JPS5934460B2 - Resin model for microwave heating - Google Patents
Resin model for microwave heatingInfo
- Publication number
- JPS5934460B2 JPS5934460B2 JP3941577A JP3941577A JPS5934460B2 JP S5934460 B2 JPS5934460 B2 JP S5934460B2 JP 3941577 A JP3941577 A JP 3941577A JP 3941577 A JP3941577 A JP 3941577A JP S5934460 B2 JPS5934460 B2 JP S5934460B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- model
- microwave heating
- resins
- resin model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 title claims description 26
- 239000011347 resin Substances 0.000 title claims description 26
- 238000010438 heat treatment Methods 0.000 title claims description 6
- 239000000126 substance Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000002345 surface coating layer Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003110 molding sand Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920006298 saran Polymers 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Constitution Of High-Frequency Heating (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
【発明の詳細な説明】
本発明はマイクロ波加熱によつて硬化させる鋳造用鋳型
を成形するための模型に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a model for forming a casting mold which is hardened by microwave heating.
従来、各種の造型法に用いられて来た模型は木型や金型
が主体であつた。Traditionally, the models used in various molding methods have mainly been wooden molds and metal molds.
ところが近年、マイクロ波加熱装置が家庭用電子レンジ
として普及したことにより低価格となり、それを各種の
造型法に応用することで造型速度を向上させる試みがな
されているが、木型や金型では次に述べる欠点があつて
使用できないことが明らかとなつた。すなわち、木型は
比誘電率、損失係数が大きく、マイクロ波を吸収して過
熱し変形する欠点があり、金型はマイクロ波を反射する
性質があり、マイクロ波が金型中の鋳物砂まで到達しな
いため加熱されない欠点があつた。マイクロ波加熱時に
このような欠点のない模型を提供すべく本発明者等は研
究を重ねた結果、樹脂に無機物又は有機物の微小中空体
を添加することにより、該樹脂を多孔状とし、この樹脂
を模型の内部材質として用いれば上記の目的を達成でき
ることを見出して本発明に到達したものである。However, in recent years, as microwave heating devices have become popular as household microwave ovens, they have become cheaper, and attempts have been made to improve molding speed by applying them to various molding methods, but wooden molds and metal molds It has become clear that the method cannot be used due to the following drawbacks. In other words, wooden molds have a large dielectric constant and loss coefficient, and have the disadvantage of absorbing microwaves and overheating and deforming.Molds have the property of reflecting microwaves, and microwaves can reach the molding sand in the mold. There was a drawback that it could not be heated because it could not reach the target temperature. In order to provide a model that does not have such defects during microwave heating, the inventors of the present invention have conducted repeated research. By adding microscopic hollow bodies of inorganic or organic matter to the resin, the resin is made porous. The present invention was achieved by discovering that the above object could be achieved by using the material as the internal material of the model.
添付図面は本発明の模型を示す縦断面図である。図にお
いて、1は多孔状樹脂模型を、2はその表面コーテング
層を示す。発泡樹脂模型のベースレジンとしては、注型
用として、ポリエステル系樹脂、ポリウレタン系樹脂、
シリコーン系樹脂、ポリスチレン系樹脂、エポキシ系樹
脂、ポリイミド系樹脂、フェノール系樹脂、アクリル系
樹脂などがあり、これらは、後述する微小中空体を添加
して、所定の形状を持つた型に流し込んで常温放置、あ
るいは加熱して縮合させる。The accompanying drawing is a longitudinal sectional view showing a model of the present invention. In the figure, 1 indicates a porous resin model, and 2 indicates its surface coating layer. Base resins for foamed resin models include polyester resins, polyurethane resins,
There are silicone resins, polystyrene resins, epoxy resins, polyimide resins, phenolic resins, acrylic resins, etc. These resins are made by adding micro hollow bodies (described later) and pouring them into a mold with a predetermined shape. Leave at room temperature or heat to condense.
又、射出成形、押出成形、トランスファー成形などで、
所定の形状もしくは素材を得る場合には、前述した注型
用レジンの他に、ポリプロピレン、ポリエチレン、フッ
素樹脂、繊維素誘導体、尿素樹脂、メラミン樹脂、アニ
リン樹脂、キシレン樹脂、ジアリル樹脂などに微小中空
体を添加して成形する。次に、微小中空体について述べ
る。In addition, injection molding, extrusion molding, transfer molding, etc.
