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JPS592759B2 - Plating processing equipment - Google Patents
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JPS592759B2 - Plating processing equipment - Google Patents

Plating processing equipment

Info

Publication number
JPS592759B2
JPS592759B2 JP19833881A JP19833881A JPS592759B2 JP S592759 B2 JPS592759 B2 JP S592759B2 JP 19833881 A JP19833881 A JP 19833881A JP 19833881 A JP19833881 A JP 19833881A JP S592759 B2 JPS592759 B2 JP S592759B2
Authority
JP
Japan
Prior art keywords
container
plating
plated
wall
rotating shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19833881A
Other languages
Japanese (ja)
Other versions
JPS58100698A (en
Inventor
文弥 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP19833881A priority Critical patent/JPS592759B2/en
Publication of JPS58100698A publication Critical patent/JPS58100698A/en
Publication of JPS592759B2 publication Critical patent/JPS592759B2/en
Expired legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】 この発明は、被めつき物を高速でめつきし、取出すこと
ができるようにしためつき処理装置に関するものである
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fastening processing device that can plate a plated object at high speed and take it out.

最近の電気めつき技術の進歩により、めつき浴に流速を
与え、陽極面、陰極面附近における流速を高速に保つこ
とにより電着速度を静止浴の場合に比べて格段と上昇さ
せることが可能となつた。
Recent advances in electroplating technology have made it possible to significantly increase the electrodeposition speed compared to a static bath by giving a flow velocity to the plating bath and maintaining the flow velocity near the anode and cathode surfaces at high speeds. It became.

例えば、必要とするめつき膜厚を従来の静止浴中5 で
は25分で得られたものを、上記のように流速を与えら
れためつき浴中では15秒で得られた。然し、このよう
に高速で必要とするめつき膜厚が形成されてもめつき処
理物をめつき浴中より取出すための適当な装置が関発さ
れない限り、高速10めつき処理の効果が十分に生かさ
れない。従来このため、めつき浴槽中で高速度でめつき
処理されたものを、これに対応するような高速で浴槽中
より摘み出す装置等が開発され、試作されているが、い
ずれの装置も電着速度に適応できる15ような速度でめ
つき処理物を浴槽中より取出すことができず、高速めつ
き処理の効果が十分に生かされていない。この発明は上
記実情に鑑み、高速めつき処理に適応できるようなめつ
き処理装置を開発する目的20で研究、開発したもので
、その要旨とするところは上端を開放し、且つ下端にい
くに従つて縮径する内壁を有し、該内壁には螺旋状の通
路と陰極を形成した不導体からなる被めつき物の容器を
めつき浴槽内に収容し、更に該めつき浴槽内には上記2
5被めつき物の容器外に陽極を挿入し、また該被めつき
物の容器の回転軸を垂設し、該回転軸の駆動モータを上
記めつき浴槽外に設け、一方上記被めつき物容器内には
めつき液補給管の排出口を臨ませ、また上記被めつき物
の容器にはその壁面に多30数の透水孔を形成し、上記
駆動モータにより上記被めつき物の容器がめつき浴槽内
で回転駆動される際に、その回転力により被めつき物を
上記螺旋状の通路に従つて容器内壁を上昇させるととも
に、容器内のめつき液を上記透水孔を通して容器外へ3
5排出させ、めつき処理するようにしたものである。
For example, the required plating film thickness, which could be obtained in 25 minutes in a conventional static bath, was obtained in 15 seconds in a plating bath with a flow rate as described above. However, even if the required plating film thickness is formed at such high speed, the effects of high-speed 10 plating processing cannot be fully utilized unless an appropriate device is used to take out the plated material from the plating bath. Not done. Conventionally, for this reason, devices have been developed and prototyped that can pick out items that have been plated at a high speed in a plating bathtub at a corresponding high speed, but none of these devices require electricity. It is not possible to take out the plated material from the bathtub at a speed of 15 that can be adapted to the deposition speed, and the effects of high-speed plating processing are not fully utilized. In view of the above circumstances, this invention was researched and developed for the purpose of developing a plating processing device that can be adapted to high-speed plating processing. The plating bath has an inner wall that reduces in diameter, and a container for a plated object made of a nonconductor with a spiral passage and a cathode formed in the inner wall is accommodated in the plating bath. 2
5. An anode is inserted outside the container of the object to be plated, a rotating shaft of the container of the object to be plated is vertically provided, and a drive motor for the rotating shaft is provided outside the plating bath; The outlet of the plating liquid replenishment pipe faces into the object container, and the container for the object to be plated has as many as 30 water permeable holes in its wall surface, and the container for the object to be plated is driven by the drive motor. When the plating is driven to rotate in the plating bathtub, the rotational force causes the object to be plated to rise up the inner wall of the container along the spiral path, and the plating liquid in the container flows out of the container through the water permeable hole. 3
5 is discharged and subjected to plating treatment.

