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JPS5933077B2 - How to position items - Google Patents
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JPS5933077B2 - How to position items - Google Patents

How to position items

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Publication number
JPS5933077B2
JPS5933077B2 JP53008342A JP834278A JPS5933077B2 JP S5933077 B2 JPS5933077 B2 JP S5933077B2 JP 53008342 A JP53008342 A JP 53008342A JP 834278 A JP834278 A JP 834278A JP S5933077 B2 JPS5933077 B2 JP S5933077B2
Authority
JP
Japan
Prior art keywords
laser beam
article
light
receiving device
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53008342A
Other languages
Japanese (ja)
Other versions
JPS54101738A (en
Inventor
明 小野
裕一 村上
建二 牛見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP53008342A priority Critical patent/JPS5933077B2/en
Publication of JPS54101738A publication Critical patent/JPS54101738A/en
Publication of JPS5933077B2 publication Critical patent/JPS5933077B2/en
Expired legal-status Critical Current

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  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 本発明は同様な形状す法の複数個の物品を順次加工する
際の位置ぎめ方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a positioning method for sequentially processing a plurality of articles of similar shape.

同様な形状寸法の物品を順次位置ぎめすることは多量生
産においては随所に行なわれているが、あまク精度を必
要としない加工の位置ぎめは簡単な治具などにより手作
業で行なわれる。
Sequential positioning of articles of similar shape and size is often performed in mass production, but positioning for processing that does not require moderate precision is performed manually using a simple jig or the like.

しかし精度が要求される場合、例えばスポット径の非常
に小さいレーザビームにより溶接する場合などは顕微鏡
により位置ぎめがなされる。第1図を参照してこれを略
述すると、レーザ発振器1から発振された加工レーザビ
ーム2は、反射鏡3により直角に偏向され溶接されるべ
き部材4、5からなる物品6の突合わせ部6a上に集束
レンズ7により集束され、焦点8を結び突合わせ部6a
に沿つて溶接がなされる。
However, when precision is required, for example when welding with a laser beam with a very small spot diameter, positioning is performed using a microscope. To briefly describe this with reference to FIG. 1, a processing laser beam 2 oscillated from a laser oscillator 1 is deflected at right angles by a reflecting mirror 3 and is applied to the butt portion of an article 6 consisting of members 4 and 5 to be welded. 6a is focused by a focusing lens 7, and a focal point 8 is connected to the abutting portion 6a.
Welding is done along the

この場合の位置ぎめは、一般にレーザ発振器1から加工
レーザビーム2と同軸的に検出レーザビーム10が出さ
れ、突合わせ部6a上に焦点11を結ぶ。これを顕微鏡
12により□lしながら突合わせ部6aに沿つて部品6
を移動させ、位置決めがなされるのである。上述のよウ
な位置ぎめ方法は精度が高く、しかも当接治具を使用し
ないのでレーザ加工によるスプラッシュの治具への付着
などによる悪影響もないという長所はあるが、位置ぎめ
に非常に時間がかゝD、作業者も眼が疲れ、さらに自動
化できないなどの大きな不都合があつた。本発明は上述
の不都合を除去するためになされたもので、位置ぎめさ
れる物品に検出レーザビームを照射する検出レーザ発振
器と、あらかじめ位置ぎめされた物品の所定の部位に検
出レーザビームを照射したときのその反射光の受光が極
大となる位置に置かれた受光装置とを設け、位置ぎめさ
れるべき部品に検出レーザビームを照射するとともに位
置ぎめされるべき物品を移動させるか、または検出レー
ザビームで物品を走査させて受光装置の入射光を極大に
することにより位置ぎめするもので、自動化が容易で、
しかも精度の高いレーザビームを用いた位置ぎめ方法で
ある。
In general, for positioning in this case, a detection laser beam 10 is emitted from the laser oscillator 1 coaxially with the processing laser beam 2, and is focused 11 on the abutting portion 6a. While inspecting this using the microscope 12, the part 6 is inspected along the butt portion 6a.
The position is determined by moving the The above-mentioned positioning method has the advantage of being highly accurate, and since it does not use a contact jig, there is no negative effect caused by splashes from laser processing adhering to the jig, but it takes a lot of time to position. However, there were major inconveniences such as eye strain for workers and the inability to automate the process. The present invention has been made in order to eliminate the above-mentioned disadvantages, and includes a detection laser oscillator that irradiates a detection laser beam to an article to be positioned, and a detection laser oscillator that irradiates a predetermined part of the article that has been positioned in advance. A light receiving device is provided at a position where the reception of the reflected light is maximum at the same time, and the detection laser beam is irradiated onto the part to be positioned and the object to be positioned is moved. Positioning is done by scanning the object with a beam and maximizing the incident light on the light receiving device, and it is easy to automate.
Furthermore, this positioning method uses a highly accurate laser beam.

