JPS5980794A - Electrodeposition painting device - Google Patents
Electrodeposition painting deviceInfo
- Publication number
- JPS5980794A JPS5980794A JP18982882A JP18982882A JPS5980794A JP S5980794 A JPS5980794 A JP S5980794A JP 18982882 A JP18982882 A JP 18982882A JP 18982882 A JP18982882 A JP 18982882A JP S5980794 A JPS5980794 A JP S5980794A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- water
- electrodeposition
- conductivity
- chambers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は、電着塗装装置の改良に関する。[Detailed description of the invention] The present invention relates to improvements in electrodeposition coating equipment.
従来、水分散性または水溶性の電着塗料を満した電着槽
内に一方の電極を設けるとともに、該電着槽内を搬送さ
れる被塗物を他方の電極とし、両電極間に被塗物が電着
槽に浸漬する前から通電するいわゆる通電入槽方式で一
定の直流電流を通電して、上記被塗物上に電着塗料を付
着させて行なうものが知られている。この電着塗装によ
れば、自動車車体等の塗装をかなり良好に行なうことが
できるが、上述のように通電入槽方式で電極と被塗物の
間に一定の直流電流を通電して行なうため、被塗物の入
槽時に電着槽に部分的に浸漬される被塗物に大きな電流
が流れ、このため塗膜面に7・ツシュマークすなわち波
肌が生じてしまうという欠点があった。Conventionally, one electrode is provided in an electrodeposition tank filled with water-dispersible or water-soluble electrodeposition paint, and the object to be coated that is transported in the electrodeposition tank is used as the other electrode, and the coating is applied between the two electrodes. A method is known in which electrocoating paint is deposited on the object to be coated by applying a constant direct current using a so-called energization tank method in which electricity is applied before the object is immersed in the electrodeposition bath. According to this electrodeposition coating, it is possible to paint automobile bodies etc. fairly well, but as mentioned above, it is carried out by passing a constant DC current between the electrode and the object to be coated using the energized bath method. However, when the object to be coated is placed in the electrodeposition tank, a large current flows through the object partially immersed in the electrodeposition tank, resulting in formation of 7. tsch marks, that is, ripples, on the surface of the coating film.
このように塗膜面にハツシュマークが生ずるのを防止す
るため、特公昭、t 4− ’11477号においては
、上記被塗物と電極との間に流れる電流を、被塗物の搬
送方向において変化させ、搬送方向に進むほど大きくし
、すなわち入槽部での電流値を小さくした状態で電着塗
装を行なう電着塗装方法を提案している。In order to prevent the formation of hash marks on the coating surface, in Japanese Patent Publication No. 4-'11477, the current flowing between the object to be coated and the electrode is changed in the conveying direction of the object to be coated. We have proposed an electrodeposition coating method in which electrodeposition is performed with the current value increasing as it progresses in the transport direction, that is, the current value at the bath entry section is decreased.
この電着塗装方法によれば、ハツシュマークのない一段
とすぐれた外観の電着塗膜を得ることができるが、この
方法においては上記電流の搬送方向の変化を、電極のサ
イズ、あるいはこの電極の被塗物からの距離、またはこ
の電極と被塗物の間に印加する電圧値を搬送方向に変化
させることによって生じさせているので、電極の大きさ
を変える場合には、種々の大きさの電極を用意するか、
あるいは特殊形状の電極を用意しなければならず、また
電極と被塗物の間の距離を変える場合には、電極から被
塗物までの距離を入槽側はど大きくしなければ々らず、
すなわち電極を斜め配置しなければならず、従って広い
スペースを必要とし、このため電着槽がかなり大きくな
ってしまい、更に電極と被塗物の間に印加する電圧値を
変える場合には、各電極に印加する電圧を変えるだめの
装置が必要となるほど欠点も多い。According to this electrodeposition coating method, it is possible to obtain an electrodeposition coating film with a better appearance without hash marks, but in this method, the change in the current transport direction is This is generated by changing the distance from the object to be coated or the voltage value applied between this electrode and the object to be coated in the transport direction, so when changing the size of the electrode, it is necessary to use electrodes of various sizes. or prepare
Alternatively, a specially shaped electrode must be prepared, and if the distance between the electrode and the object to be coated is changed, the distance from the electrode to the object must be increased on the tank side. ,
In other words, the electrodes have to be arranged diagonally, which requires a large space, which makes the electrodeposition tank quite large.Furthermore, when changing the voltage value applied between the electrode and the object to be coated, it is necessary to There are so many drawbacks that it requires a device to change the voltage applied to the electrodes.
