JPS5933200B2 - Processing method for plating copper material - Google Patents
Processing method for plating copper materialInfo
- Publication number
- JPS5933200B2 JPS5933200B2 JP5849877A JP5849877A JPS5933200B2 JP S5933200 B2 JPS5933200 B2 JP S5933200B2 JP 5849877 A JP5849877 A JP 5849877A JP 5849877 A JP5849877 A JP 5849877A JP S5933200 B2 JPS5933200 B2 JP S5933200B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- rotating drum
- electrolytic
- solder
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
Description
【発明の詳細な説明】
この発明は、部分的に半田や鉛がメッキされていたり或
いは付着している錫メッキ鋼材料または半田メッキされ
ている鋼材料から錫および鉛を除去し原料銅材料として
再生使用可能とする処理方法に関する。[Detailed Description of the Invention] This invention removes tin and lead from tin-plated steel materials or solder-plated steel materials that are partially plated or attached with solder or lead, and uses them as raw copper materials. This invention relates to a processing method for making it recyclable.
周知のごとく錫メッキ銅線、特に20mwL〆以下の絶
縁被覆を施した錫メッキ導体絶縁電線は通信ケーブル局
内配線やIVケーブル或いは機器連結用ジャンパー線等
に使用されている。As is well known, tin-plated copper wires, particularly tin-plated conductor insulated wires with an insulation coating of 20 mwL or less, are used for communication cables, IV cables, jumper wires for connecting equipment, etc.
これ等の電線ケーブルを回収して導体である銅線を有効
に再使用することは省資源等の観点からも好ましいこと
である。しかるに撤去された錫メッキ絶縁電線を再生使
用するためには、まず絶縁被覆を錫メッキ銅線から除去
する必要があり、この方法としては錫メッキ絶縁電線を
5〜15m1程度の短尺に切断粉砕して機械的に絶縁被
覆を錫メッキ銅線から除去する方法が知られている。It is preferable from the viewpoint of resource saving and the like to collect these electric wire cables and effectively reuse the copper wires that are the conductors. However, in order to reuse the removed tin-plated insulated wire, it is first necessary to remove the insulation coating from the tin-plated copper wire, and this method involves cutting the tin-plated insulated wire into short pieces of about 5 to 15 m1 and crushing them. A known method is to mechanically remove the insulation coating from tin-plated copper wire.
こめようにして絶縁被覆が除去された錫メッキ銅線はそ
のまま溶融して銅線等に再生使用した場合、銅中に相当
量の錫が含まれるため導電率が著しく低下するから、錫
を除去する必要がある。錫メッキ銅線から錫を除去する
方法としては、乾式精錬においてソーダ処理や燐酸処理
等により除去する方法が知られているが、この方法では
錫を充分に除去することが困難であると共に、炉の耐火
物の寿命が処理剤により著しく短かくなり、かつまた銅
の再生歩留が低い等の問題があり、したがつて従来はこ
の方法は試験的に実施されているだけであつて、実用化
は困難であつた。If the tin-plated copper wire whose insulation coating has been removed is melted and recycled into copper wire, etc., the conductivity will drop significantly because the copper contains a considerable amount of tin, so the tin must be removed. There is a need to. A known method for removing tin from tin-plated copper wire is to use soda treatment, phosphoric acid treatment, etc. in pyrometallurgical refining, but it is difficult to remove tin sufficiently with this method, and the furnace There are problems such as the lifespan of refractories is significantly shortened by treatment agents and the copper regeneration yield is low. It was difficult to adapt.
また長尺の錫メッキ銅線の錫除去方法としては錫メッキ
銅線を互いにからみ合わせてこれを硫酸水溶液浴中にお
いて電解処理する方法が知られているが、この方法を、
前述のように絶縁被覆を除去するために5〜15n程度
に粉砕した錫メッキ銅線の錫除去法に適用した場合、被
処理材料すなわち粉砕した錫メツキ銅線が小寸法かつ不
定形であるため被処理材の電解のための取扱いに困難を
伴うと共に完全に錫を除去することが困難であり、かつ
又1回当りの電解処理が少く、このため処理コストが高
くなる等の問題があり、従つて粉砕した錫メツキ銅線に
ついては電解処理により錫を除去することが困難である
とされていた。Also, as a method for removing tin from long tin-plated copper wires, a method is known in which the tin-plated copper wires are intertwined with each other and electrolytically treated in a sulfuric acid aqueous solution bath.
As mentioned above, when applying the tin removal method to tin-plated copper wire that has been crushed to about 5 to 15 nanometers to remove the insulation coating, the material to be treated, that is, the crushed tin-plated copper wire, is of small size and irregular shape. It is difficult to handle the material to be treated for electrolysis, it is difficult to completely remove tin, and there are also problems such as less electrolytic treatment per time, which increases the treatment cost. Therefore, it has been considered difficult to remove tin from pulverized tin-plated copper wire by electrolytic treatment.
以上のような事情を背景とし、この発明の発明者は、特
定の構成の電解装置を使用し、多数の短尺な錫メツキ銅
材を、硫酸浴中において特定の電解条件下で連続的に電
解し、これによつて錫を除去する方法を開発しており、
この方法によれば短尺かつ不定形の錫メツキ銅線の錫を
高能率かつ低コストで充分に除去することが可能となつ
た。Against the background of the above circumstances, the inventor of the present invention used an electrolyzer with a specific configuration to continuously electrolyze a large number of short tin-plated copper materials under specific electrolytic conditions in a sulfuric acid bath. We have developed a method to remove tin using this method.
