JPS5937034B2 - Adhesive composition for PVC/steel plates - Google Patents
Adhesive composition for PVC/steel platesInfo
- Publication number
- JPS5937034B2 JPS5937034B2 JP16678979A JP16678979A JPS5937034B2 JP S5937034 B2 JPS5937034 B2 JP S5937034B2 JP 16678979 A JP16678979 A JP 16678979A JP 16678979 A JP16678979 A JP 16678979A JP S5937034 B2 JPS5937034 B2 JP S5937034B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- type epoxy
- parts
- pvc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001070 adhesive effect Effects 0.000 title claims description 23
- 239000000853 adhesive Substances 0.000 title claims description 22
- 229910000831 Steel Inorganic materials 0.000 title claims description 18
- 239000010959 steel Substances 0.000 title claims description 18
- 239000000203 mixture Substances 0.000 title claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 33
- 229920000647 polyepoxide Polymers 0.000 claims description 33
- 229920000058 polyacrylate Polymers 0.000 claims description 13
- -1 acrylic ester Chemical class 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229920006222 acrylic ester polymer Polymers 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
本発明は軟質塩ビ/鋼板用接着剤組成物に関し、更に詳
しくは塩ビフイルムラミネート時、圧着処理温度条件の
低温化を図つた接着剤組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an adhesive composition for soft PVC/steel plates, and more particularly to an adhesive composition that is capable of lowering the pressure bonding temperature during PVC film lamination.
塩ビ/鋼板複合体の製造に際し従来より採られている方
法としては、塩ビ樹脂を加熱融着により直接鋼板一、、
ラミネートする方法やある種の接着剤(例えばニトリル
−ブタジエンゴムとフェノールを主体とするもの)を介
し塩ビ樹脂をラミネートする方法があるが、何れの方法
による場合でも殆どが高温処理(2o0゜C以上)であ
るため、製品の外観(美観)を損ねたり、ラミネート体
に変色を来す恐れもあり、又エネルギー的に見ても多大
な量が消費される。The conventional method for producing PVC/steel plate composites is to heat-fuse PVC resin directly onto the steel plate.
There is a method of laminating PVC resin and a method of laminating PVC resin through a certain type of adhesive (for example, one mainly composed of nitrile-butadiene rubber and phenol), but in most cases, high temperature treatment (2o0°C or higher) is used. ), there is a risk that the appearance (beauty) of the product may be impaired, the laminate body may become discolored, and a large amount of energy is consumed.
さらに接着剤を介する場合殆どが多量に溶剤を必要とす
るため作業環境上問題がある。本発明は塩ビ/鋼板複合
体製造時の加熱処理条件の低温化に見合う接着剤の開発
を目的とする。Furthermore, most cases involving adhesives require a large amount of solvent, which poses problems in terms of the working environment. The object of the present invention is to develop an adhesive suitable for lowering the temperature of heat treatment conditions during the production of PVC/steel plate composites.
本発明者等は軟質塩ビ/鋼板複合体用の接着剤、特に低
温処理条件で良好な接着性を発現する様な接着剤の開発
を目指し研究を重ねた結果、基本配合としてアクリル系
ポリマー(コポリマーを含む〕エポキシ樹脂、およびア
ミン化合物から成る組成物が上記目的を満足する事を見
い出し本発明を完成するに至つた。即ち、本発明はアク
リル系ポリマー100重量部に対しビスフエノールA型
エボキシ樹脂、ビスフエノールF型エポキシ樹脂、ノボ
ラツク型エポ+シ樹脂、オキシ安息香酸のグリシジルエ
ステルエーテル型エボキシ樹脂、ジアミノフエニルメタ
ンのグリシジルエーテル型エポキシ樹脂から選択される
1種以上のエポキシ樹脂20〜100重量部、ならびに
エポキシ樹脂の硬化剤として、l分子中に2個以上のl
級および/または2級アミノ基を有するアミン化合物を
エポキシ樹脂を硬化し得る量を、とから構成された溶剤
系の接着剤を軟質塩ビと鋼板間に介在させ150℃程度
の温度で熱圧着することを特徴とするものである。The present inventors have conducted extensive research aimed at developing adhesives for soft PVC/steel sheet composites, particularly adhesives that exhibit good adhesion under low-temperature processing conditions. The present invention has been completed by discovering that a composition comprising an epoxy resin and an amine compound satisfies the above-mentioned objects.That is, the present invention provides a composition comprising a bisphenol A type epoxy resin per 100 parts by weight of an acrylic polymer. , bisphenol F type epoxy resin, novolak type epoxy resin, glycidyl ester ether type epoxy resin of oxybenzoic acid, and glycidyl ether type epoxy resin of diaminophenylmethane. and as a curing agent for epoxy resin, two or more l in the l molecule.
