JPS5950459B2 - Chuck device for workpiece materials such as crystal oscillators - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chuck device for a workpiece in an apparatus for polishing lenses, crystal resonators, etc.

Conventionally, for example, when polishing a crystal resonator, the chuck method involves fixing the crystal piece to a spherical polishing plate with an adhesive such as pitch, and manually polishing the spherical surface.

However, it is inefficient because it is done manually, and since the crystal pieces are individually identified by pitch etc., there is a thick adhesive layer, making it difficult to inspect the thickness of the crystal piece.Accurate thickness cannot be determined unless the adhesive is removed and done manually. It won't happen.

Furthermore, when individualizing crystal blanks at pitches, if they are not attached accurately, they will be polished in an inclined state, which will disrupt the cutting angle of the crystal blank and cause deterioration of temperature characteristics.

The present invention eliminates the above-mentioned drawbacks; it is easy to attach and remove the material to be polished, such as a crystal resonator, and therefore it is easy to measure the thickness after polishing, and it is possible to prevent one-sided polishing, resulting in good quality. The present invention provides a chuck device for workpieces such as crystal resonators that can be processed in a variety of ways.

An embodiment in which the present invention is applied to a polishing device will be described.

In FIG. 1, frame plates 2 and 3 are installed on a base plate 1 at a predetermined interval, bearings 4 and 5 are fixed to the upper parts of the frame plates 2 and 3, and an arm shaft 6 is attached to the bearing 4. The arm shaft 7 is inserted into the bearing 5.

A rocking body 8 is attached between the arm shafts 6 and 7, and is fixed to the arm shaft 6 with a key 9 and loosely fitted to the arm shaft 7.

A bearing 10 passes through the bottom plate of the rocking body 8,
A shaft 13 is rotatably supported on the bearing 10 via bearings 14 and 15.

A wrap plate 16 is screwed onto the upper threaded portion of the shaft 13.
A pulley 17 is pivotally attached to the lower end with a nut 18.

A spherical polishing surface 16a is formed on this lapping plate 16, and this spherical surface has a radius equal to the distance R between the axis A-A of the arm shafts 6 and 7 and the spherical polishing surface 16a.

As shown in the second figure, the rotational driving means for the lap plate 16 includes a bell 21a stretched between a motor 19 attached to the oscillating body 8 and a pulley 21 and a pulley 17 that are pivotally attached to a drive shaft of a deceleration mechanism 20. It has a similar structure.

Further, the rocking drive means of the rocking body 8 includes a rotary plate 2 which is rotated at a constant speed by a motor 22 and a reducer 23 as shown in the first and second figures.
One end of a link 26 is connected to a shaft 25 protruding from the outer periphery of the arm shaft 6, and the other end of this link is connected via a pin 29 to the other end of a link 28 connected to the arm shaft 6 with a nut 27. are doing.

Therefore, a chuck device for chucking a workpiece according to the present invention and a rotation driving means for this means will be explained.

In FIG. 1, a support column 30 is installed on the substrate 1,
An arm 31 is rotatably supported on a shaft 32 at the upper end of this support column.

Reference numeral 30a is a stepped portion that restricts the rotation angle of the arm 31.

A bearing 33 is inserted into the tip of the arm 31 in the vertical direction, and is fixed to the upper and lower surfaces of the arm via an insulating bushing 35, 35 by a round hole 34, 34.

A rotary shaft 36 is rotatably inserted into the bearing 33 and supported at a predetermined position by a bearing portion 37 and a double nut 38 .

The insulating bushings 35,35 are not required if piezoelectric detection is not performed.

An upper end of a rotating shaft 39 is screwed onto the lower end of the rotating shaft 36, and a chuck means 40 is provided at the lower end of the rotating shaft 39.

A gap 33a is provided in the center of the inner peripheral surface of the bearing 33,
The hollow parts 33b and 31a communicating with this cavity are the bearings 33.
and is bored in the arm 31.