In order to obtain a predetermined shape or material, in addition to the above-mentioned casting resin, micro-hollows can be used in polypropylene, polyethylene, fluororesin, cellulose derivatives, urea resin, melamine resin, aniline resin, xylene resin, diallyl resin, etc. Add body and shape. Next, we will discuss micro hollow bodies.
微小中空体とは外径がミクロンのオーダーで薄い隔壁か
らなる単細胞の中空球体である。Microhollow bodies are single-cell hollow spheres with an outer diameter on the order of microns and consisting of thin septa.
その種類は、無機物、有機物、金属に大別されるが、本
発明では、無機物及び有機物のものを使用する。無機物
としてはアルミナ、シリカ、ジルコニア、マグネシア、
ガラス、シラス、フライアッシュ、カーボン、けい酸ナ
トリウムなどがあり、有機物としては、エポキシ樹脂、
ポリウレタン、サラン、ポリスチレン、フェノール樹脂
、ポリアミドなどがある。次に表面コーティング層2に
ついて説明する。The types are broadly classified into inorganic materials, organic materials, and metals, and in the present invention, inorganic materials and organic materials are used. Inorganic substances include alumina, silica, zirconia, magnesia,
There are glass, shirasu, fly ash, carbon, sodium silicate, etc. Organic substances include epoxy resin,
Examples include polyurethane, saran, polystyrene, phenolic resin, and polyamide. Next, the surface coating layer 2 will be explained.
この表面コーテイング層2は必須のものではなく、必要
に応じて適宜設ければよい。表面コーテイング層として
は、溶剤形若しくは無溶剤形のワニス及び塗料を使用す
る。前者に属するものとしては、セラツク、油性アスフ
アルト系、フエノール樹脂系、アルキド系、エポキシ系
、ジフエニルエーテル系、シリコーン系のものがあり、
後者に属するものとしてポリエステル、エポキシ、ウレ
タン、シリコーン、ポリイミドがある。塗布方法は、一
般に行なわれているスプレーコーテイング若しくは、含
浸コーテイングによる。以下、本発明の応用例について
述べる。This surface coating layer 2 is not essential and may be provided as appropriate. As the surface coating layer, solvent-based or non-solvent-based varnishes and paints are used. Those belonging to the former include shellac, oil-based asphalt, phenolic resin, alkyd, epoxy, diphenyl ether, and silicone.
Those belonging to the latter include polyester, epoxy, urethane, silicone, and polyimide. The coating method is generally performed by spray coating or impregnation coating. Application examples of the present invention will be described below.
第1表に、代表的な配合組成を示し、以下その詳細につ
いて述べる。Table 1 shows typical formulations, and the details will be described below.
例
この例はエポキシ樹脂をベースレジンとし、シラスバル
ーンを用いて多孔性とした樹脂模型である。Example This example is a resin model using epoxy resin as the base resin and making it porous using Shirasu balloons.
これは、非常に優れた耐熱性を有する。エポキシ樹脂1
00部を60℃前後に温め、これに硬化剤75部を混合
する。これに微小中空体としてシラスバルーン(商品名
)15部を加える。この配合物を所定の形状を持つた石
膏型に流し込み、そのまま80℃前後に保つてゲル化さ
せる。ゲル化後、更に、200℃前後で16時間程度加
熱することにより0.85g/Crltのみかけ比重を
持つた多孔状樹脂が得られる。得られた多孔状樹脂の表
面は非常に優れた安定性を持つており、表面コーテイン
グは不要であつた。以上述べた本発明樹脂模型の効果は
、特に中子取りに用いた場合に顕著である。It has very good heat resistance. Epoxy resin 1
00 parts is heated to around 60° C., and 75 parts of a curing agent are mixed therein. To this, 15 parts of Shirasu Balloon (trade name) is added as a micro hollow body. This mixture is poured into a plaster mold with a predetermined shape and kept at around 80°C to gel. After gelation, a porous resin having an apparent specific gravity of 0.85 g/Crlt is obtained by further heating at around 200° C. for about 16 hours. The surface of the porous resin obtained had excellent stability and no surface coating was required. The effects of the resin model of the present invention described above are particularly remarkable when used for core removal.
