JPS5945756B2 - Alkaline aluminum chemical polishing liquid - Google Patents
Alkaline aluminum chemical polishing liquidInfo
- Publication number
- JPS5945756B2 JPS5945756B2 JP14390781A JP14390781A JPS5945756B2 JP S5945756 B2 JPS5945756 B2 JP S5945756B2 JP 14390781 A JP14390781 A JP 14390781A JP 14390781 A JP14390781 A JP 14390781A JP S5945756 B2 JPS5945756 B2 JP S5945756B2
- Authority
- JP
- Japan
- Prior art keywords
- chemical polishing
- polishing liquid
- aluminum
- salts
- nitrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000126 substance Substances 0.000 title claims description 67
- 238000005498 polishing Methods 0.000 title claims description 62
- 229910052782 aluminium Inorganic materials 0.000 title claims description 34
- 239000007788 liquid Substances 0.000 title claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 27
- 150000003839 salts Chemical class 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 17
- 235000012239 silicon dioxide Nutrition 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 14
- 229910001385 heavy metal Inorganic materials 0.000 claims description 11
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 10
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 9
- 239000000440 bentonite Substances 0.000 claims description 8
- 229910000278 bentonite Inorganic materials 0.000 claims description 8
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 5
- 150000002823 nitrates Chemical class 0.000 claims description 5
- 150000002826 nitrites Chemical class 0.000 claims description 5
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- 150000001868 cobalt Chemical class 0.000 claims description 4
- 150000001879 copper Chemical class 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 3
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 150000002696 manganese Chemical class 0.000 claims description 3
- 150000002751 molybdenum Chemical class 0.000 claims description 3
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- -1 aluminum ions Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 6
- 235000019353 potassium silicate Nutrition 0.000 description 6
- 235000010344 sodium nitrate Nutrition 0.000 description 6
- 239000004317 sodium nitrate Substances 0.000 description 6
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 6
- 229910052681 coesite Inorganic materials 0.000 description 5
- 229910052906 cristobalite Inorganic materials 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910052682 stishovite Inorganic materials 0.000 description 5
- 229910052905 tridymite Inorganic materials 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 235000010333 potassium nitrate Nutrition 0.000 description 3
- 239000004323 potassium nitrate Substances 0.000 description 3
- 235000010288 sodium nitrite Nutrition 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004111 Potassium silicate Substances 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 2
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 2
- 229910001981 cobalt nitrate Inorganic materials 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 235000010289 potassium nitrite Nutrition 0.000 description 2
- 239000004304 potassium nitrite Substances 0.000 description 2
- 229910052913 potassium silicate Inorganic materials 0.000 description 2
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 235000015393 sodium molybdate Nutrition 0.000 description 2
- 239000011684 sodium molybdate Substances 0.000 description 2
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000018660 ammonium molybdate Nutrition 0.000 description 1
- 239000011609 ammonium molybdate Substances 0.000 description 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
- 229940010552 ammonium molybdate Drugs 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- AAJBNRZDTJPMTJ-UHFFFAOYSA-L magnesium;dinitrite Chemical compound [Mg+2].[O-]N=O.[O-]N=O AAJBNRZDTJPMTJ-UHFFFAOYSA-L 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- RAFRTSDUWORDLA-UHFFFAOYSA-N phenyl 3-chloropropanoate Chemical compound ClCCC(=O)OC1=CC=CC=C1 RAFRTSDUWORDLA-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
【発明の詳細な説明】
本発明はアルカリ性アルミニウム化学研磨液の改良に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in alkaline aluminum chemical polishing liquids.
従来、アルミニウムの化学研磨液としては、リン酸を主
体とし、これに硝酸や硫酸等を添加したものが使用され
ていた。Conventionally, chemical polishing liquids for aluminum have been mainly composed of phosphoric acid, to which nitric acid, sulfuric acid, etc. have been added.
しかし、近年、廃水のリン規制がきびしくなり、かつこ
の種の酸性化学研磨液において硝酸を添加したものは窒
素酸化物を発生しやすく、大気汚染の原因となる等の欠
点があつた。他方、アルミニウムの表面処理工場より排
出される廃水は強酸性のものが多いことからして、アル
ミニウムの化学研磨にアルカリ性のものを用いることが
できれば、廃水中和のために著しく有利で、かつ経済的
となる。However, in recent years, wastewater phosphorus regulations have become stricter, and this type of acidic chemical polishing solution to which nitric acid has been added tends to generate nitrogen oxides, which has the disadvantage of causing air pollution. On the other hand, since most of the wastewater discharged from aluminum surface treatment plants is strongly acidic, it would be extremely advantageous and economical to use alkaline water for chemical polishing of aluminum. become a target.
