JPS5929119B2 - Multilayer composite plating layer - Google Patents
Multilayer composite plating layerInfo
- Publication number
- JPS5929119B2 JPS5929119B2 JP12216176A JP12216176A JPS5929119B2 JP S5929119 B2 JPS5929119 B2 JP S5929119B2 JP 12216176 A JP12216176 A JP 12216176A JP 12216176 A JP12216176 A JP 12216176A JP S5929119 B2 JPS5929119 B2 JP S5929119B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- composite plating
- hard
- copper
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Sliding-Contact Bearings (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は多層複合メッキ層、とくに軸受け部品のごとく
摺動面を有する機械部品の表面処理手段として有効な複
合メッキ層に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer composite plating layer, particularly a composite plating layer effective as a surface treatment means for mechanical parts having sliding surfaces such as bearing parts.
公知の軸受け用部品のメッキとしては銅メッキ、銅一ス
ズ合金メッキなどがある。Known examples of plating for bearing parts include copper plating and copper-tin alloy plating.
しかし、銅メッキ、銅一スズ合金メッキは耐摩耗性、耐
熱性、耐疲労性、潤滑性に問題がある。また一方、ニッ
ケルマトリックスにシリコンカーバイドを共析させたニ
ッケル−複合メッキ被膜は耐摩耗性に極めてすぐれてい
るが、反面、ダイヤモンド砥石などによる機械加工性の
悪さに欠点がある。このように、従来のメッキ方法によ
つては、耐摩耗性、耐疲労性、潤滑性あるいは耐熱性を
備え、しかも機械加工の容易なメッキ層を形成すること
はできない。本発明の目的は、軸受け用部品などの摺動
部を有する機械部品の機械加工性の改良、初期なじみ性
の向上に加えて耐摩耗性、耐熱性、耐疲労性、潤滑性の
向上を計るための多層複合メッキ層を提供することにあ
り、その要旨は、被メッキ体表面に、硬質微粒子を共析
物質とし硬質金属をマトリックスとする硬質複合メッキ
層を形成させ、該層の表面に軟質金属メッキ層または軟
質金属複合メッキ層を形成させることを特徴とする多層
複合メッキ層にある。本発明の複合メッキ層は、硬質の
複合メッキ層の表面に軟質金属メッキ層または軟質金属
複合メッキ層が形成されているので、メッキ後の加工が
極めて容易で、相手材との［初期なじみ性」が良好であ
り、上層のメッキ層が摩耗しても下層のメッキ層によつ
て耐摩耗性が保持される。However, copper plating and copper-tin alloy plating have problems in wear resistance, heat resistance, fatigue resistance, and lubricity. On the other hand, a nickel-composite plating film in which silicon carbide is eutectoided in a nickel matrix has extremely good wear resistance, but on the other hand, it has the disadvantage of poor machinability with a diamond grindstone or the like. As described above, conventional plating methods cannot form a plating layer that has wear resistance, fatigue resistance, lubricity, or heat resistance and is easy to machine. The purpose of the present invention is to improve the machinability of mechanical parts having sliding parts such as bearing parts, improve initial conformability, and improve wear resistance, heat resistance, fatigue resistance, and lubricity. The purpose of this is to form a hard composite plating layer on the surface of the object to be plated, which has hard fine particles as a eutectoid and a hard metal as a matrix. A multilayer composite plating layer characterized by forming a metal plating layer or a soft metal composite plating layer. The composite plating layer of the present invention has a soft metal plating layer or a soft metal composite plating layer formed on the surface of the hard composite plating layer, so it is extremely easy to process after plating and has a good initial compatibility with the mating material. ” is good, and even if the upper plating layer wears out, the wear resistance is maintained by the lower plating layer.
また、硬質の複合メッキ層の表面に共析された共析物質
によつて形成される該複合メッキ層の表面の凹凸が、通
常の積層メッキ表面に比べて大きく、そのため上層の軟
質金属と上記硬質複合メッキ層の結合が強固になり、剥
離等に強い多層メッキ層を得ることができる。上記硬質
微粒子としては、酸化アルミニウム、酸化ケイ素、酸化
鉄、炭化タングステン、炭化ケイ素、炭化チタン、炭化
ホウ素、炭化クロム、ダイヤモンド、金属性微粉末、セ
ラミック、酸化ジルコニウム、窒化ケイ素などがある。In addition, the unevenness on the surface of the hard composite plating layer formed by the eutectoid material eutectoid is larger than that of a normal laminated plating surface, so that the soft metal of the upper layer and the above The bond between the hard composite plating layers becomes strong, and a multilayer plating layer that is resistant to peeling etc. can be obtained. Examples of the hard fine particles include aluminum oxide, silicon oxide, iron oxide, tungsten carbide, silicon carbide, titanium carbide, boron carbide, chromium carbide, diamond, fine metallic powder, ceramic, zirconium oxide, and silicon nitride.
