JPS5945576B2 - Simultaneous transfer method of multiple small pieces using slide mechanism - Google Patents
Simultaneous transfer method of multiple small pieces using slide mechanismInfo
- Publication number
- JPS5945576B2 JPS5945576B2 JP10128380A JP10128380A JPS5945576B2 JP S5945576 B2 JPS5945576 B2 JP S5945576B2 JP 10128380 A JP10128380 A JP 10128380A JP 10128380 A JP10128380 A JP 10128380A JP S5945576 B2 JPS5945576 B2 JP S5945576B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- magazine
- bottom plate
- small pieces
- fixed plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- De-Stacking Of Articles (AREA)
Description
【発明の詳細な説明】
本発明はスライド機構による多数小片の同時移送方法、
更に詳しくは、多数種の小片をそれぞれ縦積しであるマ
ルチマガジンの下側に設けたスライド機構により、マル
チマガジンの各種の小片をそれぞれ一枚づつ同時に抜出
し、該スライド機構の固定板よりこれらの多数小片を同
時に次工程へ移送する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for simultaneously transporting multiple small pieces using a slide mechanism;
More specifically, a slide mechanism provided at the bottom of a multi-magazine in which many types of small pieces are stacked vertically is used to simultaneously pull out each type of small piece from the multi-magazine one by one, and then remove these pieces from a fixed plate of the slide mechanism. The present invention relates to a method for simultaneously transferring multiple small pieces to the next process.
混成集積回路を製作するには、多数、多種の回路素子を
基板上の一定の位置に取付ける必要がある。To fabricate a hybrid integrated circuit, it is necessary to attach a large number and variety of circuit elements to fixed positions on a substrate.
電子工業の発展に伴い、同一混成集積回路製作の要求が
多くなり、その数が数百または数千以上に及ぶものもあ
る。With the development of the electronic industry, the demand for producing identical hybrid integrated circuits has increased, and the number of such hybrid integrated circuits may reach hundreds or even thousands.
この為に、基板への多数の回路素子の同時装置の自動化
装置が要求され、その一部は実用に供されている。For this reason, an automated device for simultaneously attaching a large number of circuit elements to a substrate is required, and some of these devices are in practical use.
従来の自動装着装置の基本的な構成は次のとおりである
。The basic configuration of a conventional automatic mounting device is as follows.
即ち、基板に装着すべき各回路素子毎に、回路素子を縦
に積重ねてマガジンに収容し、各マガジンを、各回路素
子が基板に装着された場合と同一位置関係になるように
並列配置してマルチマガジンとし、これより各m素子を
一個づつ相互の関係位置を保持したまま吸着手段で吸着
し、基板位置まで搬送装着するものである。That is, for each circuit element to be mounted on a board, the circuit elements are stacked vertically and housed in a magazine, and the magazines are arranged in parallel so that the circuit elements are in the same positional relationship as when mounted on the board. A multi-magazine is used, from which each m element is sucked one by one by a suction means while maintaining their relative positions, and transported and mounted to the substrate position.
従来の多くの自動装着装置では、各回路素子をマルチマ
ガジンの上側より一枚づつ吸着手段で直接吸着する方法
がとられている。Many conventional automatic mounting apparatuses employ a method of directly sucking each circuit element one by one from the upper side of a multi-magazine using a sucking means.
しかしながら、かかる装置においては、回路素子同志の
電極部による冷間圧着が発生し、吸着手段に同種の回路
素子が2個同時に吸着されて搬送、装着されるという欠
点がある。However, such an apparatus has the disadvantage that cold press bonding between the circuit elements by the electrode portions occurs, and that two circuit elements of the same type are simultaneously attracted to the suction means, conveyed, and mounted.
本発明者等は、前述の欠点を解消する装置及び方法を発
明し、特願昭54−120658号及び特願昭54−1
37018号として特許出願している。The present inventors have invented an apparatus and method for solving the above-mentioned drawbacks, and have
A patent application has been filed as No. 37018.
該発明における基本的な構成は次のとおりである。The basic configuration of the invention is as follows.
