JPS5944776B2 - Resin pellet for encapsulating electrical components and method for encapsulating electrical components using the same - Google Patents

Description

Detailed Description of the Invention The present invention relates to resin pellets for sealing electrical components (including electronic components), and electrical components (including electronic components) using the same.
This relates to a sealing method.

Below, we mainly focus on electronic components among electrical components.
The technology of this invention will be explained. For example, in order to prevent other components from coming into contact with electronic components such as printed wiring boards used in watches, it is necessary to place and weld electrically insulating resin pellets. The resin pellets mentioned above are small, usually a few millimeters to several tens of millimeters square in length and width, and 0.2 to 3 millimeters thick. Conventionally, they were made by hand, one by one. The method used was to place the sheet on an electronic member and then feed it into a heated opening to weld it.

However, the manual method described above not only requires a great deal of time and effort to attach the pellets, resulting in poor work efficiency, but also makes it difficult to attach pellets that have two sides, for example, pellets with non-woven fabric attached to one side. There was a problem with pellets in that it was necessary to check the front and back sides in order to place the resin side on the electrical component.

This invention was developed in view of the above-mentioned points, and it is made by pasting resin pellets for electrical component sealing onto an adhesive sheet. Peeling and pasting can be done continuously and automatically without making any mistake between the front and back sides of the pellets. It is an object of the present invention to provide a method for efficiently and labor-savingly attaching pellets.

An embodiment of the present invention will be described below with reference to the accompanying drawings.

The resin pellets A shown in FIG. 1 are continuously bonded to a band-shaped adhesive sheet B through slits C. The resin pellets A shown in FIG.

The resin pellets A shown in FIGS. 2 and 3 are made by arranging individual vents A having a predetermined shape such as rectangular or circular shapes on an adhesive sheet B at a predetermined interval. Further, the resin pellets A shown in FIGS. 4 and 5 are arranged in a plurality of rows on an adhesive sheet B at predetermined intervals.

The above-mentioned resin pellet A is formed by cold-molding a powder of a thermosetting resin composition, or by melting the powder into a semi-hardened molten solid layer, or as shown in FIG. After uniformly scattering the powder of the thermosetting resin composition on the surface of the base material E, the powders are melted together and the powder and the base material are melted together to form a semi-cured molten solid layer on the surface of the base material E. A type with F is used.

Furthermore, when resin pellet A using sheet-like base material E is brought into contact with the adhesive surface of sheet-like base material E,
Alternatively, the case where the resin surface F is brought into contact is optional.

Next, FIGS. 6 to 20 show that electronic components are encapsulated using resin pellets A that are continuously pasted onto a band-shaped adhesive sheet B through slits C as shown in FIGS. 1 or 9. This is an embodiment of a continuous sealing method, and as shown in FIG. 9, resin pellets A are continuously bonded to a band-shaped adhesive sheet B through slits C, and this band-shaped body D is attached to an appropriate length. It is wound up into a roll.

As shown in FIGS. 10, 12, 13, and 15, the pellets A are made by uniformly scattering thermosetting resin composition powder on the surface of a sheet-like base material E made of nonwoven fabric, etc. The semi-hardened molten solid layer F is formed on the surface of the base material E by heating and melting the powders and fusing and integrating the powders with each other and the base material.

The resin beret A is attached to the adhesive sheet B via the adhesive layer G, as shown in FIGS. It is formed so that it can be peeled off depending on the size.

An apparatus for automatically peeling the resin pellets A from the adhesive sheet B and pasting the peeled pellets A onto the electronic component H by running the strip D in the longitudinal direction is shown in FIGS. 6 to 8.
As shown in the figure, a feed conveyor 2 and a conveyor line 1 are arranged at the entrance side of a linear conveyance line 1 that horizontally supports electronic components H, and a feed conveyor 2 and a conveyor line 1 that intermittently supply electronic components onto this line 1.
An intermittent feeding mechanism 3 that holds a plurality of electronic components H lined up at a fixed interval and simultaneously sends a fixed stroke intermittently, and the upper side of the electronic components H stopped at an appropriate position on the conveyance line 1. A pellet supply mechanism 4, a suction means 5 for placing the pellets of this mechanism 4 on the electronic parts H, and a suction means 5 disposed at the outlet of the conveyance line 1 to receive the electronic parts H on which the pellets A are placed and place them in a heating orthopedic oven. Pellet A
and a take-out conveyor 7 that fuses the electronic components to the electronic components.

The conveyance line 1 is constituted by a pair of guide rails arranged on both sides, and both sides of the electronic component H are supported by the grooves of the rails.

