JPS5944150B2 - How to drill holes in metal plates using laser - Google Patents
How to drill holes in metal plates using laserInfo
- Publication number
- JPS5944150B2 JPS5944150B2 JP52077378A JP7737877A JPS5944150B2 JP S5944150 B2 JPS5944150 B2 JP S5944150B2 JP 52077378 A JP52077378 A JP 52077378A JP 7737877 A JP7737877 A JP 7737877A JP S5944150 B2 JPS5944150 B2 JP S5944150B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- laser
- laser beam
- hole
- spot diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title claims description 32
- 229910052751 metal Inorganic materials 0.000 title claims description 32
- 238000005553 drilling Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 7
- 229910001882 dioxygen Inorganic materials 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
本発明はレーザにより金属板に穴あけを行う方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for drilling holes in a metal plate using a laser.
従来、Ｃ０２レーザを用いて金属板に穴あけを行ラ場合
、第１図に示すように、レーザの焦点を金属板表面に一
致させるか、あるいは近づけた状態（主に金属表面にお
けるレーザ光パワー密度の９０％以上の範囲内）で、酸
素ガスを吹きつけながらレーザ光を照射する方法が採ら
れてきた。Conventionally, when drilling a hole in a metal plate using a C02 laser, as shown in Fig. (within a range of 90% or more), a method of irradiating laser light while blowing oxygen gas has been adopted.
しかし、この方法により加工できる穴の直径は、金属表
面におけるレーザ光のスポット径にほぼ一致する大きさ
であり、それ以上の大きな穴をあける事は不可能である
。例えば、出力２５ＯＷ（７）Ｃ０２レーーザで厚さ２
ｎの軟鉄板に穴をあける場合、穴径は０．５ｍｍ以下で
ある。又この方法により厚い金属板に穴あけを行う場合
、第２図に示すように、穴径が小さいため、補助ガスの
酸素ガスが十分に穴の奥のレーザ照射部まで到達せず、
穴が金属板裏面迄貫通しない欠点がある。より大きな径
の穴、例えば２ｍｍ径の穴を金属板にあける場合には、
金属板か集光光学系のどちらか一方を円形に移動させて
穴径を拡大する方法があるが、金属板が容易に動かせな
い場合が多く、光学系を動かす場合には、その機構がか
なり複雑で高価になるという欠点がある。However, the diameter of the hole that can be processed by this method is approximately the same as the spot diameter of the laser beam on the metal surface, and it is impossible to make a hole larger than that. For example, a thickness of 2 with an output of 25 OW(7) C02 laser.
When making a hole in a soft iron plate of n, the hole diameter is 0.5 mm or less. In addition, when drilling a hole in a thick metal plate using this method, as shown in Figure 2, because the hole diameter is small, the oxygen gas of the auxiliary gas does not reach the laser irradiation part deep in the hole.
There is a drawback that the hole does not penetrate all the way to the back of the metal plate. When drilling a hole with a larger diameter, for example a 2mm diameter hole, in a metal plate,
There is a way to enlarge the hole diameter by moving either the metal plate or the condensing optical system in a circular manner, but in many cases the metal plate cannot be moved easily, and the mechanism is quite difficult to move when moving the optical system. The disadvantage is that it is complex and expensive.
又、焦点を金属表面から遠ざけ金属表面でのレーザ光の
スポット径を大きくした状態で穴あけする方法が考えら
れるが、穴あけ可能のレーザパワー密度を維持するため
には、高出力のレーザ発振器が必要となり、非常に高価
な装置となつてしまう。本発明は以上に述べた問題に鑑
みなされたもので、その目的は、金属板にレーザ光焦点
のスポット径の数倍の直径の穴を容易にしかも安価にあ
ける方法を提供するにある。Another possible method for drilling holes is to move the focus away from the metal surface and increase the spot diameter of the laser beam on the metal surface, but in order to maintain the laser power density that allows drilling, a high-power laser oscillator is required. This results in a very expensive device. The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a method for easily and inexpensively drilling a hole in a metal plate having a diameter several times the spot diameter of a laser beam focal point.
以下第３図により本発明を具体的に説明する。The present invention will be specifically explained below with reference to FIG.
