JPS5941190B2 - Manufacturing method of solid state display device - Google Patents
Manufacturing method of solid state display deviceInfo
- Publication number
- JPS5941190B2 JPS5941190B2 JP54010576A JP1057679A JPS5941190B2 JP S5941190 B2 JPS5941190 B2 JP S5941190B2 JP 54010576 A JP54010576 A JP 54010576A JP 1057679 A JP1057679 A JP 1057679A JP S5941190 B2 JPS5941190 B2 JP S5941190B2
- Authority
- JP
- Japan
- Prior art keywords
- row
- column
- electrodes
- substrate
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】 本発明は固体表示装置の製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing a solid-state display device.
近年、基板上に多数の発光ダイオードを行列状に配列し
て画像等の表示を行なう装置が提案されているが、斯る
装置の製造上の最も大きな問題点は多数の発光ダイオー
ドを整然と規則正しく配列することが困難なことである
。本発明は上記点に鑑みてなされたもので以下実施例に
おいて詳述する。In recent years, devices have been proposed that display images, etc. by arranging a large number of light emitting diodes in rows and columns on a substrate, but the biggest problem in manufacturing such devices is how to arrange a large number of light emitting diodes in an orderly and orderly manner. It is difficult to do so. The present invention has been made in view of the above points, and will be described in detail below in Examples.
第1図は第1の工程を示し、平坦な補助基板1上に等間
隔で基板1長に亘つて延びる列電極2、2、・・・・・
が形成される。FIG. 1 shows the first step, in which column electrodes 2, 2, .
is formed.
補助基板1としては表面に酸化膜を有するシリコン結晶
板が好適であるが、その他セラミック板も使用できる。
第2図は第2の工程を示し、燐化ガリウム結晶からなる
緑色発光ダイオードペレット4が準備される。A silicon crystal plate having an oxide film on the surface is suitable as the auxiliary substrate 1, but other ceramic plates can also be used.
FIG. 2 shows the second step, in which a green light emitting diode pellet 4 made of gallium phosphide crystal is prepared.
該ペレットはその表面両主面に平行なPN接合面5を有
し、更にその裏主面に行列配置の裏電極(即ちP側オー
ミック電極)6、6・・・・・・を備えると共に表主面
に、裏電極6の各々に対応する窓Tを有し、上記行列配
置の行方向にて連続する表電極(即ちN側オーミック電
極)8、8・・・・・・を備えている。第3図は第3の
工程を示し、ペレット4の裏主面より行及び列方向の溝
9、10を刻設して、上記各裏電極下のPN接合が分離
される。The pellet has a PN junction surface 5 parallel to both its front and main surfaces, and is further provided with back electrodes (i.e., P-side ohmic electrodes) 6, 6, arranged in rows and columns on its back main surface. It has a window T corresponding to each of the back electrodes 6 on its main surface, and includes front electrodes (i.e., N-side ohmic electrodes) 8, 8, . . . that are continuous in the row direction of the matrix arrangement. . FIG. 3 shows the third step, in which grooves 9 and 10 are carved in the row and column directions from the back main surface of the pellet 4, and the PN junctions under each of the back electrodes are separated.
第4図は第4の工程を示し、上記ペレット4の裏面が補
助基板1上に固着される。FIG. 4 shows the fourth step, in which the back surface of the pellet 4 is fixed onto the auxiliary substrate 1.
このとき、同→リに属する裏電極6が補助基板1の対応
する各列電極2に整列するべく配置され、そして対応す
る裏電極6と列電極2とは導電性接着剤で固着され、又
必要に応じてその他のペレット裏主面と補助基板1表面
とは適当な絶縁性接着剤で強固に固着される。第5図は
第5の工程を示し、ペレット4表主面より上記行方向の
溝9、9・・・・・・に対応し、該溝に達する切り込み
11を設け、ペレット4が各行毎に分離される。At this time, the back electrodes 6 belonging to the same group are arranged to be aligned with the corresponding column electrodes 2 of the auxiliary substrate 1, and the corresponding back electrodes 6 and column electrodes 2 are fixed with a conductive adhesive, and If necessary, the other main surfaces on the back side of the pellet and the surface of the auxiliary substrate 1 are firmly fixed with a suitable insulating adhesive. FIG. 5 shows the fifth step, in which cuts 11 are provided that correspond to and reach the grooves 9, 9, . . . in the row direction from the main surface of the pellet 4, and the pellets 4 are separated.
この工程における上記の切り込みは通常ダイシング方法
により行なわれるが、ペレット4の裏主面側より予め適
当深さの溝9、9・・・・・・が刻設されているので、
上記切り込み作業はペレット4を傷めることなく、容易
になされる。第6図は最終工程を示し、別途形成した絶
縁性の主基板15上に既述の補助基板1が複数個並置固
着され、その後各補助基板の列電極2の各々と主基板1
5に設けられた外部列端子16の各々との間、及び左側
ペレツトの各表面電極8と主基板15に設けられた共通
行端子17の各々との間、更に各ペレツト4,4の対応
する表面電極8相互が夫々金属細線18にて結合される
。上記装置において、外部列端子16及び行端子17の
各々に選択的に順方向電圧を印加すると選択された行及
び列電極の交点にあるPN接合部分にて緑色発光が生じ
、斯る発光は直上の電極窓7を経て上方に取り出され、
2個のペレツト4,4により例えば2桁の文字が表示さ
れる。The above-mentioned cuts in this step are usually performed by a dicing method, but since grooves 9, 9, etc. of an appropriate depth are previously cut from the back main surface side of the pellet 4,
The above-mentioned cutting operation can be easily performed without damaging the pellet 4. FIG. 6 shows the final step, in which a plurality of the above-mentioned auxiliary substrates 1 are juxtaposed and fixed on an insulating main substrate 15 formed separately, and then each of the column electrodes 2 of each auxiliary substrate and the main substrate 1 are fixed.
between each of the external column terminals 16 provided on the main substrate 15, and between each of the surface electrodes 8 of the left pellet and each of the common row terminals 17 provided on the main substrate 15; The surface electrodes 8 are connected to each other by thin metal wires 18, respectively. In the above device, when a forward voltage is selectively applied to each of the external column terminals 16 and row terminals 17, green light emission occurs at the PN junction at the intersection of the selected row and column electrodes, and such light emission occurs directly above. is taken out upward through the electrode window 7 of
For example, a two-digit character is displayed by the two pellets 4,4.