以下、図示の実施例に基いてこの発明を説明すると図面
はこの発明の一実施例を示すもので、1は内部に陽極2
,2を挿設しためつき浴槽、3はプラスチツク等の不導
体で構成し、その上端を開放し、且つ下端にいくにした
がつて縮径する例,えば逆円錐台型、放物状或いは円頭
状の被めつき物容器、4はめつき浴槽1内に垂設された
被めつき物容器3の回転軸である。容器3は開放上端部
3aが液面より僅か上方に位置するようにめつき浴槽1
内に収容し、更にその壁面には多数の透水孔3b,・・
・を形成し、その中心には上記回転軸4を貫通させ、該
貫通部には回転軸4を容器3に固定するためのフランジ
部5を設けるとともに、めつき浴槽1の底部には回転軸
4の下端を回転可能に支える軸受部6を設ける。
Hereinafter, the present invention will be explained based on the illustrated embodiment.
, 2 are inserted, and 3 is made of a nonconductor such as plastic, and the upper end is open and the diameter decreases toward the lower end, such as an inverted truncated conical shape, a parabolic shape, or This is a rotating shaft of a round head-shaped container for objects to be fitted, 4, which is installed vertically in a bathtub 1 for objects to be fitted. The container 3 is placed in the plating bathtub 1 so that the open upper end 3a is located slightly above the liquid level.
In addition, there are many water permeable holes 3b on the wall surface.
The rotary shaft 4 is passed through the center thereof, and a flange portion 5 for fixing the rotary shaft 4 to the container 3 is provided in the penetrating portion. A bearing part 6 is provided to rotatably support the lower end of the bearing part 4.

なお、この実施例では回転軸4を中空にしてその上部に
は被めつき物の通路7、下部にはめつき液の補給路8を
形成し、被めつき物の通路7の下端には被めつき物容器
3内の底部に臨む被めつき物供給口7aを設け、更にめ
つき液の補給路8の上端は容器3内に斜め上方に突出し
ためつき液の排出口8aを形成し、且つ回転軸4の下部
には適宜間隔で供給路8に通するめつき液の取入口8b
,・・・を形成する。なお被めつき物の通路7の上端に
は被めつき物の供給ホツパ一9が設けられ、被めつき物
の供給ホツパ一9が設けられ、被めつき物は通路7を通
つて供給口7aより容器3内の底部中央附近に供給され
るように構成する。
In this embodiment, the rotary shaft 4 is hollow, with a passage 7 for the object to be plated formed in its upper part, a replenishment passage 8 for plating liquid in the lower part, and a passage 7 for the object to be plated formed at the lower end of the passage 7 for the object to be plated. A plating material supply port 7a facing the bottom of the plating material container 3 is provided, and the upper end of the plating solution supply path 8 forms a plating solution discharge port 8a that projects obliquely upward into the container 3. In addition, in the lower part of the rotating shaft 4, there are inlets 8b for the plating liquid to be passed through the supply path 8 at appropriate intervals.
,... is formed. A supply hopper 19 for the material to be plated is provided at the upper end of the passage 7 for the material to be plated. 7a so as to be supplied to the vicinity of the center of the bottom of the container 3.

一方容器3の内壁面には例えば径5〜6W1の丸棒10
によつて回転軸4の回転方向とは逆方向に容器3の底部
より上端部3aに至る螺線状の通路11を形成する。
On the other hand, on the inner wall surface of the container 3, for example, a round rod 10 with a diameter of 5 to 6W1 is provided.
As a result, a spiral passage 11 extending from the bottom of the container 3 to the upper end 3a is formed in a direction opposite to the direction of rotation of the rotating shaft 4.