以下本発明の実施例を図面を参照して説明する、第2図
は本発明の第1の実施例の説明図で、本実施例は第1図
に示した従来例と同様な工程に本発明方法を適用したも
のである。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is an explanatory diagram of the first embodiment of the present invention. This embodiment is based on the same process as the conventional example shown in FIG. This is an application of the invented method.

従来例と同一部分には同一符号を付して詳細な説明は省
略する。本発明の実施に使用した装置は、検出レーザビ
ーム13を発振する検出レーザ発振器14と、このレー
ザビーム13を偏向する反射鏡15と、突合わせ部材4
,5からなる物品6の突合わせ部6aの上面6b(以下
所定部位という)に検出レーザビーム13を集束する集
束レンズ16と6物品6を支持し矢印17方向(X方向
)および紙面直角な方向(Y方向)に移動自在なXYテ
ーブル18と.このXYテーブル18を駆動するパルス
モータからなる駆動装置19と、検出レーザビーム13
の反射光20を受光する光電素子などを内蔵した受光装
置21と、この受光装置21からの出力により駆動装置
19を制御する制御装置22とからなつている。次に作
動とともに本発明方法の実施態様を説明する。
Components that are the same as those in the conventional example are designated by the same reference numerals and detailed explanations will be omitted. The device used to implement the present invention includes a detection laser oscillator 14 that oscillates a detection laser beam 13, a reflector 15 that deflects this laser beam 13, and an abutting member 4.
, 5, and a focusing lens 16 that focuses the detection laser beam 13 on the upper surface 6b (hereinafter referred to as a predetermined portion) of the abutting portion 6a of the article 6. An XY table 18 that is movable in the Y direction. A drive device 19 consisting of a pulse motor that drives this XY table 18 and a detection laser beam 13
The light receiving device 21 includes a built-in photoelectric element that receives reflected light 20, and a control device 22 that controls the driving device 19 based on the output from the light receiving device 21. Next, an embodiment of the method of the present invention will be explained along with its operation.