即ち、複数の同一回路素子を縦に積重ねて収容するマガ
ジンを、基板に装着する回路素子の数及び位置関係に対
応して、多数個立設し、下側Eこ各マガジンに連通ずる
礼拝を有する底板を設けたマルチマガジンの底板の下側
に、該底板の孔群と同じ孔相互の関係位置で礼拝を穿設
したスライド板と固定板よりなるスライド機構を、スラ
イド板を底板と固定板の間に挟み摺動可能とし、且つ固
定板の礼拝の位置を底板の礼拝の位置より水平方向)こ
ずらして固定して、取付け、前記礼拝(こ相当するくぼ
みを有するパレットをくぼみと礼拝を一致せしめて固定
板に当接し、スライド板を、腰板の礼拝が底板の礼拝と
一致する位置から固定板の礼拝と一致する位置に移動し
て、マルチマガジンの各マガジン中の回路素子を一枚づ
つ同時に固定板の礼拝よりパレットのくぼみに移送した
後、パレットを下降せしめて、スライド機構から離し、
各回路素子の関係位置を保持したまま、または更に関係
位置を修正した後、吸着手段で吸着し、基板位置に搬送
装着するものである。That is, a plurality of magazines storing a plurality of identical circuit elements stacked vertically are installed upright according to the number and positional relationship of the circuit elements to be mounted on the board, and the lower E is connected to each magazine. A slide mechanism consisting of a slide plate and a fixing plate with holes drilled in the same relationship position as the hole group of the bottom plate is installed on the underside of the bottom plate of the multi-magazine, which has a bottom plate with a bottom plate. The fixing plate is made to be slidable between the plates, and the fixing plate is fixed by shifting the position of the fixing plate horizontally from the position of the bottom plate. move the slide plate from the position where the width of the waist plate matches the width of the bottom plate to the position where the width of the fixed plate matches the width of the bottom plate, and simultaneously remove the circuit elements in each magazine of the multi-magazine one by one. After transferring from the stationary plate to the recess of the pallet, lower the pallet and release it from the slide mechanism.
While maintaining the relative positions of each circuit element, or after further correcting the relative positions, the circuit elements are picked up by suction means and transported and mounted on the substrate.
該発明の装置及び方法によるときは、基板への回路素子
の自動装着を円滑に行なうことができる。When using the apparatus and method of the invention, circuit elements can be automatically mounted on a board smoothly.
しかしながら、該方法により1動作で同時に40〜50
個の小形軽量の回路素子をマルチマガジンからスライド
機構によりパレットへ移送するときは、回路素子外径寸
法のばらつき、スライド機構のスライド板及び固定板の
礼拝の加工精度等により、回路素子がスライド機構の孔
内に引掛り詰りを起すこさがあり、これが該方式の致命
的欠陥となっている。However, with this method, 40 to 50
When transferring small and lightweight circuit elements from a multi-magazine to a pallet using a slide mechanism, the circuit elements may This is a fatal flaw of this method, as it tends to get stuck in the hole and cause clogging.
これは、回路素子の外径寸法及びスライド機構の孔明は
寸法の精度向上によって回避することができると思われ
るが、技術的にも非常に難しく、出来るとしても多くの
労力、費用及び時間を要することとなる。Although it is possible to avoid this by improving the accuracy of the dimensions of the outer diameter of the circuit elements and the sliding mechanism, it is technically extremely difficult, and even if possible, it would require a lot of effort, money, and time. That will happen.
スライド機構による多数小片を移送する方法は、上記の
回路素子の移送の場合に限らず、他の多くの場合におい
ても同様な問題をかかえている。The method of transporting a large number of small pieces using a slide mechanism has similar problems not only in the case of transporting circuit elements as described above, but also in many other cases.
本発明の目的は、スライド機構により多数の小片を同時
に移送する方法において、小片がスライド機構の孔に引
掛り詰る問題が解決され、円滑に自動的に行なうことが
できる方法を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for simultaneously transporting a large number of small pieces using a slide mechanism, which can solve the problem of small pieces getting stuck in the holes of the slide mechanism and can be carried out smoothly and automatically.