According to this method, it has become possible to sufficiently remove tin from short and irregularly shaped tin-plated copper wires with high efficiency and at low cost.
しかるに一般の錫メツキ銅線は、その端末の接続に半田
付を行うことが多く、また端末の半田作業を容易にする
ため予め半田メツキを施す場合が多い。さらには半田メ
ツキ銅線が使用される場合もある。したがつて徹去後の
回収材には、半田が付着している場合が多く、このよう
な回収材を処理して銅線等に再使用するためには錫の他
に鉛も除去しなければならない。ところがこの場合前述
のようなこの発明の発明者等が提案した電解処理法では
錫が除去されるだけであつて鉛をも充分に除去すること
は困難であることが明らかとなつた。そこでこの発明の
発明者は前記提案技術について更に検討を加えたところ
、錫と鉛との両者を短尺から不定形な錫メツキ銅材や半
田メツキ銅材料から高能率かつ低コストで除去すること
が可能となり、この発明をなすに至つたのである。すな
わちこの発明の方法は、一端にメツキ銅材料の投入口を
形成すると共に他端に排出口を形成しかつ外周面を電解
液通過自在となるように構成した中空円筒状の絶縁材か
らなる回転ドラムを、その軸線が前記投入口から排出口
へ向け傾斜可能に電解槽内に配置し、前記回転ドラム内
に陽極を挿入すると共に回転ドラム外に陰極を配設して
なる電解装置を用い、該電解装置の濃度1〜6規定の希
硫酸中において前記回転ドラムを回転させつつ該回転ド
ラム内に前記投入口から短尺の多数のメツキ銅材を連続
的に投入して見掛電流密度が100A/Dm2以下とな
る条件下で電解してまず錫を除去すると共に回転ドラム
の前記排出口から処理済の短尺材を連続的に排出させ、
次いで前記電解装置或いは同様の装置中の濃度2規定以
上の水酸化ナトリウム水溶液中において回転ドラムを回
転させつつ回転ドラムに錫を除去した銅材料を順次投入
口から連続的に投入して3V以下の電解電圧で電解して
鉛を除去した後回転ドラムの排出口から連続的に排出さ
せることを特徴とするものである。However, common tin-plated copper wires are often soldered to connect their terminals, and are often pre-soldered to facilitate soldering of the terminals. Furthermore, solder-plated copper wire may also be used. Therefore, recovered materials after removal often have solder attached to them, and in order to process such recovered materials and reuse them for copper wire, etc., lead as well as tin must be removed. Must be. However, in this case, it has become clear that the electrolytic treatment method proposed by the inventors of the present invention as described above only removes tin, but it is difficult to sufficiently remove lead as well. Therefore, the inventor of the present invention further investigated the proposed technology and found that it is possible to remove both tin and lead from short to irregularly shaped tin-plated copper materials and solder-plated copper materials with high efficiency and low cost. This became possible and led to this invention. That is, the method of the present invention consists of a rotating hollow cylindrical insulating material having an inlet for the plated copper material formed at one end and an outlet at the other end, the outer peripheral surface of which is configured to allow the electrolyte to pass through. Using an electrolytic device in which a drum is arranged in an electrolytic cell so that its axis can be tilted from the input port to the discharge port, an anode is inserted into the rotating drum, and a cathode is arranged outside the rotating drum, While rotating the rotary drum in dilute sulfuric acid having a concentration of 1 to 6 N in the electrolytic device, a large number of short plated copper materials were continuously introduced into the rotary drum from the inlet, so that the apparent current density was 100 A. /Dm2 or less to first remove tin by electrolysis and continuously discharge the treated short material from the discharge port of the rotating drum,
Next, while rotating the rotating drum in a sodium hydroxide aqueous solution having a concentration of 2N or more in the electrolysis device or similar device, the copper material from which tin has been removed is sequentially introduced into the rotating drum from the inlet, and the voltage is 3V or less. It is characterized in that lead is removed by electrolysis at an electrolytic voltage and then continuously discharged from the discharge port of the rotating drum.
以下この発明を詳細に説明すると、第1図ないし第3図
はこの発明の方法に使用する電解装置の一例を示す図で
、この電解装置は、方形状の電解槽1内に、絶縁材料か
らなる中空円筒状の回転ドラム2を配設した構成となつ
ている。To explain this invention in detail below, FIGS. 1 to 3 are diagrams showing an example of an electrolytic device used in the method of this invention. It has a configuration in which a hollow cylindrical rotating drum 2 is disposed.
