JPS596919B2 - Roll plating method - Google Patents
Roll plating methodInfo
- Publication number
- JPS596919B2 JPS596919B2 JP12834781A JP12834781A JPS596919B2 JP S596919 B2 JPS596919 B2 JP S596919B2 JP 12834781 A JP12834781 A JP 12834781A JP 12834781 A JP12834781 A JP 12834781A JP S596919 B2 JPS596919 B2 JP S596919B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- rotating body
- plating method
- strip
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は連続した帯状部品又条又は板等の貴金属を主と
する電気メッキに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electroplating of continuous strip-shaped parts, strips, plates, etc., mainly of noble metals.
帯状部品に電気メッキを施す場合、特に片面のみに施す
場合噴射ノズルを用い液流を用いて行う。When applying electroplating to a strip-shaped part, especially when applying it only to one side, a spray nozzle is used and a liquid stream is used.
特に貴金属の電気メッキを行′う場合局所に限定する必
要から精密に噴射する液量の条件を制御する必要がある
。特に厳正を要する時はマスキングテープを用い流電の
遮蔽を行うが、マスキングテープの着脱にコストの増加
を招く。更に帯状部品にプレス加工が施された場合、噴
射液流は背面にも廻り、片面のみメッキを行うことは不
能となる場合が多く、貴金属メッキの場合背面に表面部
のJ〜30%のメッキ層が形成されこれが損失となる。
本発明は回転体を用い被メッキ物の対向面にメッキを行
うメッキ方法に関するものである。即ち回転体表面に運
びあげられたメッキ液と連続的又は間歇的に走行する被
メッキ物の湿潤張力により構成される領域の流電゜を利
用し、連続的にメッキを行うことを特徴とするロールメ
ッキ法により効率の良いメッキを実現するものである。
以下、本発明の具体例について詳細説明する。In particular, when performing electroplating of precious metals, it is necessary to precisely control the conditions of the amount of liquid to be sprayed because it is necessary to limit the electroplating to a localized area. When particularly strict conditions are required, masking tape is used to shield the current, but the cost of attaching and removing the masking tape increases. Furthermore, when press processing is applied to a band-shaped part, the jetted liquid flow also reaches the back surface, making it often impossible to plate only one side.In the case of precious metal plating, J~30% of the surface area is plated on the back side. A layer is formed and this results in loss.
The present invention relates to a plating method for plating opposing surfaces of objects to be plated using a rotating body. That is, it is characterized by continuous plating by utilizing the current current in the region formed by the plating solution carried up to the surface of the rotating body and the wet tension of the object to be plated, which runs continuously or intermittently. The roll plating method realizes highly efficient plating.
Hereinafter, specific examples of the present invention will be explained in detail.
伺以下図中同一符号は同一物を示す。第1図は本発明に
係るロールメッキ法の原理を示す投影図である。The same reference numerals in the figures below indicate the same thing. FIG. 1 is a projection view showing the principle of the roll plating method according to the present invention.
コネクタに用いられる帯状部品1の屈曲部1aに金メッ
キを要している。帯状部品1は正確に水平に保たれ矢印
A方向に送られる。この帯状部品1と平行してメッキ液
槽2に浸された回転体3が設けられ、回転体3は矢印B
方向に動力を得て回転する。回転体3の頂部3aと帯状
部品1の屈曲部1aには僅かの間隙が平行して与えられ
ている。回転体3はメツキ液中で高速で回転するため表
面が濡れ、この液が帯状部品1の屈曲部1aにも触れメ
ツキ液の毛管現象によりこの間隙にメツキ液が保たれる
。メツキ槽中には陽極4が設けられ、一方帯状部品1に
は陰極電位が与えられるため、毛管現象により付着した
メツキ液を介し流電が行われる。帯状部品1は回転体の
回転体軸と平行に連続して移行してゆき、一方回転体3
は連続的に回転し、メツキ液槽中のメツキ液を吸着し、
帯状部品1の屈曲部1aの接触部に補給する。このため
帯状部品1は回転体3の上部を走行中に条の形に部分メ
ツキが施される。メツキ液はメツキ液槽2と貯蔵タンク
(図省略)との間を連続的にポンプにより循環し、ろ過
、加温液条件の調整を連続的に行つている。第2図は本
発明に係るロールメツキ法の実施例の構造を示す要部概
略の斜視図である。Gold plating is required on the bent portion 1a of the band-shaped component 1 used for the connector. The strip 1 is kept exactly horizontal and fed in the direction of arrow A. A rotating body 3 immersed in a plating liquid tank 2 is provided parallel to this strip-shaped part 1, and the rotating body 3 is indicated by the arrow B.
