JPS5923255B2 - Manufacturing method for mosaic flooring - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a method for manufacturing mosaic flooring,
More specifically, it is a thermoplastic resin flooring material with improved aesthetics that is made by fusing two or more types of mosaic chips with different colors, shapes, textures, etc. onto a base material according to a desired arrangement pattern. Regarding manufacturing methods.

As a means of decorating floors or walls, small pieces of stone, glass, metal, porcelain, etc. are fixed with mortar and the joined ends of the pieces are sealed with hydraulic cement, or on long base materials. A method is known in which mosaic chips are continuously bonded with an adhesive that has been applied in advance.

Although it is possible to form flooring and wall materials with good aesthetics to some extent using these methods, all of these existing methods require significant labor and time for construction, and are difficult to form when forming the floor or wall surface. It is not practical as it requires a high degree of skill. On the other hand, as a new method for producing flooring or wall materials in place of these existing methods, US Pat. A method is described in which, after bonding, the gaps between the mosaic pieces are filled with a powdered matrix resin, and this is pressed under heat to form a mosaic-like flooring material.

Although this method has greatly facilitated the manufacture of flooring on an industrial scale, it also requires a process in which the mosaic pieces are laid over the entire surface of the substrate only once. This has a fatal drawback in that it is virtually impossible to select the pattern for disposing the mosaic pieces. In other words, this method only forms an irregular arrangement of mosaic pieces that is almost uniform over the entire area on which the mosaic pieces are laid, and does not produce geometric repeating patterns or figurative or abstract paintings. It was completely impossible to form a pattern on the surface of the mosaic piece. The main purpose of the present invention is to eliminate the practical constraints associated with the above-mentioned prior art, and to freely change the degree of freedom in mosaic chip arrangement, that is, the type of designs and patterns formed by mosaic chips on the surface of the flooring material. An object of the present invention is to provide a means for manufacturing a new mosaic-like flooring material.

Another object of the present invention is to provide a process for manufacturing a mosaic-like flooring material that is capable of repeating a desired mosaic chip arrangement pattern and has excellent productivity and operational stability.

These objects of the present invention are to supply first thermoplastic resin mosaic chips onto a continuously supplied elongated base material, and to form a non-overlapping layer of the mosaic chips on the base material. After heating, the mosaic chips are fed to a pressure roll having pressure protrusions on the circumference according to a predetermined mosaic chip pressure bonding pattern to pressure the mosaic chips onto the base material, and the mosaic chips that are not pressure bonded by the pressure roll are was removed from the base material, a second thermoplastic resin mosaic chip was crimped onto the surface of the elongated base material to which the first mosaic chip was not crimped, and then further crimped onto the base material. Powdered matrix resin is supplied into the gap between the first and second mosaic chips, and the matrix resin and mosaic chip pressure bonding layer are spread by preheating and applying pressure under heat to create a mosaic style in which the mosaic chip is buried around the mosaic chip with the matrix. This can be achieved industrially advantageously by employing a method for producing flooring materials.

Hereinafter, the method of the present invention will be explained in detail based on the illustrations of the accompanying drawings.

In the drawings, FIG. 1 is a process schematic diagram showing the method of the present invention, and FIG. 2 is an overall perspective view of a pressure roll having pressure projections on its circumferential surface. FIG. 3 is a top perspective view of the mosaic chip laying layer pressed onto the base material by the first pressure roll of FIG. 2, and FIG. FIG. 3 is a top perspective view of the conditioned flooring material. In carrying out the present invention, the thermoplastic resin forming the mosaic chip is polyvinyl chloride or a copolymer thereof, polyvinylidene chloride or a copolymer thereof, vinyl chloride vinyl monoacetate, vinyl chloride monovinylidene chloride, vinylidene chloride monoacetic acid. vinyl,
It can be arbitrarily selected from mixtures of the above polymers or copolymers, such as vinyl chloride monoacetate pinyruvinyl alcohol, depending on the physicochemical properties required for the mosaic chip.

