JPS5938186B2 - Method for producing inorganic compound single crystals - Google Patents
Method for producing inorganic compound single crystalsInfo
- Publication number
- JPS5938186B2 JPS5938186B2 JP5900882A JP5900882A JPS5938186B2 JP S5938186 B2 JPS5938186 B2 JP S5938186B2 JP 5900882 A JP5900882 A JP 5900882A JP 5900882 A JP5900882 A JP 5900882A JP S5938186 B2 JPS5938186 B2 JP S5938186B2
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- Prior art keywords
- temperature
- boat
- single crystal
- crystal
- group
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
- C30B11/06—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt at least one but not all components of the crystal composition being added
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】
本発明は、周期律表第■族元素及び第V族元素からなる
無機化合物(以下「111−V族化合物」という。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inorganic compound (hereinafter referred to as a "111-V group compound") consisting of a Group I element and a Group V element of the periodic table.
)単結晶の製造方法に関する。ひ化ガリウム(GaAs
) 、ひ化インジウム(InAs)、りん化ガリウム(
GaP)等の■−V族化合物単結晶は、発光ダイオード
、半導体レーザー、高周波(主として、UHFXSHF
帯)用のFET、ガンダイオード等の素子の製造に広(
用いられている。) Regarding a method for producing a single crystal. Gallium arsenide (GaAs
), indium arsenide (InAs), gallium phosphide (
-V group compound single crystals such as GaP) are used for light emitting diodes, semiconductor lasers, high frequency (mainly UHF
Widely used in manufacturing elements such as FETs and Gunn diodes for
It is used.
これらI−V族化合物単結晶は、温度傾斜法(GF法)
、水平ブリッジマン法(HB法)等の府−ト成長法によ
〃製造される場合が多い。These IV group compound single crystals can be obtained using the temperature gradient method (GF method).
, horizontal Bridgman method (HB method) and other flat growth methods.
これは、ボート成長法によると、引上法(CZ法)に比
較して一定形状の単結晶が得られるからである。This is because the boat growth method allows a single crystal with a fixed shape to be obtained compared to the pulling method (CZ method).
特に、GF法は、HB法と異なシ加熱炉を移動させる必
要がないので大型の単結晶の製造に適している。In particular, the GF method is suitable for manufacturing large-sized single crystals because it does not require moving a heating furnace unlike the HB method.
GF法は、ボート成長法の一種であるが、第1図に示す
ように、ボートまたは炉を移動することなく温度勾配を
移動させて単結晶を成長させる方法である。The GF method is a type of boat growth method, and as shown in FIG. 1, a single crystal is grown by moving a temperature gradient without moving a boat or furnace.
すなわち、第1図は従来技術によるGF法における温度
分布の変化を説明する図である。That is, FIG. 1 is a diagram illustrating changes in temperature distribution in the GF method according to the prior art.
第1図において、縦軸は温度(任意目盛)を示す。In FIG. 1, the vertical axis indicates temperature (arbitrary scale).
M、P、は■−■族化合物の融点である。横軸は、結晶
成長方向の長さく任意目盛)を示す。M and P are the melting points of the ■-■ group compound. The horizontal axis indicates the length (arbitrary scale) in the crystal growth direction.
1゜2及び3は温度分布を示す曲線である。1°2 and 3 are curves showing temperature distribution.
4は横軸と同一縮尺で示した単結晶成長用ボートの縦断
面図である。4 is a vertical cross-sectional view of the single crystal growth boat shown on the same scale as the horizontal axis.
5は、ボート40種結晶設置部である。GF法により単
結晶を成長させる場合、温度分布曲線を1から3へ曲線
の形を変化させずに降温させて固液界面を移動させる。5 is a boat 40 seed crystal installation part. When growing a single crystal by the GF method, the temperature distribution curve is lowered from 1 to 3 without changing the shape of the curve, and the solid-liquid interface is moved.
かかる温度分布を形成し、かつ、移動させるには電気炉
を4〜6個の部分に分割してそれぞれの部分をシーケン
ス制御するのが一般的である。In order to form and move such a temperature distribution, it is common to divide the electric furnace into 4 to 6 parts and sequentially control each part.