該回転ドラム2の外周部分は、電解液が流通可能となる
よう周壁面のほぼ全面にわたつて多数の透孔3を形成し
た塩化ビニル等の耐酸耐アルカリ性で絶縁性の硬質樹脂
材料からなる中空円筒状の外筒体4の内周面に、120
メツシユないし140メツシユ程度の網目を持つポリ塩
化ビニリデン系繊維(商品名サラン)等の耐酸性、耐薬
品性耐摩耗性材料からなる布網5を添着した構成となつ
ている。この布網5は、外筒体4の軸線方向とほぼ平行
となる被複数の塩化ビニル等の条板状の押え板6により
前記外筒体4の内周面に取付けられている。前記外筒体
4の一端(図の右端)には、短円筒状の投入側端部枠7
が同軸上に嵌着されており、この投入側端部枠7の端面
には、ローラ状の支持体8が固着されている。前記投入
側端部枠7および支持体8には、回転ドラム2の軸線方
向に貫通しかつ外側から内側へ向け拡大テーパ状となる
投入口9が形成されている。また前記投入側端部枠7内
には、プロペラ状に傾斜する例&ば4枚の羽根10を中
空筒状の支軸11に放射状に取付けてなるメツキ銅材の
取入部材12は前記投入口9の内側端部から所定距離内
方へ離された位置に設けられており、これにより取入部
材12と投入口9との間には小室13が形成され、この
小室13によつてメツキ銅材の送り出しがスムーズに行
なわれるようになつている。また前記外筒体4の他端(
図の左端)には、前記投入側端部材7と同様な排出側端
部枠14が嵌着されており、この排出側端部枠14の外
壁面には、ベークライト等の硬質絶縁材料からなる大径
ギヤ15が固着され、さらに該大径ギヤ15の外壁側に
は、前記投入側の支持体8と同様なローラ状の支持体1
6が固定されている。The outer circumferential portion of the rotating drum 2 is a hollow body made of an acid- and alkali-resistant and insulating hard resin material such as vinyl chloride, which has a large number of through holes 3 formed over almost the entire surface of the circumferential wall so that the electrolyte can flow therethrough. 120 on the inner peripheral surface of the cylindrical outer cylinder 4
It has a structure in which a cloth net 5 made of acid-resistant, chemical-resistant, and abrasion-resistant material such as polyvinylidene chloride fiber (trade name Saran) having a mesh size of about 1 to 140 meshes is attached. The cloth mesh 5 is attached to the inner circumferential surface of the outer cylinder 4 by a plurality of strip-shaped holding plates 6 made of vinyl chloride or the like, which are substantially parallel to the axial direction of the outer cylinder 4. A short cylindrical input side end frame 7 is provided at one end of the outer cylinder 4 (the right end in the figure).
are coaxially fitted, and a roller-shaped support 8 is fixed to the end surface of the input side end frame 7. The input side end frame 7 and the support body 8 are formed with an input port 9 that penetrates in the axial direction of the rotary drum 2 and is tapered to expand from the outside to the inside. In addition, in the input side end frame 7, there is an intake member 12 made of plated copper material, which has four propeller-like inclined blades 10 radially attached to a hollow cylindrical support shaft 11. A small chamber 13 is formed between the intake member 12 and the input port 9, and the plating Copper materials can now be delivered smoothly. Also, the other end of the outer cylinder 4 (
A discharge side end frame 14 similar to the input side end member 7 is fitted on the left end of the figure), and the outer wall surface of the discharge side end frame 14 is made of a hard insulating material such as Bakelite. A large-diameter gear 15 is fixed, and a roller-shaped support 1 similar to the input-side support 8 is disposed on the outer wall side of the large-diameter gear 15.
6 is fixed.
これら排出側端部枠14、大径ギヤ15および支持体1
6には、これを外筒体4の軸線方向に貫通しかつ外方へ
向つてテーパー状に拡開する排出口17が形成されてお
り、また排出側端部枠16内には、前記取入部材12と
同様に、プロペラ状に傾斜する4枚の羽根18を中空筒
状の支軸19に放射状に取付けてなる排出部材20が固
設されている。以上のように構成された回転ドラム2は
、電解槽1の内底面に設けた一対の受け枠21,22に
回転可能に支持されている。These discharge side end frame 14, large diameter gear 15 and support body 1
6 is formed with a discharge port 17 that passes through the outer cylinder body 4 in the axial direction and expands outward in a tapered shape. Similar to the input member 12, a discharge member 20 is fixedly provided, which is formed by four propeller-like inclined blades 18 radially attached to a hollow cylindrical support shaft 19. The rotating drum 2 configured as described above is rotatably supported by a pair of receiving frames 21 and 22 provided on the inner bottom surface of the electrolytic cell 1.
すなわち電解槽1の内底面に所定間隔を置いて上面円弧
状の受け枠21,22が設けられており、この受け枠2
1,22に、前記回転ドラム2の両端部の支持体8,1
6が摺動可能に載置保持されている。なお受け枠21,
22の上面には、摩擦抵抗の少ない材料、例えばポリ4
フツ化エチレン(商品名デフロン)等からなる膜23が
形成されている。なおまた回転ドラム2は、その中心軸
線lが水平線Hに対し、投入口の側から排出口の側へ向
け小角度a下方に傾斜可能となるように設置されている
。一方電解槽1の上部にはモータ等の回転5駆動装置2
4が配設されており、この回転駆動装置24の駆動軸2
5に設けたスプロケツト26が中間回転ギヤ27を介し
前記回転ドラム2の大径ギヤ15に噛合い、これにより
回転ドラム2が若干下方へ傾斜した軸線lを中心として
回転するようになつている。That is, receiving frames 21 and 22 each having an arcuate upper surface are provided at a predetermined interval on the inner bottom surface of the electrolytic cell 1.