本発明のスライド機構による多数小片の同時移送方法は
、複数の小片を縦に積重ねて収容するマガジンを多数個
立設し、下側に各マガジンに連通ずる礼拝を有する底板
を設けたマルチマガジンの底板の下側に、該底板の礼拝
と同じ孔相互の関係位置で礼拝を穿設したスライド板と
固定板よりなるスライド機構を、スライド板を底板と固
定板の間に挟み摺動可能とし、且つ固定板の礼拝の位置
を底板の礼拝の位置より水平方向にずらして固定して、
取付け、スライド板を腰板の礼拝が底板の礼拝と一致す
る位置から固定板の礼拝と一致する位置まで移動して、
マルチマガジンの各マガジン中の小片を一枚づつ同時に
固定板の礼拝より次工程へ移送する方法において、該ス
ライド板を該スライド板の礼拝が固定板の礼拝に一致す
る位置を催かに過ぎ礼拝が一部重複する位置まで移動さ
せることを特徴とする方法である。The method for simultaneously transferring multiple small pieces using the slide mechanism of the present invention is a multi-magazine system in which a large number of magazines for vertically stacking and accommodating a plurality of small pieces are installed, and a bottom plate is provided on the bottom side with a hole that communicates with each magazine. A slide mechanism consisting of a slide plate and a fixing plate with holes drilled in the same position relative to each other as the holes in the bottom plate on the underside of the bottom plate, the slide plate being sandwiched between the bottom plate and the fixing plate to make it slidable and fixed. Shift the worship position of the board horizontally from the worship position of the bottom plate and fix it.
Installation, move the slide plate from the position where the waist plate worship matches the bottom plate worship to the position where the fixed plate worship matches,
In a method of simultaneously transferring the small pieces in each magazine of a multi-magazine one by one from the position of the fixed plate to the next process, the sliding plate is held at a position where the position of the sliding plate coincides with the position of the fixed plate. This method is characterized by moving the objects to a position where they partially overlap.
以下、本発明の方法を実施例の図面に基づいて説明する
。Hereinafter, the method of the present invention will be explained based on drawings of embodiments.
実施例においては、小片を回路素子としである。In the embodiment, the small pieces are used as circuit elements.
先ず本発明の方法によって組立てられる混成集積回路の
例として、電子チューナの一例を第1図に示す。First, as an example of a hybrid integrated circuit assembled by the method of the present invention, an example of an electronic tuner is shown in FIG.
基板1には長方形の回路素子2が基板1に対して直交配
置で多数搭載固定されている。A large number of rectangular circuit elements 2 are mounted and fixed on the substrate 1 in a perpendicular arrangement to the substrate 1.
第1図の電子チューナの基板1には回路素子2が40数
個装着され、本発明の方法は40〜50個のように多数
の回路素子を同時に移送する場合に特に効果をあげるこ
とができるが、以下本発明の方法を実施する装置の実施
例の図面においては、図面が複雑、不明瞭となることを
避ける為に、多数の回路素子を分割して移送、装着する
場合の装置の図面に基づいて説明する。More than 40 circuit elements 2 are mounted on the electronic tuner board 1 of FIG. 1, and the method of the present invention is particularly effective when transferring a large number of 40 to 50 circuit elements at the same time. However, in the drawings of the embodiments of the apparatus for carrying out the method of the present invention, in order to avoid the drawings from becoming complicated and unclear, drawings of the apparatus for transporting and mounting a large number of circuit elements in parts are shown below. The explanation will be based on.
第2図は本発明の方法を実施する装置の実施例の縦断面
図、第3図は第2図における要部拡大図、第4図は第3
図の部分の斜視図第5図はスライド板の移動状態を示す
部分断面図である。FIG. 2 is a vertical sectional view of an embodiment of the apparatus for carrying out the method of the present invention, FIG. 3 is an enlarged view of the main part in FIG. 2, and FIG.
FIG. 5 is a perspective view of the illustrated portion, and is a partial cross-sectional view showing the state of movement of the slide plate.
第2図にはマルチマガジン20、スライド機構30及び
パレット40が示しである。FIG. 2 shows the multi-magazine 20, slide mechanism 30, and pallet 40.
21がマガジンである。21 is a magazine.
各マガジン21には多数(一実施例では約200個)の
回路素子2が縦に積重ねて収 −容されている。Each magazine 21 stores a large number (approximately 200 in one embodiment) of circuit elements 2 in a vertically stacked manner.
マルチマガジン20には多数のマガジン21が、例へば
第1図に示す電子チューナを1回で組立てる為には41
個のマガジン21が立設されている。The multi-magazine 20 includes a large number of magazines 21. For example, in order to assemble the electronic tuner shown in FIG.
Magazines 21 are arranged upright.
(前述の如くマガジンの数は省略しである。(As mentioned above, the number of magazines is omitted.