后接される2個の部材4,5を突き合わして構成した物
品6をXYテーブル18上に載置し、レーザ発振器1か
らの光軸調節用のレーザビームによシ突き合わせ部6a
の上面、すなわち所定部位6bを加工レーザビームの光
軸上に位置させレンズ7の調節によ勺所定部位6bに加
工レーザビームが焦点8を結ぶように調節する。この調
節は第1図に示したように顕微鏡によジ行なう。物品6
のY方向の位置ぎめすなわち突き合わせ部6a0延在す
る方向は図示しない当接治具によジ位置ぎめされている
。この状態でXYテーブル18をY方向(図面直角方向
)に送れば所定の醇接を行なうことができるので物品6
は本明細書でいう位置ぎめされた状態である。次にこの
所定部位6bに検出レーザビーム13を照射し、レンズ
16の調節により所定部位6bに焦点11を結ばせる。
この検出レーザビーム13は物品6の表面では一般に正
規の反射をするが、所定部位6bは突き合わせ面である
ので反射光は散乱光となる。受光装置21は散乱光の一
部20を受光する位置に取付ける。この際正規の反射光
路上から外れた位置を選択する。このように取付けられ
た受光装置21の出力は第3図に示すようになる。すな
わち横軸に所定部位6bの位置をとD、縦軸に散乱光の
受光量をとつてある。曲線25は位置ぎめされた物品6
をその位置からx方向(第2図矢印17方向)に沿つて
前後に移動させた場合の受光量の変化(受光装置21の
出力変化)を示すもので、所定部位6bが焦点11と一
致した点を横軸上の所定)点26とすると、ここでは反
射光はすべて散乱光となるので正規の反射光路から外れ
た位置に受光装置21は設けられているが受光量は多い
An article 6 constructed by abutting two members 4 and 5 to be abutted is placed on an XY table 18, and a laser beam for adjusting the optical axis from the laser oscillator 1 is applied to the abutting portion 6a.
The upper surface, that is, a predetermined portion 6b, is positioned on the optical axis of the processing laser beam, and the lens 7 is adjusted so that the processing laser beam focuses 8 on the predetermined portion 6b. This adjustment is performed using a microscope as shown in FIG. Article 6
The positioning in the Y direction, that is, the direction in which the abutting portion 6a0 extends, is determined by an abutment jig (not shown). In this state, if the XY table 18 is sent in the Y direction (direction perpendicular to the drawing), the specified welding can be performed.
is the positioned state referred to in this specification. Next, the detection laser beam 13 is irradiated onto the predetermined portion 6b, and the focal point 11 is focused on the predetermined portion 6b by adjusting the lens 16.
This detection laser beam 13 is generally reflected normally on the surface of the article 6, but since the predetermined portion 6b is an abutting surface, the reflected light becomes scattered light. The light receiving device 21 is attached at a position to receive a portion 20 of the scattered light. At this time, a position off the normal reflected optical path is selected. The output of the light receiving device 21 installed in this manner is as shown in FIG. That is, the horizontal axis represents the position of the predetermined portion 6b, and the vertical axis represents the amount of received scattered light. Curve 25 is the positioned article 6
This shows the change in the amount of received light (change in the output of the light receiving device 21) when the pointer is moved back and forth in the x direction (arrow 17 direction in Figure 2) from that position, and the predetermined portion 6b coincides with the focal point 11. If the point is a predetermined point 26 on the horizontal axis, all of the reflected light here becomes scattered light, so although the light receiving device 21 is provided at a position deviating from the normal reflection optical path, the amount of light received is large.

しかし前後に離れるに従つで散乱光は正規の反射光に変
わるので、受光量は著しく減少する。このため第3図に
示すように、所定点26に極大値をもつた曲線となる。
以上のように受光装置21を調節して、装置の調節が終
り、物品6をレーザ発振器1からの加工レーザビーム2
によジ洛接する。
However, as the distance from the front and rear increases, the scattered light changes to normal reflected light, and the amount of light received decreases significantly. Therefore, as shown in FIG. 3, the curve becomes a curve having a maximum value at the predetermined point 26.
After adjusting the light receiving device 21 as described above and adjusting the device, the article 6 is processed by the laser beam 2 from the laser oscillator 1.
I met Yoji Raku.

加工の終つた物品6は取う除かれ、次に加工される物品
6がXYテーブル18上に載置される。XYテーブル1
8は左端にあるとすると、X方向に沿つて右へ移動され
る。同時に検出レーザビーム13が物品6を照射するが
、部材5上において焦点11を結び正規の反射をする。
したがつて受光装置21への入力は少なく、制餌装置2
2の指令により駆動装置19はXYテーブル18右方へ
の移動を続ける。移動により所定部位6bが焦点11の
位置に来ると、反射光は急速に散乱光に変わるため受光
装置21の出力は極大となジ、これを制御装置22が検
出して、直ちに駆動装置19のパルスモータを止めXY
テーブル18を停止させる。この位置では突合わせ部6
aと加工レーザビーム2の焦点8とが一致し、位置ぎめ
が完了したことになる。その後加工レーザビーム2の照
射と同時にY方向に物品6を移動させ?接が行なわれる
。第4図は第2の実施例を示すものである。
The article 6 that has been processed is removed and the article 6 to be processed next is placed on the XY table 18. XY table 1
Assuming that 8 is at the left end, it is moved to the right along the X direction. At the same time, a detection laser beam 13 illuminates the article 6, but focuses 11 on the member 5 and undergoes normal reflection.
Therefore, the input to the light receiving device 21 is small, and the feeding control device 2
In response to the command No. 2, the drive device 19 continues to move the XY table 18 to the right. When the predetermined portion 6b comes to the focal point 11 due to movement, the reflected light rapidly changes to scattered light, so the output of the light receiving device 21 reaches its maximum.The control device 22 detects this and immediately controls the driving device 19. Stop the pulse motor
Stop the table 18. In this position, the butt part 6
a coincides with the focal point 8 of the processing laser beam 2, and the positioning is completed. After that, the article 6 is moved in the Y direction at the same time as the processing laser beam 2 is irradiated? A meeting will take place. FIG. 4 shows a second embodiment.