一方、電着槽内での被塗物への塗装が進むと、塗料中の
塗料成分が被塗物に付着されるので、塗料中の中和剤の
濃度が高くなり、従って塗料のクーロン効率が低下し、
この結果塗膜の膜厚の低下という事態を生じる。このた
め現在は、塗料中の中和剤の濃度を一定にするため、電
着槽内に被塗物の搬送路に沿って隔膜室を設け、電着塗
装により被塗物に電着した塗膜形成分に見合う量の中和
剤を上記隔膜室で除去して、塗料中の中和剤の濃度を一
定に保つタイプの電着塗装装置を用いることが多くなっ
ている。このタイプの電着塗装装置においては、中和剤
濃度が槽内塗料の中和剤濃度と同じ塗料を補給塗料とし
て用いることができ電着槽の管理が容易である。この隔
膜室を備えたタイプの電着塗装装置においてはハツシュ
マークの発生を防止するために、入槽部付近には隔膜室
(極板)を設置しないようにしているが、これでは、入
槽時に被塗物への塗装が有効に行なわれないため、所望
の塗膜を得るためには所定数の隔膜室を出槽側の方へず
らして配置しなければならす電着槽が長くなるという問
題がある。On the other hand, as the coating progresses on the object to be coated in the electrodeposition tank, the paint components in the paint adhere to the object, so the concentration of the neutralizing agent in the paint increases, and therefore the coulombic efficiency of the paint increases. decreases,
As a result, a situation occurs in which the film thickness of the coating film decreases. For this reason, in order to maintain a constant concentration of the neutralizing agent in the paint, a diaphragm chamber is currently installed in the electrodeposition tank along the conveyance path of the object to be coated. Electrodeposition coating equipment of a type that maintains a constant concentration of neutralizing agent in the paint by removing an amount of neutralizing agent commensurate with the film-forming components in the membrane chamber is increasingly used. In this type of electrodeposition coating apparatus, a paint whose neutralizing agent concentration is the same as that of the paint in the tank can be used as a replenishing paint, and the electrodeposition tank can be easily managed. In this type of electrodeposition coating equipment equipped with a diaphragm chamber, the diaphragm chamber (electrode plate) is not installed near the tank entry area in order to prevent the occurrence of hash marks. Since the coating is not applied effectively to the object to be coated, the electrodeposition tank becomes longer, requiring a predetermined number of diaphragm chambers to be shifted toward the exit tank side in order to obtain the desired coating film. There is.
本発明は、上記隔膜室を備えたタイプの電着塗装装置に
おいて、形成される塗膜面にノ・ツシュマークが生ずる
のを防止する従来の構成の上記したような欠点のない電
着塗装装置を提供することを目的とするものである。The present invention provides an electrodeposition coating apparatus of the type equipped with the above-mentioned diaphragm chamber, which is free from the above-mentioned drawbacks and has a conventional structure that prevents the formation of scratch marks on the surface of the coating film formed. The purpose is to provide
本発明は、電着塗料が満たされた電着槽内に被塗物の搬
送路に沿って複数の隔膜室を設け、該隔膜室内にそれぞ
れ電極板を配置し、この電極板と、前記電着塗料内に浸
漬される被塗物との間に通電入槽方式で直流電圧を印加
して、被塗物の表面に前記電着塗料を電着することによ
って塗装を行なう電着塗装装置において、前記電着槽の
入槽部側の隔膜室に、電導塵が他の隔膜室に供給される
隔膜水の電導塵より低い隔膜水を循環供給するため、該
隔膜水を冷却する冷却器を備えだ隔膜水循環回路を設け
たことを特徴とするものである。The present invention provides a plurality of diaphragm chambers along the conveyance path of the object to be coated in an electrodeposition tank filled with an electrodeposition paint, and arranges an electrode plate in each of the diaphragm chambers. In an electrocoating device that performs painting by electrodepositing the electrodeposition paint onto the surface of the object by applying a DC voltage between the object and the object immersed in the coating material using an energizing tank method. In order to circulately supply diaphragm water having a lower conductivity than the diaphragm water supplied to the other diaphragm chambers to the diaphragm chamber on the entrance side of the electrodeposition tank, a cooler is provided to cool the diaphragm water. It is characterized by being equipped with a diaphragm water circulation circuit.