Rotates by gaining power in a direction. A slight gap is provided between the top portion 3a of the rotating body 3 and the bent portion 1a of the band-shaped component 1 in parallel. Since the rotating body 3 rotates at high speed in the plating liquid, its surface becomes wet, and this liquid also comes into contact with the bent portion 1a of the band-shaped part 1, and the plating liquid is maintained in this gap due to the capillary action of the plating liquid. An anode 4 is provided in the plating bath, and a cathode potential is applied to the strip-shaped component 1, so that a current is applied through the plating liquid attached by capillary action. The strip 1 continues to move parallel to the rotary axis of the rotating body, while the rotating body 3
rotates continuously and adsorbs the plating liquid in the plating liquid tank.
The contact portion of the bent portion 1a of the band-shaped component 1 is replenished. For this purpose, the strip-shaped part 1 is partially plated in the form of a strip while running on the upper part of the rotating body 3. The plating liquid is continuously circulated by a pump between the plating liquid tank 2 and a storage tank (not shown), and filtration and heating liquid conditions are continuously adjusted. FIG. 2 is a schematic perspective view of main parts showing the structure of an embodiment of the roll plating method according to the present invention.
伺説明の都合上メツキ液槽支持構造部を省略し、連続の
帯状部品の一部を適宜切断除去し、説明の便をはかつて
ある。遊動する多数の押えローラー6によつて帯状部品
1は案内部品5の案内面5aに押圧され、水平に一定の
高さに保たれて送られる。帯状部品1には金属製固定ブ
ラシ7により陰極電位が与えられる。回転体3は両端の
軸3bによりメツキ液中に正確に水平に保持されかつ軸
3bから動力を得てメツキ液中で円滑に回転する。陽極
4はメツキ液中に回転体3に近接して固定して保持され
ている。実施例に卦いて回転体3の長さは約50cm、
回転数は毎分300回転である。第3図はロールメツキ
法のメツキ装置の断面図であり帯状部品1は紙面垂直方
向に走行する。For the convenience of explanation, the plating liquid tank support structure has been omitted, and a portion of the continuous band-shaped component has been cut and removed as appropriate for the convenience of explanation. The band-shaped part 1 is pressed against the guide surface 5a of the guide part 5 by a large number of floating press rollers 6, and is fed horizontally while being kept at a constant height. A cathode potential is applied to the strip component 1 by a metal fixed brush 7. The rotating body 3 is held accurately horizontally in the plating liquid by shafts 3b at both ends, and rotates smoothly in the plating liquid by receiving power from the shafts 3b. The anode 4 is fixedly held in the plating solution in the vicinity of the rotating body 3. In the example, the length of the rotating body 3 is about 50 cm,
The rotation speed is 300 revolutions per minute. FIG. 3 is a cross-sectional view of a plating device for the roll plating method, in which the strip-shaped component 1 runs in a direction perpendicular to the plane of the paper.
回転体3は硬質塩化ビニールで製作され、表面は平滑に
仕上げられている。メツキ液中でこの回転体3が高速で
回転すると回転体の表面が濡れ、更に回転力を得て、メ
ツキ液は回転体頂部3aに運ばれ、帯状部品1の屈曲部
1aの微少な間隙に湿潤張力が働きメツキ液により満さ
れる。向回転体3の表面処理、材質等はメツキ液組成、
加温条件メツキ金属等により選択される。第4図は被メ
ツキ物が平面の帯材の場合に}ける本発明に在るロール
メツキ法のメツキ装置の断面図であり、第3図コネクタ
実施例と同じく毛管現象によりメツキ液が接触し帯材部
品1の1部にメツキが施される。The rotating body 3 is made of hard vinyl chloride and has a smooth surface. When the rotary body 3 rotates at high speed in the plating liquid, the surface of the rotary body gets wet, and further rotational force is obtained, and the plating liquid is carried to the top part 3a of the rotary body and enters the minute gap in the bent part 1a of the strip-shaped part 1. Wetting tension acts and the plating liquid fills the area. The surface treatment, material, etc. of the rotating body 3 are determined by the plating liquid composition,
It is selected depending on the heating conditions, plating metal, etc. FIG. 4 is a cross-sectional view of a plating device according to the roll plating method according to the present invention when the object to be plated is a flat strip, and the plating liquid comes into contact with the strip due to capillary action as in the connector embodiment of FIG. 3. A part of the material part 1 is plated.