加工時、Ｃ０２レーザ発振器６の出力光Ｔは、シャッタ
装置８を通り、集光レンズ９、補助ガス噴射ノズル１０
を通つて被加工金属板１１に照射される。非加工時には
、出力光Ｔはシャッタ装置８に吸収される。補助ガス噴
射ノズル１０の噴射口１２はレーザ焦点１３よりわずか
にレンズ側に位置しており、レンズ９とノズル１０は光
学系移動装置１４に取りつけられて上下方向にスラィィ
’ト゜する。ノズル１０にはパイプ１５を介して電磁弁
１６が取りつけられ、酸素ガス供給装置１７からの酸素
ガスの供給、停止を行う。加工開始時、シャッタ８は開
状態となり、レーザ光はレンズ９ノズル１０を通つて金
属板１１に照射されるが、レンズ９、ノズル１０は上位
に位置して、レーザ光焦点１３は、第４図に示すように
、金属板表面から離れており、金属板表面のスポツト径
１８は１．０ｍｍから２．５ｍｍである。During processing, the output light T of the C02 laser oscillator 6 passes through the shutter device 8, the condensing lens 9, and the auxiliary gas injection nozzle 10.
The metal plate 11 to be processed is irradiated through the beam. During non-processing, the output light T is absorbed by the shutter device 8. The injection port 12 of the auxiliary gas injection nozzle 10 is located slightly closer to the lens than the laser focal point 13, and the lens 9 and nozzle 10 are attached to an optical system moving device 14 to slide vertically. A solenoid valve 16 is attached to the nozzle 10 via a pipe 15 to supply and stop oxygen gas from an oxygen gas supply device 17. At the start of processing, the shutter 8 is in an open state, and the laser beam passes through the lens 9 and the nozzle 10 and is irradiated onto the metal plate 11. However, the lens 9 and the nozzle 10 are located at the upper position, and the laser beam focus 13 As shown in the figure, the spot is away from the surface of the metal plate, and the spot diameter 18 on the surface of the metal plate is 1.0 mm to 2.5 mm.
この状態でレーザ光は金属板表面に吸収され金属板表面
が赤熱する。次に第５図に示すようにレーザ光を照射し
ながら光学系移動装置１４を下位に移動させ、レーザ光
焦点１３を金属板表面１１に近づけ、同時に電磁弁１６
を開けてノズル１０から酸素ガスを噴射すると金属板１
１には直径１．５ｍｍ以上の穴１９が容易に加工できる
。これは加工開始時、第４図に示す状態でレーザ照射す
ると第６図のように金属表面が直径１．０〜２．５ｍｍ
の範囲２０で赤熱し、次に第５図に示す状態でレーザ照
射しながら補助ガスを吹きつけると、第６図に示した赤
熱部が、ビーム焦点の照射を受けた中心部の溶融ととも
に大部分が溶融し、酸化し、ふきとばされ、第７図のよ
うな穴１９があけられるのである。第３図に示す装置構
成により実験を行つたところ、出力２５０Ｗｆ）ＣＯ２
レーザにより、厚さ５．８能の軟鉄板に直径２ｍｍの穴
を再現性良くあけることができた。一方、同じ２５０Ｗ
（７）ＣＯ２レーザを第１図に示す従来方法で厚さ５．
８ｍｍの軟鉄板に照射したところ、表面に直径０．５ｍ
７７！の穴があいたが、裏面には貫通せず本発明の優位
囲が確認された。In this state, the laser beam is absorbed by the surface of the metal plate, causing the surface of the metal plate to become red-hot. Next, as shown in FIG. 5, while irradiating the laser beam, the optical system moving device 14 is moved downward to bring the laser beam focus 13 close to the metal plate surface 11, and at the same time, the solenoid valve 16
When the metal plate 1 is opened and oxygen gas is injected from the nozzle 10,
1 can be easily machined with a hole 19 having a diameter of 1.5 mm or more. When the laser is irradiated in the state shown in Figure 4 at the start of processing, the metal surface will have a diameter of 1.0 to 2.5 mm as shown in Figure 6.
When the area 20 becomes red hot, and then auxiliary gas is blown while irradiating the laser in the condition shown in Figure 5, the red hot area shown in Figure 6 melts in the center area irradiated by the beam focus, and becomes large. The portion is melted, oxidized, and blown off to form a hole 19 as shown in FIG. When an experiment was conducted using the equipment configuration shown in Figure 3, the output was 250Wf) CO2
Using a laser, we were able to drill holes with a diameter of 2 mm in a 5.8 mm thick soft iron plate with good reproducibility. On the other hand, the same 250W
(7) The CO2 laser was heated to a thickness of 5.5 mm using the conventional method shown in FIG.
