JPS5927096B2 - Carrier film punching and forming equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a carrier film for punching a wiring lead portion in a carrier film having openings and forming wiring leads on the upper surface and bending the openings of the wiring leads. Regarding punching and forming equipment,
Specifically, the purpose is to provide an apparatus that can perform punching and bending in one operation, and can bend even thin wiring leads to a large extent without breaking them.

First, an example of the structure of a carrier film will be explained using FIG. 1.

In FIG. 1, reference numeral 1 denotes a long carrier film, which is provided with openings 2 and 3 as well as sprocket holes 4 for driving or positioning. 5
is a wiring lead formed on the upper surface of the carrier film 1, and a semiconductor chip (hereinafter referred to as a chip) 6 is bonded to the tip of the wiring lead 5 protruding into the opening 2.

Then, the part to which the chip 6 is bonded is punched out, and the intermediate part 5 at the opening of the wiring lead 5 is punched out.
A is bent and bonded to a desired substrate. Conventionally, when bonding to a substrate by punching out the portion of the carrier film 1 where the chip 6 is placed, and bending and forming the intermediate portion 5a of the wiring lead 5, the process is performed as shown in FIG.
This was done through the steps shown in D. That is, the second
As shown in FIG. 2B, the state shown in FIG.
After punching out the required portions as shown in FIG. 2D, the wiring leads 5 are bonded to the leads 8 of the substrate 7 as shown in FIG. 2D.

However, when the chip 6 is placed on the carrier film 1 as shown in FIGS. 2A to 2D, the following problem occurs.

(1) Since the wiring pattern surface 6a of the chip 6 faces the wiring pattern surface 7a of the board 7, a wiring pattern cannot be formed on the portion of the chip 6 facing the wiring pattern surface 7a, and the packaging density can be increased. Can not do it.

(2) As shown in Figure 3 (enlarged view of part A in Figure 2B), the adhesive 9 for fixing the wiring lead 5 to the carrier film 1 may protrude, and the wiring lead The bonding of the intermediate portion 5a of the lead 8 to the lead 8 becomes unstable.

(3) If heat radiation from the chip 6 becomes a problem and the heat from the chip 6 is to be radiated to the board 7, the gap between the chip 6 and the board 7 is filled with a material with good thermal conductivity, but the wiring pattern surface of the chip 6 Since 6a is a live part, metals with good thermal conductivity cannot be used, which limits heat radiation, making it difficult to mount the chip 6, which consumes a large amount of power.

In order to solve this problem, it has been proposed to punch and mold the chip 6 with the carrier film 1 under the carrier film 1 and bond it to the substrate 7, as shown in FIGS. 4A to 4C.

However, in the case shown in FIGS. 4A to 4C, it is necessary to increase the bending depth of the wiring lead 5, and excessive tension may be generated in the wiring lead 5 during the bending process, causing the wiring lead 5 to be cut. occurs.

The present invention has been made in view of the current situation, and the contents of the present invention will be explained below with reference to the drawings of FIGS. 5 to 17.

FIG. 5 and FIG. 6 show a punching and forming apparatus according to an embodiment of the present invention, and in the figures, reference numeral 10 denotes a die holder with four guide posts 11 and 12 set up and a die 13 fixed with bolts 14; Reference numeral 15 denotes a positioning pin fixed to the die 13, and this positioning pin 15 positions the carrier film 1 by fitting into the sprocket hole 4 of the carrier film 1.

Reference numeral 16 denotes an upper punch holder that slides while being guided by the guide post 11 in the vertical direction, that is, in the direction of arrow J. An upper punch 17 is fixed to this upper punch holder 16 with a bolt 18.

Further, the upper punch holder 16 is slid in the direction of arrow J using an air cylinder, a hydraulic cylinder, or the like. 1
Reference numeral 9 denotes a film holding member built into the upper punch 17 so as to be able to slide vertically. This film holding member 19 is always urged downward by a spring 20,
9a protrudes from the lower end surface 17a of the upper punch 17.

Reference numeral 21 denotes a shaft that is slidably supported in the vertical direction by a bush 22 press-fitted into the upper punch holder 16.
1 is always urged downward by a spring 23 and is in the state shown in FIG.

24 is a receiving plate for receiving the spring 23, and this receiving plate 24 is connected to the upper punch holder 16 via a spacer 25.
is fixed with screws 26.

A stripper 27 is fixed to the shaft 21 with a bolt 28, and the stripper 27 supports the carrier film 1 slidably in the longitudinal direction within the groove 27a.
It serves as a guide member for the carrier film 1.

Reference numeral 29 denotes a lower punch holder that slides while being guided in the vertical direction by the guide post 22, that is, in the direction of arrow K. An upper table 30 is supported on this lower punch holder 29 so as to be movable in the direction of arrow L by a slide bearing 31. A lower table 32 is fixed, and the upper table 3
A lower punch 33 inserted into the hole 13a of the die 13 is fixed to the hole 0 by a bolt 34.