1 and 22, supports 8 and 1 at both ends of the rotating drum 2;
6 is slidably mounted and held. In addition, receiving frame 21,
The upper surface of 22 is made of a material with low frictional resistance, such as poly 4
A film 23 made of fluorinated ethylene (trade name: Deflon) or the like is formed. Furthermore, the rotating drum 2 is installed so that its center axis 1 can be tilted downward at a small angle a from the input port side to the discharge port side with respect to the horizontal line H. On the other hand, at the top of the electrolytic cell 1, there is a rotation 5 drive device 2 such as a motor.
4 is arranged, and the drive shaft 2 of this rotation drive device 24
A sprocket 26 provided at 5 meshes with the large diameter gear 15 of the rotary drum 2 through an intermediate rotary gear 27, so that the rotary drum 2 rotates about an axis l inclined slightly downward.
さらに電解槽1の上部には、被処理材28としての短尺
の半田や鉛を含む錫メツキ銅線や半田メツキ銅線を連続
的に回転ドラム2の投入口9に投入するためのホツパ2
9が設けられており、このホツパ29の下部は開閉可能
なシヤツタ37および被処理材通路30を介して前記投
入口9に導かれている。Further, at the upper part of the electrolytic cell 1, a hopper 2 is provided for continuously feeding short lengths of solder, lead-containing tin-plated copper wire, and solder-plated copper wire as the material to be processed 28 into the input port 9 of the rotating drum 2.
9 is provided, and the lower part of this hopper 29 is guided to the input port 9 via an openable/closable shutter 37 and a material passage 30.
一方回転ドラム2の排出口17近傍には、該排出口17
から落下する処理済材を受けてこれを電解槽1の外部へ
搬出する傾斜状の排出コンベヤ32が配設されており、
またこの排出コンベヤ32の下方にはコンベヤ32から
こぼれ落ちた処理済材を受ける上面開口の図示しない筐
体が配設されている。なおコンベヤ32の上方には、該
コンベヤ32により運び上げられる途中の処理済材に加
圧空気を吹付けて水切りを行うための図示しない空気噴
出部材が設けられている。またノ回転ドラム2内には前
記被処理材通路30を介して投入口から棒状等の陽極3
5が挿入されており、回転ドラム2の外部で該回転ドラ
ム2を下方から囲む位置には、陰極36が配設されてい
る。On the other hand, near the discharge port 17 of the rotating drum 2, the discharge port 17
An inclined discharge conveyor 32 is provided to receive the treated material falling from the electrolytic cell 1 and transport it to the outside of the electrolytic cell 1.
Further, below the discharge conveyor 32, a casing (not shown) having an opening on the top surface is provided to receive the treated material spilled from the conveyor 32. Note that an air jetting member (not shown) is provided above the conveyor 32 for blowing pressurized air onto the treated material being carried up by the conveyor 32 to drain water. Further, an anode 3 such as a rod-shaped anode 3 is inserted into the rotary drum 2 from the input port through the material passage 30 to be treated.
5 is inserted, and a cathode 36 is disposed outside the rotating drum 2 at a position surrounding the rotating drum 2 from below.
前記陽極35は回転ドラム2内において被処理材のメツ
キ銅線に接するものであり、銅、ステンレス鋼、チタン
等の材料が使用される。また前記陰極36としても同様
に銅、ステンレス鋼、チタン等の材料が使用される。次
に前述のような電解装置を用い、5〜15mm程度に短
尺に切断されかつ半田、鉛がメツキ或いは付着した錫メ
ツキ銅線や半田メツキ銅線(以下被処理材と記す)の脱
錫および鉛処理を行う方法について具体的に説明する。The anode 35 is in contact with the plated copper wire of the material to be treated within the rotating drum 2, and is made of a material such as copper, stainless steel, titanium, or the like. Similarly, materials such as copper, stainless steel, and titanium are used for the cathode 36. Next, using the electrolytic device as described above, the tin-plated copper wire or solder-plated copper wire (hereinafter referred to as the material to be treated) that has been cut into short lengths of approximately 5 to 15 mm and is plated or adhered with solder and lead is detined and A method for performing lead treatment will be specifically explained.
先ず電解槽1には、硫酸水溶液を満たす。First, the electrolytic cell 1 is filled with an aqueous sulfuric acid solution.