しかし、従来、アルカリ性のアルミーウム化学研磨液と
しては、ＮａＯＨを生体とし、これに硝酸ソーダ、亜硝
酸ソーダ、リン酸ソーダ及び硝酸銅等を配合する程度の
ことが発表されていただけで、その詳細は殆んど不明で
あつた。However, so far, the only known alkaline aluminum chemical polishing solution has been to use NaOH as a living body and to mix sodium nitrate, sodium nitrite, sodium phosphate, copper nitrate, etc., but the details are not available. Most of it was unknown.
本発明者は、アルカリ性アルミニウム化学研磨液を実際
に調製してその研磨処理をした結果によると、この種の
アルカリ性アルミニウム化学研磨液には下記の問題点が
あることが判明した。The inventor of the present invention actually prepared an alkaline aluminum chemical polishing liquid and performed a polishing process thereon, and found that this type of alkaline aluminum chemical polishing liquid had the following problems.
（１）光沢及び平滑性のある化学研磨が得られにくい。
（゛）化学研磨終了後、水洗や酸洗等を行なうために、
研磨されたアルミニウム材が空気中に引上げられた際に
、短時間空気に触れただけでアルカリエッチングを起し
、光沢や平滑性が失なわれやすい。(1) Chemical polishing with gloss and smoothness is difficult to obtain.
(゛) After chemical polishing, in order to perform water washing, pickling, etc.
When a polished aluminum material is lifted into the air, even a short period of exposure to the air causes alkali etching, which tends to cause it to lose its luster and smoothness.
そして、本発明者は、アルカリ性アルミニウム化学研磨
液のかかる欠点を改良するために種々研究を重ねた結果
、重金属塩触媒とともに珪酸アルカリやベントナイト等
の珪酸含有物質を添加することにより、上記の欠点、特
に光沢及び平滑性の低下を防止できることを知り、本発
明に到達したのである。The inventor of the present invention has conducted various studies to improve the drawbacks of alkaline aluminum chemical polishing liquids, and as a result, the above-mentioned drawbacks can be solved by adding a silicic acid-containing substance such as alkali silicate or bentonite together with a heavy metal salt catalyst. In particular, the present invention was developed based on the knowledge that deterioration in gloss and smoothness can be prevented.
なお、本発明におけるアルミニウムとは、純すいなアル
ミニウムだけに限られるものでなく、これにはアルミニ
ウム合金も含まれる。すなわち、本発明のアルカリ性ア
ルミニウム化学研磨液は、苛性ソーダと硝酸塩及び／又
は亜硝酸塩とを含有する水性液よりなるアルミニウム化
学研磨液において、重金属塩触媒とともに珪酸アルカリ
及びベントナイトよりなる群から選ばれた珪酸含有物質
を含有せしめてなることを特徴とするものである。本発
明の化学研磨液を構成する各成分の主要な作用効果につ
いて説明をすると、アルミニウムは苛性ソーダ水溶液中
で下記式にしたがつてアルミニウムイオンとなつて溶出
し、化学研磨され、その際に電子（ｅ）が放出される。Note that aluminum in the present invention is not limited to pure aluminum, but also includes aluminum alloys. That is, the alkaline aluminum chemical polishing liquid of the present invention is an aluminum chemical polishing liquid consisting of an aqueous liquid containing caustic soda and nitrates and/or nitrites, and a silicic acid selected from the group consisting of alkali silicates and bentonite together with a heavy metal salt catalyst. It is characterized by containing a substance. To explain the main effects of each component constituting the chemical polishing liquid of the present invention, aluminum is eluted as aluminum ions according to the following formula in a caustic soda aqueous solution, and is chemically polished. e) is released.
Ａｌ−＋Ａｌ３＋＋３ｅ
本発明の化学研磨液中に含有せしめられた硝酸塩及び亜
硝酸塩は、その放出された電召ｅ）を下記式にしたがつ
て吸収して、適度の速度でその化学研摩作用を進行させ
、同時に生成する亜硝酸イオン（ＮＯ２−）がインヒビ
ターとしての作用をして、適度の化学研磨、したがつて
平滑な研磨面が得られるのに寄与する、と推測される。Al−+Al3++3e The nitrates and nitrites contained in the chemical polishing liquid of the present invention absorb the emitted electrolyte e) according to the following formula, and proceed with their chemical polishing action at an appropriate speed. It is presumed that the nitrite ions (NO2-) produced at the same time act as an inhibitor, contributing to appropriate chemical polishing and, therefore, to obtaining a smooth polished surface.
