JPS5950117B2 - semiconductor float - Google Patents
semiconductor floatInfo
- Publication number
- JPS5950117B2 JPS5950117B2 JP51019392A JP1939276A JPS5950117B2 JP S5950117 B2 JPS5950117 B2 JP S5950117B2 JP 51019392 A JP51019392 A JP 51019392A JP 1939276 A JP1939276 A JP 1939276A JP S5950117 B2 JPS5950117 B2 JP S5950117B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- light emitting
- hollow
- emitting element
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
本発明は半導体発光表示装置の改良に関するもので特に
発光効率の良好な半導体発光表示装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in semiconductor light emitting display devices, and particularly to semiconductor light emitting display devices with good luminous efficiency.
一般に半導体発光表示装置にて比較的狭小な空間に多数
の発光素子ペレットを配置したものに浮子、浮標などが
ある。2. Description of the Related Art In general, semiconductor light emitting display devices in which a large number of light emitting element pellets are arranged in a relatively narrow space include a float and a buoy.
従来の浮子で発光素子を用いたものの構造の一例を第１
図と第２図で示す。An example of the structure of a conventional float using light emitting elements is shown in the first example.
This is shown in Figs.
第２図のａとｂは第１図で示すような単一光源１ａ、ｌ
ｂを使用する代りに複数の発光素子ペレット１１を透明
な樹脂１５でモールドして一体化したブロックを示すも
ので、第１図に示す様な透光性の合成樹脂で形成されて
いる浮子の外器囲６の発光部に挿入して第１１図の電源
電池５と第２図の絶縁板１２に形成された電極用リード
層１３ａ、１３ｂ、２３ａ、２３ｂとを電気的に接続し
て発光させる発光ブロックである。しかしこの装置では
、絶縁板を使用するために前後２つの発光面の相互の発
光の干渉が妨げられ発行素子附近と遠隔部とに明暗の差
が生じ均一な帯状の光源を得ることが出来ない欠点があ
つた。a and b in FIG. 2 are single light sources 1a, l as shown in FIG.
This figure shows a block in which a plurality of light-emitting element pellets 11 are molded with transparent resin 15 instead of using a light-emitting element pellet 15, and the float is made of a transparent synthetic resin as shown in Fig. The power battery 5 shown in FIG. 11 is inserted into the light emitting part of the outer enclosure 6 and the electrode lead layers 13a, 13b, 23a, 23b formed on the insulating plate 12 shown in FIG. 2 are electrically connected to emit light. It is a light-emitting block that allows you to However, with this device, the use of an insulating plate prevents the mutual interference of light emission between the two front and rear light emitting surfaces, resulting in a difference in brightness between the vicinity of the light emitting element and the remote part, making it impossible to obtain a uniform strip-shaped light source. There were flaws.
本発明は上記の様な欠点を除去し、さらに外囲器に含ま
れるソケットを介して片側の発光面の取ｌ換えが自由な
両面発光表示装置を提供することを目的とするものであ
る。本発明は上記の様な目的を達成するために、第３図
に示す様な１本の幹から間隔を置いて複数の短い横枝が
出ている形の電極用リードを兼ねたフ・レーム１３を使
用することを特徴とする。SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned drawbacks and to provide a double-sided light-emitting display device in which one side of the light-emitting surface can be freely replaced through a socket included in the envelope. In order to achieve the above-mentioned object, the present invention has a frame which also serves as an electrode lead and has a plurality of short lateral branches extending from a single trunk at intervals as shown in Fig. 3. 13 is used.
なお横枝相互の間隔は発光の波長の偶数倍に相当する距
離になる様にすると、発光効率が良い。まずこの枝部を
有するフレーム１３は、その先端に電気的に固着され、
相互に接続された半導体ノ発光素子ペレット１１とリー
ド線１４を覆う透明な樹脂１５の支えともなる。Note that the luminous efficiency is good when the distance between the lateral branches is set to a distance corresponding to an even number multiple of the wavelength of the emitted light. First, the frame 13 having the branch portion is electrically fixed to its tip,
It also supports the transparent resin 15 that covers the interconnected semiconductor light emitting element pellets 11 and lead wires 14.
これにより樹脂モールドの部分を自由にかつ最少限度に
抑えることができ発光装置の軽量化が可能である。さら
に第５図ａ、ｂ、ｃに示す様に電源電池５・のソケット
１６、２６へのさしこみ用の足として使用される。This allows the resin mold portion to be freely and minimized, making it possible to reduce the weight of the light emitting device. Further, as shown in FIGS. 5A, 5B, and 5C, they are used as legs for inserting the power battery 5 into the sockets 16 and 26.
