JPS5944394B2 - Electroplated plate stacking device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for stacking electrodeposited plates separated from a cathode mother plate.

Conventionally, to stack a predetermined number of electrodeposited plates peeled from the cathode plate, the electrodeposited plates peeled off from the cathode plate were stacked along a chute or guide as shown in Japanese Patent Publication No. 46-38883. However, in this case, in the process of peeling off, the electrodeposited plates fall while falling, and while they are falling and being transferred to the stacking position, noise is generated and unevenness occurs when stacking. This has the disadvantage that the stacking process may be hindered due to the stacking or scattering.

An object of the present invention is to provide an electrodeposited plate stacking device that eliminates the drawbacks of the conventional devices and can reliably transfer electrodeposited plates to a stacking position without causing noise, irregularities, scattering, etc. shall be.

The present invention will be described below based on embodiments shown in the drawings.
1 and 2 show a first embodiment of the invention,
A first elevating mechanism 2 and a rotating drum mechanism 3 are arranged below a conventionally known peeling mechanism 1, and the first elevating mechanism 2 has a support 4 provided almost vertically and a support 4 that is movable up and down. Consisting of a support stand 5, a drive motor 6 for appropriately moving the support stand 5 between the upper position and the lower position of the support column 4 as desired, and a weight 28 connected to the support stand 5 via a wire T. has been done.

Further, the rotating drum mechanism 3 has two outer plates 11 provided on a rotating shaft 9 provided in the machine frame 8, facing each other with the first elevating mechanism 2 in between, and having an interval for receiving the electrodeposited plate 10. ,
A plurality of partition plates 12 facing the rotating shaft 9 are fixedly provided inside both outer plates 11, so that a plurality of partition chambers 13 are formed by the outer plates 11 and the partition plates 12.

Further, on the side of the rotating drum mechanism 3, there is provided a first conveyor 14 having one end located between both outer plates 11 and having a horizontal conveying surface at approximately the same height as the rotating shaft 9. It is being

A pair of rails 15 are provided on the other side of the first conveyor 14, and are movable and actuated by a drive source 2T between a position approaching the first conveyor 14 and a position away from the first conveyor 14. A stacking mechanism 18 having a gripping member IT operated by the member 16 is provided, and a second elevating mechanism 19 having a mounting surface that can move up and down is provided below this stacking mechanism 18. A second conveyance conoveyor 20 is provided on the side of the second elevating device 19 and has approximately the same height as the placement surface when the placement surface is in the lower position. Next, the operation of the above will be explained. Transfer mechanism (
(not shown), the cathode plates P are transported in parallel by
Peeling mechanism 1 removes cathode mother plate P.