なお丸棒10はこの実施例では銅などの導体で構成して
それ自体を陰極としているが、丸棒10をプラスチツク
等の不導体で構成し、その下面に導体を電着してこれを
陰極としてもよく、また丸棒10の3面にこれとは別体
に陰極を添わせて設けてもよい。
In this embodiment, the round bar 10 is made of a conductor such as copper and serves as a cathode; however, the round bar 10 is made of a non-conductor such as plastic, and a conductor is electrodeposited on its lower surface, which serves as a cathode. Alternatively, cathodes may be separately provided on three sides of the round bar 10.

更に通路7は丸棒10に限らず、板状体で構成してもよ
い。更にこの実施例では陰極を構成する丸棒10の下端
にリード線12を接続する。
Furthermore, the passage 7 is not limited to the round rod 10, but may be formed of a plate-shaped body. Furthermore, in this embodiment, a lead wire 12 is connected to the lower end of the round bar 10 that constitutes the cathode.

一方容器の上端部3aは多少緩いテーパー面にして、そ
の下方にはテーパー状に設けられた環状水切板13の下
端部を臨ませ、更にめつき浴槽1の上方外周にはめつき
処理された製品の取出ガイド14を設ける。
On the other hand, the upper end part 3a of the container is made into a somewhat gently tapered surface, and the lower end part of the annular draining plate 13 provided in a tapered shape is exposed below the upper end part 3a of the container. A removal guide 14 is provided.

該ガイド14は内周側に隆起状のガイド部14aを有し
、その外周側には平坦な溝部14bを有し、且つガイド
部14aの内縁を水切板13の上端部下方に臨ませる。
なお、15は被めつき物容器の回転軸4を駆動するため
のモータであつて、モータ15はこの実施例ではコンピ
ユータ16で制御される可変速度モータを使用し、モー
タの駆動力はベルト17及びプーリ−18を介して回転
軸4に伝えられる。
The guide 14 has a protruding guide portion 14a on the inner circumferential side and a flat groove portion 14b on the outer circumferential side, and the inner edge of the guide portion 14a faces below the upper end of the drain plate 13.
Note that 15 is a motor for driving the rotating shaft 4 of the object container. In this embodiment, the motor 15 is a variable speed motor controlled by a computer 16, and the driving force of the motor is transmitted by the belt 17. and is transmitted to the rotating shaft 4 via the pulley 18.

次にこの発明に係るめつき処理装置を使用しためつき処
理法について説明すると、ボルト、ナツト等の被めつき
物は本願発明者が既に提案した特許第419766号、
特許第449352、号等の装置により定量的に分割、
前処理して本装置のホツパ一9に供給され、更に通路7
を通つて供給口7aより容器3の底部に排出される。一
方回転軸4及びフランジ部5によつて回転軸4に固定さ
れた容器3はモータ15の予め設定された速度で回転す
る。
Next, the plating processing method using the plating processing apparatus according to the present invention will be explained.Platted objects such as bolts and nuts are manufactured by the patent No. 419766, which was already proposed by the inventor of the present invention.
Quantitative division using a device such as Patent No. 449352,
The pre-treated
It is discharged to the bottom of the container 3 through the supply port 7a. On the other hand, the container 3 fixed to the rotating shaft 4 by the rotating shaft 4 and the flange portion 5 rotates at a preset speed of the motor 15.

この回転に伴いめつき浴槽1内のめつき液は取入口8b
,・・・より回転軸4の内部に設けられた補給路8に供
給され、該補給路8を通つて、排出口8aより容器3内
の上側部めがけて放出される。また、容器3の回転遠心
力により容器3内に供給された被めつき物は容器の内壁
に沿つて形成された螺旋状の通路11を回転とは逆方向
に上昇するとともに、容器3内のめつき液は回転遠心力
により透水孔3b,・・・よりめつき浴槽1内に排出さ
れ、容器3内にはめつき浴槽1に向けてめつき液の流速
が発生する。
With this rotation, the plating liquid in the plating bath 1 flows through the intake port 8b.
, . . , to a supply path 8 provided inside the rotating shaft 4, and through the supply path 8, is discharged toward the upper side of the container 3 through the discharge port 8a. Further, the object to be plated, which is supplied into the container 3 by the rotational centrifugal force of the container 3, ascends in a direction opposite to the rotation through a spiral passage 11 formed along the inner wall of the container, and The plating liquid is discharged into the plating bath 1 through the water permeable holes 3b, .