すなわち、木型、金型と異り誘電損失係数が低い樹脂や
無機物を成形材料とし、しかも、内部が微小中空体によ
り多孔状としているため、従来の内部が中実の樹脂模型
と比較してマイクロ波照射による型温度の上昇が、樹脂
模型の比重に比例して軽減される。従つて、木型、金型
では困難であつた鋳物砂を模型に充填したままマイクロ
波を照射して硬化させることができ、しかも、内部が中
実の樹脂模型より、マイクロ波エネルギの損失が少ない
ため、より多くのエネルギが鋳物砂(粘結剤)に吸収さ
れて速やかに発熱して硬化する。更に、模型に吸収され
るエネルギーが、本発明模型は内部が中実の樹脂模型と
比較して少ないため、型温上昇による模型の亀裂や変形
を生じにくい利点がある。また、模型と接した部分は、
模型の優れた断熱効果のため、熱損失が少なく鋳物砂は
均一に加熱される。その他、加工性の向上、樹脂の節約
による模型費の低減および重量の軽減、振動や衝撃の吸
収など機械性質の向上などの効果がある。In other words, unlike wooden molds and molds, the molding material is resin or inorganic material with a low dielectric loss coefficient, and the inside is porous due to micro hollow bodies, so compared to conventional resin models with solid insides. The rise in mold temperature due to microwave irradiation is reduced in proportion to the specific gravity of the resin model. Therefore, it is possible to harden the molding sand by irradiating it with microwaves while the mold is filled with molding sand, which is difficult to do with wooden molds or metal molds.Moreover, the loss of microwave energy is lower than that of resin models with solid interiors. Because it is less, more energy is absorbed by the foundry sand (binder), which quickly generates heat and hardens. Furthermore, since the model of the present invention absorbs less energy than a resin model having a solid interior, it has the advantage that the model is less likely to crack or deform due to an increase in mold temperature. In addition, the parts in contact with the model are
Due to the excellent insulation effect of the model, there is little heat loss and the foundry sand is heated evenly. Other effects include improved workability, reduced model costs and weight by saving resin, and improved mechanical properties such as vibration and shock absorption.
添付の図は本発明模型の一実施態様例の断面を示す。 The attached figure shows a cross section of an embodiment of the model according to the invention.
Claims (1)
とにより、該樹脂を多孔状とし、この多孔状樹脂を内部
構造として有することを特徴とするマイクロ波加熱用樹
脂模型。1. A resin model for microwave heating, characterized in that the resin is made porous by adding microscopic hollow bodies of an inorganic or organic substance to the resin, and has this porous resin as an internal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3941577A JPS5934460B2 (en) | 1977-04-08 | 1977-04-08 | Resin model for microwave heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3941577A JPS5934460B2 (en) | 1977-04-08 | 1977-04-08 | Resin model for microwave heating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53125227A JPS53125227A (en) | 1978-11-01 |
| JPS5934460B2 true JPS5934460B2 (en) | 1984-08-22 |
Family
ID=12552342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3941577A Expired JPS5934460B2 (en) | 1977-04-08 | 1977-04-08 | Resin model for microwave heating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5934460B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956942A (en) * | 1982-09-28 | 1984-04-02 | Komatsu Ltd | Microwave heating hardening mold model |
| JPS60255233A (en) * | 1984-05-29 | 1985-12-16 | Enshu Cloth Kk | Pseudo casting pattern |
| JPS60255234A (en) * | 1984-05-31 | 1985-12-16 | Toyota Motor Corp | Working method of full mold pattern material for casting |
| JPS6122243U (en) * | 1984-07-13 | 1986-02-08 | 新東工業株式会社 | casting model |
| US20070204967A1 (en) * | 2004-01-23 | 2007-09-06 | Shonan Design Co., Ltd. | Method of Smoothing Surface and Process of Lost Wax Precious Casting with Resin Model Having Its Surface Smoothing by the Method |
-
1977
- 1977-04-08 JP JP3941577A patent/JPS5934460B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53125227A (en) | 1978-11-01 |
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