JPS5949296B2 - Copper alloy and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper alloy containing Ni and having good weldability and brazing properties, and a method for producing the same.

Copper alloys containing Ni are generally subjected to aging precipitation treatment to produce desired products.

This is because the above-mentioned copper alloy was originally developed as a copper alloy with high strength, and until now, it has been thought that it is natural for those skilled in the art to carry out aging precipitation treatment in order to make it into a product.

However, this type of alloy has insufficient workability, weldability, and brazing properties, and it is difficult to perform brazing or welding after deep drawing the material of this type of alloy. However, it was sometimes difficult to obtain the quality required for the product.

The present inventor has completed the present invention by considering the above-mentioned conventional technology and conducting research with the aim of creating a copper alloy that is easy to process and can ultimately produce products with high strength and excellent properties. .

Therefore, an object of the present invention is to obtain a copper alloy that is easy to process.

Another object of the present invention is to obtain a copper alloy with good weldability and brazing properties.

A further object of the present invention is to obtain a copper alloy from which a copper alloy product can be formed which can have sufficient strength in end-use conditions.

Another object of the present invention is to obtain a copper alloy that has sufficient strength to handle operations such as processing, welding, and brazing.

The copper alloy according to the present invention is different from the prior art in that it is not a non-precipitated solid solution consisting of effective trace amounts of additive elements such as Ni and Si, and the remainder is substantially copper, but is a mere solid solution with no precipitates. It is something.

The composition of the non-precipitating solid solution constituting the copper alloy of the present invention will be described below.

(1) Ni is preferably in the range of 1 to 5% by weight, with the remainder being substantially Cu0, and preferably Ni in the range of 2 to 4%.

(2) 0.00% by weight of 1-5% Ni and at least one selected from the group consisting of Si, Mg, Ge, and B;
5 to 0.1% and the balance is substantially Cu0, preferably Ni is 2
The content of at least one element such as Si added in a small amount is preferably in the range of 0.01 to 0.05%.

The reasons for limiting the composition of these copper alloys are described below.

By adding Ni, it is possible to improve strength, oxidation resistance, and heat resistance, and if the content exceeds the above range, thermal conduction and electrical conduction will decrease sharply.
Furthermore, if the component range is less than the above range, no effects such as improvement in strength will be exhibited.

Si, Mg, Ge, and B are added in small amounts to improve strength and heat resistance, and also have the function of suppressing coarsening of crystal grains and preventing surface roughness during processing.

However, if the content exceeds the above range, the thermal conductivity will deteriorate,
Also, if the amount of ingredients is less than the above range, the above effect will not be achieved.

The copper alloy of the present invention is obtained by melting an ingot of the alloy having the above-mentioned composition and processing it under zero hot stress to form a desired bar or plate at an angle of 800° to 90°.
Solution treatment is carried out at 50°C, preferably 850° to 930°C, and this is processed to obtain various desired copper alloy products.

If this solution treatment is carried out at a temperature that is too high, precipitates will aggregate at grain boundaries and crystal grains will become coarse.

These phenomena must be avoided because they cause roughness during processing and cracking during bending.

Furthermore, if the solution treatment temperature is low, ductility is insufficient and cracks occur during press forming, making it impossible to perform drawing and crimp forming, which is not preferable.

The copper alloy of the present invention obtained by the above manufacturing method is a non-precipitating solid solution.

The properties of the copper alloy of the present invention are shown in Table 1 below.

Table-1 Bending workability Drawing workability that does not break in the adhesion test Hardness that does not break in the cup test
70~80HV Proof strength 10~20 to 7/'mA Tensile strength 30~40 kg/mA Elongation 30~
40% Welding properties Good edge arc properties Good brazing properties Silver brazing properties Good crystal grains The copper alloy of the present invention, which is finer than A5, can be processed and high-temperature treated to form a desired shape and structure.

In this case, processing refers to mechanical processing such as rolling, press forming, drawing, or bending, and high-temperature processing refers to not only simple heat treatment but also work performed while heating, such as welding,
Refers to brazing or exhaust treatment.

Processing is not necessarily essential in the process of using the copper alloy of the present invention, and is merely a process for finishing the copper alloy into other shapes and structures.

Regarding high-temperature processing, for example, when brazing in a continuous furnace, the brazing work may be performed at around 850°C, but the brazing process is then heated at 450° to 650°C in the furnace. There is.

Such use is a preferred use of the present invention.

Next, one example of use of the present invention will be described with reference to the drawings.

FIG. 1 shows a vacuum sealing member 1, which is one of vacuum container members, which was obtained by solution treatment at 900° C. and press molding.

FIG. 2 shows a vacuum container member 2 sealed with this vacuum sealing member 1.

The vacuum sealing member 1 is applied to the sealing part 3 of the vacuum container member 2 at 830°C.
It is then soldered with silver, as shown in Figure 3.

The vacuum container 4 assembled in this way is subjected to exhaust treatment at 500° C. for 1 hour.

The workability of such work and the properties of the final vacuum container members are shown in Table 2 for various components of the present invention.

The appendix 6 is a reference example.

In addition, if the difference between the value of the distance shown by h of the recess in Figure 3 before the exhaust treatment and the value after the exhaust treatment when the internal pressure is 10 mmHg is expressed as the amount of deformation, the following table 3 shows the difference. It became.

At this time, the outer diameter of the vacuum container was 45 m, and the internal pressure was maintained as described above while heating at 500° C. for 1 hour.

Table 3 Amount of deformation (wIK) Y1~A5 0~0.1 YE6 0.8~2.0 As described above, the copper alloy of the present invention can be used not only as a member for vacuum vessels but also for various purposes. Extremely easy to process,
It exhibits excellent weldability, brazing properties, etc., and has sufficient strength during these operations, and also has sufficient strength as a final product.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1, 2, and 3 are views showing examples of the use of the copper alloy of the present invention. 1... Vacuum sealing member, 2... Vacuum container member.

Claims (1)

[Scope of Claims] A copper alloy which is a non-precipitated solid solution and has good weldability and brazing properties, consisting of 1 to 5% Ni by weight and the remainder substantially Cu. 2. An alloy consisting of 1 to 5% Ni by weight and the remainder substantially Cu is solution-treated at 800°-950°C.It is a non-precipitation solid solution and has good weldability and brazing properties. method for producing copper alloys. 3 1 to 5% by weight of Ni and 0.005% of at least one selected from the group consisting of Si, Mg, Ge, and B.
A copper alloy with good weldability and brazing properties since it is a non-precipitated solid solution with a content of ~0.1% and the remainder is substantially Cu.