Although there are no strict restrictions on the fluidity of the resin material forming these mosaic chips at the heating temperature,
In consideration of the adhesion to the base material and the ease of forming embossing on the surface of the product, it is desirable to select a resin material that has lower fluidity at the heating temperature than the thermoplastic resin material forming the matrix described below. Therefore, any resin other than those exemplified above can be suitably used as the mosaic chip forming material in the present invention as long as it exhibits such fluidity characteristics, such as polyethylene, polypropylene, methacrylate, etc. Alternatively, resin materials such as ABS may also be selected as the material for forming the mosaic chips of the present invention. These thermoplastic resins may also contain various plasticizers, stabilizers, fillers, lubricants, pigments, etc., as required. In order to make the fluidity at the heating temperature of the mosaic chip lower than that at the heating temperature of the matrix, the degree of polymerization of the resin and the amount of monomers to be copolymerized must be adjusted when selecting the resin for forming the mosaic chip and the powdered matrix. Adjust the type and amount of body, the type and content of filler or plasticizer, or a combination thereof. On the other hand, the powdered thermoplastic resin used as the matrix forming material fills the gap between the first and second mosaic chips that are pressed onto the base material, and is melted by heating to solidify the space between the mosaic chips. It is necessary to form a fused structure with a grain size of 3.
The fine powder is preferably 5 mesh or less, more preferably 42 mesh or less, and may contain a filler such as calcium carbonate. In order to maintain the embossability etc. at a practically satisfactory level, the thermoplastic resins forming the first and second mosaic chips are desirably blended in an amount equal to or less than the weight of the matrix resin. After being fed to a compounding device such as the above, kneaded, calendered or extruded to form a sheet, fed to a dicing machine and cut into regular shapes, or cut into irregular shapes with a crusher to form chips.

The shape, size, color or texture of the first and second mosaic chips may be freely selected, and the first and second mosaic chips may have different shapes, sizes, colors, textures, etc., if necessary. Mixtures of several types of chips can also be used. However, when crimping with a pressure roll, it is necessary to apply a uniform pressure force to the entire surface of the mosaic chips laid on the base material, so at least a group of mosaic chips supplied at the same time on a long base material , each preferably having substantially equal thickness. Furthermore, the long base material to which the mosaic chips are crimped is an endless chip-placing sheet made of asbestos, fiber cloth, resin film, paper, etc. Although it is not absolutely necessary to apply an adhesive, it is possible to use a drying agent, such as an FVA resin adhesive, prior to supply, to facilitate the pressing of the mosaic chips with a pressure roll after subsequent heating. It is also possible to apply a thermally activated adhesive to the chip-receiving surface of the substrate.

In FIG. 1, a first thermoplastic resin mosaic chip 40 housed in a hopper 12 having a metering roll 11 and a doctor blade 13 is connected to a long base material 10 that is continuously supplied from a separate supply source. A non-overlapping laying layer 50 of the mosaic chips is formed on the substrate by the operation of the vibrating device 14 which is supplied above and positioned below the travel path of the elongated substrate.