Ｈ２Ｏ＋ＮＯ３−＋２ｅ−＋ＮＯ２−＋２０Ｈ本発明の
化学研磨液中に含有せしめられた重金属塩触媒は、上記
の機構による化学研磨の触媒作用をする。H2O+NO3-+2e-+NO2-+20H The heavy metal salt catalyst contained in the chemical polishing liquid of the present invention catalyzes chemical polishing by the above mechanism.
特に、硝酸イオンの亜硝酸イオン（ＮＯ２−）への変換
を助長し、生成した亜硝酸イオンのインヒビター作用に
よつて、アルミニウム表面を徐々に均一に溶解させて、
研磨面を平滑化するのに貢献する、と推測される。本発
明の化学研磨液中に含有せしめられた珪酸含有物質は、
研磨される又は研磨されたアルミニウム表面に水溶性の
珪酸イオン（ＨＳｉＯ３一等と推測される）の膜、すな
わち］の保護膜を形成せしめ、均一な溶解（研磨）に寄
与するとともに、研磨終了後に水洗や酸洗等を施すため
に空気中に短時間取出したときに、研磨面が空気に触れ
てアルカリエツチングを起すのを防止し、研磨面の平滑
性及び光沢保持に寄与する、と推測される。In particular, it promotes the conversion of nitrate ions to nitrite ions (NO2-), and by the inhibitory action of the generated nitrite ions, the aluminum surface is gradually and uniformly dissolved.
It is presumed that it contributes to smoothing the polished surface. The silicic acid-containing substance contained in the chemical polishing liquid of the present invention is
Forms a protective film of water-soluble silicate ions (estimated to be HSiO3, etc.) on the polished or polished aluminum surface, which contributes to uniform dissolution (polishing) and also after polishing is completed. It is presumed that when the polished surface is exposed to air for a short period of time for washing with water or pickling, it prevents the polished surface from coming into contact with the air and causing alkaline etching, contributing to the smoothness and gloss retention of the polished surface. Ru.
本発明の化学研磨液中の苛性ソーダ濃度は、通常１〜１
６モル／１１好ましくは２〜１２モル／ｌである。本発
明における硝酸塩としては、たとえば硝酸ソーダ、硝酸
カリ、硝酸マグネシウム及び硝酸カルシウム等があげら
れる。The concentration of caustic soda in the chemical polishing solution of the present invention is usually 1 to 1.
The amount is 6 mol/11, preferably 2 to 12 mol/l. Examples of the nitrate in the present invention include sodium nitrate, potassium nitrate, magnesium nitrate, and calcium nitrate.
好ましい硝酸塩は硝酸ソーダ及び硝酸カリである。また
、本発明における亜硝酸塩としては、たとえば亜硝酸ソ
ーダ、亜硝酸カリ、亜硝酸マグネシウム及び亜硝酸カル
シウム等があげられる。好ましい亜硝酸塩は亜硝酸ソー
ダ及び亜硝酸カリである。本発明の化学研磨液における
硝酸塩及び／又は亜硝酸塩の濃度は、合計量で通常０．
３〜７モル／ｌ、好ましくは１〜５モル／Ｆ．である。Preferred nitrates are sodium nitrate and potassium nitrate. Further, examples of the nitrite in the present invention include sodium nitrite, potassium nitrite, magnesium nitrite, and calcium nitrite. Preferred nitrites are sodium nitrite and potassium nitrite. The total concentration of nitrates and/or nitrites in the chemical polishing solution of the present invention is usually 0.
3-7 mol/l, preferably 1-5 mol/F. It is.
本発明における重金属塩触媒としては、たとえば銅塩（
硫酸銅、硝酸銅等）、コバルト塩（硫酸コバルト、硝酸
コバルト等）、マンガン塩（硫酸マンガン、硝酸マンガ
ン等）、モリブデン塩（モリブデン酸アンモニウム、モ
リプデン酸ナトリウム等）及び銀塩（硝酸銀等）があげ
られる。As the heavy metal salt catalyst in the present invention, for example, copper salt (
copper sulfate, copper nitrate, etc.), cobalt salts (cobalt sulfate, cobalt nitrate, etc.), manganese salts (manganese sulfate, manganese nitrate, etc.), molybdenum salts (ammonium molybdate, sodium molybdate, etc.), and silver salts (silver nitrate, etc.). can give.