XYテーブル18上に断面矩形の板状部材30と丸棒状
部材31とからなる物品32が載置されている。本実施
例はこれら両部材30,31の突合わせ部32aを加工
レーザビーム2で?接する工程における位置ぎめ方法で
ある。第1の実施例と同様に予め物品32と加工レーザ
ビーム2との相互関係を調節し6突合わせ部32aに加
工レーザビーム2が焦点8を結ぶようにする。すなわち
位置ぎめされた状態にする。その後検出レーザビーム1
3を加工レーザビーム2と平行に例えば間隔dたけ隔て
て物品32の所定の部位32b,本実施例においては丸
棒状部材31の上高円弧部に焦点を結ばせる。この検出
レーザとビーム13は正規の反射をし、反射光33とな
るので、この光路上に受光装置21を設ける。この状態
で、XYテーブル18のX方向の前後動によう生じるこ
の受光装置21の受光量の変化は、第5図に示すように
なる。すなわち、縦軸に受光装置21への入射光量をと
)、横軸に所定部位32bのx方向の位置をとると、両
者の関係は曲線34となる。突合わせ部32aが焦点8
と一致した位置における所定部位32bの横軸上の位置
を点35とすると、これに対応した入射光量は受光装置
21が反射光33の光路上にあるので極大となジ、例え
ば物品32を一点鎖線で示す位置36に移動させた場合
は、検出レーザビーム13の焦点11の位置は変わらな
いので、所定部位32bで反射せずに反射光37となジ
受光装置21は反射光路上になく入射光量は著しく減少
する。従つて曲線34は点35において極大となジその
前後において急速に減少する。本実施例はこのように受
光装置21を設置した後加工レーザビーム系、検出レー
ザビーム系を固定して位置ぎめを行なうものである。ま
ずXYテーブル18をX方向の本図左方に位置させ新た
に位置ぎめすべき物品32を載置する。その後検出レー
ザビーム13を照射しながらXYテーブル18を制御装
置22,駆動装置19によシX方向の本図右方に移動さ
せる。この移動によ)、物品32の所定部位32bが検
出レーザビーム13の焦点11に近接すると、第5図の
曲線34に示すように受光装置21への入射光量は変化
し、極大値に到るとこれを制御装置が検出し、駆動装置
19に停止を命じ位置ぎめが完了する。この位置で突き
合わせ部32aに加工レーザビーム2の焦点8が結ばれ
るようになつている。次に薄板のレーザビーム加工にお
ける実施例につき述べる。
An article 32 consisting of a plate member 30 with a rectangular cross section and a round bar member 31 is placed on the XY table 18 . In this embodiment, the abutting portion 32a of these two members 30 and 31 is processed using the laser beam 2. This is a positioning method in the contacting process. As in the first embodiment, the mutual relationship between the article 32 and the processing laser beam 2 is adjusted in advance so that the processing laser beam 2 focuses 8 on the 6 abutting portions 32a. In other words, it is placed in a positioned state. Then detection laser beam 1
3 is parallel to the processing laser beam 2, for example, at an interval d, and focused on a predetermined portion 32b of the article 32, in this embodiment, the upper arcuate portion of the round bar-shaped member 31. Since this detection laser and beam 13 are regularly reflected and become reflected light 33, a light receiving device 21 is provided on this optical path. In this state, the amount of light received by the light receiving device 21 changes as shown in FIG. 5 as the XY table 18 moves back and forth in the X direction. That is, when the vertical axis represents the amount of light incident on the light receiving device 21 and the horizontal axis represents the position of the predetermined portion 32b in the x direction, the relationship between the two becomes a curve 34. The abutting portion 32a is the focal point 8
If the position of the predetermined part 32b on the horizontal axis at a position that coincides with the point 35 is a point 35, the amount of incident light corresponding to this will be maximum because the light receiving device 21 is on the optical path of the reflected light 33.For example, when the article 32 is placed at one point When the detection laser beam 13 is moved to the position 36 indicated by the chain line, the position of the focal point 11 of the detection laser beam 13 does not change, so the light is not reflected at the predetermined portion 32b and becomes reflected light 37. The light receiving device 21 is not on the reflected optical path and is incident The amount of light decreases significantly. Therefore, the curve 34 reaches a maximum at a point 35 and rapidly decreases before and after that. In this embodiment, after the light receiving device 21 is installed in this manner, the processing laser beam system and the detection laser beam system are fixed and positioning is performed. First, the XY table 18 is positioned on the left side of the figure in the X direction, and the article 32 to be newly positioned is placed thereon. Thereafter, while irradiating the detection laser beam 13, the XY table 18 is moved to the right in the figure in the X direction by the control device 22 and the drive device 19. Due to this movement), when the predetermined portion 32b of the article 32 approaches the focal point 11 of the detection laser beam 13, the amount of light incident on the light receiving device 21 changes as shown by the curve 34 in FIG. 5, and reaches a maximum value. The control device detects this and orders the drive device 19 to stop, completing the positioning. At this position, the focal point 8 of the processing laser beam 2 is focused on the abutting portion 32a. Next, an example of laser beam processing of a thin plate will be described.