これにより外囲器６の中でそれぞれの半円状の発光ブロ
ックを一体と成し、円柱状の発光装置を得られると共に
、一方の発光プロツクの故障の場合には取換えが可能に
なる。以下本発明に於ける一実施例を製造方法と伴に第
３図〜第５図を参照しながら説明する。As a result, each of the semicircular light emitting blocks can be integrally formed within the envelope 6 to obtain a cylindrical light emitting device, and in the event that one of the light emitting blocks breaks down, it can be replaced. An embodiment of the present invention will be described below along with a manufacturing method with reference to FIGS. 3 to 5.
第３図において１３は本装置の特徴である電極リードを
兼ねたフレーム横枝の間隔は発光の波長の偶数倍に形成
されている。In FIG. 3, reference numeral 13 indicates that the interval between horizontal branches of the frame which also serve as electrode leads, which is a feature of this device, is formed to be an even number multiple of the wavelength of light emission.
材質としてはＣｕＮｉ等が好適する。第３図において発
光素子ペレツト１１を一方の電極をフレーム１３ａの先
端に電気的にマウントする。As the material, CuNi or the like is suitable. In FIG. 3, a light emitting element pellet 11 is electrically mounted with one electrode on the tip of a frame 13a.
尚発光素子ペレツトを設置する場所は複数段に形成され
ている為、任意に選択でき、全体の光の強さを任意に調
節できる利点がある。次にペレツト１１の他の電極面と
他方のフレーム１３ｂの先端とを金属細線１４にて接続
導接して梯子状の枠組を形成する。Since the light emitting element pellets are installed in multiple stages, they can be arbitrarily selected and the overall light intensity can be adjusted arbitrarily. Next, the other electrode surface of the pellet 11 and the tip of the other frame 13b are connected and electrically connected using the thin metal wire 14 to form a ladder-like framework.
金属細線１４の材質としてはＡｕ，ＡｌＡｕ−Ｇａ等が
好適である。次に第３図及び第４図に示す様にフレーム
１３ａと１３ｂの間で透明樹脂１５でペレツト１１を覆
う様に半円柱状にモールドして組立体を形成す．る。図
の１５は透光性の合成樹脂、例えばシリコン又はエポキ
シ樹脂にてモールド又はキヤステング等のいずれでも良
い。さらに第４図及び第５図に示す様に上記半円柱状の
プロツク即ち組立体２つを、その裏面の平ら．な樹脂面
を背中合せにした状態で第５図ａの外囲器６の発光部の
中に押込んで第５図ｂに示す様にソケツト１６，２６を
介して電源電池５に接続する。Preferred materials for the thin metal wire 14 include Au, AlAu-Ga, and the like. Next, as shown in FIGS. 3 and 4, the transparent resin 15 is molded into a semi-cylindrical shape between the frames 13a and 13b so as to cover the pellet 11, thereby forming an assembly. Ru. The reference numeral 15 in the figure may be molded or cast using a transparent synthetic resin such as silicone or epoxy resin. Further, as shown in FIGS. 4 and 5, the two semi-cylindrical blocks or assemblies are attached to the flat surface of the back surface. With the resin surfaces facing each other, it is pushed into the light emitting part of the envelope 6 shown in FIG. 5a, and connected to the power source battery 5 through the sockets 16 and 26 as shown in FIG. 5b.
前記外囲器６は透光性の合成樹脂、例えばシリコン又は
エポキシ樹脂でなり、特に先端部の内径は第５図ｃの樹
脂モールドの外径に等しく形成されている。The envelope 6 is made of a transparent synthetic resin, such as silicone or epoxy resin, and in particular, the inner diameter of the tip portion is formed to be equal to the outer diameter of the resin mold shown in FIG. 5c.
この透光性外囲器６はその１端に設けた中空樹脂筒体２
７とこれを支える中空の膨出樹脂基部２８とから構成さ
れる。This transparent envelope 6 has a hollow resin cylinder 2 provided at one end thereof.
7 and a hollow bulging resin base 28 that supports this.
本発明により、従来装置では得られなかつた帯状の均一
なる光源が簡単かつ安価に得られると共に交換が容易で
あるため浮子等の光源としても最適である。According to the present invention, it is possible to easily and inexpensively obtain a uniform light source in the form of a band, which could not be obtained with conventional devices, and since it is easy to replace, it is also suitable as a light source for floats and the like.