Further, the lower punch 33 is provided with an air suction hole 33a, one of which opens at the upper end surface of the lower punch 33.
6 to a negative pressure source. Further, the lower punch holder 29 is slid in the vertical direction by an air cylinder, a hydraulic cylinder, etc., and the upper table 30 is similarly slid in the direction of arrow L. Furthermore, the lower table 3
2, the lower punch 33 is inserted into the hole 1 of the die 13.
A stopper 32a is provided for positioning the upper table 30 at a position where it can be inserted into the upper table 3a. The lower punch holder 29 also includes a lower surface 10 of the die holder 10.
A pin 37 is installed which makes contact with the upper surface of the lower punch 33 and aligns the upper surface of the lower punch 33 with the upper surface of the die 13 to stand by in the state shown in FIG. Here, the carrier film 1 is driven in the longitudinal direction at a required pitch by a sprocket wheel or the like.

Next, the operation of the punching and forming apparatus with the above configuration is shown in FIGS.
This will be explained using FIG. 13.

FIG. 7 is an enlarged view of the main parts in the standby state, and when the upper punch holder 16 moves downward from this state, first the eighth
As shown in the figure, the stripper 27 is attached to the carrier film 1.
is pressed onto the upper surface of the die 13.

At this time, the positioning pin 15 is fitted into the sprocket hole 4 of the carrier film 1 to accurately position the carrier film 1. Next, the lower end surface 19 of the film holding member 19
a lower punches 3 film piece 1a of carrier film 1;
Press it on the top surface of 3.

The downward biasing force of the film pressing member 19 by the spring 20 is F1, and the upward biasing force of the lower punch 33 is F2.
If F1 is set to F2, the upper punch 17 descends while the film holding member 19 is stopped, and the cutting blade 17b of the upper punch 17 acts with the cutting blade 13b of the die 13 as shown in FIG. The carrier film 1 is punched out, and the upper punch 17 is lowered to form the bending edge 1 of the upper punch 17.
7c acts with the stepped portion 33b of the lower punch 33 to bend and shape the intermediate portion 5a of the wiring lead 5. That is, since the intermediate portion 5a of the wiring lead 5 is bent after being separated from the carrier film 1, almost no tension is applied to the wiring lead 5 during the bending process. Even if 5 is thin, it will not be cut. Furthermore, since the film piece 1a between the openings 2 and 3 of the carrier film 1 is strongly held between the film holding member 19 and the lower punch 33, the wiring lead 5 is held tightly when the carrier film 1 is punched and bent. Even if some tension is applied, no force is applied to the bonding portion between the chip 6 and the wiring leads 5, so the bonding will not come off. M in Figure 9
-M' line is shown in FIG. 10, and the film piece 1a of the carrier film 1 is also
It is punched out by the cutting blade 17b of the die 13 and the cutting blade 13b of the die 13, and is bent by the bending blade 17c and the stepped portion 33b.

Furthermore, the gap P between the bending blade 17c and the stepped portion 33b is
The value is such that the film piece 1a of the carrier film 1 is not cut during this time.

This is because if it is cut there, not only the chip 6 but also the cut piece must be recovered. As shown in FIG. 11, the carrier film 1 is
A chip 6 is punched out from the material and then bent and formed.

The length Q of the film piece 1b in this chip 6 is generally larger than the dimension R between the cutting blades 13b of the die 13. Therefore, when the chip 6 is sucked onto the upper surface of the lower punch 33 by the air suction hole 33a of the lower punch 33 from the state shown in FIG. 9 and only the lower punch 33 is lowered, the film piece 1b shown in FIG. Both ends 1b2 are holes 13 between cutting blades 13b
Since the wiring lead 5 is in strong contact with the inner surface of c, the wiring lead 5 is pulled upward, and the wiring lead 5 is bent as shown in FIG. In order to prevent this, as shown in FIG. 13, the upward biasing force F2 of the lower punch 33 is made smaller than the downward biasing force F3 of the film pressing member 19.
It is sufficient to push down the lower punch 33 through the film piece 1b with the soil punch 17 to lower the film piece 1b to the escape hole 13d of the die 13, and both ends 1b' of the film piece 1b are separated from the die 13 and become free.

Also, due to the lower punch 33's downward movement, the film piece 1b
Since the impact when the wire is sandwiched between the upper punch 17 and the lower punch 33 can be buffered, the wiring lead 5 in the portion of the film piece 1b is crushed and becomes wider, and if the pitch is small, adjacent wiring leads 5 may be short-circuited. can be prevented.

Furthermore, in order to increase the cushioning effect, the lower punch 33 may be attached to the upper table 30 via an elastic body such as a spring or rubber. After the chips 6 are punched and bent as described above, the chips 6 are inserted into the lower punch 33 as described above.
Lower the lower punch 33 while it is sucked, and then move the upper table 30 2 horizontally to the left of arrow L
It is sufficient to feed the chip to a position S shown by a dotted chain line, release the adsorption of the chip 6 at this position, and collect the chip 6 on the lower punch 33.