)マルチマガジン20は支柱24で保持された一対のマ
ガジンプレート25を備え、マガジンプレート25がマ
ガジン21を保持固定している。) The multi-magazine 20 includes a pair of magazine plates 25 held by struts 24, and the magazine plates 25 hold and fix the magazine 21.
回路素子2の上には重錘22が載置され、回路素子2に
は下向きの軽い負荷をかけである。A weight 22 is placed on the circuit element 2, and a light downward load is applied to the circuit element 2.
マルチマガジン20の下側には各マガジン21に連通ず
る礼拝23Aを有する底板23が取付けである。Attached to the underside of the multi-magazine 20 is a bottom plate 23 having a hole 23A communicating with each magazine 21.
スライド機構30は、底板23の礼拝23Aと同じ孔相
互の関係位置でそれぞれ礼拝31A及び32Aを穿設し
たスライド板31及び固定板32よりなる。The slide mechanism 30 consists of a slide plate 31 and a fixed plate 32, each having holes 31A and 32A formed therein at the same positions relative to the holes 23A of the bottom plate 23.
固定板32はその礼拝32Aの位置を底板23の礼拝2
3Aの位置よりずらして固定板32に固定され、スライ
ド板31は底板23と固定板32の間に挟まれ摺動可能
とされている。The fixed plate 32 moves the position of the prayer 32A to the position of the prayer 2 of the bottom plate 23.
It is fixed to the fixed plate 32 at a position shifted from the position 3A, and the slide plate 31 is sandwiched between the bottom plate 23 and the fixed plate 32 and is slidable.
第2図には、スライド機構30の下側に、次工程の為の
固定板の礼拝32Aに相当するくはみ40Aを有するパ
レット40をくぼみ40Aと礼拝32Aを一致せしめて
固定板に当接しである。In Fig. 2, a pallet 40 having a recess 40A corresponding to the recess 32A of the fixed plate for the next process is placed on the lower side of the slide mechanism 30, and the pallet 40 is brought into contact with the fixed plate with the recess 40A and the recess 32A aligned. It is.
実施例の装置は以上の如く構成されている。The apparatus of the embodiment is constructed as described above.
実施例の方法では、スライド板31を、杉板31の礼拝
31Aが底板23の礼拝23Aと一致する位置から固定
板32の礼拝32Aを一致する位置を僅かに過ぎ(その
距離を9で示す。In the method of the embodiment, the slide plate 31 is moved from the position where the cedar plate 31's curvature 31A coincides with the bottom plate 23's cursor 23A to the position where the fixed plate 32's cursor 32A coincides (the distance is indicated by 9).
)礼拝31Aと32Aが重複する位置まで、矢印7の方
向に移動する。) Move in the direction of arrow 7 to the position where prayers 31A and 32A overlap.
各板の関係位置の変化の状態を第5図に示しである。FIG. 5 shows how the relative positions of each plate change.
スライド板31の礼拝31Aを底板23の礼拝23Aに
一致せしめると回路素子2は自重及び垂鐘22の荷重に
より降下し、固定板32に止められて孔群31A内に各
1個づつの回路素子2が入る。When the prayer 31A of the slide plate 31 is made to match the prayer 23A of the bottom plate 23, the circuit elements 2 are lowered by their own weight and the load of the hanging bell 22, and are stopped by the fixed plate 32, one circuit element each in the hole group 31A. 2 enters.
この状態を第5図の左端に示しである。スライド板31
を7の方向tこ移動せしめると、孔群31A内の各1個
の回路素子2丈抜取られ、其他の積重ねられた回路素子
2はスライド板31により降下が停止せしめられている
。This state is shown at the left end of FIG. Slide plate 31
When the circuit elements 2 are moved in the direction 7, two lengths of each circuit element are removed from each hole group 31A, and the other stacked circuit elements 2 are stopped from falling by the slide plate 31.
回路素子2の抜取を円滑にし、損傷を与えない為案内板
等が設けられることがある。A guide plate or the like may be provided to facilitate extraction of the circuit element 2 and prevent damage.
スライド板31を7の方向に摺動し礼拝31Aが固定板
32の礼拝32Aと一致した状態を第5図中央に示しで
ある。A state in which the slide plate 31 is slid in the direction 7 and the prayer 31A matches the prayer 32A of the fixed plate 32 is shown in the center of FIG.