また、マトリックスとして用いられる上記硬質金属とし
ては、ニッケル、クロムなどがあり、軟質金属としては
、銅、鉛、銅−スズ合金、銅一亜鉛合金がある。The hard metals used as the matrix include nickel and chromium, and the soft metals include copper, lead, copper-tin alloys, and copper-zinc alloys.
上記軟質金属メッキ層には、共析物質として上記硬質微
粒子あるいは自己潤滑性のある微粒子を用いることがで
きる。The above-mentioned hard fine particles or self-lubricating fine particles can be used as the eutectoid material in the above-mentioned soft metal plating layer.
この潤滑性微粒子としては、窒化ホウ素、セリサイト、
フッ化黒鉛グラファイト、二硫化モリブデン、二硫化タ
ングステン、二硫化タンタル、フッ素樹脂、ニセレン化
モリブデン、ニセレン化タングステンなどがある。また
、複合メッキ層の厚さは用途に応じて選択するが、例え
ば下層は２０〜１００μ、上層は１０〜１５μ程度が好
ましい。These lubricating particles include boron nitride, sericite,
Examples include graphite fluoride, molybdenum disulfide, tungsten disulfide, tantalum disulfide, fluororesin, molybdenum diselenide, and tungsten diselenide. Further, the thickness of the composite plating layer is selected depending on the application, and for example, the thickness of the lower layer is preferably about 20 to 100 μm, and the thickness of the upper layer is about 10 to 15 μm.
共析される各微粒子は用途に応じてマトリックスに対し
て例えば１〜７重量％用いられる。以下、実施例を挙げ
て本発明を説明する。Each fine particle to be eutectoid is used in an amount of, for example, 1 to 7% by weight based on the matrix, depending on the purpose. The present invention will be explained below with reference to Examples.
実施例１
ニッケルスルファミン酸浴中に硬質微粒子としてシリコ
ンカーバイドを添加し、そして、該浴中に、被メッキ体
として軸受け用ブッシュを陰極側△に白金を陽極側に設
置し、電流密度２０〜３０１澹で複合メッキを行なつた
。Example 1 Silicon carbide was added as hard particles to a nickel sulfamic acid bath, and in the bath, a bearing bush was placed as an object to be plated on the cathode side and platinum was placed on the anode side, and the current density was 20 to 301. Composite plating was performed at Sawa.
該メッキをよつてブッシュ表面上に、ニッケルマトリッ
クス中にシリコンカーバイドを共析した複合メッキ層が
形成された。さらに該メッキ後、別に設けた愼酸銅ｔ浴
中に前記複合メッキ層を有する軸受け用ブッシュを設置
して銅メッキを行なつた。該メッキによつて、前記ニッ
ケル−シリコンカーバイドの複合メッキ層の上に銅メッ
キ層が形成された。これを第１図に示す。仝図において
、１はブッシュ、２はニッケル−シリコンカーバイドの
複合メッキ層、３はシリコンカーバイド粒子、４は銅メ
ッキ層を示す。実施例２
実施例１と同様にシリコンカーバイドを混入したニップ
ルスルファミン酸浴中で軸受け用ブッシュに複合メッキ
を行なつた。A composite plating layer in which silicon carbide was eutectoided in a nickel matrix was formed on the bush surface through the plating. Further, after the plating, the bearing bush having the composite plating layer was placed in a separately provided copper t bath, and copper plating was performed. Through this plating, a copper plating layer was formed on the nickel-silicon carbide composite plating layer. This is shown in FIG. In the figure, 1 is a bush, 2 is a nickel-silicon carbide composite plating layer, 3 is silicon carbide particles, and 4 is a copper plating layer. Example 2 As in Example 1, a bearing bush was subjected to composite plating in a nipple sulfamic acid bath containing silicon carbide.
