JPS5920422B2 - How to supply solder chips - Google Patents

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a method for manufacturing an electrical component in which a chip-shaped electrical element is soldered to the upper surface of a substrate, etc. In particular, a solder chip is mounted on the upper surface of a substrate, etc. This invention relates to improvements in the method of supplying solder chips.

(b) Background of the technology When incorporating a chip-shaped electric element, such as a piezoelectric ceramic plate, on the top surface of a substrate, a foil-shaped solder chip is placed on the top surface of the substrate in advance to form a preliminary solder layer, and then solder bonded. things are being done.

Further, even when an IC chip or the like is wirelessly bonded to a conductor wire on the upper surface of a substrate, soldering is often performed using a foil-shaped solder chip. (c) Prior art and problems The conventional method for placing thin solder chips on this type of board is to punch or cut a foil solder tape into a large number of solder chips in the desired shape. Each sheet is manually picked up using tweezers or vacuum suction tweezers, and placed at a predetermined position on the top surface of the substrate.

However, this method of manually supplying solder chips is an inefficient operation because one of the solder chips is selected and held from among a large number of solder chips that are not arranged in an organized manner. Furthermore, when holding the solder chip with tweezers, there is a risk that the end of the solder chip may be bent and damaged. (d) Object of the Invention The object of the present invention is to punch out a solder chip and at the same time, to
It is an object of the present invention to provide a method for supplying solder chips, which eliminates the above-mentioned conventional problems by adsorbing solder chips onto a driven suction head.

(e) Structure of the Invention In order to achieve this object, the present invention punches a solder chip of a desired shape from a foil-like solder tape using a punch and a die, and then attaches the solder chip to the tip of a suction head attached to the tip of an arm. After inserting the tip of the solder chip into the opposite side of the punch to the tip of the suction head, the arm is driven as desired to remove the solder chip from the substrate. The solder chip is placed at a desired position on the top surface.

(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments.

FIG. 1 is a sectional view showing important parts of an embodiment of the present invention.

FIG. 2 is a perspective view of the cutting die part in FIG. 1, and a sectional view of the opening immediately after punching. In FIG. 1, 9 is a die attached to the die holder 11 and fixed downward,
A hole 10 having the same shape as a solder chip is vertically formed in the center. 8 has a flat upper surface facing the die 9,
This is a punch guide that also serves as a stripper and slides up and down below the die holder 11 using a guide bar (not shown) as a guide.

The punch guide 8 has a guide hole 8' vertically formed in the center thereof corresponding to the punch hole 10 of the die 9, into which the punch 7 slides. Reference numeral 7 designates a punch whose elongated upper end surface has the same shape as a solder chip, and which is inserted into a guide hole 8' and driven up and down as desired.

The punch 7 is driven after the punch guide 8 is first driven upward by an air cylinder (not shown), and the upper surface of the punch guide 8 is pressed against the lower surface of the die 9 via a solder tape 1, which will be described later. , performs a punching movement in an upward direction. Further, the punch guide 8 descends before the punch guide 8 moves downward. 1 is a solder tape in the form of a foil (for example, a solder tape with a desired width and a thickness of 0.05 m0, and is mounted horizontally so as to be in contact with the lower surface of the die 9 by a pair of guide rollers 2 mounted on both sides of the die holder 11. There is.

The end of the solder tape 1 from which the solder chip has been punched is inserted between a pair of friction rollers 31, 3. A ratchet wheel 4 is attached to the shaft of the friction roller 31, and a feed pawl bar 5 is mounted on the ratchet wheel 4, which is driven substantially downward by the downward movement of the punch guide 8. The feed claws are interlocked. Therefore, when the punch guide 8 is lowered by one level, the feed pawl bar 5 is lowered to rotate the ratchet wheel 4 by a desired angle. When the feed claw bar 5 returns to Hijikata by the spring, the occlusion is in play, so the ratchet wheel 4 does not move.
Since the friction roller 31 thus performs intermittent rotational motion together with the ratchet wheel 4, it gives a motion to feed the solder tape 1 by a desired amount for each movement of the punch guide 8. 1
9 is a hole 11' provided in the center of the die holder 11.
The tip moves up and down above, and the suction head 12 attached to the tip sucks the solder chip 6 punched out from the solder tape 1, and then is driven as desired to place it on the top surface of the board (not shown). This is an arm on which a solder chip 6 is placed.

