JPS591970B2 - Multi-wavelength photodetector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multi-wavelength photodetector in which a plurality of detection elements are mounted on an insulating base.

FIG. 1 is a plan view of a multi-wavelength spectrophotometer in which a multi-wavelength photodetector, which is the object of the present invention, is used.

Light from a light source lamp 1 is focused by lenses 2 and T, and enters a concave diffraction grating 9 through an entrance slit. The white light incident on the concave diffraction grating 9 undergoes dispersion and convergence to form a continuous spectrum on a Rowland circle. Therefore, if a large number of test tubes are attached to the flexible chain 4 as shown in Fig. 1, a test sample is placed therein, and the absorbance is detected by the multi-wavelength spectrophotometer, the amounts of multiple components in the sample can be determined simultaneously and quickly. can be measured. In addition, after the test tube is immersed in a water tank 8 and photometered, a sprocket 5 is rotated by a motor 6.
You can move it with The multi-wavelength photodetector 10 has a large number of detection elements 11 to 20 attached to an insulating material.
FIG. 2 is a plan view of a multi-wavelength photodetector currently being tested, and FIG. 3 is a top view thereof.

In order to show how the sensing element is mounted, FIG. 4 shows the A--A section of FIG. 3, and FIG. 5 is an enlarged sectional view of the sensing element. In FIG. 5, the sensing element 15 has a photoreceptor 28 made of a semiconductor fitted into a recess in an insulator 29 and connected to a lead needle 24. As shown in FIG.

Further, pin holes 23 are provided above and below the detection element 15. In order to attach this sensing element 15 to the detector stand 21, the sensing element 15 is fitted into a predetermined position in the recess of the detector stand 21 made of ceramic material, and a blind hole and a pin formed in the detector stand 21 are inserted in advance. Align the holes 23 and drive a pin with a diameter of 0.8 mm. Before that, the lead needle 24 is covered with a connector pin 25 and soldered at point b, and then passed through the hole in the detector stand 21. Next, the female connector 26 to which the external lead wire 2T is compressed and connected is fitted into the connector pin 25 and the part a is soldered. In this way, the electric signal generated by the wavelength light received by the photoreceptor 28 can be transferred to the external lead wire 2T.
It can be taken out from. The multi-wavelength photodetector 10 has a large number of such detection elements attached thereto. The multi-wavelength photodetector with the above structure had the following drawbacks.

That is, in order to attach a large number of detection elements to the detector stand, it is necessary to drive the positioning pins 30 so that the blind holes provided at the mounting location and the pin holes of the detection elements are aligned. Since the parts to be handled are extremely small, this work is extremely troublesome and time consuming. Furthermore, in order to attach 2n lead wires to n sensing elements, 4n points must be soldered. This work is troublesome, and the large number of soldered parts tends to cause failures, reducing reliability. SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-wavelength photodetector which has a simple structure, is easy to operate, and has high reliability, eliminating the above-mentioned conventional drawbacks.

The main points of the present invention are to attach a positioning pin to the sensing element and drive it into the pin hole, and to lengthen the lead wire attached to the sensing element and solder the external lead wire to it. The aim was to simplify the work and improve reliability.

FIG. 6 is a sectional view of a multi-wavelength photodetector which is an embodiment of the present invention, and FIG. 7 is an enlarged sectional view of only the detection element thereof. 7 differs from FIG. 5 in that the positioning pin 30 is embedded and fixed in the detection element stand, and the connector pin 25 is longer than the thickness of the detector stand 21. This detection element is attached by inserting a positioning pin 30 into a blind hole provided in the detector stand 21 as shown in FIG. The connector pin 25 comes out on the back side of the detector stand 21, so insert the female connector 26 with the external lead wire 27 pressed into it and solder it at point C. In this case, the installation time could be reduced to 1/3 of the conventional time. This embodiment has the advantage that the detection element is easy to attach, the number of soldering points is reduced by half, and reliability is improved. FIG. 8 is a sectional view of a multi-wavelength photodetector according to another embodiment of the present invention. In the detection element, a lead wire 31 which also serves as a pin is embedded and fixed in an insulator 29.
Its tip is connected to the photoreceptor 28. The lead wire 31 which also serves as a pin for this sensing element is passed through a hole in the detector stand 21 made of ceramic material and attached. The external lead wire 27 may be pressed into contact with the pin lead wire 31 or soldered.
This embodiment has the advantage that no connector pins are required, and the work of attaching the sensing element is further simplified.

As described above, the present invention has the effect of simplifying the work of attaching the detection element to the detector stand, reducing the number of soldering points, and improving reliability.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a multi-wavelength spectrophotometer, Fig. 2 is a plan view of a multi-wavelength photodetector currently being tested, Fig. 3 is a front view of Fig. 2, and Fig. 4 is a plan view of Fig. 3. A-N sectional view, Figure 5 is the 4th
6 is a sectional view of a multi-wavelength photodetector which is an embodiment of the present invention, FIG. 7 is an enlarged sectional view of the sensing element shown in FIG. 6, and FIG. FIG. 3 is a cross-sectional view of a multi-wavelength photodetector according to another embodiment of the present invention. Explanation of symbols, 1... Light source lamp, 2, 7...
...Lens, 3...Test tube, 9...
Concave diffraction grating, 10...Multi-wavelength photodetector, 11
~20...Detection element, 21...Detector stand, 24...Lead wire, 27...External lead wire, 28... Photoreceptor, 29...
Insulator, 30...1 positioning pin, 31...
・Lead wire that doubles as a pin.

Claims (1)

[Claims] 1. Multi-wavelength light detection in which a plurality of detection elements are installed at predetermined locations on a detector stand, and the positions of the photoreceptors of the detection elements match the spectral imaging location of a spectrometer. A multi-wavelength photodetector, characterized in that the length of the signal extraction lead wire fixed to the detection element is greater than the thickness of the detector stand, and is connected to an external lead wire outside the detector stand. . 2. The multi-wavelength photodetector according to claim 1, wherein the detection element is provided with a positioning pin, and the detector stand is provided with a pin hole that matches the positioning pin. 3. Claim 1 provides that the signal extraction lead wire of the detection element is brought into close contact with the lead wire passage hole of the detector stand, and the detector stand and the detection element are integrated. Features a multi-wavelength photodetector.