In a preferred embodiment, a fallen chip collecting device (not shown) that utilizes a suction air flow or the like is provided adjacent to the vibrating device 14, and the mosaic chips that have slid down from the base material are collected by the operation of the vibrating device and returned to the hopper. You can also send it back to 12. Base material 10 as a laying layer 50 with no overlap
The first mosaic chip 40 placed on the top is transferred to a known heating device 20 that uses an infrared heater or the like, where it is heated and the mosaic chip 40 is placed on the base material by the subsequent pressure roll 30. Soften to the extent that crimping is possible.
The heating temperature cannot be determined uniformly because it varies depending on the type or composition of the thermoplastic resin forming the first mosaic chip, but for example, when vinyl chloride resin is selected as the material for forming the mosaic chip, it is 170°C. The softening of the first mosaic chip 40 can be completed by heating it to 190°C. Alternatively, if an adhesive has been applied to the substrate prior to laying the mosaic chips, the softening of the adhesive can be completed by heating to 110 to 130°C. The first mosaic chip 40 on which the non-overlapping laying layer 50 has been formed is then supplied to the first pressure roll 30 having pressing protrusions 32 protruding from the circumferential surface according to a predetermined mosaic chip crimping pattern, and then the first mosaic chip 40 is fed to the first pressure roll 30 having pressure protrusions 32 protruding from the circumferential surface according to a predetermined mosaic chip crimping pattern. Accordingly, the first mosaic chip 40 is crimped onto the base material 10, and then supplied to a known vacuum suction device 60 having a suction port facing the mosaic chip laying layer 50, where the pressure roll is removed. The mosaic chips 40 that have not been crimped by the pressure roller 30 are removed by suction, and the first mosaic chips 40 are attached to the base material 10 in accordance with the mosaic chip crimping pattern of the pressure protrusions 32 provided on the first pressure roll 30. Form into a crimped first intermediate product.
The unpressed mosaic chips removed by the vacuum suction device 60 are returned to the hopper 12 for reuse. The first intermediate product obtained in this way is then slowly cooled and rolled up, or is placed directly under the second hopper 17 containing the second mosaic chip 42 made of thermoplastic resin without being rolled up. Supply to position.

The second mosaic chip 42 is laid on the base material 10 on the part of the base material 10 on which the unpressed first mosaic chip 40 has been suctioned and removed by the operation of the vacuum suction device 60. The measuring roll 15 and the doctor blade 16 are operated to form the laying layer 52 of the second mosaic chip 42. The operation of the second vibrating device 19 located below the travel path of the elongated substrate facilitates the formation of a laying layer 52 of the second mosaic chips 42 without overlapping. In this case as well, as a preferred embodiment, a falling chip recovery device (not shown) using a suction air flow or the like is provided adjacent to the vibration device 19, and the second mosaic chip that has slipped from the base material due to the operation of the vibration device 19 is removed. 42 can also be collected and returned to the hopper 17. The second mosaic chip 42 placed on the base material 10 as a non-overlapping laying layer 52 is integrated with the non-overlapping laying layer 50 formed by the first mosaic chips 40 that has already been formed. A mosaic chip laying layer 54 is formed on the mosaic chips 10 in which a first mosaic chip 40 and a second mosaic chip 42 are placed according to a predetermined arrangement pattern. The non-overlapping chip laying layer 54 formed by repeatedly laying different types of mosaic chips is then transferred to a second heating device 22 that uses an infrared heater or the like, where it is heated and the second mosaic chips 42 are placed next. The material is softened to the extent that it can be pressed onto the substrate by a second pressure roll 34 having a flat pressure surface 36 . The heating temperature conditions for the second mosaic chip must be determined in consideration of the type of thermoplastic resin forming the second mosaic chip, but if the second mosaic chip has the same composition as the first mosaic chip 40, If so, the heating conditions can be selected to be the same as those for the first mosaic chip. The heating by the heating device 22 naturally brings about a softening phenomenon in the first mosaic chip 40 that is pressed onto the substrate together with the second mosaic chip 42, but the first mosaic chip 40 is heated by the subsequent flat pressing surface. Since the first mosaic chip is merely repeatedly pressed by the second pressure roll 34 having a pressure of 100.degree. Alternatively, if an adhesive has been previously applied to the surface of the substrate, the heating temperature may be between 110 and 13, which may soften the adhesive.
It is possible to select within the range of 0 addition. The heated chip laying layer 54 is then applied to the mosaic chips 40 and 4.
The second mosaic chip 40 and the second mosaic chip 42 are supplied to a second pressure roll 34 having a flat pressure surface that applies a pressure force over the entire surface of the two laid layers to maintain the arrangement pattern of the first mosaic chips 40 and the second mosaic chips 42. While attaching the second mosaic chip 42 to the base material 1
0 and two types of mosaic chips 40 and 42 are pressed together to form a chip laying layer 56. The first pressure roll 30 is a metal roll having pressure protrusions 32 on its circumferential surface that correspond to the pressure bonding pattern of the mosaic chips. A back-up roll 35 is provided on the lower surface of the laying layer 50 so as to sandwich it, and a pressing force of 400 to 3000 K9 is applied to the entire width of the mosaic chip laying layer. The second pressure roll 34 has the same structure and function as the first pressure roll except that it has a flat pressure surface without pressure protrusions, and simultaneously presses the first and second mosaic chips to create a chip laying layer. form 56. In order to facilitate understanding, the above explanation has exemplified a mode in which supplying and crimping of mosaic chips onto a base material is repeated twice, but from supplying mosaic chips to crimping using a pressure roll having pressure protrusions. The process can be repeated as many times as desired according to the same combination of process sequences as described above, depending on the type of mosaic chip to be laid on the substrate or the crimp pattern of the mosaic chip. The second intermediate product 56 is then cooled to about room temperature, and after being rolled up, or without being rolled up, it is transferred to the third hopper 18 containing the powdered matrix resin 44.
lead downwards.

