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JPS5933476B2 - How to inspect the cutting condition - Google Patents
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JPS5933476B2 - How to inspect the cutting condition - Google Patents

How to inspect the cutting condition

Info

Publication number
JPS5933476B2
JPS5933476B2 JP56148730A JP14873081A JPS5933476B2 JP S5933476 B2 JPS5933476 B2 JP S5933476B2 JP 56148730 A JP56148730 A JP 56148730A JP 14873081 A JP14873081 A JP 14873081A JP S5933476 B2 JPS5933476 B2 JP S5933476B2
Authority
JP
Japan
Prior art keywords
cutting
metal plate
workpiece
sensor
sensors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56148730A
Other languages
Japanese (ja)
Other versions
JPS5850190A (en
Inventor
義雄 山根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP56148730A priority Critical patent/JPS5933476B2/en
Publication of JPS5850190A publication Critical patent/JPS5850190A/en
Publication of JPS5933476B2 publication Critical patent/JPS5933476B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 この発明は、レーザービーム等を用いた切断における切
断状態の検査方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for inspecting the state of cutting in cutting using a laser beam or the like.

。従来のこの種の検査方法について第1図Aおよび第1
図Bを用いて説明する。第1図A、Bにおいて、1は切
断用のビームであるレーザービーム、2は被加工物の金
属板、3はレーザービーム1により加熱溶融され、ガス
噴射ノズル5よりの高速 。流ガスによつて吹き飛ばさ
れたスパッタ、4はフォトダイオード又は太陽電池等の
フォトセンサである。第1図Aではセンサ4を金属板2
の裏側のみに、また第1図Bでは表側のみに配設した状
態を示している。次に、動作について説明する。
. Regarding the conventional inspection method of this kind, Figure 1A and Figure 1
This will be explained using Figure B. In FIGS. 1A and 1B, 1 is a laser beam for cutting, 2 is a metal plate to be processed, and 3 is heated and melted by the laser beam 1 at a high speed from a gas injection nozzle 5. Spatter blown away by the flowing gas, 4 is a photosensor such as a photodiode or a solar cell. In Fig. 1A, the sensor 4 is connected to the metal plate 2.
Figure 1B shows a state in which it is disposed only on the back side, and only on the front side in Fig. 1B. Next, the operation will be explained.

第1図A、Bに示した状態では、レーザービーム1をワ
ーク2に照射することにより、加熱溶融された金属が噴
射ノズル5よりのガス流によつてスパッタ3として金属
板2から分離され、金属板2の切断が達成される。ここ
で第1図Aに示した状態では、金属板2に対し下方に配
置されたフォトセンサ4により、スパッタ3の発する光
の量を測定している。また、第1図Bに示した状態は、
フォトセンサ4を金属板2に対して上方に配置した場合
であり、金属板2表面上の溶融金属の放つ光の量を測定
することになる。従来の切断状態の検査方法は以上のよ
うにして行なつているので、第1図Aに示される方式で
はスパッタ3の量、また第1図Bに示される方式では金
属板2表面での溶融金属の量のみ検出測定しているので
、切断状態を検査するためには不十分であり、完全な検
査をするにはデータとして不十分であり、検査方法とし
て適当でないという問題があつた。
In the state shown in FIGS. 1A and 1B, by irradiating the workpiece 2 with the laser beam 1, the heated and melted metal is separated from the metal plate 2 as spatter 3 by the gas flow from the injection nozzle 5. Cutting of the metal plate 2 is achieved. In the state shown in FIG. 1A, the amount of light emitted by the sputter 3 is measured by the photosensor 4 placed below the metal plate 2. In addition, the state shown in FIG. 1B is
This is a case where the photosensor 4 is placed above the metal plate 2, and the amount of light emitted by the molten metal on the surface of the metal plate 2 is measured. Since the conventional cutting state inspection method is performed as described above, the method shown in FIG. 1A measures the amount of spatter 3, and the method shown in FIG. Since only the amount of metal is detected and measured, it is insufficient for inspecting the state of cutting, and the data is insufficient for complete inspection, so there are problems in that it is not suitable as an inspection method.