第１図は従来の発生装置を使用した浮子の一例を示した
図。
第２図ａは第１図に示す様な従来例に対する改良された
提案例を示した図。第２図ｂは第２図ａに示されたＡＡ
′線に沿つた断面図、第３図は本発明による実施例を示
す平面図。第４図は第３図のＡ−Ａ’線に沿つた断面図
。第５図ａは外囲器中に組立てられた状態図。第５図ｂ
は第５図ａの拡大したソケツト部への組立図。第５図ｃ
は第５図ｂの断面図。１ａ〜１ｂ・・・・・・発光素子
、２ａ〜２ｂ・・・・・・絶縁被覆管、３ ・・・・・
・リード線、４ ・・・・・・抵抗、５ ・・・・・・
電源電池、５ａ〜 ５ｂ・・・・・・電極電子、６ ・
・・・・・外囲器、１１・・・・・・発光素子ペレツト
、１２・・・・・・絶縁板、１３ａ，１３ｂ，２−３ａ
，２３ｂ・・・・・・電極用リードフレーム、１４・・
・・・・リード線、１５・・・・・・透明樹脂、１６，
２６・・・・・・ソケツト部、２７・・・・・・中空樹
脂筒体、２８・・・・・・膨出樹脂基部。FIG. 1 is a diagram showing an example of a float using a conventional generator. FIG. 2a is a diagram showing a proposed example improved from the conventional example shown in FIG. Figure 2b is the AA shown in Figure 2a.
FIG. 3 is a plan view showing an embodiment of the present invention. FIG. 4 is a sectional view taken along line AA' in FIG. 3. FIG. 5a is a diagram of the assembled state in the envelope. Figure 5b
5 is an enlarged assembly diagram of the socket part in FIG. 5a. Figure 5c
is a sectional view of FIG. 5b. 1a-1b...Light emitting element, 2a-2b...Insulation cladding tube, 3...
・Lead wire, 4...Resistance, 5...
Power supply battery, 5a-5b... Electrode electronic, 6.
... Envelope, 11 ... Light emitting element pellet, 12 ... Insulation plate, 13a, 13b, 2-3a
, 23b...Lead frame for electrode, 14...
...Lead wire, 15...Transparent resin, 16,
26...Socket portion, 27...Hollow resin cylinder, 28...Bulging resin base.
Claims (1)
空の膨出樹脂基部とより成る透光性外囲器と、前記中空
の膨出樹脂基部に配置する電源と、平行に配置するフレ
ームから互に向き合つた複数の技部を形成し、この一対
の技部の１方に発光素子を固着し、この発光素子電極と
他方の技部間を電気的に導通して形成した組立体と、こ
の１対の組立体を被覆する透光性樹脂と、この透光性樹
脂より導出したリードと、前記中空樹脂筒体に配置する
前記透光性樹脂からの導出リードと前記電源とを電気的
に接続する手段とを具備することを特徴とする半導体浮
子。1. A translucent envelope consisting of a hollow resin cylinder formed at one end and a hollow bulging resin base supporting the same, a power source disposed in the hollow bulging resin base, and a frame arranged in parallel. An assembly formed by forming a plurality of technique parts facing each other from a pair of technique parts, fixing a light emitting element to one of the pair of technique parts, and electrically conducting between the light emitting element electrode and the other technique part. A translucent resin covering the pair of assemblies, a lead led out from the translucent resin, a lead led out from the translucent resin disposed in the hollow resin cylinder, and the power supply. A semiconductor float characterized by comprising means for electrically connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51019392A JPS5950117B2 (en) | 1976-02-26 | 1976-02-26 | semiconductor float |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51019392A JPS5950117B2 (en) | 1976-02-26 | 1976-02-26 | semiconductor float |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52103984A JPS52103984A (en) | 1977-08-31 |
| JPS5950117B2 true JPS5950117B2 (en) | 1984-12-06 |
Family
ID=11998003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51019392A Expired JPS5950117B2 (en) | 1976-02-26 | 1976-02-26 | semiconductor float |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950117B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6237464U (en) * | 1985-08-26 | 1987-03-05 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843933B2 (en) * | 1977-08-30 | 1983-09-30 | パイオニア株式会社 | D-A converter |
| JPS61100982A (en) * | 1984-10-23 | 1986-05-19 | Fuji Electric Co Ltd | Collecting display body |
| JP6414183B2 (en) | 2016-11-16 | 2018-10-31 | 富士ゼロックス株式会社 | Light emitting element array and optical transmission device |
| JP6835152B2 (en) * | 2019-07-01 | 2021-02-24 | 富士ゼロックス株式会社 | Light emitting element array and optical transmission device |
| CN112385621B (en) * | 2020-11-16 | 2022-11-29 | 山东延卓渔具有限公司 | Float for fishing device |
-
1976
- 1976-02-26 JP JP51019392A patent/JPS5950117B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6237464U (en) * | 1985-08-26 | 1987-03-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52103984A (en) | 1977-08-31 |
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