この硫酸水溶液の濃度は1〜6規定の範囲内であれば良
い。多数の被処理材28をホツパ29に投入し、適宜シ
ヤツタ37を開けば、被処理材28は被処理材通路30
を経て回転ドラム2の投入口9から回転ドラム端部の小
室13内に投入される。回転ドラム2は回転駆動装置2
4により定速度で回転せしめられるから、回転ドラム2
の投入側のプロペラ状の取入部材12も回転する。この
時、小室13内の被処理材28は、回転ドラム2の回転
に対し、自重により小室1)の内周壁を転がり落ちるが
、取入部材12の各羽根10の間に位置する被処理材2
8はその転落方向が羽根10により規制されて回転ドラ
ム2の内方、すなわち取入部材12の左方へ順次取入れ
られる。一旦取入れられた後には、回輯ドラ,ム例が小
角度aだけ傾斜しているから、回転ドラム2の回転に伴
つて順次排出口側(左方)へ移動する。回転ドラム2内
は前記外筒体4の透孔3および布5の布目により外部と
連通しているから硫酸水溶液は回転ドラム2の内外を流
通する。そして回転ドラム2内を移動する被処理材は陽
極35に接するから、該陽極35と回転ドラム2の外部
の陰極36との間の電解電流により被処理材表面の錫が
まず電解される。このようにして被処理材は回転ドラム
2内を移動しつつ次第に錫が除去され、ほぼ完全に錫が
除去された時点で排出部材20の各羽根18の間に位置
することになる。したがつて前述の取入部材12の作用
と同様にして処理済材が排出部材20の外側へ排出され
、排出口17を介して排出コンベヤ32により上方へ搬
送され、電解槽1の上方において例えば空気噴出部材に
より高圧空気が吹付けられて処理済材に附着している電
解液が吹飛ばされ、さらに電解槽1の外方へ搬出される
。この後処理済材は水洗および乾燥される。なお前記収
入部材12は、回転ドラム2内への被処理材の投入を円
滑に行うと共に、小室13内の被処理材の量がばらつい
ても、回転ドラム2の回転に伴つて定量ずつドラム内に
投入する作用を奏する。また排出部材20も同様に処理
済材を定量ずつ排出する作用を奏する。したがつて回転
ドラム2の収入部材12と排出部材20との間、すなわ
ち有効に電解がなされる部分には常に一定量の処理材が
存在することになる。上述のようにして錫が除去された
被処理材は、前記同様の電解装置により鉛除去のための
電解処理が施される。The concentration of this sulfuric acid aqueous solution may be within the range of 1 to 6 normal. By putting a large number of materials 28 into the hopper 29 and opening the shutter 37 as appropriate, the materials 28 are transferred to the material path 30.
The liquid is then introduced into the small chamber 13 at the end of the rotating drum 2 through the inlet 9 of the rotating drum 2. The rotary drum 2 is a rotary drive device 2
4 rotates at a constant speed, the rotating drum 2
The propeller-shaped intake member 12 on the input side also rotates. At this time, the material to be processed 28 in the small chamber 13 rolls down the inner peripheral wall of the small chamber 1) due to its own weight due to the rotation of the rotating drum 2, but the material to be processed located between the blades 10 of the intake member 12 2
8 are sequentially introduced into the rotary drum 2, that is, to the left of the intake member 12, with the falling direction thereof being regulated by the blades 10. Once taken in, since the rotating drum 2 is inclined by a small angle a, it sequentially moves toward the discharge port side (to the left) as the rotating drum 2 rotates. The inside of the rotating drum 2 is communicated with the outside through the through holes 3 of the outer cylinder 4 and the texture of the cloth 5, so that the sulfuric acid aqueous solution flows inside and outside the rotating drum 2. Since the material to be treated moving within the rotating drum 2 comes into contact with the anode 35, tin on the surface of the material to be treated is first electrolyzed by the electrolytic current between the anode 35 and the cathode 36 outside the rotating drum 2. In this way, the material to be treated moves within the rotating drum 2 while gradually removing tin, and when the tin is almost completely removed, the material is located between the blades 18 of the discharge member 20. Therefore, the treated material is discharged to the outside of the discharge member 20 in the same manner as the action of the intake member 12 described above, and is conveyed upwardly by the discharge conveyor 32 through the discharge port 17, and is placed above the electrolytic cell 1, for example. High-pressure air is blown by the air blowing member to blow off the electrolyte adhering to the treated material, and the material is further carried out to the outside of the electrolytic cell 1. This post-treated material is washed with water and dried. The collecting member 12 allows the material to be processed to be smoothly introduced into the rotary drum 2, and even if the amount of material to be processed in the small chamber 13 varies, a fixed amount is fed into the drum as the rotary drum 2 rotates. It has the effect of adding energy to the Further, the discharge member 20 similarly functions to discharge the treated material in fixed amounts. Therefore, a certain amount of treatment material is always present between the income member 12 and the discharge member 20 of the rotating drum 2, that is, the area where electrolysis is effectively performed. The material to be treated from which tin has been removed as described above is subjected to an electrolytic treatment for removing lead using an electrolytic device similar to that described above.
すなわち前記錫除去処理に用いた電解装置と同様な構造
の別の電解装置の電解槽1に濃度2規定以上の水酸化ナ
トリウム水溶液を満たし、この電解装置のホツパ29に
錫除去処理済の多数の被処理材を投入する。前述と同様
にして回転ドラム2を定速度で回転させれば、被処理材
は連続的に回転ドラム2内に取入れられ、陽極35に接
触しながら回転ドラム2内を順次排出口側へ移動する。
したがつて陽極35と陰極36との間の電解電流により
被処理材は水酸化ナトリウム水溶液中電解がなされ、被
処理材表面の鉛が電解除去される。なおこの時、前記硫
酸浴中電解により除去され得なかつた小量の残留錫も電
解除去される。このようにして鉛および残留錫がほぼ完
全に゛除去された時点で回転ドラム2の回転に伴つて該
回転ドラム2から排出され、前記と同様に水切りおよび
水洗、乾燥が施され、ほぼ銅分のみを含有する再生材が
得られる。以上の説明において、各電解処理における回
転ドラム2の傾斜角度aは1解〜10お程度であること
が望ましい。That is, the electrolytic cell 1 of another electrolytic device having the same structure as the electrolytic device used for the tin removal treatment is filled with an aqueous sodium hydroxide solution having a concentration of 2N or more, and the hopper 29 of this electrolytic device is filled with a large number of cells that have been subjected to the tin removal treatment. Inject the material to be treated. When the rotary drum 2 is rotated at a constant speed in the same manner as described above, the material to be treated is continuously taken into the rotary drum 2 and sequentially moves within the rotary drum 2 toward the discharge port side while contacting the anode 35. .
