JPS5925319B2 - semiconductor memory device - Google Patents
semiconductor memory deviceInfo
- Publication number
- JPS5925319B2 JPS5925319B2 JP52046947A JP4694777A JPS5925319B2 JP S5925319 B2 JPS5925319 B2 JP S5925319B2 JP 52046947 A JP52046947 A JP 52046947A JP 4694777 A JP4694777 A JP 4694777A JP S5925319 B2 JPS5925319 B2 JP S5925319B2
- Authority
- JP
- Japan
- Prior art keywords
- column
- row
- line
- column line
- line side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Static Random-Access Memory (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
- Semiconductor Integrated Circuits (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Description
【発明の詳細な説明】
この発明は半導体メモリ装置、特にスクリーニング用の
テスト用端子を設けた半導体メモリ装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor memory device, and particularly to a semiconductor memory device provided with a test terminal for screening.
半導体の高密度集積技術の進展に伴いメモリ装置への半
導体の適用が進み、ますます大容量化の傾向にある。With the progress of high-density integration technology of semiconductors, the application of semiconductors to memory devices is progressing, and there is a trend toward increasingly larger capacities.
第1図は従来の半導体メモリ装置の構成を示すブロック
図で、図において、1はメモリセル部で、行方向の選択
線である行線2と列方向の選択線である列線3と図示は
省略してあるが各行線2と各列線3とのすべての交点に
はメモリ用半導体素子が設けられている。4は行選択回
路、5は列選択回路、6は行線への信号供給端子、1は
列線への信号供給端子である。FIG. 1 is a block diagram showing the configuration of a conventional semiconductor memory device. In the figure, 1 is a memory cell section, and a row line 2 is a selection line in the row direction, and a column line 3 is a selection line in the column direction. Although not shown, memory semiconductor elements are provided at all intersections between each row line 2 and each column line 3. 4 is a row selection circuit, 5 is a column selection circuit, 6 is a signal supply terminal to the row line, and 1 is a signal supply terminal to the column line.
なお、図には示されていないか、行選択回路4および列
選択回路5には選択番地を指定するアドレス情報の入力
端子か設けられるのが普通である。さて、この装置の動
作を説明する。Although not shown in the figure, the row selection circuit 4 and the column selection circuit 5 are usually provided with an input terminal for address information specifying a selected address. Now, the operation of this device will be explained.
行選択回路4は行線2の一本を選択し、この選択された
行線2に信号供給端子6からの行駆動信号が供給される
。一方、列選択回路5は列線3の1本を選択し、この選
択された列線3に信号供給端子7からの列駆動信号が供
給される。このようにして、選択された行線と列線との
交点にあるメモリ用半導体素子がアクセスされ、所定の
書込みもしくは読出しの操作が行なわれる。ところで、
半導体メモリ装置には、いわゆるビット不良と呼ばれる
故障がよく発生する。The row selection circuit 4 selects one of the row lines 2, and the row drive signal from the signal supply terminal 6 is supplied to the selected row line 2. On the other hand, the column selection circuit 5 selects one of the column lines 3, and the column drive signal from the signal supply terminal 7 is supplied to the selected column line 3. In this way, the memory semiconductor element located at the intersection of the selected row line and column line is accessed, and a predetermined write or read operation is performed. by the way,