この場合、温度勾配は、1℃/肩程度が通常用いられて
いる。In this case, a temperature gradient of about 1° C./shoulder is usually used.
しかしながら、単結晶成長用ボートの全長が40cn1
以上になると、低温部と高温部の温度差が犬となるため
結晶欠陥が発生しやす(なりまた、高温部においてボー
ト材料による汚染が生じ易いことが問題となっていた。However, the total length of the boat for single crystal growth is 40cn1.
If the temperature is higher than that, the temperature difference between the low-temperature part and the high-temperature part becomes large, so crystal defects are likely to occur (and contamination by boat material is likely to occur in the high-temperature part, which is a problem).
一方、温度勾配を小さくすると、温度制御の誤差によシ
、該ボート全長にわたシ一様に温度を低下させることが
困難となる。On the other hand, if the temperature gradient is made small, it becomes difficult to lower the temperature uniformly over the entire length of the boat due to errors in temperature control.
その結果、種結晶に接しない部分から固化が始まり、単
結晶化しない場合が多(なる。As a result, solidification begins from the part that is not in contact with the seed crystal, and it often does not become a single crystal.
本発明者等は、かかる従来技術の問題点を解決すること
を目的として鋭意研究を重ねた結果、本発明に達したも
のである。The present inventors have conducted extensive research aimed at solving the problems of the prior art, and as a result, they have arrived at the present invention.
本発明の上記の目的は、■−■族化合物単結晶をGF法
によって製造する方法において、単結晶成長用ボートの
温度が、上記III−V族化合物の融点から低温側15
℃以内の範囲の温度よシ低くならず、かつ、上記ボート
の高温部と低温部の温度差が20℃以内であることを特
徴とする方法により達せられる。The above-mentioned object of the present invention is to provide a method for producing a single crystal of a group III-V compound by the GF method, in which the temperature of the single crystal growth boat is 15 to 15 degrees lower than the melting point of the group III-V compound.
This is achieved by a method characterized in that the temperature does not drop below a range of 0.degree.
本発明方法においては、単結晶成長用ボートに■−v族
化合物の種結晶及び原料となる多結晶、または第■族元
素(Ga、In等)を収容して、このボートを該■−■
族化合物の融点付近での解離圧に相当する第V族元素の
蒸気圧を発生させるために、該当する第V族元素ととも
に封管中に封入する。In the method of the present invention, a seed crystal of a group ■-v compound and a polycrystal as a raw material, or a group
In order to generate a vapor pressure of the Group V element corresponding to the dissociation pressure near the melting point of the Group compound, it is sealed in a sealed tube together with the relevant Group V element.
単結晶成長用ボートに第■族元素を収容した場合は、単
結晶成長の過程で第V族元素と反応して■−V族化合物
を生成し、その融液が生成する。When a Group 1 element is placed in a single crystal growth boat, it reacts with the Group V element during the single crystal growth process to produce a Group 1-V compound, and its melt is produced.
単結晶の成長にあたっては、種結晶の部分が該■−V族
化合物の融点より低温側15℃以内、好ましくは10℃
以内の範囲の、予じめ定めた温度、すなわち下限温度ま
たは上記範囲内でそれより高い温度に設定し、ボートの
他端に向って、所定の温度勾配で上昇していくように温
度分布を設定する。When growing a single crystal, the seed crystal portion should be kept at a temperature within 15°C, preferably 10°C, of the melting point of the -V group compound.
Set the temperature to a predetermined temperature within the range specified above, i.e., the lower limit temperature or a higher temperature within the above range, and set the temperature distribution so that it increases with a predetermined temperature gradient toward the other end of the boat. Set.
種結晶部分の温度を該■−v族化合物の融点よシ15℃
を越えて低下させると温度の変化による収縮に伴なう歪
により結晶欠陥が増加するので不適当である。The temperature of the seed crystal part is 15°C below the melting point of the ■-v group compound.
If it is lowered beyond this value, crystal defects will increase due to distortion caused by shrinkage due to temperature changes, which is inappropriate.