Therefore, the material to be treated is electrolyzed in the sodium hydroxide aqueous solution by the electrolytic current between the anode 35 and the cathode 36, and lead on the surface of the material to be treated is electrolytically removed. At this time, a small amount of residual tin that could not be removed by electrolysis in the sulfuric acid bath is also electrolytically removed. When lead and residual tin have been almost completely removed in this way, they are discharged from the rotary drum 2 as it rotates, and are drained, washed, and dried in the same manner as described above, and almost all copper is removed. A recycled material containing only In the above description, it is desirable that the inclination angle a of the rotating drum 2 in each electrolytic treatment is about 1 to 10 degrees.
1未満では円滑に被処理材が充分に移送されず、また1
0はを越えた場合には回転ドラム2内における被処理材
の滞留時間が短か過ぎ、このため錫および鉛の除去が充
分になされないおそれがある。If it is less than 1, the material to be treated will not be transferred smoothly or sufficiently.
If it exceeds 0, the residence time of the material to be treated in the rotating drum 2 is too short, and therefore tin and lead may not be removed sufficiently.
また回転ドラム2の回転速度は毎分5〜20回転程度に
設定することが望ましい。さらに回転ドラム2内におけ
る被処理材の量は、回転ドラム2の横断面図において被
処理材が30〜70%の面積を占めるように設定するこ
とが望ましい。30%よりも少なければ陽極35と充分
に接触せず、給電に支障を来たし、また70%を越えれ
ば電解(脱錫、脱鉛)に支障を来たすおそれがある。Further, it is desirable that the rotational speed of the rotating drum 2 is set to about 5 to 20 revolutions per minute. Further, it is desirable that the amount of the material to be treated in the rotary drum 2 is set such that the material to be treated occupies 30 to 70% of the area in the cross-sectional view of the rotary drum 2. If it is less than 30%, it will not make sufficient contact with the anode 35, causing problems in power supply, and if it exceeds 70%, it may cause problems in electrolysis (detining, deleading).
次に第1電解処理、すなわち脱錫のための硫酸浴中電解
における電解条件について説明すれば、浴温40℃にお
いて硫酸浴の濃度を変えた場合の電流密度と錫の溶解電
流効率との関係は第4図に示されるようになる。Next, to explain the electrolytic conditions in the first electrolytic treatment, that is, electrolysis in a sulfuric acid bath for detining, the relationship between current density and tin dissolution current efficiency when the concentration of the sulfuric acid bath is changed at a bath temperature of 40°C. is as shown in FIG.
すなわち硫酸濃度が低い程溶解効率は高くなる。したが
つて硫酸濃度は低いことが望ましいが、1規定未満では
絶対的に電流密度を高めることが困難となつて電解の進
行が遅くなるから、1規定以上であることが必要である
。また濃度を高めて6規定を越えた場合には前述のよう
に溶解電流効率が低くなつて経済的ロスが大きくなると
共に排液の酸濃度が高いため排液処理に困難を伴う等の
問題がある。したがつて硫酸濃度は1〜6規定の範囲内
であることが必要である。一方、硫酸濃度4規定におい
て浴温を変化させた場合の電流密度と錫の溶解電流効率
との関係は第5図に示すよう,になる。第5図から明ら
かなように液温は錫の溶解電流効率にほとんど影響しな
いから、液温は任意であれば良い。但し、液温を上昇さ
せれば液抵抗が減少してロスが少なくなる反面、硫酸ミ
ストが発生する問題が生じるから、この両者の兼ね合い
により30〜50℃程度に設定することが望ましい。更
に電解電流の見掛電流密度(被処理材の集合体の表面積
で全電解電流を除いた値。)は、20〜30A/Dm2
の範囲が最適であるが、100A/Dm2以下であれば
良い。100A/Dm2を越える場合には溶解電流効率
が低下し、経済的コストが上昇する問題がある。That is, the lower the sulfuric acid concentration, the higher the dissolution efficiency. Therefore, it is desirable that the sulfuric acid concentration be low, but if it is less than 1N, it will be difficult to absolutely increase the current density and the progress of electrolysis will be slow, so it is necessary to have a concentration of 1N or more. In addition, if the concentration is increased to exceed 6 regulated, as mentioned above, the dissolution current efficiency will decrease, resulting in large economic losses, and the high acid concentration of the effluent will cause problems such as difficulty in treating the effluent. be. Therefore, the sulfuric acid concentration must be within the range of 1 to 6 normal. On the other hand, the relationship between the current density and the tin dissolution current efficiency when the bath temperature is changed at a sulfuric acid concentration of 4 normal is as shown in FIG. As is clear from FIG. 5, the liquid temperature has little effect on the tin dissolution current efficiency, so any liquid temperature may be used. However, if the liquid temperature is raised, the liquid resistance is reduced and the loss is reduced, but on the other hand, there is a problem of generation of sulfuric acid mist, so it is desirable to set the temperature to about 30 to 50°C in consideration of the balance between the two. Furthermore, the apparent current density of the electrolytic current (the value obtained by excluding the total electrolytic current by the surface area of the aggregate of the treated material) is 20 to 30 A/Dm2.