ついで、硫酸銅浴中にシリコンカーバイドを添加し、該
浴中に前記複合メッキされた軸受け用ブッシュを設置し
、複合メッキを行なつた。これらのメッキによつて、ニ
ッケル−シリコンカーバイドの複合メッキ層の上に銅−
シリコンカーバイド複合メッキ層が形成された。これを
第２図に示す。同図において、１はブッシュ、２はニッ
ケル−シリコンカーバイド複合メッキ層、３はシリコン
カーバイド粒子、５は銅−シリコンカーバイド複合メッ
キ層である。実施例３実施例１と同様にシリコンカーバ
イドを混入したニッケルスルファミン酸浴中で軸受け用
ブッシュに複合メッキを行なつた。Next, silicon carbide was added to a copper sulfate bath, and the composite plated bearing bush was placed in the bath to perform composite plating. These platings create copper-silicon carbide composite plating layers.
A silicon carbide composite plating layer was formed. This is shown in FIG. In the figure, 1 is a bush, 2 is a nickel-silicon carbide composite plating layer, 3 is silicon carbide particles, and 5 is a copper-silicon carbide composite plating layer. Example 3 Similar to Example 1, a bearing bush was subjected to composite plating in a nickel sulfamic acid bath containing silicon carbide.
ついで、硫酸銅浴中にセリサイトを添加し、該浴中に前
記複合メッキされた軸受け用ブッシュを設置し、複合メ
ッキを行なつた。該メッキによつて、ニッケル−シリコ
ンカーバイドの複合メッキ層の上に銅−セリサイトの複
合メッキ層が形成された。これを第３図に示す。仝図に
おいて、１はブッシュ、２はニッケル−シリコンカーバ
イドの複合メッキ層、３はシリコンカーバイド粒子、６
は銅−セリサイトの複合メッキ層、７はセリサイト粒子
を示す。以上、本発明の多層複合メッキ層は極めて良好
な耐摩耗性、耐熱性、耐疲労性及び潤滑性を有し、しか
もメッキ後の機械加工が極めて容易であり、しかもメッ
キ作業が簡単である。Next, sericite was added to a copper sulfate bath, and the composite plated bearing bush was placed in the bath to perform composite plating. Through this plating, a copper-sericite composite plating layer was formed on the nickel-silicon carbide composite plating layer. This is shown in FIG. In the figure, 1 is a bush, 2 is a nickel-silicon carbide composite plating layer, 3 is silicon carbide particles, and 6 is a bush.
7 indicates a copper-sericite composite plating layer, and 7 indicates sericite particles. As described above, the multilayer composite plating layer of the present invention has extremely good wear resistance, heat resistance, fatigue resistance, and lubricity, and is also extremely easy to machine after plating, and the plating work is simple.
また、軸受け部品と相手材との初期なじみ性が極めて良
好である。In addition, the initial compatibility between the bearing component and the mating material is extremely good.
第１図は一種あるいは二種以上の金属メッキ層と複合メ
ッキ層とを組み合わせた多層複合メッキ層の縦断面図、
第２図は１司一の共析物質を共析させた複合メッキ層を
組み合わせた多層複合メッキ層の縦断面図、第３図は異
質の共析物質を共析させた複合メッキ層を組与合わせた
多層複合メッキ層の縦断面図をそれぞれ示す。
１・・・・・・被メッキ体、２・・・・・・硬質複合メ
ッキ層、３・・・・・・硬質微粒子、４・・・・・・金
属メツキ層、５、６・・・・・・軟質複合メツキ層、７
・・・・・・セリサイト粒子。FIG. 1 is a longitudinal cross-sectional view of a multilayer composite plating layer that combines one or more metal plating layers and a composite plating layer.
Figure 2 is a vertical cross-sectional view of a multilayer composite plating layer that combines composite plating layers in which one eutectoid substance is eutectoid, and Figure 3 shows a composite plating layer in which different eutectoid substances are eutectoid. FIG. 3 shows longitudinal cross-sectional views of the combined multilayer composite plating layers. 1... Body to be plated, 2... Hard composite plating layer, 3... Hard fine particles, 4... Metal plating layer, 5, 6... ... Soft composite plating layer, 7
・・・・・・Sericite particles.