好ましい重金属塩触媒は銅塩、コバルト塩、モリブデン
塩及びマンガン塩であり、特にコバルト塩が最も好まし
い。そして、この種の化学研磨液において銅塩以外の重
金属塩触媒を使用することは、従来知られていなかつた
。本発明の化学研磨液における重金属塩触媒濃度は、無
水塩として０，０３７／ｌ以上、好ましくは０．１ｙ／
ｆ！以上である。Preferred heavy metal salt catalysts are copper salts, cobalt salts, molybdenum salts and manganese salts, with cobalt salts being most preferred. The use of heavy metal salt catalysts other than copper salts in this type of chemical polishing liquid has not been previously known. The heavy metal salt catalyst concentration in the chemical polishing liquid of the present invention is 0,037/l or more as an anhydrous salt, preferably 0.1 y/l.
f! That's all.
同濃度が低すぎると充分な触媒効果を発揮せしめること
ができない。本発明における珪酸含有物質としては、珪
酸アルカリ及びベントナイトよりなる群から選ばれたも
のが使用される。珪酸アルカリとしては、珪酸ソーダ、
珪酸カリ及び珪酸リチウム等があげられるが、珪酸ソー
ダ及び珪酸カリが好ましい。また、ベントナイトも好ま
しい。本発明の化学研磨液における珪酸含有物質の濃度
は、ＳｉＯ２として、通常０．１ｙ／ｌ以上、好ましく
は０．３ｙ／ｌ以上である。その濃度が低すぎると光沢
及び平滑性の改善効果が得られなくなる。本発明のアル
カリ性アルミニウム化学研磨液には、必要に応じてさら
に他の成分、たとえばリン酸アルカリ等を含有せしめる
ことができる。If the concentration is too low, sufficient catalytic effect cannot be exhibited. The silicic acid-containing substance used in the present invention is selected from the group consisting of alkali silicates and bentonite. Examples of alkali silicate include sodium silicate,
Examples include potassium silicate and lithium silicate, and sodium silicate and potassium silicate are preferred. Bentonite is also preferred. The concentration of the silicic acid-containing substance in the chemical polishing liquid of the present invention is usually 0.1 y/l or more, preferably 0.3 y/l or more as SiO2. If the concentration is too low, the effect of improving gloss and smoothness cannot be obtained. The alkaline aluminum chemical polishing liquid of the present invention may further contain other components such as alkali phosphate, if necessary.
本発明のアルカリ性アルミニウム化学研磨液を用いてア
ルミニウム（その合金を含む）を化学研磨するには、こ
の研磨液を通常７０〜１１０℃、好ましくは８０〜１０
０℃の温度に保持し、その化学研磨液中に研磨をすべき
アルミニウム材を浸漬して処理する。その浸漬処理時間
は、通常５〜３０秒、好ましくは１０〜２０秒である。
本発明の化学研磨液は、純アルミニウムのみならず、ア
ルミニウム合金の化学研磨にも用いられる。その化学研
磨を終了後は、常法にしたがつて水洗や酸洗等の仕上げ
処理を行なう。本発明の化学研磨液は、上記した各成分
を含有せしめてなるものであるから、これを用いてアル
ミニウム又はその合金の化学研磨をすると、上記したよ
うに平滑で光沢のある研磨面が容易に得られる。In order to chemically polish aluminum (including its alloy) using the alkaline aluminum chemical polishing solution of the present invention, the polishing solution is usually heated at 70-110°C, preferably at 80-110°C.
The temperature is maintained at 0° C., and the aluminum material to be polished is immersed in the chemical polishing solution. The immersion treatment time is usually 5 to 30 seconds, preferably 10 to 20 seconds.
The chemical polishing liquid of the present invention can be used not only for pure aluminum but also for chemical polishing of aluminum alloys. After the chemical polishing is completed, finishing treatments such as washing with water and pickling are performed in accordance with conventional methods. Since the chemical polishing liquid of the present invention contains the above-mentioned components, when aluminum or its alloy is chemically polished using the chemical polishing liquid, a smooth and glossy polished surface as described above can be easily obtained. can get.