At this time, since the lower punch 33 is located outside the die holder 10, it can be easily recovered. By the way, when the structure of the carrier film 1 is such that the wiring leads 5 are arranged on four sides as shown in FIG. 14, the film pressing member 19 of the punching and forming apparatus in the above embodiment
The shapes of the upper punch 17, die 13, and lower punch 33 are
What is necessary is just to make it into the shape as shown in figure AD.

Thereby, in the same way as the carrier film 1 shown in FIG. 1, it can be punched and bent as shown in FIG. 16. Furthermore, if the film piece 1b of the carrier film 1 is tapered and punched as shown in FIG. It is not necessary to lower the film piece 1b to the escape hole 1d of the die 13 as in the example.

This also applies to the carrier film 1 having the structure shown in FIG. Further, in the above embodiment, the carrier film 1 is provided with the wiring leads 5 having a fine pitch of 100 to 200μ and very easily deformed by external force. If the film is thick and rigid, the film piece 1a may be omitted.

In this case, it is not necessary to punch out the film piece 1b as well, but it is sufficient to punch out the intermediate portion 5a of the wiring lead 5. According to the punching and forming apparatus of the present invention as described above, the following effects can be obtained.

In other words, in a punching and forming device that punches out a wired portion provided on a carrier film and bends and forms a required wiring lead, an upper punch and a film that is biased to protrude from the lower end surface of the upper punch are used. It is composed of a presser member, a die that punches out the carrier film using the upper punch, and a lower punch that bends and forms the wiring lead using the upper punch, and furthermore, the force that urges the upper punch toward the die is
The lower punch is pushed toward the upper punch with a force greater than the biasing force, and the film holding member presses a predetermined wiring lead part, and the upper punch and die punch out the carrier film to separate the wiring lead part from the carrier film. After that,
The upper punch and the lower punch collide with each other via the wiring lead by bending the wiring lead using the upper punch and the lower punch, and then lowering the lower punch by the urging force of the upper punch. Since it is possible to reduce the impact caused by the molding and prevent short circuits between the wiring leads due to crushing of the wiring leads, even wiring leads with a fine pitch can be molded without any problem.

Further, the lower punch is fixed on a horizontally movable table, and the chip is placed on the lower punch together with the wiring lead portion formed by punching and lowered, and then the chip is moved in the horizontal direction. This makes it easier to collect chips. In addition, when removing the material manually, there is no need to put hands inside the device body, so even if the device malfunctions or is operated incorrectly, there is no possibility of harm to the human body. Moreover, since it is not necessary to take a large operating stroke of the lower punch, it is possible to downsize the apparatus.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of a general carrier film;
2A to 2D are process diagrams showing an example of the process for punching out the portion on which the chip is placed from the carrier film;
The figure is an enlarged view of part A in FIG. 2c, FIGS. 4A to 4C are process diagrams showing another example of the process for punching out the part on which chips are placed from the carrier film, and FIG. FIG. 6 is a perspective view showing a carrier film punching and molding device according to an embodiment; FIG. 6 is a cross-sectional view of the same; FIGS. 12 is a perspective view showing the state in which the chip is punched out from the carrier film using the same device, FIG. 12 is a schematic diagram showing a bad example after punching, and FIG. 13 is the same as that shown in FIG. 14 is a perspective view showing another example of a carrier film, and FIGS. 15A-D are 14th views thereof. FIG. 16 is a perspective view showing another example of the essential parts of the apparatus of the present invention when using the carrier film shown in FIG.
FIG. 17 is a perspective view showing a state in which a portion where a chip is placed is punched out from the carrier film shown in the figure, and FIG. 17 is a plan view showing another example of the carrier film. 1... Carrier film, 5... Wiring lead, 6... Chip, 13... Die, 13a... Hole, 13b... ...cutting blade,
17...Upper punch, 17a...Lower end surface, 17b...Cutting blade, 17c...Bending blade, 19...Film holding member , 20...
...Spring, 30...Top table, 33...
...Lower punch, 33b...Stepped portion.

Claims (1)

[Claims] 1. Punching out the lead portion arranged on the carrier film,
A carrier film punching and forming device for bending and forming a required wiring lead, which comprises: an upper punch that moves in the vertical direction and is provided with a film holding member biased so as to protrude from the lower end surface; Therefore, a die for punching out the carrier film, a part of the carrier film together with the film pressing member inserted into a hole provided in the die, and the upper punch are used to bend and form the wiring lead in the vertical direction. a moving lower punch, the force for urging the upper punch toward the die is greater than the force for urging the lower punch toward the upper punch, and the carrier is pressed by the film pressing member. After sandwiching a part of the film, the upper punch is lowered and a predetermined part of the carrier film is punched out by the upper punch and the die, and then bent and formed by the upper punch and the lower punch. 2. A carrier film punching and molding device, wherein the lower punch is lowered by the urging force of the upper punch. 2. The carrier film punching and forming apparatus according to claim 1, wherein the lower punch is fixed to a horizontally movable table.