そこで陽極2,2と容器3の内壁に沿つて設けられた陰
極10間に通電すれば、螺旋状の通路11を上昇する被
めつき物は流速状態にあるめつき液中で速やかにめつき
処理され、更に回転遠心力により螺旋状通路11の終端
部に当る容器3の上端部3aより水切板13を通り、隆
起状のガイド部14aを越えて溝部14bに集められる
Therefore, if electricity is applied between the anodes 2, 2 and the cathode 10 provided along the inner wall of the container 3, the object to be plated moving up the spiral passage 11 will be quickly plated in the plating solution at a high flow rate. After being processed, the liquid is further collected by rotational centrifugal force from the upper end 3a of the container 3, which is the terminal end of the spiral passage 11, through the drain plate 13, over the raised guide portion 14a, and into the groove portion 14b.

したがつてこの発明によれば流速状態にあるめつき液中
で被めつき物を速やかためつき処理することができると
ともに、めつき処理速度に合わせて製品をめつき浴槽1
から取り出すことができる。なお、製品をめつき浴槽1
から取り出す速度は容器3の回転速度に関係するが、こ
の実施例では可変速度モータ15の回転速度をコンピユ
ータ16で制御することにより容器3の回転速度を調整
し、製品の取り出し速度をめつき処理速度に対応させて
いる。また被めつき物容器3としては浅い逆円錐台型、
放物状或いは円頭状のものが好ましく、深い逆円錐台型
、放物状或いは円頭状のものであると、製品の取り出し
に高速回転を要し、しかも高速回転による遠心力で容器
3内にめつき液が無くなる虞れがある。
Therefore, according to the present invention, it is possible to quickly harden the plated object in the plating solution in a flow rate state, and also to transfer the product to the plating bath 1 in accordance with the plating processing speed.
It can be taken out from. In addition, the product is attached to the bathtub 1.
The speed at which the product is taken out is related to the rotational speed of the container 3, but in this embodiment, the rotational speed of the variable speed motor 15 is controlled by the computer 16 to adjust the rotational speed of the container 3, and the speed at which the product is taken out is controlled by the plating process. It corresponds to the speed. In addition, the container 3 for covering objects is a shallow inverted truncated cone type.
A parabolic shape or a round head shape is preferable. If the shape is a deep inverted truncated cone shape, a parabolic shape or a round head shape, high speed rotation is required to take out the product, and centrifugal force due to the high speed rotation causes the container 3 There is a risk that the plating liquid may run out.

空器3内へのめつき液の循環補給のために、この実施例
では回転軸4の下方を中空にしてめつき液の補給路8を
形成し、且つその上端を容器3内に斜め上方に突出させ
てめつき液の排出口8aを形成しているが、回転軸4と
は別にめつき液の供給管を設け、ポンプ等によりめつき
液を容器3内に補給するようにしてもよい。
In order to circulate and replenish the plating liquid into the empty container 3, in this embodiment, the lower part of the rotary shaft 4 is made hollow to form a plating liquid replenishment path 8, and its upper end is inserted diagonally upward into the container 3. Although the plating liquid discharge port 8a is formed by protruding from the rotary shaft 4, a plating liquid supply pipe may be provided separately from the rotating shaft 4, and the plating liquid may be supplied into the container 3 by a pump or the like. good.

またこの実施例では回転軸4の上方を中空にして被めつ
き物の通路7を形成したが、これについても回転軸4と
は別に容器3への被めつき物を供給するようにしてもよ
い。
Further, in this embodiment, the upper part of the rotating shaft 4 is made hollow to form the passage 7 for the covering material, but it is also possible to supply the covering material to the container 3 separately from the rotating shaft 4. good.