この発明は上記のような欠点を除去するためになされた
ものであり、光または温度を検知するセンサを被加工物
の表側と裏側の適正な位置に複数個設置し上記センサ出
力信号を同時に観測することにより、精度のよい検査が
行なえる切断状態の検査方法を提供することを目的とし
ている。
This invention was made to eliminate the above-mentioned drawbacks, and it involves installing a plurality of sensors that detect light or temperature at appropriate positions on the front and back sides of the workpiece, and simultaneously observing the sensor output signals. The purpose of the present invention is to provide a cutting state inspection method that allows highly accurate inspection.

以下この発明の一実施例を図について説明する、、第2
図はこの発明の一実施例を示し、図において、4aは金
属板2の上方に配置され、表面上の溶融金属より発生す
る光の量を検出するための指向性のすぐれたフォトセン
サ、4b〜4dは金属板2の下方、即ち裏側に所定の間
隔で配列され、フオセンサ4aと同様に指向性のすぐれ
た特性を持つフォトセンサである。なお、第1図と同一
または相当部分は同一符号を付してある。また、第3図
は、各々のフオトセンサ出力の時間的推移を示す。次に
第2図の実施例装置の動作について説明する。一般に、
金属板をレーザー等により切断する際に、金属板下方に
飛び散るスパツタは指向性を有することが知られている
。このスパツタ飛散の指向性は、板厚により若干異なる
が、2〜3m7!L程度の薄板の場合、切断巾が狭く、
しかも金属板裏面へのドロース付着が少なくなるような
いわゆる良好な切断品質が得られる切断を行なつた際は
、スパツタの大半がなす飛散角度は10度を超えない。
また、金属板裏面のドロース付着が多くなるようないわ
ゆる悪い品質状態になるような切断を行なつた際は、ス
パツタの飛散する角度が極端に広がる傾向がある。この
特徴を利用し、金属板の上方、即ちビームが照射される
表側、および下方、即ち裏側に、第2図に示されるよう
に、指向性のすぐれたフオトセンサを配列させ、金属板
のレーザ切断を行なつた際のフオトセンサ出力をシンク
ロスコープ等を用いて観測した場合の各々の時間推移を
第3図に示す。ここで、第2図中、フオトセンサ4cは
レーザービーム1軸直下より適当な距離を保つと共に、
レーザービーム軸を臨む位置に設定されるものとし、金
属板溶融部とビーム軸に対するフオトセンサ4bおよび
4dのなす角度θ1,θ2はそれぞれ30度以内に設定
まることが望ましい。第3図において、時間0の時点で
レーザービームの照射が開始され、金属板2の表面を加
熱溶融し始める。
An embodiment of the present invention will be explained below with reference to the figures.Second
The figure shows one embodiment of the present invention, in which 4a is placed above the metal plate 2 and has a highly directional photosensor 4b for detecting the amount of light generated from the molten metal on the surface; 4d are photosensors that are arranged at predetermined intervals below the metal plate 2, that is, on the back side, and have excellent directivity characteristics like the photosensor 4a. Note that the same or corresponding parts as in FIG. 1 are given the same reference numerals. Moreover, FIG. 3 shows the time course of the output of each photo sensor. Next, the operation of the embodiment apparatus shown in FIG. 2 will be explained. in general,
It is known that when a metal plate is cut with a laser or the like, the spatter scattered below the metal plate has directionality. The directionality of this spatter scatters varies slightly depending on the board thickness, but it is 2 to 3 m7! In the case of a thin plate of about L size, the cutting width is narrow,
Moreover, when cutting is performed to obtain so-called good cutting quality, such as less dross adhering to the back surface of the metal plate, the scattering angle of most of the spatters does not exceed 10 degrees.
Furthermore, when cutting is performed in a manner that results in a so-called poor quality state in which a large amount of dross adheres to the back surface of a metal plate, the angle at which spatter is scattered tends to become extremely wide. Utilizing this feature, photo sensors with excellent directivity are arranged above the metal plate, that is, on the front side where the beam is irradiated, and below, that is, on the back side, as shown in Figure 2, and the metal plate is laser cut. FIG. 3 shows the time course of each photo sensor output observed using a synchroscope or the like. Here, in FIG. 2, the photo sensor 4c is kept at an appropriate distance from directly below the axis of the laser beam, and
The angles θ1 and θ2 formed by the photo sensors 4b and 4d with respect to the fused portion of the metal plate and the beam axis are desirably set within 30 degrees, respectively. In FIG. 3, irradiation of the laser beam is started at time 0, and the surface of the metal plate 2 begins to be heated and melted.