次に、実施例及び比較例をあげて本発明をさらに詳述す
る。Next, the present invention will be explained in further detail by giving Examples and Comparative Examples.
実施例１〜５、比較例１〜５
表１に記載の各種の組成の化学研磨液を調製し、それぞ
れの化学研磨液を８０〜１００℃に保ち、平滑なアルミ
ニウム板を３０秒間浸漬して化学研磨処理をし、次いで
取出して直ちに水洗、又は３０秒間空気中に放置してか
ら水洗した。Examples 1 to 5, Comparative Examples 1 to 5 Chemical polishing liquids with various compositions listed in Table 1 were prepared, each chemical polishing liquid was kept at 80 to 100°C, and a smooth aluminum plate was immersed for 30 seconds. After chemical polishing, the sample was taken out and immediately washed with water, or left in the air for 30 seconds and then washed with water.
得られた各化学研磨アルミニウム板について、研磨面の
光沢及び肌荒れ状態を調べて評価した結果は表１に示す
とおりであつた。For each of the chemically polished aluminum plates obtained, the gloss and roughness of the polished surface were examined and evaluated, and the results are shown in Table 1.
※〈 その評価は、下記の基準にした
がつて行ない、下記の表示方法で表示した（以下の各実
施例及び比較例も同様）。（１）光沢の評価基準
↓ Ｈピ′ＪＳＪｌこｌへ？〜縛Ｖ−１ノベＶＶ（
３）評価の表示光沢及び肌荒れの評価の表示は、たとえ
ばＡ×ａ又ぱＢＸｄ等のように表示した。*< The evaluation was performed according to the following criteria and displayed using the following display method (the same applies to the following examples and comparative examples). (1) Evaluation criteria for gloss ↓ Hpi'JSJl? ~Baku V-1 novel VV (
3) Display of evaluation The display of evaluation of gloss and rough skin was displayed as, for example, A×a or BXd.
なお、゛ＤＸｄ程度でも梨地等に使用できるので、ＤＸ
ｄ以上であれば工業的実施が可能である。実施例６、比
較例６
苛性ソーダを６４０ｙ／ｌ（１６モル／ｌ）、硝酸ソー
ダを３００７／ｌ（約３．５モル／ｌ）、触媒として硝
酸コバルトを無水塩として１ｔ／１及び水ガラスを３ｙ
／ｌ（ＳｉＯ２として１ｙ／ｆ！）含む水性液を調製し
た。In addition, even DXd level can be used for satin finishes, etc., so DX
If it is d or more, industrial implementation is possible. Example 6, Comparative Example 6 640 y/l (16 mol/l) of caustic soda, 3007 y/l (about 3.5 mol/l) of sodium nitrate, 1 t/1 cobalt nitrate as an anhydrous salt as a catalyst, and water glass. 3y
/l (1y/f as SiO2!) was prepared.
この水性液を化学研磨液として用い、平滑なアルミニウ
ム板を８０〜１００′Ｃの温度の同液に３０秒間浸漬し
て化学研磨処理をした。その結果は表２に示すとおりで
あつた。また比較のために、水ガラスを全く用いないで
、そのほかは上記組成と同様の組成の化学研磨液を調製
した。Using this aqueous solution as a chemical polishing solution, a smooth aluminum plate was immersed in the same solution at a temperature of 80 to 100'C for 30 seconds for chemical polishing treatment. The results were as shown in Table 2. For comparison, a chemical polishing liquid having the same composition as above was prepared without using any water glass.
この化学研磨液を用いて上記と同一の条件でアルミニウ
ム板の化学研磨を行なつた。その結果は表２に示すとお
りであつた。実施例７
苛性ソーダ３２０７／ｆ！（８モル／ｆ）、硝酸ソーダ
４００ｙ／ｌ（約４．７モル／ｌ）、硫酸銅をＣＵＳＯ
４として０．４ｔ／ｌ及び水ガラス３７／ｌ（ＳｉＯ２
として１ｆ７／／？）含む化学研磨液を調製し、これを
用いて１００℃の温度で３０秒間処理した。Using this chemical polishing liquid, an aluminum plate was chemically polished under the same conditions as above. The results were as shown in Table 2. Example 7 Caustic soda 3207/f! (8 mol/f), sodium nitrate 400 y/l (approximately 4.7 mol/l), copper sulfate in CUSO
4 as 0.4t/l and water glass 37/l (SiO2
As 1f7//? ) A chemical polishing solution was prepared and treated with this at a temperature of 100° C. for 30 seconds.