例えば第6図イに示すように薄板41の端面42に加工
レーザビーム2によジ穴あけ加する場合や、第6図口に
示すように端面42に板部材43を爵接するような場合
に適用したものである。第7図は第3の実施例を示す。
For example, it is applicable when drilling a hole in the end surface 42 of a thin plate 41 using the processing laser beam 2 as shown in FIG. 6A, or when attaching a plate member 43 to the end surface 42 as shown in FIG. This is what I did. FIG. 7 shows a third embodiment.

力旺レーザビーム2の光軸2aと端面42の中心とを一
致させる泣置ぎめである。予め端面42の中心である所
定部位41bを加工レーザビーム2の光軸と同軸の検出
レーザビーム13の光軸2aと一致させる。すなわち物
品41を位置ぎめし、検出レーザビーム13の反射光3
3を半透鏡44によ)直角方向に偏向導出し、レンズ4
5によジ受光装置21に集光入射させる。この状態にお
いて、前述の実施例と同様に、物品41をX方向17に
沿つて前後に若干移動させると、この受光装置21の出
力とX方向の位置との関係は第8図に示すようになる。
第8図イに示すように、光軸2aと端面42の長手方向
の中心線42aとが一致した状態で検出レーザビーム1
3を照射した場合、反射光の強度分布は同図口に示すよ
うにガウス分布となう曲線45のようになる。したがつ
てXYテーブルの前後動によジ受光装置21の出力は端
面42の中心線42aと光軸2aとが一致したときに極
大となる。次に新規に位置ぎめされるべき物品41をX
Yテーブル18上に載置し、制御装置22の指令により
、X方向17の→lから他側へ移動させると、受光装置
21の出力が次第に上昇し、極大値を示す。この点を制
御装置22が検出し、XYテーブル18の移動を停止さ
せる。この位置で所定の位置ぎめが完了する。第9図に
示すは、第4の実施例である。
This is a stopper for aligning the optical axis 2a of the laser beam 2 with the center of the end surface 42. A predetermined portion 41b, which is the center of the end face 42, is aligned in advance with the optical axis 2a of the detection laser beam 13, which is coaxial with the optical axis of the processing laser beam 2. That is, the article 41 is positioned and the reflected light 3 of the detection laser beam 13 is
3 is deflected in the right angle direction by a semi-transparent mirror 44, and the lens 4
5, the light is condensed and incident on the light receiving device 21. In this state, when the article 41 is slightly moved back and forth along the X direction 17 as in the previous embodiment, the relationship between the output of the light receiving device 21 and the position in the X direction is as shown in FIG. Become.
As shown in FIG. 8A, the detection laser beam 1 is
3, the intensity distribution of the reflected light becomes a Gaussian distribution curve 45, as shown at the top of the figure. Therefore, when the XY table moves back and forth, the output of the light receiving device 21 becomes maximum when the center line 42a of the end face 42 and the optical axis 2a coincide. Next, the article 41 to be newly positioned is
When placed on the Y table 18 and moved from →l in the X direction 17 to the other side according to a command from the control device 22, the output of the light receiving device 21 gradually increases and reaches a maximum value. The control device 22 detects this point and stops the movement of the XY table 18. At this position, the predetermined positioning is completed. FIG. 9 shows a fourth embodiment.