Claims (1)
金属をマトリックスとする硬質複合メッキ層を形成させ
、該層の表面に軟質金属メッキ層または軟質金属複合メ
ッキ層を形成させたことを特徴とする多層複合メッキ層
。 ２ 上記硬質複合メッキ層が、上記硬質微粒子を酸化ア
ルミニウム、酸化ケイ素、酸化鉄、シリコンカーバイト
、炭化タングステン、炭化チタン、炭化ホウ素、炭化ク
ロム、ダイヤモンド、金属性微粉末、セラミック、酸化
ジルコニウム、窒化ケイ素のグループから選ばれた少く
とも１種とし、上記硬質金属をニッケルまたはクロムと
することを特徴とする特許請求の範囲１に記載の多層複
合メッキ層。 ３ 上記軟質金属メッキ層が、銅メッキ、鉛メッキ、銅
−スズ合金メッキ、銅−亜鉛合金メッキ層の１種または
その組み合せからなることを特徴とする特許請求の範囲
１又は２に記載の多層複合メッキ層。 ４ 上記軟質金属複合メッキ層が、上記硬質微粒子を共
析物質として含む複合メッキ層である特許請求の範囲１
に記載の多層複合メッキ層。 ５ 上記軟質金属複合メッキ層が、自己潤滑性を有する
物質、例えばセリサイト、グラファイト、二硫化モリブ
デンを共析物質として含む複合メッキ層である特許請求
の範囲１に記載の多層複合メッキ層。[Claims] 1. A hard composite plating layer containing hard fine particles as a eutectoid and a hard metal as a matrix is formed on the surface of an object to be plated, and a soft metal plating layer or a soft metal composite plating layer is formed on the surface of the layer. A multilayer composite plating layer characterized by the formation of a multilayer composite plating layer. 2 The hard composite plating layer coats the hard fine particles with aluminum oxide, silicon oxide, iron oxide, silicon carbide, tungsten carbide, titanium carbide, boron carbide, chromium carbide, diamond, fine metallic powder, ceramic, zirconium oxide, nitride. The multilayer composite plating layer according to claim 1, characterized in that the hard metal is at least one selected from the group of silicones, and the hard metal is nickel or chromium. 3. The multilayer according to claim 1 or 2, wherein the soft metal plating layer is made of one or a combination of copper plating, lead plating, copper-tin alloy plating, and copper-zinc alloy plating layer. Composite plating layer. 4 Claim 1, wherein the soft metal composite plating layer is a composite plating layer containing the hard fine particles as a eutectoid substance.
The multilayer composite plating layer described in . 5. The multilayer composite plating layer according to claim 1, wherein the soft metal composite plating layer is a composite plating layer containing a self-lubricating substance such as sericite, graphite, or molybdenum disulfide as a eutectoid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12216176A JPS5929119B2 (en) | 1976-10-12 | 1976-10-12 | Multilayer composite plating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12216176A JPS5929119B2 (en) | 1976-10-12 | 1976-10-12 | Multilayer composite plating layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5346441A JPS5346441A (en) | 1978-04-26 |
| JPS5929119B2 true JPS5929119B2 (en) | 1984-07-18 |
Family
ID=14829091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12216176A Expired JPS5929119B2 (en) | 1976-10-12 | 1976-10-12 | Multilayer composite plating layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929119B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104053737A (en) * | 2011-08-03 | 2014-09-17 | 汉高美国知识产权有限责任公司 | Electrically conductive structural adhesive |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2083076B (en) * | 1980-07-02 | 1984-06-13 | Baj Vickers Ltd | Composite electrodeposited coating and a method of forming such a coating |
| JPS5894631A (en) * | 1981-11-30 | 1983-06-04 | Taiho Kogyo Co Ltd | Sliding material |
| JPS6077990A (en) * | 1983-10-04 | 1985-05-02 | Ntn Toyo Bearing Co Ltd | Solid lubricative composite material |
| FR2638781B1 (en) * | 1988-11-09 | 1990-12-21 | Snecma | ELECTROPHORETIC ANTI-WEAR DEPOSITION OF THE CONSOLIDATED METALLOCERAMIC TYPE BY ELECTROLYTIC NICKELING |
| JPH0665470U (en) * | 1992-03-19 | 1994-09-16 | 金井 宏之 | Ring for spinning machine |
| JP2002039186A (en) | 2000-07-27 | 2002-02-06 | Taiho Kogyo Co Ltd | Plain bearing |
| DE102011013881B3 (en) * | 2011-03-04 | 2012-05-03 | Ks Gleitlager Gmbh | Sliding bearing composite material and slide bearing element produced therefrom |
| JP6614625B2 (en) * | 2018-05-22 | 2019-12-04 | 帝国イオン株式会社 | Abrasion-resistant film, wear-resistant member, method for producing abrasion-resistant film, and sliding mechanism |
-
1976
- 1976-10-12 JP JP12216176A patent/JPS5929119B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104053737A (en) * | 2011-08-03 | 2014-09-17 | 汉高美国知识产权有限责任公司 | Electrically conductive structural adhesive |
| CN104053737B (en) * | 2011-08-03 | 2016-09-07 | 汉高知识产权控股有限责任公司 | The construction adhesive of conduction |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5346441A (en) | 1978-04-26 |
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