The suction head 12 is composed of a substantially cylindrical head holder 18 mounted vertically on the tip of an arm 19, and a head shaft 13 inserted into the head holder and having a suction hole 14 formed through it in the center. There is. A compression coil spring 17 is inserted as desired between the outer circumference of the head shaft 13 and the inner circumference of the head holder 18, so that even if the tip of the arm 19, that is, the head holder 18 makes a sudden downward movement, the head shaft remains fixed. Solder chip 6 with the lower end surface of 13 facing downward, die 9
Furthermore, no impact force is applied to a substrate (not shown). As shown in FIG. 2, the solder chip 6 has a rectangular shape and is continuously punched out from the thin (approximately 0.05 mu) solder tape 1.

Therefore, the end face of the punch 7 is also rectangular, and the hole 10 of the die 9 is also rectangular. The upper part of the punching hole 10 of the die 9 is formed with a pyramid-shaped guide portion 9'. The downwardly protruding tip of the holder 18 of the head shaft 13 is inserted into the guide portion 91. A pyramid-shaped guide taper portion 15 is formed. A suction surface 16 is formed. A suction hole 14 is opened in the suction surface 16 . The suction head 12 configured in this way is moved downward by the movement of the arm 19 immediately before the punch 7 rises to punch out the solder chip 6, so that the suction surface 16 is positioned directly above the punching hole 10, and Furthermore, the air in the suction hole 14 is sucked into the suction surface 16 by a vacuum device (not shown). Therefore, the punch r rises and punches out the solder chip 6, and the solder chip 6 is punched out through the hole 10.
When the solder chip 6 is pushed up to the top of the suction head 12
It is attracted to the attraction surface 16 of. When the solder chip 6 is sucked, the suction head 12 is raised by the drive of the arm 19.
The suction surface 16 is moved so as to come into contact with a desired position on the upper surface of the substrate (not shown), and the vacuum pump is stopped, or the suction surface 16 is connected to the suction surface 14 (as shown), and the valve in the piping is opened. It becomes open, releasing the adsorption of solder chips. Further, when the punch 7 finishes punching and descends, the punch guide 8 descends, and as explained in FIG. 1, the solder tape 1 is fed and preparations for punching the next solder chip 6 are completed.
Since the entire surface of the solder chip 6 comes into contact with the flat suction surface 6 and is suctioned, the solder chip 6 does not wrinkle or sag, so that it can be placed on the substrate without being damaged.

Further, since the compression coil spring 17 is inserted, it is cushioned and the solder chip 6 or the board will not be damaged.
In the illustrated embodiment, only one suction hole is opened in the center of the suction surface, but if two or three suction holes are opened depending on the size of the solder chip, it will be more stable. Can absorb solder chips.

(g) Effects of the Invention As explained above, the present invention automatically sucks a solder chip with a suction head each time it is punched out from a solder tape, and supplies and places it on a desired position on a board. It has great practical effects, such as not damaging the chip and being efficient.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing essential parts of an embodiment of the present invention. FIG. 2 is a perspective view of the cutting die part in FIG. 1, and the opening is a cross-sectional view of the cutting die immediately after punching. In the figure, 1 is soldering tape, 2 is a roller, 31 is a friction roller, 4 is a ratchet, 6 is a soldering chip, 7 is a punch, 8 is a punch guide, 9 is a die 10, and 11 is a die holder. 12 is a suction head, 13 is a head shaft, 1
4 is a suction hole, 16 is a suction surface, 18 is a head holder, 1
9 indicates an arm.

Claims (1)

[Claims] 1. In a method for manufacturing an electrical component in which a chip-shaped electrical element or the like is fixed to the upper surface of a substrate via a solder chip,
Punch out a solder chip from a foil-shaped solder tape using a punch and a die, insert the tip of the suction head attached to the tip of the arm into the punching hole of the die on the opposite side of the punch, and punch out the solder chip. A method for supplying solder chips, which comprises vacuum suctioning the solder chips to the tip surface of a suction head, and then driving the arm as desired to place the solder chips at a desired position on the upper surface of the substrate. .