JPS5924913B2 - Spherical solder supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a spherical solder supply device for partial soldering.

Conventionally, when performing partial soldering, there is no device that can automatically supply spherical solder onto the object to be soldered, and even if automation is attempted, it is possible to reliably supply only one spherical solder. It is difficult to take out the solder from the container, and it is also difficult to carry the taken out minute spherical solder onto the object to be soldered and place it in an accurate position, so automation is not easy.

The present invention has been developed in view of these points, and it is possible to automatically pick up only one spherical solder and accurately position it on the object to be soldered when performing partial soldering. The purpose of this project is to make it possible to supply

An embodiment of the present invention will be described based on the drawings.

A rectangular ceramic plate B is attached to a circular metal plate A to form an object W to be soldered. The metal plate A is a diaphragm of a piezoelectric vibrator, and the ceramic plate B is plated with a solderable metal, and vibrates when the ceramic plate B is energized. P1, P2, and P3 are parts to be soldered on the object W to be soldered. In addition, solder is applied in advance to the portion or the entire portion of the lead wire L to be soldered to each of the soldered portions P1, P2, and P3 to be cut.

Also, the soldered parts P1, P2, P of the soldered object W
3 at a predetermined position, and the soldered parts P4, P2, P at the predetermined positions.
3, a flux and spherical solder supply unit 2 applies flux F in a dotted manner and supplies spherical solder H onto the dotted flux; and a lead wire supply unit 3 that brings the tip of a lead wire L close to the spherical solder H. and,
By irradiating the beam F to the spherical solder H and melting the spherical solder H, the soldered parts P1 and P2 are melted.
, P3 and the lead wire L, and a lead wire cutting unit 5 that cuts the lead wire L to a predetermined length are respectively disposed.

Further, a transfer mechanism 6 for the table unit 1 is provided between the flux and spherical solder supply unit 2 and the beam unit 4.

Next, the flat solder and the spherical solder supply unit 2 will be explained.

A small base 13 is provided on the dog base 11 via a support part 12 so as to be movable and adjustable with an adjustment screw 14, and a bearing 16 is fitted from above into the mounting hole 15 at the center of the small base 13, and this bearing The upper flange 18 of the 16 outer cylinder portion 17 is supported by the small base 13 via a member 19.

Since a spline 22 is formed in the vertical direction on the inner peripheral surface of the inner cylindrical portion 21 of the bearing 16, this spline 22
A vertical spline 24 on the outer circumferential surface of the main shaft 23 is fitted to the main shaft 23 so as to be vertically movable.

An arm 26 is fixed horizontally to the upper end of the main shaft 23 via a flange 25, and a downwardly opening suction nozzle 27 is attached to the tip of the arm 26. The rotary joint 31 at the lower end of the main shaft 23 is connected through a pipe 28 provided between the main shaft 23 and the upper end of the main shaft 23 and a through hole 29 inside the main shaft 23. Further, a gear 32 is integrally fitted to a lower fixed position of the main shaft 23, and a vertical movement operation base 34 is rotatably fitted via a bearing 33.

Further, a mounting portion 35 is provided on the lower surface of the small base 13, and a main body 38 of a pneumatic cylinder 37 as a main shaft vertical movement drive unit is fixed to a mounting plate 36 at the bottom of this mounting portion 35, and a piston rod of this pneumatic cylinder 37 is fixed. The upper end of 39 is connected to the underground movement operation base 34. Further, a stopper 41 is provided on the upper surface of the vertical movement operation base 34 to stop the base 34 from rising. Further, a stopper 42 for stopping the lowering of the base 34 is provided upright on the mounting plate 36 of the pneumatic cylinder 37. Further, a mounting part 43 is fixed to the lower surface of the small base 13, and a support part 44 protruding from the mounting part 43 is used to connect the main body 46 of the pneumatic rotary attuator 45 as a main shaft rotation drive part.
is fixedly supported in a fixed position, and a hollow gear 4 with thick teeth is mounted vertically on a rotating shaft 47 of this pneumatic rotary actuator 45.
8 are fitted together, and this gear 48 and the gear 32 are meshed.