The cavity 33a communicates with hollow parts 36a and 39a passing through the axial center of the rotating shaft 36°39.

The structure of the chuck means 40 attached to the lower end of the rotating shaft 39 is as shown in the third figure.

A suction port 39b of a hollow portion 39a is opened below the rotary shaft 39, a shaft 41 is fixed below the suction port 39b, and the lower end is a hemispherical pressing portion 39C.

A cover unit 42 is attached to the rotating shaft 39 so as to be vertically movable with a slight gap therebetween.

The integral cover 42 has an inner chamber 42a with an opening at the lower end, and is prevented from being separated from the rotating shaft 39 by a shaft 41 serving as a stopper means, and when in contact with the shaft 41, a suction opening is opened as shown in the fourth figure. 39b is occluded.

Reference numeral 43 denotes a chuck tool, which has a fitting groove 43a formed in its lower surface into which the material to be polished 44 is fitted, and small holes 43b, 43b passing through from the fitting groove 43a to the upper surface of the chuck tool.

A conical hole 43C is formed in the center of the upper surface of the chuck tool 43, and is joined to the pressing portion 39C at the lower end of the rotating shaft with a gap therebetween.

45. 45 is a drive pin implanted in the chuck tool 43, which rotates the chuck tool 43 together with the rotating shaft 39 by engaging with the shaft 41.

Since there is a slight gap between the cover unit 42 and the rotating shaft 39,
Even if the chuck tools 43 are somewhat similar, the upper surface of the chuck tool 43 and the lower surface of the cover unit 42 are always in close contact.

Further, since the material to be polished 44 is not bonded to the chuck tool 43 with an adhesive or the like, piezoelectricity can be easily detected when polishing a piezoelectric element such as a crystal piece.

Hollow portions 31a, 33b and void portion 33 forming a pressure reduction passage
a, the hollow parts 36a and 39a communicate with a nozzle 46 protruding from the side of the arm 31, and this nozzle is connected to a decompression or vacuum pump (not shown), so the cover 42
In the reduced pressure state in which the inner chamber 42a is depressurized and the workpiece 44 is mounted, the chuck tool 43 maintains the state shown in FIG. 3.

Next, the pressing means for pressing the workpiece 44 against the spherical polished surface 16a will be described.

An engagement protrusion 47 is screwed onto the tip of the arm 31.

An L-shaped locking plate 49 is protruded by a nut 50 from one end of the cover plate 48 which is installed on the upper end surfaces of the frame plates 2 and 3.

The engagement protrusion 47 can be engaged with the engagement groove 49a of the engagement plate 49.

A weight 51 is fitted into the small diameter portion of the engagement protrusion 47 .

Next, the rotation driving means for the rotating shaft 36 that rotates the chuck means 40 will be explained.

A mounting plate 52 is provided protruding from the base end of the arm 31.
In this attachment, the motor 53 is attached to the tip of the plate 52.

And the pulley 5 which is pivoted on the drive shaft 54 of the motor 53
5, and bearings 56 and 57 implanted from the side of the arm 31.
A belt 61 is wound around a pulley 60 that is pivoted on the upper end of the rotary shaft 36 and the Boo'J58, 59 that are pivotally supported.

Next, the operation of the present invention will be explained.

From the state shown in FIG. 1, the arm 31 is swung clockwise about the shaft 32 and lifted.

At this time, the chuck means 40 is in a state as shown in the fourth figure.

The material to be polished 44 is fitted in advance into the fitting groove 43a formed on the lower surface of the chuck tool 43, and held down with fingers in the state shown in FIG.
2a is depressurized.

Therefore, the small holes 43b, 43 formed in the chuck tool 43
The material to be polished 44 is attracted and adsorbed by b.

Next, the arm 31 is swung counterclockwise, and the material to be polished 44
is brought into contact with the spherical polished surface 16a, and pressed against the spherical polished surface 16a by the weight 51.