なお容器3の回転を継続的に行わせるためには回転軸4
にハズミ車等を設けることが好ましい。
Note that in order to continuously rotate the container 3, the rotating shaft 4 is
It is preferable to provide a hand wheel or the like.

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの発明の一実施例を示す一部欠截の側面図であ
る。 図中1はめつき浴槽、3は被めつき物容器、4は回転軸
、8はめつき液の補給路、11は螺旋状の通路。
The drawing is a partially cutaway side view showing an embodiment of the present invention. In the figure, 1 is a plating bathtub, 3 is a plating object container, 4 is a rotating shaft, 8 is a plating liquid supply path, and 11 is a spiral passage.

Claims (1)

【特許請求の範囲】[Claims] 1 上端を開放し、且つ下端にいくに従つて縮径する内
壁を有し、該内壁には螺旋状の通路と陰極を形成した不
導体からなる被めつき物の容器をめつき浴槽内に収容し
、更に該めつき浴槽内には上記被めつき物の容器外に陽
極を挿入し、また該被めつき物の容器の回転軸を垂設し
、該回転軸の駆動モータを上記めつき浴槽外に設け、一
方上記被めつき物容器内にはめつき液補給管の排出口を
臨ませ、また上記被めつき物の容器にはその壁面に多数
の透水孔を形成し、上記駆動モータにより上記被めつき
物の容器がめつき浴槽内で回転駆動される際に、その回
転力により被めつき物を上記螺旋状の通路に従つて容器
内壁を上昇させるとともに、容器内のめつき液を上記透
水孔を通して容器外へ排出させ、めつき処理するように
したことを特徴とするめつき処理装置。
1. The upper end is open and the inner wall has an inner wall that decreases in diameter toward the lower end, and a container for a plated object made of a nonconductor with a spiral passage and a cathode formed in the inner wall is placed in the bathtub. Further, an anode is inserted into the plating bath outside the container of the plating material, a rotating shaft of the container of the plating material is vertically provided, and a drive motor for the rotating shaft is connected to the container of the plating material. The plating liquid supply pipe is provided outside the plating bathtub, and the outlet of the plating liquid replenishment pipe faces into the container for the plating material, and the container for the plating material is provided with a large number of water permeable holes in its wall surface. When the container of the object to be plated is driven to rotate in the plating bathtub by the motor, the rotational force causes the object to be plated to rise along the inner wall of the container along the spiral path, and to prevent the plating inside the container. A plating processing apparatus characterized in that the plating processing is performed by discharging the liquid out of the container through the water permeable hole.
JP19833881A 1981-12-10 1981-12-10 Plating processing equipment Expired JPS592759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19833881A JPS592759B2 (en) 1981-12-10 1981-12-10 Plating processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19833881A JPS592759B2 (en) 1981-12-10 1981-12-10 Plating processing equipment

Publications (2)

Publication Number Publication Date
JPS58100698A JPS58100698A (en) 1983-06-15
JPS592759B2 true JPS592759B2 (en) 1984-01-20

Family

ID=16389449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19833881A Expired JPS592759B2 (en) 1981-12-10 1981-12-10 Plating processing equipment

Country Status (1)

Country Link
JP (1) JPS592759B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60114597A (en) * 1983-11-28 1985-06-21 Masayuki Otsuki Method and device for vibration stirring type composite plating
JPH0794720B2 (en) * 1992-10-02 1995-10-11 松下電工株式会社 Continuous plating apparatus and continuous plating method
JPH0832967B2 (en) * 1992-10-02 1996-03-29 松下電工株式会社 Continuous plating system
JP4635221B2 (en) * 2005-06-13 2011-02-23 学校法人福岡大学 Electroplating apparatus and plating method for minute objects
JP5435355B2 (en) * 2009-09-04 2014-03-05 日立金属株式会社 Plating equipment
DE102016211367A1 (en) * 2016-06-24 2017-12-28 Schaeffler Technologies AG & Co. KG Coating device for wet-chemical coating and method
CN110273251B (en) * 2018-03-15 2024-11-22 青岛海尔洗衣机有限公司 washing machine

Also Published As

Publication number Publication date
JPS58100698A (en) 1983-06-15

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