The feed mechanism 3 includes a rotatable spline shaft 8 disposed on one side parallel to the conveyance line 1, a sliding tube 9 fitted onto the shaft 8, and a sliding tube 9 on both ends of which protrude toward the conveyance line. A support arm 10 provided, a shaft 11 supported at the tip of the support arm 10 so as to be parallel to the spline shaft 8, and a shaft 11 attached to the shaft 11 at a constant interval, the tip of which faces between the guide rails of the conveyance line 1. It is composed of a plurality of conveying arms 12, a swinging means 13 that gives the sliding tube 9 a fixed stroke of forward and backward movement, and a rotating means 14 that gives the spline shaft 8 reciprocating rotation of a fixed angle.

The transport arms 12 are arranged at intervals that allow the electronic component H to be accommodated therebetween, and the advancing and retracting strokes are equal to the interval between the transport arms 12.

Further, the rotating means 14 is for giving vertical swing to the transport arm 12, and when the transport arm 12 moves forward, the electronic component H is sent with the tip at the lowered position, and when the transport arm 12 moves backward, the end is at the raised position. The swinging means 13 and the timing are set so that a plurality of electronic components H can be simultaneously and intermittently sent forward.

As shown in FIG. 8, the pellet supply mechanism 4 includes a support frame 15 on which the rolled strip D is mounted, a guide 16 that guides the pulled strip D toward the conveyance line 1, and a horizontal portion thereof. a peeling member 17 that is provided in the middle of the strip and bends the adhesive sheet B of the traveling strip D at an acute angle; and a feeding means 18 that sends the peeled resin pellets A forward;
Detection means 1 such as a phototube for detecting the traveling of pellet A
9.

When the adhesive sheet B is bent at an acute angle by the peeling member 17 and travels to the winding section 20, as shown in FIG.
The resin pellet A stuck to the guide 16 is automatically peeled off and pushed forward through the horizontal portion of the guide 16.

The detecting means 19 serves to detect the presence or absence of the resin pellet A within the guide 16 and to control the winding section 20 and the feeding means 18 to always arrange the resin pellet A at the tip of the guide 16.

The horizontal tip of the guide 16 is arranged so as to face close to the electronic component H that is stopped at an appropriate position on the conveyance line 1.

Next, the suction means 5 is placed above the electronic component H where the tip of the guide 16 faces, and the vacuum suction member 21 sucks up the resin pellet A located at the tip of the guide 16 and places it directly above the electronic component H. After moving, it descends, and when the resin pellet A is placed on the electronic component H located directly below, the suction is released and an operation of ascending is performed.

In the case shown in the figure, five sets of vacuum suction members 21 are arranged in the direction of the conveyance line 1 so that the resin pellets A can be simultaneously placed at five locations on a long series of electronic components. The pellet supply mechanism 14 is connected to each vacuum suction member 2.
However, when one supply mechanism 4 is used as shown in the figure, it is moved intermittently along the direction of the conveyance line 1 at intervals of the vacuum suction members 21, After the resin pellets A are absorbed by each vacuum suction member 21, several pellets can be placed on the electronic component H at the same time. This invention is carried out using the automatic pasting device configured as described above, and when the feeding mechanism 3 is in the retracted position, the feeding conveyor 2 supplies the electronic components H to the entrance side of the conveying line 1, and the feeding The electronic component H is sent intermittently by the operation of the mechanism 3 every cycle.

The pellet supply mechanism 4 peels off the resin pellets A located on the lower surface side of the adhesive sheet B at the peeling member 17 of the guide 16 by winding up the adhesive sheet B with the winding unit 20. It is sent out to the tip of the guide 16.

Since the peeled resin pellet A always has its upper surface as the peeling surface from the adhesive sheet and its lower surface as a clean surface, it is not necessary to select the front and back sides, and the direction is kept constant and the clean surface is brought into contact with the electronic component H. be able to.

When the feeding of the electronic component is stopped, the suction member 21 operates sequentially as shown in FIGS. 18 to 20 to suction the resin pellet A located at the tip of the guide 16 and place it on the electronic component H.

The electronic parts H on which the resin pellets A are placed are sent to the exit side of the conveying line 1 by the feeding mechanism 13, and sent into the heating opening 6 by the take-out conveyor 7, where they are heated to a predetermined temperature to become electronic parts. The resin pellet A is fused to the predetermined sealing location of the part H, and the work shown in FIG. 11 is completed.

It should be noted that, in addition to the sealing of the pellet A to the electronic component H using the above embodiment apparatus, in addition to the sealing of the electronic component H shown in FIG. 11, the sealing of the electronic component shown in FIGS. 12 to 14 is also performed. to 17th
It is also used to seal small electrical components such as switches as shown in the figure.