A solvent-based adhesive consisting of an amine compound having primary and/or secondary amino groups in an amount capable of curing the epoxy resin is interposed between the soft PVC and the steel plate, and thermocompression bonded at a temperature of about 150°C. It is characterized by this.
ここにおいて本発明の基本的な考え方について述べると
、軟質塩ビ樹脂に対する親和性並びに鋼板に対する濡れ
、密着性などを考慮に入れ前者についてはアクリル系樹
脂、後者についてはエポキシ系樹脂が適当であり、さら
にこの2成分が適当に良好な相溶性を有することにより
接着剤層として強靭性を示し優れた接着性を発現するも
のと考えられる。Here, to describe the basic idea of the present invention, taking into consideration the affinity for soft PVC resin and wettability and adhesion to steel plates, acrylic resin is suitable for the former, epoxy resin is suitable for the latter, and It is believed that when these two components have suitably good compatibility, the adhesive layer exhibits toughness and exhibits excellent adhesive properties.
本発明においてエポキシ樹脂の配合量は前記したごとく
、特定のアクリル系ポリマー100重量部に対して20
〜100重量部であり、好ましくは40〜70重量部で
ある。In the present invention, as mentioned above, the amount of epoxy resin blended is 20 parts by weight per 100 parts by weight of the specific acrylic polymer.
~100 parts by weight, preferably 40 to 70 parts by weight.
エポキシ樹脂の配合量が20重量部未満の場合は、鋼板
側との接着力が不安定であり、100重量部を超えた場
合は、鋼板側との接着性は向上するが塩ビとの接着力が
極端に低下する。本発明で用いるアクリル系ポリマーは
、一般式H2C=CH(R1は炭素数6以下のアルキル
基)で表わされるアタリル酸エステルのポリマー/また
は一般式 H2C=C (R2は炭素数\エステ
ルのポリマー、あるいは上記アクリル酸工スチル又はメ
タクリル酸エステルとこれらに共重合しうるビニルモノ
マーを10モル%以下共重合して得られるポリマーおよ
びこれらの混合物である。If the amount of epoxy resin is less than 20 parts by weight, the adhesive strength with the steel plate side will be unstable, and if it exceeds 100 parts by weight, the adhesive strength with the steel plate side will improve, but the adhesive strength with PVC will be unstable. decreases dramatically. The acrylic polymer used in the present invention is a polymer of arylic acid ester represented by the general formula H2C=CH (R1 is an alkyl group having 6 or less carbon atoms) or a polymer of the general formula H2C=C (R2 is a carbon number\ester polymer, Alternatively, it is a polymer obtained by copolymerizing 10 mol% or less of a vinyl monomer copolymerizable with the above-mentioned styl acrylate or methacrylate, and a mixture thereof.
上記共重合しうるビニル基、アリル基を有する、あるい
は分子内に不飽和結合を有し、共重合可能なモノマーと
しては、アクリロニトリル、メタクリロニトリル、アク
ロレイン、酢酸ビニル、塩化ビニル、アリルクロライド
、塩化ビニリデン、ビニルイソシアネート、グリシジル
メタクリレート(GMA)等であり、更に前記したアク
リル酸エステル、メタクリル酸エステル等か挙げられ、
これらを1種以上使用して成る共重合ポリマーが使用で
きる。The copolymerizable monomers that have a vinyl group, an allyl group, or an unsaturated bond in the molecule include acrylonitrile, methacrylonitrile, acrolein, vinyl acetate, vinyl chloride, allyl chloride, These include vinylidene, vinyl isocyanate, glycidyl methacrylate (GMA), and the above-mentioned acrylic esters, methacrylic esters, etc.
A copolymer formed by using one or more of these can be used.