The optimum range is 100 A/Dm2 or less. When it exceeds 100 A/Dm2, there is a problem that the dissolution current efficiency decreases and the economic cost increases.
また第2電解処理、すなわち脱鉛のための水酸化ナトリ
ウム水溶液浴中電解における電解条件について説明すれ
ば、水酸化ナトリウム水溶液浴の電解においては、前述
の硫酸浴中電解と異なり、電解電圧が溶解効率に大きな
影響を与え、特に3Vを越えた場合には急激に溶解効率
が低下するから、3V以下に抑える必要がある。また電
解時における鉛の酸化の問題を考慮すれば2V程度にす
ることが望ましい。また水酸化ナトリウム水溶液の規定
濃度は、2規定以上であることが必要であり、上限は8
規定程度にすべきである。特に2規定未満の場合には、
温度条件によつて溶解電流効率が低下する問題がある。
2〜8規定で変化させた場合における溶解電流効率と電
流密度との関係を第6図に示す。Also, to explain the electrolytic conditions in the second electrolytic treatment, that is, electrolysis in a sodium hydroxide aqueous solution bath for deleading, in the electrolysis in a sodium hydroxide aqueous solution bath, unlike the aforementioned electrolysis in a sulfuric acid bath, the electrolytic voltage is It has a great effect on efficiency, especially if it exceeds 3V, the dissolution efficiency decreases rapidly, so it is necessary to keep it below 3V. Further, considering the problem of lead oxidation during electrolysis, it is desirable to set the voltage to about 2V. In addition, the specified concentration of the sodium hydroxide aqueous solution must be 2N or higher, and the upper limit is 8N.
It should be within the prescribed range. Especially if it is less than 2 regulations,
There is a problem that the dissolution current efficiency decreases depending on the temperature conditions.
FIG. 6 shows the relationship between dissolution current efficiency and current density when the current density is varied between 2 and 8 normal.
また、水酸化ナトリウム水溶液浴の温度を変えた場合に
おける溶解電流効率と電流密度との開係を第7図に示す
。第7図から明らかなように温度は40〜50℃程度が
最適であるが、20℃あれば良い。また温度が80℃以
上になれば液の蒸発の問題が生じるから、80℃以上に
することは問題がある。さらに電解電流の電流密度は任
意であるが、30A/Dm2程度までがよい。なおこの
発明は、一部に半田メツキを施した錫メツキ銅材の他、
半田が単に附着した錫メツキ銅材、半田メツキされた銅
材、半田が附着した銅材、鉛および錫の2層のメツキが
施された銅材等に適用可能であり、かつまた銅材や錫メ
ツキ銅材に半田片や鉛片が混入された混合材料、あるい
は前述の2種以上のものの混合材料等にも適用可能であ
り、要は鉛および錫をそのままの形または合金された状
態(半田)で含む銅材に適用可能である。Further, FIG. 7 shows the relationship between dissolution current efficiency and current density when the temperature of the sodium hydroxide aqueous solution bath is changed. As is clear from FIG. 7, the optimal temperature is about 40 to 50°C, but 20°C is sufficient. Furthermore, if the temperature exceeds 80°C, the problem of liquid evaporation will occur, so setting the temperature above 80°C is problematic. Furthermore, although the current density of the electrolytic current is arbitrary, it is preferably up to about 30 A/Dm2. In addition to the tin-plated copper material which is partially solder-plated,
It can be applied to tin-plated copper materials to which solder is simply attached, solder-plated copper materials, copper materials to which solder is attached, copper materials with two layers of lead and tin plating, etc. It can also be applied to mixed materials such as tin-plated copper mixed with solder pieces or lead pieces, or mixed materials of two or more of the above-mentioned materials. Applicable to copper materials including solder).
以下に、錫が1560ppI1、鉛300ppmが附着
している5〜15mm程度の粉砕錫メツキ銅線について
硫酸浴電解および水酸化ナトリウム水溶液電解を行つた
結果を記す。第1段階の硫酸浴電解を、硫酸濃度2規定
、浴液20℃、電流密度8A/Dm2、対極にSUS3
O4を使用して実施したところ、第8図に示すように錫
は10分以内に急激に除去される反面、鉛はほとんど除
去されず、14分以上ではほとんど変化しなかつた。ま
た14分間硫酸浴電解を行つた処理材について、第2段
階の水酸化ナトリウム水溶液浴電解を、水酸化ナトリウ
ム濃度6規定、浴温60℃、対極SUS3O42V定電
圧なる電解条件で実施したところ、第9図に示すように
鉛は20分程度で30ppm以下に減少し、また前記硫
酸浴中電解において残留した錫(約70pprn)は1
0分程度で10ppm以下に減少することを確認した。
以上の説明で明らかなように、この発明によれば端末半
田付作業あるいは半田メツキ等により半田や鉛が附着し
ている短尺な錫メツキ銅材や半田メツキ銅材から錫およ
び鉛を容易に除去することができ、また傾斜させた回転
ドラムを用いることにより連続的に高能率かつ低コスト
で錫および鉛の除去処理を行うことができる。The following describes the results of sulfuric acid bath electrolysis and sodium hydroxide aqueous solution electrolysis performed on a crushed tin-plated copper wire of about 5 to 15 mm with 1560 ppI1 of tin and 300 ppm of lead attached. The first stage of sulfuric acid bath electrolysis was carried out at a sulfuric acid concentration of 2N, a bath solution of 20°C, a current density of 8A/Dm2, and a SUS3 counter electrode.