礼拝31Aと32Aを一致させても、回路素子2の外径
寸法又は礼拝31A、32Aの加工精度が充分でないと
きは、図示のように回路素子2が引掛り落下しない。Even if the openings 31A and 32A are matched, if the outer diameter of the circuit element 2 or the machining accuracy of the openings 31A and 32A are not sufficient, the circuit element 2 will get caught and not fall as shown in the figure.
これは主として孔の加工精度が悪く、礼拝31Aと32
Aとの個々の孔が完全に合致してない為である。This is mainly due to the poor machining accuracy of the holes.
This is because the individual holes with A do not match perfectly.
スライド板31を更fこ7の方向に移動すると、個々の
孔同志が完全に一致する点を通るので、回路素子2は固
定板32の礼拝32Aより落下し、回路素子2はパレッ
ト等へ運ばれる。When the slide plate 31 is moved in the direction of 7, it passes through a point where the individual holes completely coincide with each other, so the circuit element 2 falls from the base 32A of the fixed plate 32, and the circuit element 2 is carried to a pallet or the like. It will be done.
スライド板31は8方向に移動され元の位置に戻る。The slide plate 31 is moved in eight directions and returns to its original position.
スライド板31の摺動方向、即ち固定板32の礼拝32
Aを底板23の礼拝23Alこ対してずらしである方向
は、直交配置される長方形の回路素子2の配置に相当す
る直角方向又は45度傾斜方向が選ばれる。The sliding direction of the slide plate 31, that is, the movement 32 of the fixed plate 32
The direction in which A is shifted with respect to the direction 23Al of the bottom plate 23 is selected to be a right angle direction or a 45 degree inclined direction, which corresponds to the arrangement of the rectangular circuit elements 2 arranged orthogonally.
本発明の方法によるときは、小物軽量部品のスライド機
構による多点同時移送に対して、加工寸法精度等に起因
する部品の引掛り詰りの問題を解消することができ、ス
ライド機構による多点同時移送の確実性及び信頼性を向
上することができる。When using the method of the present invention, it is possible to solve the problem of parts getting stuck due to machining dimensional accuracy, etc. when transporting small lightweight parts at multiple points simultaneously using the slide mechanism. The reliability and reliability of transfer can be improved.
第1図は電子チューナの平面図、第2図は本発明の方法
を実施する装置の実施例の縦断面図、第3図は第2図に
おける要部拡大図、第4図は第3図の部分の部分切開斜
視図、第5図はスライド板の移動状態を示す部分断面図
である。
1・・・・・・基板、2・・・・・・回路素子、20・
・・・・・マルチマガジン、21・・・・・・マガジレ
、23・・・・・・底板、23A・・・・・・底板の礼
拝、30・・・・・・スライド機構、31・・・・・・
スライド板、31A・・・・・・スライド板の礼拝、3
2・・・・・・固定板、32A・・・・・・固定板の礼
拝、40・・・・・・パレット、40A・・・・・・パ
レットのくぼみ。FIG. 1 is a plan view of an electronic tuner, FIG. 2 is a longitudinal cross-sectional view of an embodiment of an apparatus for carrying out the method of the present invention, FIG. 3 is an enlarged view of main parts in FIG. 2, and FIG. FIG. 5 is a partially cutaway perspective view of a portion shown in FIG. 1...Substrate, 2...Circuit element, 20.
...Multi magazine, 21...Magazine, 23...Bottom plate, 23A...Bottom plate worship, 30...Slide mechanism, 31...・・・・・・
Slide board, 31A...Slide board worship, 3
2...Fixed plate, 32A...Fixed plate worship, 40...Pallet, 40A...Recess in pallet.