温度勾配は、0.5℃/m〜2℃/mが好ましく、1℃
/cm〜1.5℃/錆がさらに好ましい。The temperature gradient is preferably 0.5°C/m to 2°C/m, and 1°C
/cm to 1.5°C/rust is more preferred.
温度勾配が2℃/cn1を超えると、熱収縮により結晶
欠陥が増加し、0.5℃/1以下になると温度勾配の制
御が困難となるので適当でない。If the temperature gradient exceeds 2° C./cn1, crystal defects will increase due to thermal contraction, and if it becomes 0.5° C./1 or less, it will be difficult to control the temperature gradient, which is not appropriate.
この場合、高温部の温度が所定の温度、すなわち、温度
部に対して、20℃以内高い温度、好ましくは、5〜1
0℃高い温度、すなわち上限温度に達した点より先の部
分(種結晶よシ遠い部分)は当該温度で一定に保持する
。In this case, the temperature of the high temperature part is a predetermined temperature, that is, a temperature higher than the temperature part by 20 °C or less, preferably 5 to 1
The temperature 0° C. higher, that is, the portion beyond the point where the upper limit temperature is reached (the portion far from the seed crystal) is held constant at that temperature.
上記温度よりも高温に保持すると、高融点の化合物、例
えばGaAs(融点1238℃)の場合、ボート材料(
石英等)からの汚染が生じやす(、また電気炉の発熱体
にSiC等の特殊な発熱体を使用する必要が生じるので
適当でない。When held at a higher temperature than the above temperature, the boat material (
It is not suitable because it tends to cause contamination from quartz, etc. (and it is necessary to use a special heating element such as SiC for the heating element of the electric furnace).
石英ボートの各部の所定の温度に達した後、通常のGF
法と同様に温度を降下させて結晶を成長させる。After reaching the predetermined temperature of each part of the quartz boat, normal GF
As in the method, the temperature is lowered to grow crystals.
上記の結晶成長に伴なう高温の過程を図面を用いて説明
する。The high-temperature process accompanying the above-mentioned crystal growth will be explained using drawings.
第2図は、本発明方法によるGF法の温度分布の変化を
説明する図面である。FIG. 2 is a diagram illustrating changes in temperature distribution in the GF method according to the method of the present invention.
第1図と同様に、第2図の縦軸は湿度を表わし、M、P
、は融点を示す。Similar to Figure 1, the vertical axis in Figure 2 represents humidity, M, P
, indicates the melting point.
横軸は、結晶成長方向の長さを表わす。また、6は横軸
と同一の縮尺で表わした単結晶成長用ボートの縦断面図
である。The horizontal axis represents the length in the crystal growth direction. Further, 6 is a vertical cross-sectional view of the single crystal growth boat expressed on the same scale as the horizontal axis.
7,8及び9は、温度分布を示す曲線である。7, 8 and 9 are curves showing temperature distribution.
縦軸に記入したT□及びTLは、それぞれ、予じめ定め
た高温部の限界温度(上限温度)及び低温部の限界温度
(下限温度)である。T□ and TL written on the vertical axis are the predetermined limit temperature (upper limit temperature) of the high temperature section and the limit temperature (lower limit temperature) of the low temperature section, respectively.
温度分布を曲線7で示した状態から曲線9で示した状態
へ変化させるに伴ない単結晶の成長が行なわれる。As the temperature distribution changes from the state shown by curve 7 to the state shown by curve 9, the single crystal grows.
種結晶部分の温度は、結晶成長開始の際は、下限温度よ
り高く設定してもよいが、結晶成長に伴ない、当該部分
の温度がTLに達した後はその部分は下限温度で一定に
保持する。The temperature of the seed crystal part may be set higher than the lower limit temperature when starting crystal growth, but as the crystal grows, after the temperature of the part reaches TL, the temperature of that part remains constant at the lower limit temperature. Hold.
