JPS5937760B2 - Surface treatment method using AC electrolytic plating - Google Patents

Description

Detailed Description of the Invention This invention applies alternating current to at least one pair of objects to be plated immersed in a plating solution, and repeats melting and electrodeposition on the surfaces of both objects to roughen the surface. The present invention relates to a surface treatment method using AC electrolytic plating, which is subjected to surface treatment to improve adhesion and the like.

In order to improve the adhesion of a metal plate, such as a copper plate, the surface needs to be rough to some extent rather than smooth.

Therefore, a plating method using direct current has been proposed as one of the methods for roughening the surface of metal.

This method can be expected to produce a highly adhesive surface treatment by selecting the optimal conditions, but on the other hand, it requires a dedicated electrode for plating, and the electrode wears out as plating continues. There are disadvantages such as the need for complete degreasing as a pretreatment during plating, and the fact that it is dangerous because a high DC current source is applied.
In addition to direct current, some plating methods have recently been proposed in which alternating current is used to activate metal ions in the plating solution to facilitate deposition. At present, it has not been tried at all as a surface roughening treatment method. In view of the above-mentioned reasons, the present invention relates to a method of roughening a metal surface by using an alternating current instead of a direct current plating method, and which also eliminates the need for electrodes. That is, the object to be plated whose surface is to be roughened is immersed in a plating solution, an alternating current is applied to at least one pair of the objects to be plated, and melting and electrodeposition are repeated on the surfaces of both objects to be plated. The object of the present invention is to provide a new surface treatment method that roughens the surface and improves adhesiveness. Hereinafter, the method of the present invention will be explained in detail with reference to the drawings.

FIG. 1 is an explanatory diagram schematically showing an apparatus for surface treatment according to the method of the present invention. In the figure, 1 is a plating tank, and this tank 1 is filled with a plating solution 2.

Objects 3a and 3b to be plated, such as copper plates, for roughening the surface of the plating solution 2 are provided with a desired distance between the objects 3a and 3b. It forms a structure connected to the The plating solution 2 may be appropriately selected depending on the metal of the objects 3a, 3b to be plated.

Furthermore, the work to be plated is not limited to a single pair of objects 3a and 3b, but may be applied to a plurality of pairs at the same time. In that case, it is necessary to use a corresponding number of transformers or a transformer with multiple circuits. Therefore, in the surface treatment apparatus having the above structure, the alternating current is applied to both the objects to be plated 3a, 3.
The object to be plated 3a. 3b is subjected to surface roughening treatment.

In this case, the waveform of the alternating current applied is a sine wave, square wave,
Any waveform such as a triangular wave may be used. For example, if we take the sine wave 5 as shown in FIG.
In XI), the object to be plated 3a is melted and electrodeposited on the other object to be plated 3b, and conversely, in the negative potential part (river It is done as follows. During the initial melting, a kind of cleaning of the metal surface is carried out smoothly. As a result of this mutual dissolution and electrodeposition, the metal surface is gradually roughened, and an ideal rough surface with good adhesion can be obtained. Moreover, since melting and electrodeposition are performed repeatedly in this way, the object to be plated 3a,
There is no loss or increase in the mass of the metal 3b itself, and there is no need to replenish it from the outside. Also, energize ゛-j [both D4-? Shu Xian is not particularly limited. However, if a low frequency one is selected, the reactive power due to static capacitance will be reduced, and the power usage efficiency can be brought close to that of direct current, which is desirable. In addition, in the present invention, in addition to using a general AC power supply, an AC generator or even an amplifier may be connected to the surface treatment apparatus.

As explained above, if surface treatment is performed by AC electrolytic plating according to the present invention, it is possible to roughen the metal surface and improve adhesion, compared to the conventional method using DC electrolysis. The entire device is simple as it does not require electrodes, it is economical as there is no loss or increase in the mass of the object to be plated, and the dissolution action at the initial stage of electrolysis functions as a kind of cleaning action, making it suitable for degreasing, etc. It has various advantages such as no pre-treatment is required, and in the case of AC, it is less dangerous because there is no need to apply a high current source, and the product surface is evenly roughened. There is also an advantage.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing the outline of a useful surface treatment device applying the method of the present invention, and Fig. 2 is an explanatory diagram showing the mutual cycle of dissolution and electrodeposition on the surface of the object to be plated in the above device. be. 1...Plating tank, 2...Plating liquid, 3
a, 3b... object to be plated, 4... transformer.

Claims (1)

[Claims] 1. The object to be plated whose surface is to be roughened is immersed in a plating solution, an alternating current is applied to at least one pair of the objects to be plated, and melting and electrodeposition are repeated on the surfaces of both objects to be plated. A surface treatment method using AC electrolytic plating, characterized in that the surface is roughened using AC electrolytic plating.