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JPS5943526A - Manufacture of resin sealed type electronic part - Google Patents
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JPS5943526A - Manufacture of resin sealed type electronic part - Google Patents

Manufacture of resin sealed type electronic part

Info

Publication number
JPS5943526A
JPS5943526A JP57154106A JP15410682A JPS5943526A JP S5943526 A JPS5943526 A JP S5943526A JP 57154106 A JP57154106 A JP 57154106A JP 15410682 A JP15410682 A JP 15410682A JP S5943526 A JPS5943526 A JP S5943526A
Authority
JP
Japan
Prior art keywords
resin
die
lead frame
sealed
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57154106A
Other languages
Japanese (ja)
Inventor
Hirokuni Mamiya
間宮　洋邦
Teruyoshi Shibata
柴田　輝義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP57154106A priority Critical patent/JPS5943526A/en
Publication of JPS5943526A publication Critical patent/JPS5943526A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable to continuously produce multikind parts of a small quantity as well as to reduce the percentage of rejects by a method wherein, after a lead frame has been pinched between forming materials and formed in one body with a composite tablet, an element is die-inner bonded on the molded article, and said element is sealed by performing a potting. CONSTITUTION:The upper and lower surfaces of a metal lead frame 1 are pinched with the forming material consisting of phenol resin, epoxy resin and the like, and after they are formed in one body with a composite table 6, they are formed by performing a compression molding. Subsequently, after an element 2 has been die-inner bonded on a molded article 7, the element 2 is sealed by performing a potting 9 using a casting material consisting of phenol resin, epoxy resin and the like, and a resin sealed type electronic part is obtained. In order to improve the adhesive property of the forming material and the casting material, an activating process such as a pretreatment, a coating process and the like may be performed on the surface of the element, where die-inner bonding was performed, and on the surface of the lead frame.

Description

【発明の詳細な説明】 本発明は電子機器、電気機器等に用いられる樹脂封止型
電子部品の！！！！造方法に関するもので、その目的と
するところは生爪多品種生産、連続生産を可能ならしめ
且つ不良発生率を低下せしめることＫある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to resin-sealed electronic components used in electronic equipment, electrical equipment, etc. ! ! ! This relates to a manufacturing method, and its purpose is to enable the production of a wide variety of raw nails, continuous production, and to reduce the rate of defects.

従来の樹脂封止バｌＪ電子部品の製造方法は第１図に示
すようにリードフレームｌに素子２をダイボンディング
してからインナーボンティング８し次にバンシベーショ
ン４してカラトランスファー成１囮１．で素子を樹脂５
で封屯して樹脂封止型電子部品を得るもので、大量少品
種生ρ４、バッチ生産に好適であるが少１牧多品種生産
、連続生産に不向きで且つ不良発生率も６〜７％と高い
ものであった。The conventional manufacturing method for resin-sealed electronic parts is as shown in FIG. ．． The element is made of resin 5
It is suitable for high-volume, small-variety production, ρ4, batch production, but is unsuitable for small-scale, high-mix production, continuous production, and has a defect rate of 6 to 7%. It was very expensive.

本発明ｔ」上記欠点を解決するもので、リードフレーム
の士「面金成形材料で挾み複合タブレットに一体化して
から成形後、該成形品に素子をダイインナーボンディン
グしてから素子２　ボンディングで封１にするため少量
多品種生産、連続生産をＭｌ能ならしめ且つ不良発生率
を１〜２％に低下させることができだものである。The present invention solves the above-mentioned drawbacks.The lead frame is sandwiched with a metal molding material and integrated into a composite tablet, and after molding, the element is die-inner bonded to the molded product, and then the element 2 is bonded. In order to reduce the number of seals, it is possible to make small-lot, high-mix production and continuous production more efficient, and to reduce the defect rate to 1 to 2%.