49 is a stopper for the rotation shaft 47.

Further, a spherical solder container 52 is fitted and fixed in the mounting hole 51 at one end of the base 13, and this spherical solder container 5
A solder accommodating recess 53 having a V-shaped cross section is opened at the upper end of the solder holder 2, and a large number of spherical solders H are accommodated inside the accommodating recess 53. Further, a push-up rod 54 is fitted into the bottom of the spherical solder accommodating recess 53 so as to be movable up and down. A spherical solder fitting receiving groove 55 for one spherical solder H is formed at the upper end of this push-up rod 54. Further, a mounting part 56 is fixed to the lower part of the spherical solder container 52, and a main body 58 of a pneumatic cylinder 57 as a push-up rod vertical movement drive part is attached to the mounting part 56.
is fixed, and the piston rod 59 of this pneumatic cylinder 57 is
The upper end is connected to the lower end of the push-up rod 54.

Further, a receiving portion 61 is fixed on the other end of the base 13, a flux tank 63 is fitted into the groove 62 of the receiving portion 61, and a flux is accommodated inside the flatus tank 63. A cover plate 64 is fitted over the opening in the upper surface of the flux tank 63, and an insertion hole 65 is provided in the center of the cover plate 64. Further, an arm portion 6 is attached to the flange portion 25 at the upper end of the main shaft 23.
A flux application rod 67 is fixed through the screw 6. Note that the spherical solder accommodating recess 53 and the flux tank 63 are connected to the main shaft 2.
The suction nozzle 27 and flatus application rod 67 are arranged at 90 degrees with the main shaft 23 as the center. In addition, the suction nozzle 2
A vacuum pressure circuit 68 is connected to the rotary joint 31 that communicates with the rotary joint 7.

This vacuum pressure circuit 68 has a pipe 69 connected to the swivel joint 31.
and connect this pipe 69 to pipe 71 and pipe,
A vacuum switching valve 73 is connected to the pipe 71, and a vacuum switching valve 74 is connected to the pipe 72, and the vacuum switching valve 73 connects to the intake port 77 of the vacuum pump 76 via a pipe 75 The vacuum switching valve 74 is connected to a sub-exhaust port 79 of the vacuum pump 76 via a pipe 78. This sub-exhaust port section 79 exhausts a portion of the amount of air exhausted from the main exhaust port section 81 . Next, the functions of this flux and the spherical solder supply unit 2 will be explained.

The push-up bar 54 is raised to a predetermined level by the pneumatic cylinder 57, and the single spherical solder H fitted in the fitting receiving groove 55 at the upper end of the push-up bar 54 is pushed up to the predetermined level.

Next, the pneumatic rotary actuator 45 pushes up the push-up rod 5.
The tip of the suction nozzle 27 that has been rotated upwards in 4 is lowered by the pneumatic cylinder 37 to bring it close to the spherical solder H, and the vacuum switching valve 73 of the vacuum pressure circuit 68 is turned on to communicate with the vacuum switching valve 68. 74 is turned off and shut off, the suction port 77 of the vacuum pump 76 is communicated with the suction nozzle 27, and the spherical solder H is suctioned and held by the suction nozzle 27.

At the same time, the flux attached to the flux application rod 67 is applied to a predetermined position on the object W to be soldered. Next, operate the pneumatic cylinder 37 to raise the suction nozzle 27,
The pneumatic rotary actuator 45 is operated to rotate the suction nozzle 27 by 90 degrees counterclockwise in the figure, and stop it at a predetermined position on the object W to be soldered.

At the same time, the flux application rod 67 is positioned directly above the insertion hole 65 of the flux tank 63. Next, the tip of the suction nozzle 27 is brought close to the top surface of the object to be soldered W using the pneumatic cylinder 37, the vacuum switching valve 73 of the vacuum pressure circuit 68 is turned off, the vacuum switching valve 74 is turned on, and the vacuum pump 76 is turned off. A part of the air exhausted from the suction nozzle 27 is discharged from the suction nozzle 27, and the spherical solder H adsorbed by the suction nozzle 27 is dropped onto the center of the flatus F on the object W to be soldered.