The third hopper 18 is connected to the first and second hoppers 12,
The matrix resin 44 has a measuring roll and a doctor blade similar to 17, and is supplied from the third hopper 18 to the gap between the mosaic chips crimped onto the upper surface of the base material 10.
Adjust the amount. In a preferred embodiment, a vibration device (not shown) is provided adjacent to the hopper 18 and below the intermediate product 56 for which the matrix resin 44 has been supplied, so that the powdered matrix resin 44 filled in the gaps between the mosaic chips is heated. Vibration may be applied to increase the packing density of the matrix resin. The intermediate product 56 is then supplied to a second vacuum suction device 64 to remove by suction the excess matrix resin 44 remaining on the surface of the mosaic chip laying layer without being filled into the gaps, and the mosaic chips are laid on a roll brush 65. With the surfaces of the layers in light contact, the brush is rotated in a direction opposite to the direction of movement of the intermediate product 56 to lift up excess matrix resin, which is then suctioned away by a suction cleaner 66. The excess matrix resin removed by suction is returned to the third hopper 18 for reuse. Intermediate product 56 from which excess matrix resin has been removed
The material is then supplied to a third heating device 24 using, for example, an infrared heater and heated to 150 to 200°C to melt the powdered matrix resin filled between the mosaic chips. heating press 7
Supply to 0.

For example, the heating press 70 may be
A pressure roll 72 that applies a linear pressure of about 000 Kf,
It is a means for spreading a sheet-like material having a steel band 74 that applies a pressing force of about 5 Kf/Cfli at a heating temperature of about 180° C., and the sheet-like material is spread by pressing the melted matrix resin into the gaps between the mosaic chips. It spreads along with. The sheet-like material 58 thus obtained is
The mosaic flooring is then supplied to a known device such as a Feston type accumulator 80 for slow cooling, and the matrix resin 44 is firmly fused around the mosaic chips 40, 42 whose thickness is reduced by heating and pressurizing. It is formed in the material 90. The mosaic-like flooring material manufactured by the present invention has mosaic chips and matrix resin that form a substantially smooth surface with approximately the same height on the surface of the flooring material, and as a modified example, mosaic chips and matrix resin that are By controlling the degree of polymerization of the thermoplastic resin to be formed, the content of the filler, or the mixing weight ratio of the mosaic chips and the matrix resin, a difference in shrinkage rate can be caused in the resin in the slow cooling step. , can also include those that have embossing on the surface of the flooring material.