2. Description of the Related Art Failures called so-called bit defects often occur in semiconductor memory devices.
特に、製造欠陥を含んだメモリセルは、その欠陥部分を
何回かアクセスするうちに特性劣化をきたし、ビット不
良となつて現れてくる。従つて、信頼度の高い製品を出
荷するには、メモリセルを構成する全ビットの半導体素
子について、ある程度の回数アクセスして、劣化すべき
ものは劣化させてスクリーニングを行う必要がある。従
来の半導体メモリ装置では、第1図に示すような構成を
有しているのみであるから、このスクリーニングのため
にも1ビツトずつ通常の方法で順次アクセスする他に方
法がなく、全ビツトについて所要回数アクセスするには
非常に長時間の動作か必要であつた。この発明は以上の
ような点に鑑みてなされたもので、メモリセルの全ビツ
トについて同時にアクセス動作を行えるようにし、スク
リーニングに要する時間を大幅に短縮することのできる
半導体メモリ装置を提供せんとするものである。第2図
はこの発明の一実施例を示すプロツク構成図で、MOS
集積回路を使用した場合の例である。In particular, in a memory cell containing a manufacturing defect, the characteristics deteriorate as the defective portion is accessed several times, resulting in bit defects. Therefore, in order to ship a highly reliable product, it is necessary to access the semiconductor elements of all bits constituting the memory cell a certain number of times and to perform screening by deteriorating those that should deteriorate. Since conventional semiconductor memory devices only have the configuration shown in Figure 1, there is no other way to perform this screening than to sequentially access each bit one by one using the usual method. A very long operation was required to access the required number of times. The present invention has been made in view of the above points, and it is an object of the present invention to provide a semiconductor memory device that can perform access operations on all bits of a memory cell at the same time, and can significantly shorten the time required for screening. It is something. FIG. 2 is a block diagram showing an embodiment of the present invention.
This is an example when an integrated circuit is used.
図において、8は各行線2および各列線3に設けられ、
通常のアクセス動作とスクリーニングのための一斉アク
セス動作とを切換えるMOSトランジスタ、9は上記切
換え信号供給端子、10,11はそれぞれスクリーニン
グのための一斉アクセス動作時の行線および列線への信
号供給端子である。この実施例では、切換え信号供給端
子9に供給する切換え信号によつて各MOSトランジス
タ8をすべて遮断させると第1図に示した従来装置と全
く同様となり、行選択回路4および列選択回路5を経て
行および列駆動信号が選択された行線2および列線3へ
供給されて通常のアクセス動作が行われる。In the figure, 8 is provided on each row line 2 and each column line 3,
A MOS transistor for switching between a normal access operation and a simultaneous access operation for screening, 9 is the switching signal supply terminal, and 10 and 11 are signal supply terminals to the row line and column line during the simultaneous access operation for screening, respectively. It is. In this embodiment, when all the MOS transistors 8 are cut off by the switching signal supplied to the switching signal supply terminal 9, the result is exactly the same as the conventional device shown in FIG. Then, row and column drive signals are applied to the selected row line 2 and column line 3 to perform normal access operations.
しかし、このメモリセルのスクリーニングを行うときに
は、切換え信号供給端子9に供給する切換え信号によつ
て各MOSトランジスタ8をすべて導通させ、行線およ
び列線への信号供給端子10および11からそれぞれ全
行線2および全列線3に同時に駆動信号を供給すること
によつて、全ビツト一斉にアクセスされる。従つて、メ
モリセルのビツト容量をNとすれば、従来装置では、全
ビツトについて一通りアクセス動作を完了するにはN回
のアクセス動作か必要であつたのが、この発明の実施例
では、たマ1回のアクセス動作で上記と等価な効果が得
られ、スクリーニングに要する時間を従来の1/Nにす
ることができる。However, when screening the memory cells, all the MOS transistors 8 are made conductive by the switching signal supplied to the switching signal supply terminal 9, and all the rows are By applying drive signals to line 2 and all column lines 3 simultaneously, all bits are accessed at once. Therefore, if the bit capacity of a memory cell is N, in the conventional device, N access operations were required to complete one access operation for all bits, but in the embodiment of the present invention, Effects equivalent to those described above can be obtained with a single access operation, and the time required for screening can be reduced to 1/N of that of the conventional method.
上記実施例ではMOS集積回路を使用した場合を示した
か、バイポーラ集積回路を用いても実現できる。In the above embodiment, a case is shown in which a MOS integrated circuit is used, but it can also be realized using a bipolar integrated circuit.