本実施例においては、検出レーザビーム13が物品41
のエツジ41b,すなわち所定部位を照射したときの散
乱光20を受光する位置に受光装置21を設けておき、
また第10図に示すように加工レーザビーム2の焦点8
と検出レーザビーム13の焦点11との間隔を物品41
の厚さtの1/2に設定しておく。このように構成して
前述の実施例と同様に、物品41をX方向17に沿つて
一側から他側へ移動させ、受光装置21の出力の極大値
を検出して位置ぎめする。第11図に示すは第5の実施
例である。
In this embodiment, the detection laser beam 13
A light receiving device 21 is provided at a position to receive the scattered light 20 when the edge 41b, that is, a predetermined region is irradiated,
In addition, as shown in FIG. 10, the focal point 8 of the processing laser beam 2
The distance between the object 41 and the focal point 11 of the detection laser beam 13 is
The thickness is set to 1/2 of the thickness t. With this configuration, the article 41 is moved from one side to the other along the X direction 17, and the local maximum value of the output of the light receiving device 21 is detected and positioned, as in the previous embodiment. FIG. 11 shows a fifth embodiment.

物品41の側面48に直角に検出レーザビーム13を半
透鏡44を介して投射し、その反射光33をレンズ49
,50を介して受光装置21に収束入射させる。この場
合も物品41の前後動によジ受光装置21の出力は変化
し、側面48上に検出レーザビーム13が焦点を結ん位
置に極大値をもつた曲線となるので、極大値の検出によ
ジ前述の実施例と同様に所定の位置ぎめがなされる。な
お上述の実施例においてはレーザ加工の場合につき述べ
たがこれに限定されず他の加工における位置ぎめに用い
てもよく、また加工レーザビーム2,検出レーザビーム
13を固定し、物品6,32,41を移動させて位置ぎ
めする例を示したが物品6,32,41を固定し、偏向
装置によ)各レーザビーム2,13を走査して位置ぎめ
するようにしてもよいことはもちろんである。
The detection laser beam 13 is projected perpendicularly onto the side surface 48 of the article 41 through a semi-transparent mirror 44, and the reflected light 33 is reflected through a lens 49.
, 50, the light is convergently incident on the light receiving device 21. In this case as well, the output of the light receiving device 21 changes as the article 41 moves back and forth, and the detection laser beam 13 is focused on the side surface 48, forming a curve with a maximum value at the position. The predetermined positioning is done in the same manner as in the previous embodiment. In the above embodiment, the case of laser processing has been described, but it is not limited to this and may be used for positioning in other processing, and the processing laser beam 2 and detection laser beam 13 are fixed, , 41 has been shown, but it is of course also possible to fix the articles 6, 32, 41 and position them by scanning each laser beam 2, 13 (using a deflection device). It is.

さらにまたレンズ16の移動によ)ビーム径を調節した
ジ、受光装置21の開口51の調節により検出感度を調
節してもよい。以上詳述したように、本発明のレーザビ
ームを用いた物品の位置ぎめ方法は、位置検出にレーザ
ビームを使用したのでビーム径、光量および方向性を高
精度に調節できるため、その散乱反射光および正規の反
射光の検出により高精度な位置ぎめができる。
Furthermore, the detection sensitivity may be adjusted by adjusting the beam diameter (by moving the lens 16) and adjusting the aperture 51 of the light receiving device 21. As described in detail above, the article positioning method using a laser beam of the present invention uses a laser beam for position detection, so the beam diameter, light intensity, and directionality can be adjusted with high precision. Highly accurate positioning is possible by detecting regular reflected light.