When an 8mm soft iron plate was irradiated, a diameter of 0.5m appeared on the surface.
77! Although a hole was formed, the hole did not penetrate through the back surface, confirming the superiority of the present invention.
第１図は従来のレーザによる金属板の穴あけ方法を説明
するための図、第２図は従来の方法によりあけられる非
貫通穴の断面図、第３図、第４図、第５図は本発明方法
を説明するための図、第６図と第７図は本発明方法の原
理を説明するための図である。
なお図において、１・・・レーザ光、２・・・レンズ、
３・・・ノズル、４・・・被加工金属板、５・・・補助
ガス、６・・・ＣＯ２レーザ発振器、７・・ルーザ光、
８・・・シャツタ装置、９・・・集光レンズ、１０・・
・補助ガス噴射ノズル、１２・・・噴射口、１３・・・
レーザ焦点、１４・・・光学系移動装置、１６・・・電
磁弁、１７・・・酸素ガス供給装置、１８・・・金属板
表面におけるレーザスポツト径、１９・・・貫通穴。Figure 1 is a diagram for explaining the conventional method of drilling a hole in a metal plate using a laser, Figure 2 is a cross-sectional view of a non-through hole drilled by the conventional method, and Figures 3, 4, and 5 are from the book. Figures 6 and 7 are diagrams for explaining the principle of the method of the invention. In the figure, 1...laser light, 2...lens,
3... Nozzle, 4... Metal plate to be processed, 5... Auxiliary gas, 6... CO2 laser oscillator, 7... Loser light,
8... Shaft device, 9... Condensing lens, 10...
- Auxiliary gas injection nozzle, 12... injection port, 13...
Laser focal point, 14... Optical system moving device, 16... Solenoid valve, 17... Oxygen gas supply device, 18... Laser spot diameter on metal plate surface, 19... Through hole.
Claims (1)
おいて、レーザ光を集光し、その接点を被加工金属板表
面より離れた位置に保持し、金属板表面におけるレーザ
光のスポット径が焦点におけるスポット径より大きい状
態でレーザ光を照射し、被加工金属板のレーザ照射部が
赤熱した時レーザ光を照射したままレーザ光焦点を被加
工金属板に急速に近づけ、同時に加工部に酸素ガスを吹
きつけて、金属板にレーザ光の焦点におけるスポット径
より大きい径の穴をあけることを特徴としたレーザによ
る金属板の穴あけ方法。1 In a method of drilling holes in a metal plate by irradiating a laser beam, the laser beam is focused, the contact point is held at a position away from the surface of the metal plate to be processed, and the spot diameter of the laser beam on the surface of the metal plate is focused. When the laser beam is irradiated with a spot diameter larger than the spot diameter of the workpiece metal plate, and when the laser irradiation part of the workpiece metal plate becomes red-hot, the laser beam focus rapidly approaches the workpiece metal plate while the laser light is being irradiated, and at the same time oxygen gas is applied to the workpiece part. A method for drilling a metal plate using a laser, the method comprising blowing a hole in the metal plate with a diameter larger than the spot diameter at the focal point of the laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52077378A JPS5944150B2 (en) | 1977-06-28 | 1977-06-28 | How to drill holes in metal plates using laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52077378A JPS5944150B2 (en) | 1977-06-28 | 1977-06-28 | How to drill holes in metal plates using laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5411593A JPS5411593A (en) | 1979-01-27 |
| JPS5944150B2 true JPS5944150B2 (en) | 1984-10-26 |
Family
ID=13632223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52077378A Expired JPS5944150B2 (en) | 1977-06-28 | 1977-06-28 | How to drill holes in metal plates using laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944150B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240393A (en) * | 1984-05-16 | 1985-11-29 | Komatsu Ltd | Cutting method using a laser cutting machine |
| US5916462A (en) * | 1993-09-13 | 1999-06-29 | James; William A. | Laser drilling processes for forming an apertured film |
| JP3292021B2 (en) * | 1996-01-30 | 2002-06-17 | 三菱電機株式会社 | Laser processing method and laser processing apparatus |
-
1977
- 1977-06-28 JP JP52077378A patent/JPS5944150B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5411593A (en) | 1979-01-27 |
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