すなわち、本発明の電着塗装装置においては、上記冷却
器を備えた隔膜水循環回路によって、電着槽内に被塗物
の搬送方向に沿って配された複数の隔膜室のうち電着槽
の入槽部側の隔膜室内の隔膜水を冷却することによって
、その電導塵を他の隔膜室内の隔膜水の電導塵より低下
させて、入槽部においては被塗物と電極との間に流れる
電流を低下させ、以上により被塗物の入槽時に多大な電
流が流れるのを防止して、塗装面にノ・ツシュマークが
生ずるのを防止している。このように本発明によれば、
入槽部側の隔膜室内の隔膜水雷導度を他より低下させる
だけの簡単な構造で、かつ別に余分なス啄−スを必要と
することもなく、有効に塗膜面上にハツシュマークが生
ずるのを防止することができるとともに、電着槽を長く
することなく入槽直後から有効に塗膜を形成することが
できる。That is, in the electrodeposition coating apparatus of the present invention, the diaphragm water circulation circuit equipped with the above-mentioned cooler allows the diaphragm chambers in the electrodeposition tank to be controlled among the plurality of diaphragm chambers arranged in the electrodeposition tank along the conveying direction of the object to be coated. By cooling the diaphragm water in the diaphragm chamber on the entry tank side, the conductive dust is lowered compared to the conductive dust in the diaphragm water in other diaphragm chambers, and in the entry tank, it flows between the object to be coated and the electrode. By lowering the current, this prevents a large amount of current from flowing when the object to be coated enters the bath, thereby preventing scratch marks from forming on the painted surface. Thus, according to the present invention,
It has a simple structure that only lowers the diaphragm torpedo conductivity in the diaphragm chamber on the tank entry side compared to other diaphragms, and does not require any extra spacing, and effectively creates hash marks on the coating surface. In addition, it is possible to effectively form a coating immediately after entering the electrodeposition tank without increasing the length of the electrodeposition tank.
次に本発明の好ましい実施例による電着塗装装置につい
て説明する。Next, an electrodeposition coating apparatus according to a preferred embodiment of the present invention will be described.
本発明は、アニオン型電着塗装およびカチオン型電着塗
装のいずれの塗装方法にも適用できるものであり、第1
図にカチオン型電着塗装装置を示す。The present invention can be applied to both anionic electrodeposition coating and cationic electrodeposition coating methods.
The figure shows a cationic electrodeposition coating device.
第1図に示されたカチオン型電着塗装装置は、電着槽1
を有し、この電着槽1内には、その両側壁1aに沿って
隔膜装置2が配置されている。この隔膜装置2は、複数
の隔膜室3を有し、この隔膜室3の内部には、それぞれ
直流電源Vの陽極側に接続された電極板4が配置されて
いる。上記直流電源Vの陰極側は、電着槽1内の塗料液
5中に浸漬され、上記隔膜装置2に沿って、第2図に示
されたコンベアCによって搬送される被塗物6に接続さ
れている。電極板4と被塗物6との通電は被塗物6が電
着槽1に浸漬される前から通電するいわゆる通電入槽方
式で行っている。なお、アニオン型電着塗装装置は、第
1図に示したカチオン型電着塗装装置と構造は同一であ
るが、隔膜室3内の電極板4が上記直流電源■の陽極に
接続されており、−力抜塗物6が上記直流電源Vの陰極
に接続されている。隔膜室3内には、該隔膜室の上方か
ら底部近傍まで伸長した供給管7から隔膜水を供給し、
隔膜室の上部側方から外方に延び電着槽1の側壁を貫通
した排出管8から電着槽1の系外へ排出している。The cationic electrodeposition coating apparatus shown in FIG.