また、上記一般式中のR,,R2については炭素数は6
以下か望ましく更に好ましくは4以下が適当である。こ
れは例えば相溶性などの点から考慮してもこの事が言え
、さらに炭素数が多くなるど接着剤自体のモジユラスが
低下し鋼板並びに塩ビ樹脂のモジユラスに比較して見合
う程度のものでなくなるため、適当でない。又アクリル
系ポリマーの平均分子量は50,000以上のものが適
当である。In addition, the number of carbon atoms for R,,R2 in the above general formula is 6
It is preferably 4 or less, more preferably 4 or less. This is true even when considering compatibility, for example, and furthermore, as the number of carbons increases, the modulus of the adhesive itself decreases, making it no longer commensurate with the modulus of steel plates and PVC resin. , not appropriate. The average molecular weight of the acrylic polymer is preferably 50,000 or more.
50,000未満のものでは接着剤として強靭性に乏し
く有用でない。If it is less than 50,000, it lacks toughness and is not useful as an adhesive.
本発明で用いるエポキシ樹脂は、1分子中に2個以上の
エポキシ基を有する化合物であつて、具体的にはビスフ
エノールA型エポキシ樹脂、ビスフエノールF型エポキ
シ樹脂、ノボラツク型エポキシ樹脂、オキシ安息香酸の
グリシジルエステルエーテル型エポキシ樹脂、ジアミノ
ジフエニルメタンのグリシジルエーテル型エポキシ樹脂
である。勿論これらのエポキシ樹脂は単独もしくは2種
以上混合して使用しても良い。本発明において、エボキ
シ樹脂の硬化剤として用いるアミン化合物は、1分子中
に2個以上の1級および/または2級アミノ基を有する
もので、具体的には脂肪族ポリアミン例えばエチレンジ
アミン、トリエチレンテトラミン、テトラエチレンペン
タミン等または芳香族アミン、例えばm−フエニレンジ
アミン、p−フエニレンジアミン、4,4′−ジアミノ
ジフエニルメタン等が挙げられる。The epoxy resin used in the present invention is a compound having two or more epoxy groups in one molecule, and specifically includes bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, and oxybenzoic epoxy resin. These are glycidyl ester ether type epoxy resin of acid and glycidyl ether type epoxy resin of diaminodiphenylmethane. Of course, these epoxy resins may be used alone or in combination of two or more. In the present invention, the amine compound used as a curing agent for epoxy resin has two or more primary and/or secondary amino groups in one molecule, and specifically includes aliphatic polyamines such as ethylenediamine and triethylenetetramine. , tetraethylenepentamine, etc., or aromatic amines such as m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, and the like.
さらに複素環ジアミン、例えばオキサスピロ環含有ジア
ミンが挙げられる。これらのアミン化合物は単独あるい
は2種以上混合して用いることができる。本発明におい
てアクリル系ポリマー、コポキシ樹脂、硬化剤の他にフ
エノール樹脂、フタル酸ジオクチル(DOP)、リン酸
トリクレジル(TCP)等の可塑剤、又はタル久シリカ
、炭酸カリシウム等の充填剤の添加も可能である。Further mention may be made of heterocyclic diamines, such as oxaspiro ring-containing diamines. These amine compounds can be used alone or in combination of two or more. In the present invention, in addition to acrylic polymers, copoxy resins, and curing agents, phenolic resins, plasticizers such as dioctyl phthalate (DOP), and tricresyl phosphate (TCP), and fillers such as Talukyu silica and potassium carbonate may also be added. It is possible.
以上の配合樹脂及び添加剤を適当な有機溶剤にて溶解せ
しめ液状接着剤を形成する。The above blended resin and additives are dissolved in a suitable organic solvent to form a liquid adhesive.
ここで使用する溶剤としては接着剤の塗工性、さらに加
熱処理後軟質塩ビ樹脂ラミネート時の濡れ効果増大等を
考慮に入れ高沸点および低沸点混合溶媒系が望ましい。
高沸点溶剤としては沸点100℃以上のトルエン、キシ
レン、シクロヘキサノン等、低沸点溶剤としては沸点8
0℃以下の塩化メチレン、酢酸エチル、メチルエチルケ
トン(MEK)等である。軟質塩ビ樹脂と鋼板を強固に
接着させるためには接着剤塗布量としては乾燥樹脂量と
して3〜309/Rrl2が好ましく、39/M2未満
では十分な接着性が発現されず309/m超になると溶
剤揮発時に不具合を生じ塗布表面状態が良好でなくなる
。The solvent to be used here is preferably a mixed solvent system with a high boiling point and a low boiling point, taking into account the coatability of the adhesive and the increased wetting effect during lamination of the soft vinyl chloride resin after heat treatment.