When carried out using O4, as shown in FIG. 8, tin was rapidly removed within 10 minutes, while lead was hardly removed, and there was almost no change after 14 minutes. In addition, for the treated material that had been subjected to sulfuric acid bath electrolysis for 14 minutes, the second stage of sodium hydroxide aqueous solution bath electrolysis was carried out under the electrolysis conditions of sodium hydroxide concentration of 6N, bath temperature of 60℃, and constant voltage of SUS3O42V counter electrode. As shown in Figure 9, lead decreased to 30 ppm or less in about 20 minutes, and tin (about 70 pprn) remaining during the electrolysis in the sulfuric acid bath decreased to 1.
It was confirmed that the concentration decreased to 10 ppm or less in about 0 minutes.
As is clear from the above explanation, according to the present invention, tin and lead can be easily removed from short tin-plated copper materials or solder-plated copper materials to which solder and lead are attached by terminal soldering work or solder plating. Furthermore, by using an inclined rotating drum, tin and lead can be continuously removed with high efficiency and low cost.
第1図はこの発明に使用する電解装置の一例を示す縦断
面図、第2図は第1図の−線における断面図、第3図は
第1図の装置に使用される回転ドラムの要部を示す拡大
切欠斜視図、第4図から第7図まではそれぞれ諸条件を
変えた場合の電流密度と溶解電流効率との関係を示す図
、第8図および第9図は錫、鉛の除去状態を電解時間と
対応して示すグラフである。
1・・・・・・電解槽、2・・・・・・回転ドラム、3
・・・・・・透孔、9・・・・・・投入口、17・・・
・・・排出口。FIG. 1 is a longitudinal sectional view showing an example of an electrolytic device used in the present invention, FIG. 2 is a sectional view taken along the - line in FIG. Figures 4 to 7 are diagrams showing the relationship between current density and melting current efficiency when various conditions are changed, and Figures 8 and 9 are diagrams showing the relationship between tin and lead. It is a graph showing the removal state in correspondence with the electrolysis time. 1... Electrolytic cell, 2... Rotating drum, 3
...Through hole, 9...Input port, 17...
···Vent.
Claims (1)
供給する投入口を一端に形成すると共に他端には排出口
形成されかつ外周面を電解液が自由に通過できるように
構成した中空円筒状の絶縁材料からなる回転ドラムを、
その軸線が前記投入口から排出口へ向けて傾斜可能とな
るように電解槽内に配設し、前記回転ドラム内に陽極を
挿入すると共に回転ドラム外に陰極を配置してなる電解
装置を用い、前記電解装置には濃度1〜6規定の硫酸を
満しこの中で前記回転ドラムを回転しつつドラム内に投
入口から短尺の前記メッキ銅材料を連続的に投入し、1
00A/dm^2以下の見掛電流密度で電解してまず錫
を除去し、続いてこの錫を除去した銅材料を、前記電解
装置中に或いは同様の構造の別の電解装置中に満した濃
度2規定以上の水酸化ナトリウム液中に於いて、3V以
下の電解電圧で連続的に電解して鉛を除去しつつ回転ド
ラムの排出口から取り出すことを特徴とする半田、鉛を
含む錫メッキ或いは半田メッキ銅材料の処理方法。1. A hollow cylindrical shape having an input port for supplying solder, lead-containing tin plating or solder plating copper material at one end, and a discharge port at the other end so that the electrolyte can freely pass through the outer circumferential surface. A rotating drum made of insulating material,
An electrolytic device is used, which is arranged in an electrolytic cell so that its axis can be tilted from the input port to the discharge port, an anode is inserted into the rotating drum, and a cathode is arranged outside the rotating drum. , the electrolyzer is filled with sulfuric acid with a concentration of 1 to 6 normal, and while the rotary drum is being rotated, the short pieces of the plated copper material are continuously introduced into the drum from the inlet;
First, tin was removed by electrolysis at an apparent current density of 00 A/dm^2 or less, and then the copper material from which the tin was removed was filled into the electrolytic device or another electrolytic device with a similar structure. Solder and tin plating containing lead, which are characterized by being continuously electrolyzed at an electrolytic voltage of 3 V or less in a sodium hydroxide solution with a concentration of 2 or higher to remove lead while being removed from the discharge port of a rotating drum. Or a method for processing solder-plated copper materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5849877A JPS5933200B2 (en) | 1977-05-20 | 1977-05-20 | Processing method for plating copper material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5849877A JPS5933200B2 (en) | 1977-05-20 | 1977-05-20 | Processing method for plating copper material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53142926A JPS53142926A (en) | 1978-12-13 |
| JPS5933200B2 true JPS5933200B2 (en) | 1984-08-14 |
Family
ID=13086076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5849877A Expired JPS5933200B2 (en) | 1977-05-20 | 1977-05-20 | Processing method for plating copper material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933200B2 (en) |
-
1977
- 1977-05-20 JP JP5849877A patent/JPS5933200B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53142926A (en) | 1978-12-13 |
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