この時、金属板2の上方に配置されたフオトセンサ4a
の出力は、急激に上昇し始め、溶融金属が金属板2裏側
へスパツタとして飛散すると同時に急激に下降する。次
にスパツタ3の飛散が行なわれると、フオトセンサ4b
〜4dはスパツタよりの光を検出し、その出力が上昇す
る。その後、金属板2を所定の速度で移動させると、所
定の時間経過後夫々のフオトセンサ4a〜4dの出力は
安定する。ここで、フオトセンサ4aの出力が最も低く
維持され、且つフオトセンサ4cの出力がフオトセンサ
4b,4dの出力よりも高く、しかも両者の差δが最大
の時に良好な切断品質が得られることになる。このよう
に金属板の表側と裏側の適切な位置に配設された複数個
のフオトセンサの出力を同時に観測することにより、高
精度に切断状態を検査することができる。なお、上記実
施例では、切断用のビームとしてレーザービーム1を用
いて加工する場合を例示したが、プラズマやガスを用い
で切断する場合にもこの発明の検査方法は適用でき、上
述の実施例と同様の効果を奏する。
At this time, the photo sensor 4a placed above the metal plate 2
The output of the molten metal begins to rise rapidly, and at the same time as the molten metal scatters as spatters to the back side of the metal plate 2, the output suddenly falls. Next, when the spatter 3 is scattered, the photo sensor 4b
~4d detects the light from the spatter, and its output increases. Thereafter, when the metal plate 2 is moved at a predetermined speed, the outputs of the respective photo sensors 4a to 4d become stable after a predetermined time has elapsed. Here, good cutting quality can be obtained when the output of the photo sensor 4a is maintained at the lowest level, the output of the photo sensor 4c is higher than the outputs of the photo sensors 4b and 4d, and the difference δ between the two is maximum. By simultaneously observing the outputs of a plurality of photo sensors disposed at appropriate positions on the front and back sides of the metal plate in this manner, the cutting state can be inspected with high precision. In addition, in the above-mentioned embodiment, the case where the processing is performed using the laser beam 1 as the cutting beam is illustrated, but the inspection method of the present invention can also be applied to the case where cutting is performed using plasma or gas, and the above-mentioned embodiment It has the same effect as.