Inside this electrodeposition tank 1, a diaphragm device 2 is arranged along both side walls 1a. This diaphragm device 2 has a plurality of diaphragm chambers 3, and inside each of the diaphragm chambers 3, electrode plates 4 connected to the anode side of a DC power source V are arranged. The cathode side of the DC power supply V is immersed in the coating liquid 5 in the electrodeposition tank 1 and connected to the object 6 to be coated, which is conveyed by the conveyor C shown in FIG. 2 along the diaphragm device 2. has been done. The electrode plate 4 and the object to be coated 6 are energized by a so-called energization bath method in which the electrode plate 4 and the object to be coated 6 are energized before the object to be coated 6 is immersed in the electrodeposition tank 1. The anion type electrodeposition coating apparatus has the same structure as the cation type electrodeposition coating apparatus shown in FIG. 1, but the electrode plate 4 in the diaphragm chamber 3 is connected to the anode of the DC power source (■). , - A stress relief coating 6 is connected to the cathode of the DC power supply V. Diaphragm water is supplied into the diaphragm chamber 3 from a supply pipe 7 extending from above the diaphragm chamber to near the bottom,
The liquid is discharged to the outside of the electrodeposition tank 1 through a discharge pipe 8 extending outward from the upper side of the diaphragm chamber and penetrating the side wall of the electrodeposition tank 1 .
上記電着槽1の側壁に沿って複数配置された隔膜室3は
、第2図に示されているように入槽側隔膜室3aと残り
の隔膜室3bに分けられており、隔膜室3bには通常の
電着塗装に用いられる電導塵(’100−!;00μ0
/σ)の隔膜水が、隔膜室3aには、隔膜室3b内の隔
膜水の電導塵より低い値の電導塵(SO〜100μ0/
σ)の隔膜水が満たされている。入槽側の隔膜室38に
は、該隔膜43 aに上記低い電導塵の隔膜水を循環供
給する第1隔膜水循環回路9が接続されており、残りの
隔膜室3bには、該隔膜室3bに上記通常の電導塵の隔
膜水を循環供給する第コ隔膜水循環回路10が接続され
ている。The plurality of diaphragm chambers 3 arranged along the side wall of the electrodeposition bath 1 are divided into an entrance side diaphragm chamber 3a and a remaining diaphragm chamber 3b, as shown in FIG. contains conductive dust ('100-!;00μ0) used in ordinary electrodeposition coating.
/σ), the diaphragm chamber 3a contains conductive dust (SO~100μ0/σ) which has a lower value than the conductive dust of the diaphragm water in the diaphragm chamber 3b.
σ) The diaphragm is filled with water. A first diaphragm water circulation circuit 9 that circulates and supplies diaphragm water with low conductivity dust to the diaphragm 43a is connected to the diaphragm chamber 38 on the tank entry side, and the remaining diaphragm chamber 3b is connected to the diaphragm chamber 3b. A diaphragm water circulation circuit 10 for circulating and supplying the above-mentioned normal conductive dust diaphragm water is connected to the diaphragm water circulation circuit 10.
第3図に示されているように、隔膜水の電導度一温度特
性は、はぼ比例状態にあり、これを利用して上記第1隔
膜水循環回路9には、この回路9内に流れる隔膜水を冷
却してその電導塵を上記所定の低い電導塵まで下げる冷
却器COが設けられている。第3図に示す特性線a +
bは基準の温度(、zO’c)で/乙θμU/cm、
’l 00μ0ムの電導塵を有する隔膜水の温度を変
化させた場合の電導塵の変化を示しだものであり、後述
する実施例では電導塵iooμU/cmの隔膜水は特性
線aのものを用い、電導塵ti−oo〜SOOμU/c
mの隔膜水は特性線すのものを用いている。このように
すればそれぞれの隔膜水の温度を低温にできる利点があ
る。As shown in FIG. 3, the electrical conductivity-temperature characteristic of diaphragm water is approximately proportional, and by utilizing this, the first diaphragm water circulation circuit 9 has a diaphragm water flowing through the circuit 9. A cooler CO is provided to cool the water and reduce its conductive dust to the predetermined low conductive dust level. Characteristic line a + shown in Figure 3
b is the standard temperature (, zO'c) / θμU/cm,
It shows the change in conductive dust when the temperature of diaphragm water with conductive dust of 100 μU/cm is changed. conductive dust ti-oo~SOOμU/c
The diaphragm water of m is of characteristic line. This has the advantage that the temperature of each diaphragm water can be lowered.
しかしかならずしも異なる特性線a、bを有する隔膜水
を用いなくてもよく、特性線aを示す隔膜水のみを用い
てもよい。However, it is not necessary to use diaphragm water having different characteristic lines a and b, and only diaphragm water exhibiting characteristic line a may be used.