また、高温部の温度が所定の上限温度霜に達した後もそ
の点よシ先の部分(種結晶より遠い部分)は同様に一定
温度に保持する。Furthermore, even after the temperature of the high-temperature part reaches a predetermined upper limit temperature frost, the part beyond that point (the part far from the seed crystal) is similarly maintained at a constant temperature.
本発明方法によると、結晶化が終了した部分は長時間一
定の温度に保持されるので、アニーリング(焼なまし)
の効果があ多結晶欠陥の少ない良質の単結晶が得られる
。According to the method of the present invention, the part where crystallization has finished is kept at a constant temperature for a long time, so it is not annealed.
As a result, high-quality single crystals with few polycrystalline defects can be obtained.
また、GaAsのように高融点の■−v族化合物単結晶
を成長させる場合、制御が容易な温度勾配を用いても成
長末端(種結晶を設置した側とは反対側の端部)は、1
240〜1250℃と従来のように1300℃前後の高
温にはならないので、ボート材料である石英からの不純
物混入が防止できる。In addition, when growing a single crystal of a high melting point ■-V group compound such as GaAs, even if an easily controlled temperature gradient is used, the growth end (the end opposite to the side where the seed crystal is placed) 1
Since the temperature is 240 to 1,250°C, which is not around 1,300°C as in the conventional case, contamination of impurities from quartz, which is the boat material, can be prevented.
さらに、電気炉の発熱体としてスーパーカンタル線が使
用できるので、SiCと異なシ発熱体をコイル状に巻く
ことができ温度制御が容易になる。Furthermore, since superkanthal wire can be used as the heating element in the electric furnace, the heating element, which is different from SiC, can be wound into a coil, making temperature control easier.
続いて、実施例及び比較例に基づいて本発明をさらに具
体的に説明する。Next, the present invention will be explained in more detail based on Examples and Comparative Examples.
実施例 1
内径50mm、全長450rmn、断面が半円形である
石英ボートにSiドープGaAs多結晶を21001、
チャージした。Example 1 Si-doped GaAs polycrystals were placed in a quartz boat having an inner diameter of 50 mm, a total length of 450 rms, and a semicircular cross section.
I charged it.
種結晶を用いて成長方向を(111)As方向としだ。The growth direction is set to the (111) As direction using a seed crystal.
このボートを、第3図に示すようにひ素(As)ととも
に石英製の封管中に減圧封入して電気炉内に設置した。As shown in FIG. 3, this boat was sealed together with arsenic (As) in a sealed quartz tube under reduced pressure and placed in an electric furnace.
すなわち、第3図は単結晶成長装置の縦断面図である。That is, FIG. 3 is a longitudinal sectional view of the single crystal growth apparatus.
10は炉心管である。10 is a furnace tube.
11は石英製の封管である。12はAsであってGaA
sの分解を防止するために用いられる。11 is a sealed tube made of quartz. 12 is As and GaA
Used to prevent decomposition of s.
13は封管11の石英ボート封入部とAs封入部とを分
離する隔壁であって、隔壁13は、毛管状の細孔を有し
、該細孔で上記両部分を連絡している。Reference numeral 13 denotes a partition wall that separates the quartz boat-filled part and the As-filled part of the sealed tube 11, and the partition wall 13 has a capillary-like pore that connects the two parts.
14はボートである。15はボート14を加熱する電気
炉であって5個の部分に分割されている。14 is a boat. Reference numeral 15 denotes an electric furnace for heating the boat 14, which is divided into five parts.
16はAs12を約610℃に加熱してAs圧(約1気
圧)を発生させるだめの電気炉である。16 is an electric furnace for heating As12 to about 610° C. and generating As pressure (about 1 atmosphere).
結晶成長の開始にあたって、電気炉16を610℃に加
熱し、電気炉15は、種結晶を設置したボートの端部が
1234℃、温度勾配を11℃/cm、上限温度を12
40℃となるように加熱した。To start crystal growth, the electric furnace 16 is heated to 610°C.
It was heated to 40°C.
各電気炉が所定の温度に達した後、降温速度0.6℃/
hr で降温しで結晶成長を開始した。After each electric furnace reaches a predetermined temperature, the temperature decrease rate is 0.6℃/
The temperature was lowered to 100 hr, and crystal growth started.