また検出光以外の波長の光との分離が容易なので人射光
量の極大値の検出は誤動作がなく正確であり、さらに自
動化が容易であるなどの種々なすぐれた効果を奏するも
のである。
Furthermore, since it is easy to separate light of wavelengths other than the detection light, the detection of the maximum value of the amount of human light is accurate without malfunction, and furthermore, it has various excellent effects such as being easy to automate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の位置ぎめ方法の説明斜視図、第2図は本
発明の第1の実施例の説明図、第3図は第1の実施例に
おける人射光量と物品の移動との関係図、第4図は本発
明方法の第2の実施例の説明図、第5図は第2の実施例
における人射光量と物品の移動との関係図、第6図イお
よび口は本発明方法の第3の実施例ないし第5の実施例
における加工説明図、第7図は本発明方法の第3の実施
例の説明図、第8図イおよび口は上記第3の実施例の要
部説明図、第9図は本発明方法の第4の実施例の説明図
、第10図は上記第4の実施例の要部説明図、第11図
は本発明方法の第5の実施例の説明図である。 6,32,41・・・・・・物品、6b,32b,41
b・・・・・・所定の部位、13・・・・・・検出レー
ザビーム、20,33・・・・・・反射光、21・・・
・・・受光装置。
FIG. 1 is an explanatory perspective view of the conventional positioning method, FIG. 2 is an explanatory diagram of the first embodiment of the present invention, and FIG. 3 is the relationship between the amount of human light and the movement of the article in the first embodiment. 4 is an explanatory diagram of the second embodiment of the method of the present invention, FIG. 5 is a diagram of the relationship between the amount of human light and the movement of the article in the second embodiment, and FIG. Fig. 7 is an explanatory diagram of the third embodiment of the method of the present invention, and Fig. 8 A and 8 show the main points of the third embodiment described above. FIG. 9 is an explanatory diagram of the fourth embodiment of the method of the present invention, FIG. 10 is an explanatory diagram of the main part of the fourth embodiment, and FIG. 11 is a fifth embodiment of the method of the present invention. FIG. 6, 32, 41... Goods, 6b, 32b, 41
b... Predetermined portion, 13... Detection laser beam, 20, 33... Reflected light, 21...
...Light receiving device.

Claims (1)

【特許請求の範囲】[Claims] 1 同様な形状寸法の複数個の物品を順次所定位に載置
加工する際の位置ぎめ方法であつて、予め位置ぎめされ
た上記物品の所定の部位を検出レーザビームが照射した
ときに上記検出レーザビームの反射光の入射が極大とな
る位置に受光装置を設け、上記検出レーザビームを位置
ぎめされるべき上記物品に照射するとともに上記物品を
上記検出レーザビームに対し相対的に移動させ上記受光
装置への上記入射を極大ならしめることを特徴とする物
品の位置決め方法。
1 A positioning method for sequentially placing and processing a plurality of articles with similar shapes and dimensions at predetermined positions, in which the detection is performed when a detection laser beam irradiates a predetermined part of the article that has been positioned in advance. A light receiving device is provided at a position where the incidence of reflected light of the laser beam is maximum, and the detection laser beam is irradiated onto the article to be positioned, and the article is moved relative to the detection laser beam to receive the light. A method for positioning an article, characterized by maximizing the above-mentioned incidence on the device.
JP53008342A 1978-01-30 1978-01-30 How to position items Expired JPS5933077B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53008342A JPS5933077B2 (en) 1978-01-30 1978-01-30 How to position items

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53008342A JPS5933077B2 (en) 1978-01-30 1978-01-30 How to position items

Publications (2)

Publication Number Publication Date
JPS54101738A JPS54101738A (en) 1979-08-10
JPS5933077B2 true JPS5933077B2 (en) 1984-08-13

Family

ID=11690527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53008342A Expired JPS5933077B2 (en) 1978-01-30 1978-01-30 How to position items

Country Status (1)

Country Link
JP (1) JPS5933077B2 (en)

Also Published As

Publication number Publication date
JPS54101738A (en) 1979-08-10

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