JPS591982B2 - Probe device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a testing device for electronic circuit components mounted on a printed board.

As electronic circuit components such as LSI become smaller and more dense,
The leads have also become smaller and more dense, and the lead width and lead spacing have been miniaturized to 0.1 mm to 0.2 m7n. In order to accurately and stably contact the probe of a measuring instrument with such a lead, a probe fixture has been used so far, but it has the disadvantage that it takes time to attach and adjust the position. This invention eliminates the above-mentioned drawbacks,
The purpose is to provide a probe device that is easy to install, does not require position adjustment, and has a reliable and stable electrical connection. , achieves this objective by means of forming a probe insert in each lead portion thereof.

The present invention will be explained below with reference to Examples.

In the figure, the main body part 11 is square, has many leads 12 on each side, and has cooling fins 13 parallel to the main part at the top.
FIG. 2 is a perspective view of the SII in which the present invention is implemented. First, the structure of this embodiment will be explained. Reference numeral 2 designates a probe, in which a signal probe 22 and a grounding probe 23, each having a constant cross section and elasticity, protrude parallel to each other and are fixed to the tip of a main body 21 made of an insulating material.

A neck portion 24 is provided at the other end of the main body 21, and a coiled spring 2 is installed between the main body portion 21 and a support 25 that can freely rotate and slide.
6. Each of the probes 22 and 23 is led to a measuring device or the like by a coaxial cable 2T, and a resistor 28 for connecting the signal probe 22 and the coaxial cable 27 is molded inside the main body 21. 3 is a probe guide, which consists of a signal probe guide 31 and a grounding probe guide 32, and the signal probe guide 31 includes an LSII to be measured.
A groove is provided so that the signal probe 22 can be inserted into the lead 12 protruding from the side surface of the lead 12 and come into contact with the lead.

The signal probe guide 3 is attached to the grounding probe guide 32.
In addition to providing a groove corresponding to the groove 1, a grounding pin 33 is provided at a location corresponding to the grounding land on the printed board. Next, the usage and functions of this embodiment will be explained. First, the probe guide 3 is fitted onto the outer periphery of the LSII to be measured. As a result, the signal probe guide 3
The probe guide 3 is held on the LSII by the frictional force between the groove 1 and the lead 12 of the LSI, and the contact pressure necessary for electrical connection between the grounding pin 33 and the grounding land on the printed board. is maintained. Next, the probe 2 is inserted into a desired groove of the probe guide 3. At this time, the probe 2 is held in the probe guide 8 by the elasticity of the signal probe 22 and the grounding probe 23, and is also held between the signal probe 22 and the LSI lead 12 and between the grounding probe 23 and the grounding probe 23. A contact pressure necessary for electrical connection is maintained between the probe guide 32 and the probe guide 32 . Also, spring 26
Push down the support 25 against the cooling fins 13 of the LSI.
It is possible to further securely hold the probe 2 by inserting it under the probe 2 and using this as a fulcrum and using the repulsive force of the spring 26.
The above is an explanation of one embodiment of the present invention, and the case where the present invention is applied to an LSI has been described, but the present invention can also be applied to other Cs and the like.

Further, in the embodiment, the signal probe and the grounding probe are paired and integrated, but they can also be separated. As described above, according to the present invention, since the probe insertion portion can be formed in the lead portion of the electronic circuit component to be measured, the probe can be easily and reliably held.

[Brief explanation of the drawing]

The figure is a perspective view of an embodiment of the present invention, and 1 is an LSI to be measured.
2 is a probe, and 8 is a probe guide.

Claims (1)

[Claims] 1. A device for extracting electrical signals from any lead of an electronic circuit component mounted on a printed circuit board having leads arranged regularly and protruding from the side, which includes a probe;
It consists of a probe guide that is attached to the electronic circuit component in advance to maintain contact between the probe and the lead of the electronic circuit component. Fits into the groove,
A probe device comprising: a probe insertion portion;