ボートの低温側の温度が下限温度1230℃に達した後
は、その部分の温度は一定に保持した。After the temperature on the low temperature side of the boat reached the lower limit temperature of 1230°C, the temperature of that part was kept constant.
83時間でGaAs単結晶の成長工程が終了した。The GaAs single crystal growth process was completed in 83 hours.
得られたGaAs結晶棒のうち、60%に相当する部分
が単結晶化していた。Of the obtained GaAs crystal rods, a portion equivalent to 60% was single crystallized.
エッチ・ピッ)(EtchPit)密度(EPD )及
びキャリア濃度は、種結晶側端部から80rranの部
分で、それぞれ、8×10210A、 6 X 101
7/cdlであった。EtchPit density (EPD) and carrier concentration are 8 x 10210 A and 6 x 101 at a portion 80 rran from the seed crystal side end, respectively.
It was 7/cdl.
同じく260rrrmの部分でE P D 6 X 1
02/crAsキャリア濃度1.5 X 1018/c
rlであった。Similarly, E P D 6 X 1 in the 260rrrm part
02/crAs carrier concentration 1.5 x 1018/c
It was rl.
実施例 2
内径70mm、全長380rrvnの断面が半円形であ
る石英ボートに3300S’のSi ドープGaAs
多結晶をチャージした。Example 2 A quartz boat with a semicircular cross section with an inner diameter of 70 mm and a total length of 380 rrvn was coated with 3300 S' of Si-doped GaAs.
Charged polycrystal.
実施例1と同様にしてGaAs単結晶を成長させた。A GaAs single crystal was grown in the same manner as in Example 1.
単結晶成長に要した時間は70時間であった。得られた
GaAs結晶棒のうち50%が単結晶化していた。The time required for single crystal growth was 70 hours. 50% of the obtained GaAs crystal rods were single crystallized.
EPD及びキャリア濃度は、種結晶設置端から80mm
の位置でそれぞれ1.5X103/c4.6.2 x
1017/crl、同180喘でそれぞれ1、2 X
103/cm、 1. OX 1018/crAであっ
た。EPD and carrier concentration are 80mm from the seed crystal installation end.
1.5X103/c4.6.2 x at each position
1017/crl, 180/crl, 1 and 2 X, respectively
103/cm, 1. It was OX1018/crA.
実施例 3
実施例2と同様の石英ボードに金属ガリウム1460P
及びクロム(Cr)0.22■をチャージした。Example 3 Metallic gallium 1460P was placed on a quartz board similar to Example 2.
and charged with 0.22 µm of chromium (Cr).
また、封管11のAs封入部にAsを2000S’封入
した。Further, 2000 S' of As was sealed in the As sealed part of the sealed tube 11.
実施例1と同様にして70時間単結晶を成長させた。A single crystal was grown for 70 hours in the same manner as in Example 1.
得られた結晶棒のうち50%が単結晶化していた。Of the obtained crystal rods, 50% were single crystallized.
EPDは種結晶端から80mmの部分で2、5 X 1
03/crrt、同200rrvnの部分で1.1×1
03/ctAであった。EPD is 2.5 x 1 at 80mm from the end of the seed crystal.
03/crrt, 1.1×1 in the same 200rrvn part
It was 03/ctA.
Si含有量(SIMSにより分析)は、同80mmで1
.2 X 1015/crri、同200mmで6 X
1 o14/cdであった。The Si content (analyzed by SIMS) is 1 at 80 mm.
.. 2 x 1015/cri, 6 x at 200mm
It was 1 o14/cd.
実施例 4
下限温度を1232℃、上限温度を1240℃、温度勾
配を1.5℃/肩とした以外は実施例1と同様にしてG
aAs単結晶を成長させた。Example 4 G was produced in the same manner as in Example 1 except that the lower limit temperature was 1232°C, the upper limit temperature was 1240°C, and the temperature gradient was 1.5°C/shoulder.
An aAs single crystal was grown.
得られたGaAs結晶棒のうち55係が単結晶化してい
た。Of the obtained GaAs crystal rods, 55 were found to be single crystallized.