High boiling point solvents include toluene, xylene, cyclohexanone, etc. with a boiling point of 100°C or higher, and low boiling point solvents have a boiling point of 8°C or higher.
Examples include methylene chloride, ethyl acetate, and methyl ethyl ketone (MEK) at temperatures below 0°C. In order to firmly adhere the soft PVC resin and the steel plate, the amount of adhesive applied is preferably 3 to 309/Rrl2 as a dry resin amount, and if it is less than 39/M2, sufficient adhesiveness will not be developed, and if it exceeds 309/M2, Problems occur when the solvent evaporates, resulting in poor coating surface conditions.
本発明の接着剤組成物は主に軟質塩ビ樹脂と基体金属板
としてリン酸塩処理鋼板、あるいはクロム酸塩処理鋼板
との接着に使用されるが、接着前処理としてこれら被着
体の溶剤による表面清浄を行うことかより確実強固な接
着性発現を期する意味で望ましい。以下、実施例により
本発明を具体的に説明する。The adhesive composition of the present invention is mainly used for adhering a soft PVC resin to a phosphate-treated steel plate or a chromate-treated steel plate as a base metal plate. It is desirable to perform surface cleaning in order to ensure stronger adhesion. Hereinafter, the present invention will be specifically explained with reference to Examples.
なお表中、配合例の数値はすべて重量部とする。実施例
1被着体として脱脂したリン酸亜鉛処理鋼板並ぴに軟
質塩ビシートを使用し、アクリル系ポリマーとしてメチ
ルメタクリレート(MMA)95重量部(98モル(F
t))グリシジルメタクリレート(GMA)5重量部(
4モル%)より成る平均分子量60,000のポリマー
100重量部に対し工ポキシ樹脂としてスミエポキシE
LAl28(エポキシ当量185;住友化学社製)50
重量部、アミン化合物としてエポメートB−002(3
,9ビス(3−アミノプロピル)3,4,8,10−テ
トオキサスピロ〔5,5〕ウンデカン;三菱油化製)1
0重量部をメチルエチルケトン(MEK)100重量部
、シクロヘキサノン100重量部に溶解し十分混合攪拌
後、先の鋼板上に乾燥後の接着剤が厚が約10&揄2と
なる様に塗布し、常温で放置30分後、150℃×l分
加熱処理しこれに塩ビシートをローラーにて圧着し冷却
装置後、剥離強度を測定し、結果を表1表に示した。In the table, all numerical values for formulation examples are parts by weight. Example 1 A degreased zinc phosphate treated steel sheet and a soft PVC sheet were used as adherends, and 95 parts by weight (98 mol (F) of methyl methacrylate (MMA) was added as an acrylic polymer.
t)) 5 parts by weight of glycidyl methacrylate (GMA) (
4 mol %) of a polymer with an average molecular weight of 60,000, Sumiepoxy E
LAl28 (epoxy equivalent: 185; manufactured by Sumitomo Chemical Co., Ltd.) 50
Part by weight, Epomate B-002 (3
,9bis(3-aminopropyl)3,4,8,10-tetooxaspiro[5,5]undecane; manufactured by Mitsubishi Yuka) 1
Dissolve 0 parts by weight in 100 parts by weight of methyl ethyl ketone (MEK) and 100 parts by weight of cyclohexanone. After thorough mixing and stirring, apply the dried adhesive on the steel plate to a thickness of about 10 mm and 2 mm, and leave at room temperature. After being left for 30 minutes, it was heat-treated at 150° C. for 1 minute, a vinyl chloride sheet was pressed onto it using a roller, and after cooling, the peel strength was measured, and the results are shown in Table 1.