At the same time, the flatus applicator rod 67 is inserted into the flux tank 63, so that the flatus is applied to the lower end.
Also, during this work, the push-up bar 54 is lowered, and the push-up bar 54 is lowered.
One piece of spherical solder H is placed on the tip fitting receiving groove 55 of No. 4.

Next, the overall operation of this soldering device will be explained.

Move the table unit opening to the position shown in the figure, make the rotator 101 of the table unit opening attract and hold the object W to be soldered, and move the rotator 101 of the table unit 1
01, the part to be soldered P1 is rotated and set directly below the flux application rod 67 at the position shown in the figure.

The rotation stop control of the rotator 101 will be explained later.
Next, when the main shaft 23 of the flux and spherical solder supply unit 2 is lowered and the lower end of the flux distributing rod 67 is lowered to the soldering target part P1, the lower end of the flux applying rod 67 is covered with the fine particles attached in the previous process. A small amount of flux is dropped onto the soldered portion P1 and applied in a dotted manner.

At the same time, the suction nozzle 27 also descends to suction the spherical solder H picked up by the push-up rod 54. Next, when the main shaft 23 is raised and rotated 90 degrees counterclockwise in the figure, the flux application rod 67 is positioned directly above the insertion hole 65 of the flux tank 63, and the suction nozzle 27
is located directly above the soldered part P1, so when the main shaft 23 is lowered in this state, the flux application rod 6
7 is inserted into the flux tank 63 and flux is attached to the lower end thereof, and the spherical solder H adsorbed by the suction nozzle 27 is released from adsorption by switching the vacuum pressure circuit 68, and the solder object W is Drop it into the center of flux F above.

Next, the main shaft 23 is raised and rotated 90 degrees clockwise to the position shown in the figure to return to the original state, so the rotator 101 at the table unit opening is rotated by a predetermined angle and the next solder is placed. By positioning the soldering part P2 directly below the flux application rod 67 and repeating the same action, flux F and spherical solder H can be supplied to the soldered part P2, and the same can be applied to the soldered part P3. Flux F
and spherical solder H can be supplied.

Next, the table unit 1, on which the process of supplying the plurality of fluxes F and the spherical solder H has been completed, moves to just below the beam unit 4 and stops.

Next, the lead wire pulling claw 102 is closed, the lead wire fixing body 103 is opened, and the movable base 104 of the lead wire supply unit 3 in the standby state is advanced, thereby removing the pulley 105 from the winding bobbin (not shown). The lead wire L that has been drawn out through the soldering point is further pulled out, and the tip of the lead wire L is brought close to the spherical solder H on the object W to be soldered, and the beam unit 4 is operated in this state. As a result, the solder h at the tip of the lead wire L and the spherical solder H are melted on the object W to be soldered, and the tip of the lead wire L is fixed to the object W by the action of the flux F. Note that the time required for this soldering is about 1 second. Next, the lead wire pull-out claw 102 is opened, the lead wire fixing body 103 is closed, the movable base 104 is moved backward, the pull-out claw 102 is closed again, and in this state, the cutting blade 106 of the lead wire cutting unit 5 is connected to the link mechanism. When attempting to push up the cutting blade 106, the cutting blade 106 first opens due to the braking force acting on the vertically moving rod 107, and then the vertically moving base 108 of this cutting blade 106 rises, causing the cutting blade 106 to move upward. The lead wire L is inserted into the opening, and in this state, the cutting blade 10
6 through the link mechanism, the cutting blade 106 first closes due to the braking force acting on the vertically movable rod 107 and cuts the lead wire L, and then the vertically movable base of the cutting blade 106 closes and cuts the lead wire L. 108 descends.

Now supplying lead wire L to one spherical solder H,
Since the beam irradiation and the cutting of the lead wire L are completed, repeating this series of steps three times with the rotation process of the table unit 1 in between will result in soldering parts Pl, P2, P3 at three predetermined pitches. Three lead wires L can be fixed to each of the parts, and one product is completed.