また、上述の実施例では、フオトセンサを金属板のビー
ム照射側に1個、金属板の裏側に3個用いた場合につい
て説明したが、これらのフオトセンサは少なくとも表側
に1個、裏側に2個あればよい。さらに、フオトセンサ
のかわりに非接触式温度計などを用いてもさしつかえな
い。以上のように、この発明によれば、センサを金属板
のビーム照射側の適切な位置に少なくとも1個配置させ
、しかも金属板の裏側の適切な位置に少なくとも2個配
設し、これらのセンサの出力をシンクロスコープ等を用
いて同時に観測するように構成したので、従来法に比べ
切断状態を一層正確に検査することができるという効果
を有する。
Furthermore, in the above embodiment, one photo sensor was used on the beam irradiation side of the metal plate and three photo sensors were used on the back side of the metal plate, but it is also possible to use at least one photo sensor on the front side and two photo sensors on the back side. Bye. Furthermore, a non-contact thermometer or the like may be used instead of the photo sensor. As described above, according to the present invention, at least one sensor is arranged at an appropriate position on the beam irradiation side of the metal plate, and at least two sensors are arranged at appropriate positions on the back side of the metal plate, and these sensors are arranged at appropriate positions on the back side of the metal plate. The present invention is configured so that the outputs of the two are simultaneously observed using a synchroscope or the like, so the cutting state can be inspected more accurately than the conventional method.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aおよび第1図Bは従来の検査方法を説明するた
めの模式断面図、第2図はこの発明の一実施例による検
査方法を説明するための模式断面図、第3図は第2図に
示した実施例におけるセンサの出力波形図である。 図中、同一または相当部分には同一符号を付してある。 1・・・・・・ビーム、2・・・・・・被加工物、4a
〜4d・・・・・・センサ。
1A and 1B are schematic cross-sectional views for explaining a conventional inspection method, FIG. 2 is a schematic cross-sectional view for explaining an inspection method according to an embodiment of the present invention, and FIG. FIG. 2 is an output waveform diagram of the sensor in the embodiment shown in FIG. 2; In the drawings, the same or corresponding parts are denoted by the same reference numerals. 1... Beam, 2... Workpiece, 4a
~4d...Sensor.

Claims (1)

【特許請求の範囲】 1 被加工物の切断予定線に沿つて切断用のビームを照
射し、光または温度を検知するセンサを上記ビームが照
射される上記被加工物の表面の適切な位置に少なくとも
1個と、上記被加工物の裏面の適切な位置に少なくとも
2個を配設し、上記複数のセンサの出力信号を同時に観
測することにより上記被加工物の切断状態を検査するこ
とを特徴とする切断状態の検査方法。 2 切断用のビームとしてレーザービームを用いたこと
を特徴とする特許請求の範囲第1項記載の切断状態の検
査方法。 3 被加工物の裏面に配設されるセンサを切断予定線の
延長線上から30°以内に配設したことを特徴とする特
許請求の範囲第1項または第2項記載の切断状態の検査
方法。
[Claims] 1. A cutting beam is irradiated along the planned cutting line of the workpiece, and a sensor that detects light or temperature is placed at an appropriate position on the surface of the workpiece that is irradiated with the beam. At least one sensor and at least two sensors are disposed at appropriate positions on the back surface of the workpiece, and the cutting state of the workpiece is inspected by simultaneously observing the output signals of the plurality of sensors. A method for inspecting cutting conditions. 2. The cutting state inspection method according to claim 1, characterized in that a laser beam is used as the cutting beam. 3. A cutting state inspection method according to claim 1 or 2, characterized in that the sensor disposed on the back surface of the workpiece is disposed within 30 degrees from the extension line of the planned cutting line. .
JP56148730A 1981-09-22 1981-09-22 How to inspect the cutting condition Expired JPS5933476B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56148730A JPS5933476B2 (en) 1981-09-22 1981-09-22 How to inspect the cutting condition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56148730A JPS5933476B2 (en) 1981-09-22 1981-09-22 How to inspect the cutting condition

Publications (2)

Publication Number Publication Date
JPS5850190A JPS5850190A (en) 1983-03-24
JPS5933476B2 true JPS5933476B2 (en) 1984-08-16

Family

ID=15459319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56148730A Expired JPS5933476B2 (en) 1981-09-22 1981-09-22 How to inspect the cutting condition

Country Status (1)

Country Link
JP (1) JPS5933476B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296980A (en) * 1985-06-25 1986-12-27 Toshiba Corp Inspecting method for processing
US5063280A (en) * 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
JPH03174993A (en) * 1989-12-02 1991-07-30 Yamazaki Mazak Corp Instrument for detecting completion of piercing in laser beam machining apparatus
US5589090A (en) * 1994-01-31 1996-12-31 Song; Byung-Jun Laser cutting apparatus with means for measuring cutting groove width

Also Published As

Publication number Publication date
JPS5850190A (en) 1983-03-24

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