第5図は本発明に係るロールメッキ法を帯材に対し斜に
複列配置した場合の原理を示す斜視図である。FIG. 5 is a perspective view showing the principle of roll plating according to the present invention when double rows are arranged diagonally with respect to a strip.
回転体3′を帯材1/に対し斜に配置することにより帯
材1′と回転体3′の間のメツキ液の接触部(2点鎖線
で示す)を3′aのごとく斜に与えることが出来る。帯
材1′を矢印A方向に走行させると回転体3′の角度に
応じてメツキ幅を広くすることが出来、更に進んで帯材
下面全面にメツキを施すことが可能である。更に平行に
斜めに回転体を複列に配置し、メツキ厚の増加あるいは
多層メツキ等を実施することが可能である。以上本発明
によれば帯材もよび加工された帯状部品についても片面
に一定幅又は全面に自在にメツキ幅を制御しメツキを施
すことが可能である。このことはより特に金を中心とす
る貴金属の大幅な節減をもたらし機能上最も重要な個所
に集中させることが出来、経済性と同時に機能の向上の
両立をもたらすことが出来る。周金、銀の他に白金、パ
ラジウム、ロジウム等の貴金属や他に稀有金属類其他卑
金属類の部分機能メツキの利用等に際し、重層多列の構
成を自在に具現化し得る。又帯状部品は金属に限定され
ることなく、プラスチツクフイルム等に訃いても導電性
処理を施すことにより経済的に金属薄膜を付着させるこ
とが可能である。メツキ液特に貴金属用の高価なメツキ
用薬品回転量が最小限に止められるため、生産用資産管
理、品質管理維持も容易となる。又メツキ部分が限定さ
れることで洗浄工程が簡易となり、このための薬品の流
出損失、洗浄用水の減少廃液処理の簡易化がもたらされ
る。又メツキ装置は短小小形となり経済化され、設置面
積も小さく、又軽くなる。この利点で他の工程の結合を
可能とし、自動製造工程へ本発明によるメツキ工程を組
込むことによつて、製造系列全体の合理化をはかること
が出来る。以上のごとく本発明は工業生産の合理化の他
に貴金属節減による経済的寄与、更に社会的効果への貢
献等益する所が広く大きい。By arranging the rotating body 3' obliquely with respect to the strip 1/, the contact area of the plating liquid (indicated by the two-dot chain line) between the strip 1' and the rotating body 3' is provided obliquely as shown in 3'a. I can do it. When the strip material 1' is run in the direction of arrow A, the plating width can be increased in accordance with the angle of the rotating body 3', and it is possible to proceed further and apply plating to the entire lower surface of the strip material. Further, by arranging the rotating bodies in parallel and obliquely in double rows, it is possible to increase the plating thickness or perform multilayer plating. As described above, according to the present invention, it is possible to plate both a strip material and a processed strip-shaped part by controlling the plating width to a constant width on one side or to the entire surface. This results in a significant reduction in precious metals, particularly gold, which can be concentrated in the most functionally important areas, making it possible to achieve both economic efficiency and improved functionality. When using partial functional plating made of precious metals such as platinum, palladium, and rhodium, as well as rare metals and other base metals in addition to gold and silver, a multi-layered and multi-row structure can be freely realized. Moreover, the band-shaped part is not limited to metal, and even if it is made of plastic film or the like, it is possible to economically attach a metal thin film by subjecting it to conductive treatment. Since the amount of rotation of plating liquid, especially expensive plating chemicals for precious metals, can be kept to a minimum, production asset management and quality control can be easily maintained. Furthermore, by limiting the plating area, the cleaning process is simplified, resulting in loss of chemicals, reduction in cleaning water, and simplification of waste liquid treatment. In addition, the plating device is short and compact, making it more economical, requiring a smaller installation area, and becoming lighter. This advantage makes it possible to combine other processes, and by incorporating the plating process according to the present invention into an automatic manufacturing process, the entire manufacturing series can be rationalized. As described above, the present invention not only streamlines industrial production, but also contributes to the economy by saving precious metals, and also contributes to social effects.