以下本発明の一実施例を第２図のＩＷ＋而にまり貯〜明
する。１　）」金属製リードプレー１・で、リーじフＶ
−ム１の上Ｆ　而’ｓ）　７エフール樹１１ｉｆ、エポ
キシ樹脂、不飽和ボリエヌデル樹脂、ジアリルフタレー
トζ９１脂、シリコン樹脂、・′ラミンｊ＋・・１脂、
ポリアミド、ポリイミド、ボリフ゛タジ］ニン、ポリス
ルフォン、ボリウレクン等の単独又Ｑｊ混合物又ｔ」ｙ
；４性物からなる成形材料で挾み複合タブレアトロ（で
一体化してから圧縮成形等で成形後、Ｊ々＋：′ｉ、形
品７に素子２ｆ６：ダイインナーボンディング８してか
ら素子２全フ丁ノール樹脂、エボギシ樹脂、イ＜　＋ｊ
ｉ・（「［Ｊポリｌステル１１！Ｉｌ　脂、ジアリルフ
タレ−１−＋ηｌ　脂、シリフン（６寸１ｉ旨、５３ミ
リアミド、ポリイミド、−１！すブタジェン、ポリスル
フォン、ポリウレタン等の中独又は９１．４１物又は研
・ｌ’ｌ□　’ｈ＋からなる注形材でボッティング９で
封１トして（Ｉ７１脂封＋、ｌｘ型１Ｆ、子部品を得る
ものである。なりぶ了、ｑ゛イインリーボンデイングり
−ｌ−′７レーム表面に！戊形材判や注形材との接着ｆ
１を・向上させるだめの−ＩＩ処理、］−ティング処＋
ＩＪ１等（７）活性化処理音節し２−Ｃ棧くこともでき
るものであン）、以ト１？ｈ！明したように本発明の＋
、：１＋脂封１に型７（ｆ、子部品の製造方法によれば
少ＦｆＬ多品挿生産、連続生戸Ｃ全実現することができ
且つリードフレームの変形が全くないため不良発生率を
従来方？Ｊξより５％低［さすることができたものであ
る。An embodiment of the present invention will be explained below based on IW+ in FIG. 1)"Metal lead play 1, leaf V
7 Efur resin 11if, epoxy resin, unsaturated Boriendel resin, diallyl phthalate ζ91 resin, silicone resin, Lamin j+...1 resin,
Single or mixture of polyamide, polyimide, polyvinyl, polysulfone, polyurecne, etc.
; Sandwiched with a molding material consisting of four properties, integrated with a composite table atro (and then molded by compression molding etc.), J+:'i, molded product 7, element 2f6: die inner bonding 8, then element 2 Futonol resin, Ebogishi resin, i < +j
i. Seal with botting 9 using a casting material consisting of 41 parts or 1'l□'h+ (I71 fat seal +, lx type 1F, to obtain the child parts. Iinri Bonding - l-'7 On the surface of the frame! Adhesion with molded materials and cast materials f
-II processing to improve 1, ]-ting processing +
IJ1, etc. (7) Activation processing syllables can also be used as 2-C. h! As explained above, the +
,: 1 + Grease seal 1 to mold 7 (f) According to the manufacturing method of the sub-components, it is possible to achieve low FfL multi-item insertion production, continuous raw door C, and there is no deformation of the lead frame, so the defect rate is reduced. 5% lower than the conventional method?Jξ.

【図面の簡単な説明】[Brief explanation of the drawing]

牟ｊｌｉン１に従来の１．’、’１指封（ト型重了部品
の１Ｌｆｕ　Ｉ！！ｉ方法の簡略Ｔ１（−図、：’ｎ　
２１図＋１本発明による＋Ｙｆ１脂封＋ト’！１シ゛取
子部品の叫＋＋’ｊ　］Ｊ法の簡略工程図である。 ■（・Ｊリードフレーム、２は素子、８はインナーボン
ディング、４１・Ｊバ、シベー・・４ン、　５１：１　
ｊ’ｐＪ　ＩＩ？（，６は複合メブレ、ト、７　ｋＪ、
　Ｉｊ’ｊ　’ｌジ品、８　ｉｆダイインナーボンディ
ング、９　）：ｊ　＋１ｒ　、、フ゛イングである。 特Ｗ「出願人 松ト１１．工（′１式会社 代用１人）「却下　竹　元　倣　九 （に１か２名） ェ）”ｔ　１　ｊ、Ｊ 第２ｒり１ １ ７ ／The conventional 1. ',' 1 finger seal (1Lfu I!!i method of 1 finger seal (-Fig., :'n
Figure 21+1+Yf1 fat sealing +to' according to the present invention! This is a simplified process diagram of the J method for 1-shield lever parts. ■(・J lead frame, 2 is element, 8 is inner bonding, 41・J bar, side...4, 51:1
j'pJ II? (, 6 is a composite mesh, 7 kJ,
Ij'j'lji product, 8 if die inner bonding, 9): j +1r, . Special W "Applicant Matsuto 11. Eng ('1 type company substitute 1 person) "Rejected Takemoto imitation 9 (1 or 2 people) e)"t 1 j, J 2nd rri 1 1 7 /

Claims (1)

【特許請求の範囲】[Claims] （１）　　リードフレームの上下面を成形材料で挾み複
合タブレットに一体化してから成形後、該成形品に素子
をダイインナーボンディングしてから素子をボッティン
グで封止することを特徴とする樹脂封止型電子部品のｍ
進方法。(1) A resin characterized in that the upper and lower surfaces of a lead frame are sandwiched between molding materials and integrated into a composite tablet, and after molding, an element is die-inner bonded to the molded product, and then the element is sealed by botting. m of sealed electronic components
How to proceed.
JP57154106A 1982-09-03 1982-09-03 Manufacture of resin sealed type electronic part Pending JPS5943526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57154106A JPS5943526A (en) 1982-09-03 1982-09-03 Manufacture of resin sealed type electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57154106A JPS5943526A (en) 1982-09-03 1982-09-03 Manufacture of resin sealed type electronic part

Publications (1)

Publication Number Publication Date
JPS5943526A true JPS5943526A (en) 1984-03-10

Family

ID=15577049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57154106A Pending JPS5943526A (en) 1982-09-03 1982-09-03 Manufacture of resin sealed type electronic part

Country Status (1)

Country Link
JP (1) JPS5943526A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
JPH09213826A (en) * 1996-02-01 1997-08-15 Nec Corp package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
JPH09213826A (en) * 1996-02-01 1997-08-15 Nec Corp package
US5905301A (en) * 1996-02-01 1999-05-18 Nec Corporation Mold package for sealing a chip

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