When all the steps are completed in this way, the table unit 1 returns to its initial position and waits until the next object W to be soldered is set after removing the finished product.

To explain the rotation stop control of the rotator 101 of the table unit 1, a reflective photoelectric sensor is set on the metal plate A of the object W to be soldered, and when the object W to be soldered is rotated. When the ceramic ivy plate B is applied to the irradiation point of the photoelectric sensor, a different reflected signal is input to the photoelectric sensor, so the position of the object W to be soldered is used as the reference point, and the rotor 101 is set at a 1:1 ratio. The amount of rotation of the stepping motor 113 driven through the gears 111 and 112 with the gear ratio is
Since it is constantly monitored by a rotary encoder (not shown in the figure) installed on the shaft of a gear (not shown in the figure) that meshes with the gear 112 at a gear ratio of 1:1, the reference is determined by the photoelectric sensor. When the points are confirmed, the parts to be soldered Pl, P
The stepping motor 113 rotates while aiming at the setting value of a digital counter (not shown) in which the position of 2, P3 is set in advance, and the position of each soldered part Pl, P3 is set.
2. When P3 is located directly below the suction nozzle 27 and the flux application rod 67, the input value from the rotary encoder to the digital counter matches the set value of the digital counter, and the output relay is switched and stepping By stopping the rotation of the motor 113, the object W to be soldered can be rotated to a desired angle and then stopped.

As described above, according to the present invention, a spherical solder accommodating recess with a V-shaped cross section is provided in the base, a push-up rod is fitted into the bottom of the spherical solder-accommodation recess so as to be movable up and down, and the spherical solder is attached to the upper end of the push-up rod. Since one spherical solder fitting receiving groove is formed and the push-up bar is moved up and down, when the push-up bar is lowered, the spherical solder gathers at the bottom of the letter-shaped accommodation recess, and this When the push-up rod is fitted into the upper end fitting groove on the bottom and the push-up rod is raised, the upper end fitting groove ensures that only one piece of spherical solder out of the many spherical solders in the accommodation recess is inserted. The push-up rod does not pick up multiple solder balls or lift up.

In addition, the spherical solder is vacuum-adsorbed with a suction nozzle, and this suction nozzle is rotated above the object to be soldered by the rotation of the main shaft, so that the spherical solder is picked up by the push-up rod. It is possible to reliably pick up individual pieces of spherical solder, and to easily place them on the correct position on the object to be soldered by switching the vacuum pressure circuit.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a 1'' embodiment of the entire soldering device according to the present invention, Fig. 2 is a front sectional view showing an embodiment of the spherical solder supply device of the present invention, and Fig. 3 is the main part thereof. Enlarged view of
FIG. 4 is a side sectional view thereof, FIG. 5 is a vacuum pressure circuit diagram thereof, and FIG. 6 is an explanatory diagram of the operation of the entire soldering apparatus. 13...Base, 23...Main shaft, 26
... Arm part, 27 ... Suction nozzle, 45
......Pneumatic rotary actuator as the king shaft rotation 1 drive unit, 53...Spherical solder storage recess,
54... Push-up rod, 55... Spherical solder fitting receiving groove, 57... Pneumatic cylinder as the upper pivoting drive part of the push-up bar, 68...・Vacuum pressure circuit, W...
...Soldering object, H...Spherical solder.

Claims (1)

[Claims] 1. A main shaft is rotatably attached to the base, and a spherical solder accommodating recess with a V-shaped cross section is provided. A push-up rod is fitted in the bottom of the spherical solder-accommodating recess so as to be movable up and down, and a spherical solder is attached to the upper end of the push-up rod. One spherical solder fitting receiving groove is formed, a downwardly opening suction nozzle is attached to the main shaft via the arm, a vacuum pressure circuit is connected to this suction nozzle, and the suction nozzle is connected to the main shaft. A main shaft rotation drive unit that rotates between the upper part of the push-up bar and the upper part of the object to be soldered is connected, and a push-up bar vertical movement drive unit that moves the push-up bar up and down is connected to the push-up bar. A spherical solder supply device.