比較例 1
実施例1におけるアクリル系ポリマ一100重量部に対
し、エポキシ樹脂ELAl28(エポキシ当量185、
ビスフエノールAタイプエポキシ樹脂;住友化学社製)
をそれぞれ10重量部(比較例1−a)、150重量部
(比較例1−b)加え、さらにアミン化合物としてB−
002をそれぞれ5重量部(比較例1−a)、30重量
部(比較例1−b)加え、メチルエチルケトン(MEK
)100重量部、シクロヘキサノン100重量部に溶解
し、十分混合攪拌後、実施例1の方法に準じて試料を作
成し、剥離強度を測定し、結果を第1表に示した。Comparative Example 1 To 100 parts by weight of the acrylic polymer in Example 1, epoxy resin ELAl28 (epoxy equivalent: 185,
Bisphenol A type epoxy resin; manufactured by Sumitomo Chemical Co., Ltd.)
10 parts by weight (Comparative Example 1-a) and 150 parts by weight (Comparative Example 1-b), respectively, and B-
002 was added to 5 parts by weight (Comparative Example 1-a) and 30 parts by weight (Comparative Example 1-b), respectively, and methyl ethyl ketone (MEK
) and 100 parts by weight of cyclohexanone, and after thorough mixing and stirring, samples were prepared according to the method of Example 1, and the peel strength was measured. The results are shown in Table 1.
剥離試験において実施例1は良好な接着性を示し、塩ビ
の材料破壊が生じたが、エポキシ樹脂の添加量が少ない
比較例1−aにおいては鋼板と接着層との間で剥離し、
また添加量の多い比較例1一bにおいては塩ビと接着層
との間で剥離してしまつた。In the peel test, Example 1 showed good adhesion and material failure of PVC occurred, but in Comparative Example 1-a, in which the amount of epoxy resin added was small, peeling occurred between the steel plate and the adhesive layer.
In addition, in Comparative Example 11b in which the amount added was large, peeling occurred between the vinyl chloride and the adhesive layer.
実施例 2
実施例1におけるアクリル系ポリマー100重量部に対
し、各種エポキシ樹脂(ノボラツクタイプ、オキシ安息
香酸工スチルエーテルタイプ、含窒素エボキシ樹脂)及
び硬化剤としてB−002を配合して得られる接着剤に
ついてその配合例と剥離強度を第2表に示す。Example 2 100 parts by weight of the acrylic polymer in Example 1 was mixed with various epoxy resins (novolac type, oxybenzoic styrene ether type, nitrogen-containing epoxy resin) and B-002 as a curing agent. Table 2 shows formulation examples and peel strengths of the adhesives.
エポキシ樹脂の種類を変えてもそれぞれ良好な接着性を
示し、剥離試験においては塩ビの材料破壊が生じた。Even when the type of epoxy resin was changed, each exhibited good adhesion, and material failure of PVC occurred in the peel test.
実施例 3
実施例1におけるアクリル系ポリマー100重量部、エ
ポキシ樹脂としてELA−12850重量部に対して硬
化剤としてアミン化合物であるテトラエチレンペンタミ
ン(TEPA)あるいはジアミノジフエニルメタン(D
DM)を配合して得られる接着剤について、その配合例
と剥離強度を第3表に示す。Example 3 An amine compound such as tetraethylenepentamine (TEPA) or diaminodiphenylmethane (D
Table 3 shows formulation examples and peel strengths of adhesives obtained by blending DM).
”5
用しても良好な接着性を示し、剥離試験においては塩ビ
の材料破壊が生じた。"5" showed good adhesion even when used, and material failure of PVC occurred in the peel test.
実施例 4
平均分子量60,000〜100,000の範囲に在る
アクリル系ポリマーとしてポリメタクリル酸メチル(/
V)、ポリアクリル酸n−ブチル13)、ポリアクリル
酸n−ヘキシル0、ポリアクリル酸2−エチルヘキシル
(自)の4種について、これらのアクリル系ポリマー1
00重量部に対しエポキシ樹脂ELAl285O重量部
、エポキシ樹脂用硬化剤B−00210重量部をMEK
/トルエンの混合溶媒中で十分混合攪拌し、その後溶剤
を揮発させフイルム状となし相溶性を評価しz結果を第
4表に示す。Example 4 Polymethyl methacrylate (/
V), n-butyl polyacrylate 13), n-hexyl polyacrylate 0, and 2-ethylhexyl polyacrylate (auto), these acrylic polymers 1
00 parts by weight of epoxy resin ELAl285O and epoxy resin curing agent B-00210 parts by weight of MEK.
The mixture was thoroughly mixed and stirred in a mixed solvent of /toluene, and then the solvent was evaporated to form a film and the compatibility was evaluated. The results are shown in Table 4.