その評価結果は、直ちに水洗の場合、及び３０秒間空中
に放置後水洗の場合ともＢＸｃであつた。The evaluation results were BXc both when washed immediately with water and when washed with water after being left in the air for 30 seconds.
実施例８〜１２、比較例７表３に示すように、硝酸塩又
は亜硝酸塩濃度を種々に変え、種々の重金属塩触媒及び
ベントナイトを組合わせて種々の化学研磨液を調製した
。Examples 8 to 12, Comparative Example 7 As shown in Table 3, various chemical polishing liquids were prepared by varying the nitrate or nitrite concentration and combining various heavy metal salt catalysts and bentonite.
また、比較のためにベントナイトを用いない化学研磨液
（比較例７）を調製した。これらの各化学研磨液をそれ
ぞれ用いて平滑なアルミニウム板を１００℃の温度で３
０秒間処理した。In addition, for comparison, a chemical polishing liquid (Comparative Example 7) without using bentonite was prepared. Using each of these chemical polishing solutions, a smooth aluminum plate was polished at a temperature of 100℃ for 3 days.
Processed for 0 seconds.
研磨後直ちに引上げて３０秒間空気中に放置してから水
洗した。その評価結果は表３に示すとおりであつた。実
施例 １３〜１８
表４に示すように、各種の重金属塩触媒の添加量を変え
て各種の化学研磨液を調製し、この研磨液を用いて平滑
なアルミニウム板を１００℃の温度で３０秒間処理した
。Immediately after polishing, it was pulled up, left in the air for 30 seconds, and then washed with water. The evaluation results were as shown in Table 3. Examples 13 to 18 As shown in Table 4, various chemical polishing solutions were prepared by changing the amounts of various heavy metal salt catalysts added, and a smooth aluminum plate was polished using this polishing solution at a temperature of 100°C for 30 seconds. Processed.
その評価結果は表４に示すとおりであつた。The evaluation results were as shown in Table 4.
触媒金属塩は無水塩として０．０３ｔ／ｌ程度以上の添
加で有効である。実施例 １９〜２０
表５に示すように触媒金属塩としてモリブデン酸ナトリ
ウムを使用し、また珪酸含有物質としてベントナイトを
用いて各種の化学研磨液を調製した。The catalyst metal salt is effective when added as an anhydrous salt in an amount of about 0.03 t/l or more. Examples 19-20 As shown in Table 5, various chemical polishing liquids were prepared using sodium molybdate as the catalyst metal salt and bentonite as the silicic acid-containing substance.
これらの各化学研磨液に１００℃の温度で平滑なアルミ
ニウム板を３０秒間浸漬して処理をした。A smooth aluminum plate was immersed in each of these chemical polishing solutions at a temperature of 100° C. for 30 seconds.
その評価結果は表５に示すとおりであつた。実施例 ２
１〜２３表６に示すように、珪酸含有物質の添加量を種
種に変化させて各種の化学研磨液を調製した。The evaluation results were as shown in Table 5. Example 2
1-23 As shown in Table 6, various chemical polishing liquids were prepared by varying the amount of the silicic acid-containing substance added.
これらの各化学研磨液を用いて平滑なアルミニウム板を
１００℃で３０秒間処理した。その評価結果は表６に示
すとおりであつた。A smooth aluminum plate was treated at 100° C. for 30 seconds using each of these chemical polishing solutions. The evaluation results were as shown in Table 6.
珪酸含有物質はＳｉＯ２として０．１７／ｌ以上含有さ
れていれば有効である。実施例 ２４
苛性ソーダ２５０７／ｆ！（６．２５モル／ｌ）、硝酸
ソーダ１００７／ｌ（約１．２モル／ｌ）、硝酸カリ１
００ｙ／ｌ（約１モル／ｌ）、硫酸銅を無水塩として０
．２ｙ／ｌ、水ガラス３ｙ／１（ＳｉＯ２として１７／
ｌ）含有する化学研磨液を調製した。The silicic acid-containing substance is effective if it is contained in an amount of 0.17/l or more as SiO2. Example 24 Caustic soda 2507/f! (6.25 mol/l), sodium nitrate 1007/l (approximately 1.2 mol/l), potassium nitrate 1
00y/l (approximately 1 mol/l), copper sulfate as anhydrous salt
．． 2y/l, water glass 3y/1 (17/l as SiO2
l) A chemical polishing solution containing:
得られた化学研磨液を用いて各種のアルミニウム合金材
の平滑な板を１００℃で３０秒間処理した。Using the obtained chemical polishing liquid, various smooth plates of aluminum alloy materials were treated at 100° C. for 30 seconds.