以上詳述したように、この発明では、半導体メモリ装置
に用いるメモリセル部の行線のすべておよび列線のすべ
てにそれぞれ同時に行駆動および列駆動かできるように
なつているので、製品出荷前の製造欠陥のあるものは劣
化させ排除するスクリーニングの作業が非常に短時間で
可能になり、総合的に製造原価の低下、製品の信頼度向
上に貢献するものである。As detailed above, in the present invention, all row lines and all column lines of the memory cell section used in a semiconductor memory device can be simultaneously row driven and column driven. Screening operations for degrading and eliminating manufacturing defects can be carried out in a very short time, contributing to overall reductions in manufacturing costs and improved product reliability.
第1図は従来の半導体メモリ装置の構成を示すプロツク
図、第2図はこの発明の一実施例を示すプロツク構成図
である。
図において、1はメモリセル部、2は行線、3は列線、
4は行選択回路、5は列選択回路、8はスイツチング素
子(MOSトランジスタ)、9はスイツチング素子切換
え信号供給端子、10,11はそれぞれ一斉アクセス動
作時の行線および列線への信号供給端子である。FIG. 1 is a block diagram showing the configuration of a conventional semiconductor memory device, and FIG. 2 is a block diagram showing an embodiment of the present invention. In the figure, 1 is a memory cell section, 2 is a row line, 3 is a column line,
4 is a row selection circuit, 5 is a column selection circuit, 8 is a switching element (MOS transistor), 9 is a switching element switching signal supply terminal, and 10 and 11 are signal supply terminals to the row line and column line, respectively, during simultaneous access operation. It is.
Claims (1)
の行線、列選択回路によつてその1本が選択駆動される
複数の列線、及びこれらの各行線と各列線との交点に配
設されたメモリ用半導体素子を有するものにおいて、上
記各行線にそれぞれ直接接続された行線側のスイッチ素
子、これら行線側のスイッチ素子を通してそれぞれの上
記行線に行駆動信号を供給するための行信号供給端子、
上記各列線にそれぞれ直接接続された列線側のスイッチ
素子、これら列線側のスイッチ素子を通してそれぞれの
上記列線に列駆動信号を供給するための列信号供給端子
、及び上記行線側と列線側とのスイッチ素子を同時に開
閉する手段を備えたことを特徴とする半導体メモリ装置
。1 A plurality of row lines, one of which is selectively driven by a row selection circuit, a plurality of column lines, one of which is selectively driven by a column selection circuit, and a connection between each row line and each column line. In a device having memory semiconductor elements arranged at intersections, switch elements on the row line side are directly connected to each of the row lines, and a row drive signal is supplied to each of the row lines through the switch elements on the row line side. row signal supply terminal for
A column line side switch element directly connected to each column line, a column signal supply terminal for supplying a column drive signal to each column line through these column line side switch elements, and a column line side switch element connected directly to each column line. A semiconductor memory device comprising means for simultaneously opening and closing switch elements on a column line side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52046947A JPS5925319B2 (en) | 1977-04-22 | 1977-04-22 | semiconductor memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52046947A JPS5925319B2 (en) | 1977-04-22 | 1977-04-22 | semiconductor memory device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53132273A JPS53132273A (en) | 1978-11-17 |
| JPS5925319B2 true JPS5925319B2 (en) | 1984-06-16 |
Family
ID=12761482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52046947A Expired JPS5925319B2 (en) | 1977-04-22 | 1977-04-22 | semiconductor memory device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5925319B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897800U (en) * | 1981-12-22 | 1983-07-02 | 日本電気株式会社 | memory device |
| JPS6233400A (en) * | 1985-08-05 | 1987-02-13 | Mitsubishi Electric Corp | Semiconductor memory device |
| JP2558881B2 (en) * | 1989-06-30 | 1996-11-27 | 株式会社東芝 | Semiconductor memory device |
-
1977
- 1977-04-22 JP JP52046947A patent/JPS5925319B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53132273A (en) | 1978-11-17 |
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