Claims (1)
クリル酸エステルのポリマー一般式 ▲数式、化学式、表等があります▼ (R_2:炭素数6以下のアルキル基)で表わされるメ
タクリル酸エステルのポリマー、および該アクリル酸エ
ステルおよび/または該メタクリル酸エステルとこれら
の共重合しうるビニルモノマー10モル%以下とを共重
合せしめたポリマーの群から選ばれる少なくとも1種の
平均分子量50,000以上のアクリル系ポリマー10
0重量部に対して、ビスフェノールA型エポキシ樹脂、
ビスフェノールF型エポキシ樹脂、ノボラック型エポキ
シ樹脂、オキシ安息香酸のグリシジルエステルエーテル
型エポキシ樹脂、ジアミノジフェニルメタンのグリシジ
ルエーテル型エポキシ樹脂の1種以上から選択されるエ
ポキシ樹脂20〜100重量部、ならびにエポキシ樹脂
の硬化剤として、1分子中に2個以上の1級および/ま
たは2級アミノ基を有するアミノ化合物をエポキシ樹脂
を硬化し得る量、を80℃以下の低沸点溶剤および高沸
点溶剤の混合溶剤に溶解せしめて成る塩ビ/鋼板用接着
剤組成物。[Claims] 1 General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ General formula of an acrylic ester polymer represented by (R_1: an alkyl group with 6 or less carbon atoms) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ A polymer of methacrylic ester represented by (R_2: alkyl group having 6 or less carbon atoms), and 10 mol% or less of a vinyl monomer copolymerizable with the acrylic ester and/or the methacrylic ester are copolymerized. At least one acrylic polymer having an average molecular weight of 50,000 or more selected from the group of polymers 10
0 parts by weight, bisphenol A type epoxy resin,
20 to 100 parts by weight of an epoxy resin selected from one or more of bisphenol F type epoxy resin, novolac type epoxy resin, glycidyl ester ether type epoxy resin of oxybenzoic acid, and glycidyl ether type epoxy resin of diaminodiphenylmethane; As a curing agent, an amount of an amino compound having two or more primary and/or secondary amino groups in one molecule that can cure the epoxy resin is added to a mixed solvent of a low boiling point solvent and a high boiling point solvent at 80°C or less. An adhesive composition for PVC/steel plates made by melting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16678979A JPS5937034B2 (en) | 1979-12-24 | 1979-12-24 | Adhesive composition for PVC/steel plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16678979A JPS5937034B2 (en) | 1979-12-24 | 1979-12-24 | Adhesive composition for PVC/steel plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5690874A JPS5690874A (en) | 1981-07-23 |
| JPS5937034B2 true JPS5937034B2 (en) | 1984-09-07 |
Family
ID=15837697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16678979A Expired JPS5937034B2 (en) | 1979-12-24 | 1979-12-24 | Adhesive composition for PVC/steel plates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5937034B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6544653B2 (en) | 1998-04-03 | 2003-04-08 | Sony Chemicals Corp. | Adhesive for binding vinyl chloride to steel plates and vinyl chloride-coated steel plates |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2533348B2 (en) * | 1988-01-06 | 1996-09-11 | 三井石油化学工業株式会社 | Adhesive composition for vinyl halide resin |
| JPH0238480A (en) * | 1988-07-28 | 1990-02-07 | Fsk Corp | Composition for forming photocurable adhesive and adhesive composition |
| DE102007016950A1 (en) * | 2007-04-05 | 2008-10-09 | Tesa Ag | Thermally crosslinking polyacrylates and process for their preparation |
| JP2015113385A (en) * | 2013-12-10 | 2015-06-22 | パナソニックIpマネジメント株式会社 | Adhesive composition for steel plate and thermoplastic resin-coated steel plate using the same |
| WO2025244115A1 (en) * | 2024-05-23 | 2025-11-27 | 積水化学工業株式会社 | Adhesive composition and adhesive tape |
-
1979
- 1979-12-24 JP JP16678979A patent/JPS5937034B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6544653B2 (en) | 1998-04-03 | 2003-04-08 | Sony Chemicals Corp. | Adhesive for binding vinyl chloride to steel plates and vinyl chloride-coated steel plates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5690874A (en) | 1981-07-23 |
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