種結晶側端部から80rIr1nの位置でEPD9×1
02/Cmz キャリア濃度は7 X 1017/Cr
flであった。EPD9×1 at a position 80rIr1n from the seed crystal side end
02/Cmz carrier concentration is 7 x 1017/Cr
It was fl.
同230rranの位置でE P D 7 X 10
” 7/cAzキャリア濃度2.3 X 1018/c
nlであった。E P D 7 X 10 at the same 230rran position
” 7/cAz carrier concentration 2.3 x 1018/c
It was nl.
比較例
温度勾配を1.1℃/cm、降温速度を0.6℃/hr
とし、最初種結晶側端部の温度を1234℃に設定し、
上限温度及び下限温度を設けずに従来法によりGaAs
単結晶を成長させた。Comparative example: Temperature gradient: 1.1°C/cm, cooling rate: 0.6°C/hr
At first, the temperature of the end of the seed crystal side was set to 1234°C,
GaAs is produced using the conventional method without setting upper and lower temperature limits.
Grown single crystals.
得られた結晶棒のうち50係が単結晶化していた。Of the obtained crystal rods, 50 pieces were single crystallized.
EPD及びキャリア濃度は種結晶側端部から80rrm
Lの位置で、それぞれ、4 X 103/ca、、 6
.5 X 10”/crll、同200mmの位置で、
それぞれ、2 X 10 ”/c4゜1、8 X 10
18/crilであった。EPD and carrier concentration are 80 rrm from the seed crystal side end.
At position L, 4 x 103/ca, respectively, 6
.. 5 x 10"/crll, at the same 200mm position,
2 x 10"/c4゜1, 8 x 10, respectively
It was 18/cril.
第1図は、従来のGF法の温度分布を示す図である。
第2図は、本発明方法によるGF法の温度分布を示す図
である。
第3図は、GF法による結晶成長装置の縦断面模型図で
ある。
1.2,7.8及び9・・・温度分布曲線、11・・・
封管。FIG. 1 is a diagram showing the temperature distribution of the conventional GF method. FIG. 2 is a diagram showing the temperature distribution of the GF method according to the present invention. FIG. 3 is a vertical cross-sectional model diagram of a crystal growth apparatus using the GF method. 1.2, 7.8 and 9...Temperature distribution curve, 11...
Sealed tube.
Claims (1)
合物単結晶を温度傾斜法によって製造する方法において
、単結晶成長用ボートの温度が、上記無機化合物の融点
から低温側15℃以内の範囲の温度よシ低くならず、か
つ、上記ボートの高温部と低温部の温度差が20℃以内
であることを特徴とする方法。1. In a method for producing a single crystal of an inorganic compound consisting of Group I elements and Group V elements of the periodic table by a temperature gradient method, the temperature of the single crystal growth boat is within 15°C of the lower temperature side from the melting point of the inorganic compound. A method characterized in that the temperature does not drop below that range, and the temperature difference between the high temperature part and the low temperature part of the boat is within 20°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5900882A JPS5938186B2 (en) | 1982-04-09 | 1982-04-09 | Method for producing inorganic compound single crystals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5900882A JPS5938186B2 (en) | 1982-04-09 | 1982-04-09 | Method for producing inorganic compound single crystals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58176193A JPS58176193A (en) | 1983-10-15 |
| JPS5938186B2 true JPS5938186B2 (en) | 1984-09-14 |
Family
ID=13100826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5900882A Expired JPS5938186B2 (en) | 1982-04-09 | 1982-04-09 | Method for producing inorganic compound single crystals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938186B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6287477A (en) * | 1985-10-14 | 1987-04-21 | Hitachi Cable Ltd | 3-Method for manufacturing V group compound semiconductor single crystal |
| JPS62223088A (en) * | 1986-03-26 | 1987-10-01 | Sumitomo Metal Mining Co Ltd | Method for growing compound single crystal |
-
1982
- 1982-04-09 JP JP5900882A patent/JPS5938186B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58176193A (en) | 1983-10-15 |
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