Claims (1)
個立設し、下側に各マガジンに連通ずる礼拝を有する底
板を設けたマルチマガジンの底板の下側に、該底板の礼
拝と同じ孔相互の関係位置で礼拝を穿設したスライド板
と固定板よりなるスライド機構を、スライド板を底板と
固定板の間に挟み摺動可能とし、且つ固定板の礼拝の位
置を底板の礼拝の位置より水平方向にずらして固定して
、取付け、スライド板を腰板の礼拝が底板の礼拝と一致
する位置から固定板の礼拝と一致する位置まで移動して
、マルチマガジンの各マガジン中の小片を一枚づつ同時
に固定板の礼拝より次工程へ移送する方法において、該
スライド板を該スライド板の礼拝が固定板の礼拝に一致
する位置を僅かに過ぎ礼拝が一部重複する位置まで移動
させることを特徴とするスライド機構による多数小片の
同時移送方法。1. A multi-magazine has a plurality of vertically stacked magazines for accommodating a plurality of small pieces stacked vertically, and has a bottom plate with a hole that communicates with each magazine on the bottom side.The bottom plate of a multi-magazine has a hole that is the same as the hole in the bottom plate. A sliding mechanism consisting of a sliding plate and a fixed plate with prayer holes in mutually related positions is made by sandwiching the sliding plate between the bottom plate and the fixed plate so that the prayer position of the fixed plate is more horizontal than the prayer position of the bottom plate. Move the slide plate from the position where the waist plate alignment matches the bottom plate alignment to the fixed plate alignment position, then move the small pieces in each magazine of the multi-magazine one by one. At the same time, the method for transferring the worship of the fixed plate to the next process is characterized in that the sliding plate is moved slightly past the position where the worship of the sliding plate coincides with the worship of the fixed plate to a position where the worship partially overlaps. A method for simultaneously transporting multiple small pieces using a sliding mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10128380A JPS5945576B2 (en) | 1980-07-25 | 1980-07-25 | Simultaneous transfer method of multiple small pieces using slide mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10128380A JPS5945576B2 (en) | 1980-07-25 | 1980-07-25 | Simultaneous transfer method of multiple small pieces using slide mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5727834A JPS5727834A (en) | 1982-02-15 |
| JPS5945576B2 true JPS5945576B2 (en) | 1984-11-07 |
Family
ID=14296525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10128380A Expired JPS5945576B2 (en) | 1980-07-25 | 1980-07-25 | Simultaneous transfer method of multiple small pieces using slide mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5945576B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6392272U (en) * | 1986-12-05 | 1988-06-15 | ||
| JPH0383883U (en) * | 1989-12-18 | 1991-08-26 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3908474A1 (en) * | 1988-07-22 | 1990-01-25 | Metzeler Gmbh | RING SHAPED SPRING BODY MADE OF FIBER COMPOSITES |
| KR940003241B1 (en) * | 1991-05-23 | 1994-04-16 | 금성일렉트론 주식회사 | Lead Frame Automatic Feeder of TO-220 Semiconductor Maker |
| JP4739828B2 (en) * | 2005-06-23 | 2011-08-03 | 株式会社ミツバ | Plate member conveying device |
-
1980
- 1980-07-25 JP JP10128380A patent/JPS5945576B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6392272U (en) * | 1986-12-05 | 1988-06-15 | ||
| JPH0383883U (en) * | 1989-12-18 | 1991-08-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5727834A (en) | 1982-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4759488A (en) | Circuit board carrier | |
| GB2140716A (en) | Mounting apparatus for chip type electronic parts on circuit boards | |
| US4539058A (en) | Forming multilayer ceramic substrates from large area green sheets | |
| JPS5945576B2 (en) | Simultaneous transfer method of multiple small pieces using slide mechanism | |
| US7316060B2 (en) | System for populating a circuit board with semiconductor chips | |
| US4829665A (en) | Method and apparatus for mounting electronic components | |
| CN215046922U (en) | Moving device and processing equipment | |
| TWM594269U (en) | Storage rack module | |
| KR100683264B1 (en) | Handling Device and Handling Method for Lead Frame Processing System | |
| KR100398321B1 (en) | Single Array Module PCB Loading / Unloading Method | |
| CN216503375U (en) | Parts assembling machine | |
| KR0124549Y1 (en) | Tray for memory module | |
| JP3256947B2 (en) | FPC board alignment counter | |
| JPH0797041A (en) | Pivoting carrier | |
| KR950000931Y1 (en) | Board-safe arrival apparatus of an inspection device for circuit board auto-inspect system | |
| JPH0339936B2 (en) | ||
| JPH0435100A (en) | Substrate positioning device | |
| JPS6344475A (en) | Pallet for pin | |
| JPS61110654U (en) | ||
| JPH0432353Y2 (en) | ||
| JPH04256400A (en) | Conveying mechanism for ic | |
| JPH036569Y2 (en) | ||
| JP2843452B2 (en) | Printed wiring board assembly production line | |
| JPS63229285A (en) | Pallet chuck mechanism | |
| JPS60251070A (en) | Tray for aligning electronic part, etc. |