第1図は本発明に係るロールメツキ法の原理を示す投影
図、第2図は本発明に係るロールメツキ法の構造を示す
斜視図、第3図はロールメツキ法のメツキ装置の断面図
、第4図は帯材用の本発明に係るロールメツキ法のメツ
キ装置の断面図、第5図は本発明に係るロールメツキ法
により回転体を斜に複列配置した場合の原理を示す斜視
図。
図において1は帯状部品、2はメッキ液槽、3は回転体
、4は陽極である。Fig. 1 is a projected view showing the principle of the roll plating method according to the present invention, Fig. 2 is a perspective view showing the structure of the roll plating method according to the present invention, Fig. 3 is a sectional view of the plating device of the roll plating method, and Fig. 4 FIG. 5 is a cross-sectional view of a plating device of the roll plating method according to the present invention for strip material, and FIG. 5 is a perspective view showing the principle when rotating bodies are arranged diagonally in double rows according to the roll plating method according to the present invention. In the figure, 1 is a strip-shaped component, 2 is a plating liquid tank, 3 is a rotating body, and 4 is an anode.
Claims (1)
して回転させ、表面にメッキ膜をつくり、次いで被メッ
キ物を回転する円筒形物体表面に走行させて連続的に所
望部分にメッキを行うことを特徴とするロールメッキ法
。 2 特許請求の範囲第1項において、上記回転体の軸線
と連続的又は間欠的に走行する上記被メッキ物の軸線を
平行とし、連続的に部分メッキを行うことを特徴とする
ロールメッキ法。 3 特許請求の範囲第1項において、上記回転体の軸線
と連続的又は間欠的に走行する上記被メッキ物の軸線が
該軸線を含む夫々の平行面にあつて斜に交差し、被メッ
キ物の片面に連続的に部分又は全面に連続メッキを行う
ことを特徴とするロールメッキ法。 4 特許請求の範囲第1項において、上記回転体を複数
個平行に配列することを特徴とするロールメッキ法。[Claims] 1. Part of a cylindrical object made of a hard material is immersed in a plating solution and rotated to form a plating film on the surface, and then the object to be plated is run on the surface of the rotating cylindrical object to continuously A roll plating method characterized by plating the desired area. 2. The roll plating method according to claim 1, wherein the axis of the rotating body and the axis of the object to be plated, which travels continuously or intermittently, are parallel to each other, and partial plating is performed continuously. 3. In claim 1, the axis of the rotating body and the axis of the object to be plated, which run continuously or intermittently, intersect obliquely in parallel planes containing the axis, and the object to be plated is A roll plating method characterized by continuous plating on one side or the entire surface. 4. The roll plating method according to claim 1, characterized in that a plurality of the rotating bodies are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12834781A JPS596919B2 (en) | 1981-08-17 | 1981-08-17 | Roll plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12834781A JPS596919B2 (en) | 1981-08-17 | 1981-08-17 | Roll plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831094A JPS5831094A (en) | 1983-02-23 |
| JPS596919B2 true JPS596919B2 (en) | 1984-02-15 |
Family
ID=14982557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12834781A Expired JPS596919B2 (en) | 1981-08-17 | 1981-08-17 | Roll plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS596919B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019081290A1 (en) | 2017-10-25 | 2019-05-02 | CHT Germany GmbH | METHOD FOR REMOVING MANGANOX DEPOSITS OF TEXTILE SURFACES |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1333110C (en) * | 2003-12-23 | 2007-08-22 | 番禺得意精密电子工业有限公司 | Electroplating method and electroplating device special for such electroplating method |
| JP4488059B2 (en) * | 2007-11-12 | 2010-06-23 | トヨタ自動車株式会社 | Manufacturing method of fuel cell separator |
-
1981
- 1981-08-17 JP JP12834781A patent/JPS596919B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019081290A1 (en) | 2017-10-25 | 2019-05-02 | CHT Germany GmbH | METHOD FOR REMOVING MANGANOX DEPOSITS OF TEXTILE SURFACES |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831094A (en) | 1983-02-23 |
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