Claims (1)
る水性液よりなるアルミニウム化学研磨液において、重
金属塩触媒とともに珪酸アルカリ及びベントナイトより
なる群から選ばれた珪酸含有物質を含有せしめてなるこ
とを特徴とするアルカリ性アルミニウム化学研磨液。 ２ 苛性ソーダが１〜１６モル／ｌ含有されてなる特許
請求の範囲第１項記載の化学研磨液。 ３ 硝酸塩及び／又は亜硝酸塩が合計量で０．３〜７モ
ル／ｌ含有されてなる特許請求の範囲第１項、又は第２
項記載の化学研磨液。 ４ 珪酸含有物質がＳｉＯ＿２として０．１ｇ／ｌ以上
含有されてなる特許請求の範囲第１項、第２項、又は第
３項記載の化学研磨液。 ５ 重金属塩触媒が銅塩、コバルト塩、モリブデン塩及
びマンガン塩よりなる群より選ばれてなる特許請求の範
囲第１項、第２項、第３項、又は第４項記載の化学研磨
液。[Scope of Claims] 1. An aluminum chemical polishing solution consisting of an aqueous solution containing caustic soda and nitrates and/or nitrites, containing a silicic acid-containing substance selected from the group consisting of alkali silicates and bentonite together with a heavy metal salt catalyst. An alkaline aluminum chemical polishing liquid that is characterized by the following properties: 2. The chemical polishing liquid according to claim 1, which contains 1 to 16 mol/l of caustic soda. 3 Claim 1 or 2 containing nitrate and/or nitrite in a total amount of 0.3 to 7 mol/l
Chemical polishing liquid as described in section. 4. The chemical polishing liquid according to claim 1, 2, or 3, wherein the silicic acid-containing substance is contained in an amount of 0.1 g/l or more as SiO_2. 5. The chemical polishing liquid according to claim 1, 2, 3, or 4, wherein the heavy metal salt catalyst is selected from the group consisting of copper salts, cobalt salts, molybdenum salts, and manganese salts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14390781A JPS5945756B2 (en) | 1981-09-14 | 1981-09-14 | Alkaline aluminum chemical polishing liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14390781A JPS5945756B2 (en) | 1981-09-14 | 1981-09-14 | Alkaline aluminum chemical polishing liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5845380A JPS5845380A (en) | 1983-03-16 |
| JPS5945756B2 true JPS5945756B2 (en) | 1984-11-08 |
Family
ID=15349847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14390781A Expired JPS5945756B2 (en) | 1981-09-14 | 1981-09-14 | Alkaline aluminum chemical polishing liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5945756B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63179443A (en) * | 1987-01-20 | 1988-07-23 | Fuji Photo Film Co Ltd | Signal fetching device |
| JPH0320044U (en) * | 1989-07-03 | 1991-02-27 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104694931B (en) * | 2015-03-30 | 2017-03-15 | 江苏理工学院 | Alkaline chemical polishing method and the alkaline chemical polishing liquid it adopts |
| CN105039992A (en) * | 2015-07-21 | 2015-11-11 | 安徽江威精密制造有限公司 | Alkaline polishing solution and preparation method thereof |
| CN105177586A (en) * | 2015-07-21 | 2015-12-23 | 安徽江威精密制造有限公司 | Aluminum alloy polishing solution and preparing method thereof |
| CN107699897A (en) * | 2017-09-11 | 2018-02-16 | 苏州盈腾五金制品有限公司 | A kind of processing of surface polishing of Al-alloy parts |
| CN113718328B (en) * | 2021-11-04 | 2022-02-11 | 山东裕航特种合金装备有限公司 | Surface treatment method for aluminum alloy casting for ship |
-
1981
- 1981-09-14 JP JP14390781A patent/JPS5945756B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63179443A (en) * | 1987-01-20 | 1988-07-23 | Fuji Photo Film Co Ltd | Signal fetching device |
| JPH0320044U (en) * | 1989-07-03 | 1991-02-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5845380A (en) | 1983-03-16 |
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