The electrodeposited plate 10 is adjacent to the cathode plate P and the cathode mother plate PO.
The electrodeposited plate 10 is then peeled off in an almost vertical state by the chute 21, and then falls with its direction regulated by the chute 21. As a result, the lower end of the electrodeposited plate remains on the support stand 5 while remaining vertical. When the support base 5 is lowered by the operation of the drive motor 6, both sides of the lower end of the electrodeposited plate 10 are lowered within the partition chamber 13 of the rotating drum mechanism 3 and are connected to the partition plate 12 provided inside the both outer plates 11. The rotating shaft 9 is rotated by a predetermined angle by a drive motor (not shown) at the time of this contact, so that both outer plates 11
rotates until the next partition 13 is positioned below the support base 5 and stops there. Due to this rotation of the outer plate 11, the electrodeposited plate 10 comes into contact with the partition plate 12 in front of the partition chamber 13 and maintains this state. When the outer plate 11 advances one pitch in this manner, the support base 5 is moved to the upper position by the drive motor 6 and the weight 28, and is prepared for the next lowering of the electrodeposited plate 10. Then, the electrodeposited plate 10 is located in each partition chamber 13, and when the electrodeposited plate 10 becomes almost horizontal after advancing a predetermined pitch, the electrodeposited plate 10 is placed on the first conveyor 14 in the middle thereof. The stacking mechanism 180 is placed thereon, and the operating member 16 of the stacking mechanism 180 is actuated, the gripping member 17 grips the tip of the electrodeposited plate 10, and the stacking mechanism 18 moves away from the first conveyor 14. At the end of this movement, the rear end of the electrodeposited plate descends along the guide 29 and comes into contact with the mounting surface of the second elevating mechanism 19. After that, when the gripping member 17 releases the tip of the electrodeposited plate 10, the electrodeposited plate 10 is moved. Since the electrodeposited plate 10 is placed on the placement surface of the second elevating mechanism 19 in order from the middle portion toward the tip, noise caused by falling is significantly reduced. The second elevating mechanism 19 that received the electrodeposited plates 10 is sequentially lowered by a driving source (not shown), and receives a predetermined number of electrodeposited plates 10 while always keeping the falling distance of the electrodeposited plates 10 the same. Then, when the mounting surface thereof is placed below the conveyance surface of the second conveyor 20, the stacked electrodeposited plates 10 are conveyed outward by the second conveyor 20. 3 and 4 show a second embodiment of the present invention, and in this embodiment, the peeling mechanism 1, the first lifting mechanism 2, and the rotating drum mechanism 3 have the same structure as the first embodiment. The first conveyor 14 is disposed obliquely toward the outside of the rotating drum mechanism 3, and a third conveyor 14 is provided at the tip of the first conveyor 14.
A conveyor 22 is continuously provided, and this third conveyor 22 is composed of two conveyor sections 23, and the outside of each conveyor section 23 is fixed to a rotating shaft 25 rotatably provided on a machine frame 24. has been done. Also, the third conveyor 22
A third elevator 26 similar to the second elevator in the first embodiment is provided below. Next, the operation of the above will be explained.

As in the first embodiment, the peeled electrodeposited plate 10 is lowered by the first elevating mechanism 2 and placed in each partition chamber 13 of the rotating drum mechanism 3. If it is placed on top, the inclination of the first conveyor 14 will cause
It is transported outward along the upper surface of the third transport conveyor 2.
Reach 2.

Then, when it reaches a predetermined position on the third conveyor 22,
The rotation axis 2 of both conveying sections 23 is controlled by an actuating member (not shown).
5 rotates to swing both conveying sections 23 downward relative to each other, opening wider between the two conveying sections than the width of the electrodeposited plate 10, and place the electrodeposited plate 10 on the mounting surface of the third elevating mechanism 26. In this way, a predetermined number of electrodeposited plates 10 are stacked on the mounting surface and then transported outward by a discharge member (not shown). , the relative operation of each mechanism within a certain period of time can be easily achieved by an appropriate electrical or mechanical control mechanism that is commonly used, so an illustrative explanation thereof is omitted. In the invention, as described above, the electrodeposited plates that have been peeled off are lowered in a vertical state, and then moved intermittently to a horizontal state, and are successively stacked while maintaining this state, which causes noise. It has excellent effects, such as being able to align and stack the stacks without causing any scattering, and the number of stacks to be stacked can be set appropriately.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a first embodiment of the present invention, FIG. 2 is a view taken along line A-A in FIG. 1, FIG. 3 is a front view showing a second embodiment, and FIG. The figure is a plan view of the one in FIG. 3. DESCRIPTION OF SYMBOLS 1... Peeling mechanism, 2... First elevating mechanism, 3... Rotating drum mechanism, 5... Support stand, 11... Outer plate, 12... Partition plate, 13... Partition chamber, 14... First conveyor, 16... Operating member, 17...・
- Gripping member, 18... stacking mechanism, 19...
...Second lifting mechanism, 20...Second transport conveyor, 22...Third transport conveyor, 23...
...Conveyance section, 26...Third lifting mechanism.

Claims (1)

[Claims] 1. A lifting mechanism is installed below the peeling mechanism to support the lower end of the electrodeposited plate, which is peeled off from the cathode mother plate by the peeling mechanism and falls vertically, and to lower it at a predetermined speed. Electrodeposition comprising a number of wedge-shaped chambers for receiving the lowered electrodeposition plate, and a rotating mechanism that rotates intermittently to bring the electrodeposition plate into a horizontal state. Board stacking device.