This pressing force acts only in the direction of the engagement groove 49a in which the engagement protrusion 47 engages.

When the motors 19, 22, and 53 are driven, the lapping plate 16 rotates and begins to swing, and the chuck means 40 holding the workpiece 44 also rotates.

At this time, the polishing agent is being supplied to the spherical polishing surface.

Since the center of the spherical surface of the spherical polishing surface 16a of the lapping plate 16 coincides with the center of oscillation of the oscillator 8, the material to be polished 4
4, there is no risk of one side being polished.

Furthermore, the chuck tool 43 presses the conical hole 43a with the pressing portion 39C at the lower end of the rotary shaft 39, and since there is a slight gap between the rotary shaft 39 and the cover unit 42, the rotary shaft 39 Even when the chuck tool 43 is inclined, the workpiece to be polished 44 contacts the spherical polishing surface 16a uniformly over its entire circumference, so that only one part of the workpiece 44 is polished.

Further, the inner part 42a is formed in the cover integrally 43, and the lower end of the shaft 39 is connected to a conical hole provided in the chuck tool 43, so that the distance between the workpiece on the lower surface of the chuck tool and the lower end of the shaft is is extremely small.

Therefore, even if an inclined force is applied to the machined surface, the torque applied to the machined surface is extremely small, thereby preventing chipping and uniform machining.

After the polishing process is completed, first, the motors 19, 22.53 are stopped to stop the rotation and swinging movement of the lapping plate 16 and the rotational movement of the chuck means 40, and then the arm 31 is lifted and the vacuum pump is turned off. stop.

Therefore, since reduced pressure does not act on the chuck means 40, the chuck tool 43 can only be removed, and the chuck tool 43 can only be removed.
3 is removed, the cover unit 42 moves downward under its own weight as shown in the fourth figure, and closes the suction port 39b.

Then, the material to be polished 44 is removed from this chuck tool 43.

As described above, according to the present invention, since no adhesive is used for the workpiece, there is no need to consider the adhesive layer thickness, and therefore the workpiece can be easily attached and detached, and the thickness of the workpiece can be measured and checked. is easily possible.

Furthermore, when polishing a piezoelectric element such as crystal, it is also possible to use the piezoelectricity generated during processing to continuously monitor the thickness of the crystal and control the polishing process.

Furthermore, there is no risk that the material to be polished will be partially polished, and in the case of a crystal resonator, the temperature characteristics will not deteriorate.

If a fitting groove is formed in the chuck tool and the workpiece is fitted,
The material to be polished is reliably adsorbed by the chuck tool, and air leakage is reduced, which has great effects.

[Brief explanation of drawings]

Fig. 1 is a sectional view of a polishing device according to an embodiment of the present invention, Fig. 2 is a side view, Fig. 3 is an enlarged sectional view of a chuck device with a workpiece of the present invention attached, and Fig. 4 is a polishing device. FIG. 3 is an enlarged cross-sectional view of the device at a time other than when it is in operation. 39...Shaft, 39a...Hollow part, 39
b... Suction port, 39C... Pressing part, 4
0...Chuck means, 42...Cover integrated, 42a...Inner part, 43...Chuck tool, 43a...Fitting groove, 43b, 43b...
...Pore, 43C... Conical hole.

Claims (1)

[Claims] 1. A shaft having a suction port at its lower end and a hollow section communicating with a pressure reducing means, and whose lower end serves as a pressing section; , a cover with an inner opening at the lower end, a conical hole connected to the opening of the cover, and a conical hole on the top surface to which the pressing part of the shaft is connected, and a small hole for adsorbing the workpiece material. A chuck device for workpieces such as crystal resonators, which is equipped with a chuck tool. 2. A chuck device for a workpiece such as a crystal oscillator, in which the chuck tool has a fitting groove formed on its lower surface into which the workpiece fits.