes to clamp the wire 18. Subsequently, the second electromagnetic solenoid 29 becomes 0FF, and the reciprocating rod 29
a moves backward, and the clamper operating lever 24 is further swung clockwise. As a result, the wire clamper 20 further retreats by a certain amount to apply a tensile force to the wire 18 and cut the wire 18 from the base of the tool 10. Subsequently, the swing lever 42 is rotated clockwise by the Z-axis driving cam 48, and the vertically moving lever 40 is raised. Then, the tool 10 is moved by the XY drive unit 50 above the first bonding point to be bonded next. During this movement, the first and second electromagnetic solenoids 28, 29 become 0N, and the reciprocating rods 28a, 2
9a moves forward to rotate the clamper operating lever 24 counterclockwise. As a result, the sliding rod 17 moves forward, the wire clamper 20 moves along the direction in which the wire 18 is fed out, and a certain amount D of the wire 18 is fed out to the lower end of the tool 10. By repeating these series of operations, bonding work is performed in sequence. As is clear from the above description, according to the wire bonding apparatus of the present invention, the bonding arm having the tool and the wire clamper mechanism having the wire clamper are each supported by the vertically movable lever,
In addition, since the bonding arm and the wire clamper mechanism are each supported by a support shaft so as to be able to rotate independently, the weight of the wire clamper mechanism is not added to the bonding arm, and the inertia of the tool is reduced.

Therefore, it is possible to speed up the bonding operation and perform good bonding. In addition, by setting the gap where the tool touches the bonding point and the vertical lever leaves the contact point to create the best bonding condition where the tool crushes the wire, the amount of tool sag becomes constant, resulting in always stable and best bonding. can be done. In the above embodiment, the bonding arm 12 and the wire clamper holding lever 34 are attached to the support shaft 15.
Although the mechanism is configured to swing around the center, it may be configured to move vertically in parallel.

Although the swing lever 42 was swung by cam drive,
It may also be oscillated by a solenoid, cylinder, or the like.

[Brief explanation of the drawing]

The drawings show an embodiment of the wire bonding apparatus according to the present invention, in which FIG. 1 is a side view and FIG. 2 is a view taken along the line 2-2 in FIG. 1. 10... Tool, 12... Bonding arm, 13... Bonding head, 15
...... Support shaft, 16... Wire clamper mechanism holding lever, 17... Sliding rod, 18...
・・Wire, 20・・Wire clamper, 34・
...Wire clamper mechanism support lever, 40...
... Vertical lever, 41... Contact, 42...
... Swinging lever, 43 ... Connection lever, 4
8...Z-axis drive cam.

Claims (1)

[Claims] 1. A bonding arm having a tool at one end and supported so as to be swingable or vertically movable; a wire clamper mechanism attached to the bonding arm and supported independently so as to be swingable or vertically movable; A wire bonding device comprising a vertically movable lever disposed below the bonding arm and the wire clamper mechanism so that the bonding arm and the wire clamper mechanism come into pressure contact with each other, and which is movable up and down to move the bonding arm and the wire clamper mechanism up and down. . 2. The wire bonding device according to claim 1, wherein the vertically moving lever is made of a conductive material, and a contact is fixed to a contact portion of the bonding arm with the vertically moving lever.