Hereinafter, the method of the present invention will be explained with reference to Examples, but the explanations are given for the purpose of illustration only and are not intended to limit the gist of the present invention.

In addition, unless otherwise specified, parts or percentages shall be expressed on a weight basis as a general rule. Example 1 Parts of PVClOO with an average degree of polymerization of 1100, 35 parts of DOP,
2 parts of epoxy plasticizer, 3 parts of Ca-Zn stabilizer, 200 parts of calcium carbonate (equal mixture of colloidal calcium carbonate with an average particle size of 0.08μ and heavy calcium carbonate with an average particle size of 10.3μ) , 2 parts of lubricant, and 0.5 part of light green color pigment were kneaded in a two-roll mill, and calendered to a thickness of 1.6wr! After forming the sheet into n sheets, it was fed to a dicing machine and cut into regular squares with a side length of 5 rm to produce a first mosaic chip 40.

A second mosaic chip 42 was also produced using the same mosaic chip manufacturing process as described above except that the pigment was yellow.

On the other hand, PVClOO part with an average degree of polymerization of 700, DOP3O
parts, 2 parts of epoxy plasticizer, 3 parts of Ba-Zn stabilizer,
0.25 parts of white pigment was fed to the super mixer and the mixture was heated to 110
By mixing under temperature conditions of 140° C. to 140° C., a finely powdered matrix resin 44 having a particle size of 42 mesh or less was prepared.

First, the first mosaic chip 40 is housed in the hopper 12 as shown in FIG.
Thickness 0.7rIrm supplied continuously at a rate of RwL
The first mosaic chip is supplied onto a long base material 10 made of an asbestos sheet having a width of 1,900 wan, and the first mosaic chips are stacked on the base material 10 by the operation of a vibration device 14 provided on the lower surface of the travel path of the long base material. 100 parts of EVA emulsion (solid content: 9q6) and acrylic are applied to the mosaic chip laying surface of the base material 10 to form a layer 50 with no cracks and to facilitate the crimping of the mosaic chips. A heat-activated adhesive consisting of 0.2 parts of acid emulsion and 1 part of concentrated ammonia water was applied and dried.

The chip laying layer 50 is then transferred to the infrared heater 20 and heated to 120° C. to soften the adhesive coating layer to the extent that the first mosaic chip 40 can be crimped onto the base material 10, and then the surrounding area is heated. The chip is supplied to a first pressure roll 30 having mesh-like pressure protrusions 32 protruding from its surface, and a pressure of 2000 Kf is applied to the entire width of the chip laying layer at a temperature of 70°C to form a crimping pattern of the pressure protrusions 32. The first mosaic chip was pressed onto the base material 10 in accordance with the procedure.

The mosaic chips that have not been crimped by the pressure roll 30 are removed by a vacuum suction device 6 provided following the crimping process.
0 and returned to the hopper 12.
The first intermediate product thus obtained is then moved below the second hopper 17 containing the second mosaic chip 42, where the second mosaic chip 42 is placed, and the measuring roll 15, By operating the doctor blade 16 and the second vibrating device 19, a second mosaic chip was formed in a laid layer 52 without overlapping. The chip laying layer 52 is formed on the remaining surface of the base material 10 to which the first mosaic chips 40 are not crimped as described above, and is formed by laying the already formed first mosaic chips 40. A new mosaic chip laying layer 54 is formed integrally with the layer 50 in which the first mosaic chips 40 are arranged in a mesh pattern and the second mosaic chips 42 are arranged in the area surrounded by the mesh. This mosaic chip laying layer 54 is then transferred to the second infrared heater 22 and heated to 120° C. to soften the adhesive coating layer to the extent that the second mosaic chip 42 can be crimped onto the base material 10. After this, the mosaic chip laying layer 54 is supplied to a second pressure roll 34 having a flat pressing surface 36 for applying pressure, and a pressure of 2000 Kf is applied to the entire width of the chip laying layer at a temperature of 70° C. to form the mosaic chips 3. was crimped onto the base material 10.