Figures 12 and 13 show a state in which a resin pellet A is fused onto a semiconductor element K on an insulating substrate J, and the resin surface F of the resin pellet A is brought into contact with the semiconductor element K to melt and harden. Then, the semiconductor element K is sealed as shown in FIG.

Further, the electronic component H shown in FIG. 14 is supported on a carrier S, and resin pellets A are fused and sealed at predetermined sealing locations of the electronic component H in the same manner as in FIG. 11. It is.

Fig. 15 shows a resin pellet A with a terminal insertion hole L. Using such a resin pellet A, a small electric component H such as a relay switch can be inserted into a specified position, for example, as shown in Figs. 16 and 17. Resin pellet A is fused to the sealing area to seal it.

That is, the electrical component H of the relay switch is made by protruding the terminal 0 into the opening of the case N, inserting the relay R, and then engaging the cover plate M (which can be omitted depending on the case) with the stepped part of the case N. Fit together.

In this case, the terminal O protrudes from the terminal insertion hole L of the cover plate. Next, the resin surface F of the resin pellet A, which also has the terminal insertion hole L, is inserted into contact with the lid plate M, and is melted and hardened.
As shown in the figure, the electrical component H is sealed. As described above, according to the present invention, since the resin pellets formed on the strip can be automatically peeled off and placed on predetermined locations on the electrical components, the electrical components can be sealed with the resin pellets. Work can be done efficiently.

In addition, since the adhesive sheet and the pellets in the strip are peeled off by continuous running immediately before being placed on the electrical parts, the front and back sides of the peeled pellets are always the same, which eliminates the need to sort the front and back sides of the pellets. have an effect.

In addition, in this invention, the adhesive strength between the adhesive layer of the adhesive sheet and the pellet is usually 50 to 1800 peel test value.
It is said to be 200g (8.8 dragon width).

In addition to the above-mentioned nonwoven fabrics, woven fabrics,
Of course, plastic films such as polyester film, heat-resistant polyester film, and polypropylene film may also be used.

[Brief explanation of the drawing]

1 to 5 are perspective views showing examples of the resin pellets for encapsulating electrical components of the present invention, and FIGS. 6 to 20 show examples of the resin pellets for encapsulating electrical components according to the present invention. 6 shows a front view of the automatic pasting device, FIG. 7 shows a plan view of the same, FIG. 8 shows an enlarged side view of the main parts of the same, and FIG. The figure is a perspective view of the part where the pellet is peeled off, FIG. 10 is an enlarged sectional view showing the pellet before peeling off, FIG. 11 is a perspective view showing the completed state of attaching the pellet to the electrical component, and FIGS. 12, 13, and 14. 15 is a perspective view of a pellet provided with a hole through which a terminal of an electrical component is inserted; FIG.
FIG. 7 is another embodiment diagram showing sealing to an electrical component using the pellet of FIG. 15, and FIGS. 18 to 20 are explanatory diagrams showing the operating sequence of the pellet suction means. A...Resin pellet, B...Adhesive sheet, C...
Cut, D... band-shaped body, 5... suction means.

Claims (1)

[Scope of Claims] 1. A resin pellet for sealing electrical components, characterized in that the resin pellet is adhered to an adhesive sheet. 2. The resin for sealing electrical components according to claim 1, wherein the resin pellets adhered to the adhesive sheet are arranged in a continuous manner in a long strip with slits formed at predetermined intervals. pellet. 3. The resin pellets for encapsulating electrical components according to claim 1, wherein the resin pellets adhered to the adhesive sheet are single pellets of a predetermined shape arranged in parallel at predetermined intervals. 4. According to any one of claims 1 to 3, the resin pellets adhered to the adhesive sheet are semi-cured molten solid layers obtained by melting powder of a thermosetting resin composition. Resin pellets for encapsulating electrical parts as described. 5. Claim 1, characterized in that the resin pellets stuck on the adhesive sheet are semi-cured molten solid layers in which powder of a thermosetting resin composition is fused and integrated with a sheet-like base material. The resin pellet for encapsulating electrical components according to any one of items 1 to 3. 6 A strip of resin pellets pasted on an adhesive sheet is run in the longitudinal direction, and then the resin pellets are peeled off from the sheet, and the peeled resin pellets are sucked by a suction means to seal the electronic components. A method for sealing an electrical component using a resin pellet, the method comprising placing a resin pellet on a sealing part and then fusing the resin pellet. 7. A strip of resin pellets adhered to an adhesive sheet is run in the longitudinal direction, and then the resin pellets are peeled off from the sheet, and the peeled resin pellets are guided to positions close to the electronic components to be intermittently transferred. After guiding, the resin pellet that has reached the tip of the guide is sucked by a sucking means, placed on the sealing part of the electronic component stopped at a fixed position, and then fused. A method for sealing an electrical component using the resin pellet according to item 6.