このとき、燐化ガリウム結晶における緑色光は、該結晶
のバンド間エネルギよりも小さい波長を有しているので
結晶内で比較的減衰し易く、上記直上以外の他の電極窓
に向う場合結晶内光路長がより大となるので減衰が大き
く他の電極窓からの放出量は無視できる。尚上記実施例
において、行と列との関係は逆にしてもよく、又表電極
8は当初各行が全て連続する形状にしてよいことは勿論
である。At this time, the green light in the gallium phosphide crystal has a wavelength smaller than the interband energy of the crystal, so it is relatively easily attenuated within the crystal. Since the optical path length is larger, the attenuation is large and the amount of light emitted from other electrode windows can be ignored. In the above embodiment, the relationship between rows and columns may be reversed, and it goes without saying that the front electrodes 8 may initially have a shape in which all rows are continuous.
以上の説明より明らかな如く、本発明によればペレツト
を補助基板上に固定した状態で実質的に個々の発光ダイ
オードに分離すると共に、その分離に際し、予めベレツ
ト裏主面に所定の溝を刻設しておきペレツト表主面より
斯る溝に対応して切り込みを設けるものであるから、多
数の発光ダイオードを補助基板上に容易に整然と規則正
しく配列することができ、又このため表示品質の向上を
図ることができ、更に表面電極は行(又は列)毎に共通
となつているから金属細線による配線作業も簡単となり
、更には上記の如きペレツトを有する補助基板を主基板
の上に並置するものであるから容易に装置の大型化を図
ることができる。As is clear from the above description, according to the present invention, the pellet is substantially separated into individual light emitting diodes while being fixed on the auxiliary substrate, and when the pellet is separated, predetermined grooves are carved in the back main surface of the pellet in advance. Since a cut is made corresponding to the groove from the main surface of the pellet, a large number of light emitting diodes can be easily and regularly arranged on the auxiliary substrate, and the display quality can be improved. Furthermore, since the surface electrodes are common to each row (or column), wiring work using thin metal wires is also simplified, and furthermore, the auxiliary substrate having pellets as described above can be placed side by side on the main substrate. Therefore, it is possible to easily increase the size of the device.
第1図及至第6図は本発明実施例を示す工程別斜視図で
ある。FIGS. 1 to 6 are perspective views showing steps of an embodiment of the present invention.
Claims (1)
バンド間エネルギよりも小さい波長の光を放出する発光
ダイオードペレットを形成する工程、該ペレットの裏主
面に行列配置の裏電極を設けると共に表主面に上記裏電
極の各々に対応する窓を有し少なくとも上記行列配置の
行(又は列)方向にて連続する表電極を設け、更に上記
裏主面より行及び列方向の溝を刻設して、上記各裏電極
下のPN接合を分離する工程、補助基板上に上記行列配
置の列(又は行)方向に延びる配線電極を設ける工程、
同一列(又は行)に属する上記裏電極を上記基板の対応
する列(又は行)の配線電極に整列固着する工程、上記
基板上に固着されたペレットの表主面より上記行(又は
列)方向の溝に対応し、かつ該溝に達する切り込みを設
ける工程、上記補助基板を複数個主基板上に並置固着す
る工程を具備する固体表示装置の製造方法。1. A process of forming a light emitting diode pellet that has parallel PN junctions on both the front and back main surfaces and emits light of a wavelength smaller than the interband energy of the semiconductor crystal, and a back electrode arranged in a matrix on the back main surface of the pellet. In addition, a front electrode having a window corresponding to each of the back electrodes on the front main surface and continuous at least in the row (or column) direction of the matrix arrangement is provided, and further grooves extending from the back main surface in the row and column directions are provided. a step of carving and separating the PN junctions under each of the back electrodes; a step of providing wiring electrodes extending in the column (or row) direction of the matrix arrangement on the auxiliary substrate;
A step of aligning and fixing the back electrodes belonging to the same column (or row) to the wiring electrodes in the corresponding column (or row) of the substrate, from the main surface of the pellet fixed on the substrate to the row (or column) A method for manufacturing a solid-state display device, comprising the steps of: providing a cut corresponding to and reaching the groove in the direction; and fixing a plurality of the above-mentioned auxiliary substrates side by side on the main substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54010576A JPS5941190B2 (en) | 1979-01-31 | 1979-01-31 | Manufacturing method of solid state display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54010576A JPS5941190B2 (en) | 1979-01-31 | 1979-01-31 | Manufacturing method of solid state display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55103588A JPS55103588A (en) | 1980-08-07 |
| JPS5941190B2 true JPS5941190B2 (en) | 1984-10-05 |
Family
ID=11754054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54010576A Expired JPS5941190B2 (en) | 1979-01-31 | 1979-01-31 | Manufacturing method of solid state display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941190B2 (en) |
-
1979
- 1979-01-31 JP JP54010576A patent/JPS5941190B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55103588A (en) | 1980-08-07 |
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