The second intermediate product 56 thus obtained is cooled to about room temperature, and without being wound up, is guided directly below the third hopper 18 containing the finely powdered matrix resin 44, and is operated by a measuring roll and a doctor blade. By applying matrix resin 44 to the gap between the first and second mosaic chips,
was supplied.

The second intermediate product 56 is then supplied to a second vacuum suction device 64, and with the surface of the mosaic chip laying layer lightly in contact with the roll brush 65, the brush is moved in the opposite direction to the direction of movement of the intermediate product 56. It was rotated, and the excess matrix resin was floated up and removed by suction cleaner 66. Thereafter, the intermediate product 56 is supplied to the third infrared heater 24.
The matrix resin filled in the gaps between the mosaic chips is heated to 80°C and melted, and in this state the intermediate product 56 is
The melted matrix resin is supplied to a rotocure-type hot press 70 having a pressure roll 72 that applies a linear pressure of 2000 Kf per full width and a steel band 74 that applies a pressing force of 5 Kf/Cd at a heating temperature of 180° C., and the melted matrix resin is mosaiced. While pressing into the gaps between the chips, the mosaic chip laying layer was rolled out until the final product had a thickness of 2 fm, including the thickness of the base material 10, to obtain a sheet-like material 58. The thus obtained sheet-like material 58 was then fed to a Feston type accumulator 80 and slowly cooled to form a mosaic-like floor material 90 in which the matrix resin 44 was firmly fused around the mosaic chips 40 and 42. In the finally obtained flooring material, the surfaces of the mosaic chips 40 and 42 were raised about 0.2 cm above the surface of the matrix resin to form an embossed surface due to the difference in the degree of polymerization of the resin materials. As seen in the above embodiments, the method of the present invention involves regularly arranging a plurality of types of mosaic chips on the surface of a flooring material according to a desired crimping pattern. The object of the present invention is to provide a means for producing a mosaic-like flooring material, which is extremely useful based on its texture and embossed surface effect.

[Brief explanation of the drawing]

FIG. 1 is a schematic process diagram of the method of the present invention, and FIG. 2 is an overall perspective view of a pressure roll having pressure projections on its circumferential surface. 3 is a top perspective view of the mosaic chip laying layer pressed onto the base material by the first pressure roll of FIG. 2; FIG. Moreover, FIG. 4 is a top perspective view of a mosaic-like flooring material manufactured by the method of the present invention. 10: Long base material, 50, 52
, 54: Mosaic chip laying layer, 11, 15: Measuring roll, 20, 22, 24: Heating device, 12, 17, 18:
Hopper 1 30, 34: Pressure roll, 13, 16: Doctor blade, 32: Pressure projection, 14, 19: Vibration device, 60, 64: Vacuum suction device, 40, 42: Mosaic chip, 56: Intermediate product, 44: Matrix resin, 70
: heating press, 65: roll brush, 80: slow cooling device,
66: Suction cleaner 90: Mosaic flooring material.

Claims (1)

[Claims] 1. The first thermoplastic resin mosaic chips are continuously supplied onto a long base material, a non-overlapping layer of the mosaic chips is formed on the base material, and after heating, the predetermined mosaic chips are compressed. After feeding the mosaic chips to a pressure roll having pressure protrusions on the circumferential surface according to the pattern to press the mosaic chips onto the base material, and removing the mosaic chips that are not pressed by the pressure roll from the base material. , a second thermoplastic resin mosaic chip is crimped onto the surface of the elongated base material to which the first mosaic chip is not crimped, and then the first and second mosaic chips are further crimped onto the base material. A mosaic-like floor characterized by supplying a powdered matrix resin into the gap between the gaps, preheating and applying pressure under heat to spread the matrix resin and a mosaic chip pressure bonding layer, and burying the mosaic chips around them with the matrix. Manufacturing method of wood.