上記第1および第1隔膜水循環回路9および10には、
それぞれ第1および第コ隔膜水貯槽11および12が設
けられており、これら第1および第2隔膜水貯槽11お
よび12内には、隔膜室3aおよび3bから排出される
隔膜水が収容されるようになっている。従って、第1隔
膜水貯槽11内の隔膜水の電導塵は、隔膜室3a内の隔
膜水の電導塵と、また第1隔膜水貯槽11内の隔膜水の
電導塵は、隔膜室3bの電導塵とそれぞれ同じである。The first and first diaphragm water circulation circuits 9 and 10 include:
First and second diaphragm water storage tanks 11 and 12 are provided, respectively, and diaphragm water discharged from the diaphragm chambers 3a and 3b is stored in these first and second diaphragm water storage tanks 11 and 12, respectively. It has become. Therefore, the conductive dust of the diaphragm water in the first diaphragm water storage tank 11 is the conductive dust of the diaphragm water in the diaphragm chamber 3a, and the conductive dust of the diaphragm water in the first diaphragm water storage tank 11 is the conductive dust of the diaphragm water in the diaphragm chamber 3b. Each is the same as dust.
電着槽1内での被塗物6の塗装が進むと、上記隔膜室3
内には、塗料液5中の被塗物6に電着された固形物であ
る塗料成分に見合うだけ中和剤が吸収される。隔膜室3
内の隔膜水は、この吸収した中和剤の分だけ電導塵が上
がる。そこで、第1および第1隔膜水貯槽11,12に
は、それぞれ上記隔膜水の電導塵を所定の範囲内に保つ
ための電導度調整装置13.14が設けられている。こ
の電導度調整装置13.14は、純水を隔膜水貯槽11
,12に供給するだめの純水供給管路15゜16を備え
ている。この純水供給管路15 、16には、自動開閉
弁17.18が設けられており、この自動開閉弁17.
18は、弁駆動装置19゜20によってその開閉が制御
されるようになっている。この弁駆動装置19.20は
、第1および第コ隔膜水貯槽11.12内の隔膜水の電
導塵を検出し、との電導塵が上記所定の範囲の値より高
くなったとき信号Sを出力する電導度検出装置21.2
2に接続されている。上記弁駆動装置19.20は、と
の電導度検出装置21.22から上記信号Sを受けたと
き、開閉弁17 、18を開き、純水を隔膜水貯槽11
.12に供給して、該隔膜水貯槽11.12中の隔膜水
の電導塵を所定値に保つ。As the coating of the object 6 in the electrodeposition bath 1 progresses, the diaphragm chamber 3
A neutralizing agent is absorbed into the coating liquid 5 in an amount corresponding to the solid coating component electrodeposited on the object 6 to be coated. Diaphragm chamber 3
Conductive dust rises in the diaphragm water by the amount of neutralizing agent absorbed. Therefore, the first and first diaphragm water storage tanks 11 and 12 are each provided with conductivity adjusting devices 13 and 14 for keeping the conductive dust in the diaphragm water within a predetermined range. This conductivity adjustment device 13.14 controls pure water into the diaphragm water storage tank 11.
, 12 are provided with pure water supply pipes 15 and 16. The pure water supply pipes 15 and 16 are provided with automatic on-off valves 17 and 18.
The opening and closing of 18 is controlled by valve drive devices 19 and 20. This valve drive device 19.20 detects conductive dust in the diaphragm water in the first and second diaphragm water storage tanks 11.12, and outputs a signal S when the conductive dust in the diaphragm water becomes higher than the value in the predetermined range. Output conductivity detection device 21.2
Connected to 2. When the valve drive device 19.20 receives the signal S from the conductivity detection device 21.22, it opens the on-off valves 17 and 18 and supplies pure water to the diaphragm water storage tank 11.
.. 12 to keep the conductive dust in the diaphragm water in the diaphragm water storage tank 11.12 at a predetermined value.
第1および第ユ隔膜水循環回路9,100供給側の管路
にはポンプPが介設されており、このポンプPによシ、
電導塵が一定に保たれた隔膜水を隔膜水貯槽1 ]、
、 12から隔膜室3に供給する。A pump P is interposed in the pipeline on the supply side of the first and second diaphragm water circulation circuits 9,100.
The diaphragm water in which conductive dust is kept constant is stored in the diaphragm water storage tank 1],
, 12 to the diaphragm chamber 3.
従って、隔膜室3b内の隔膜水の電導塵は、上記所定範
囲内の通常の電導塵に保たれ、隔膜室3a内の隔膜水の
電導塵は、上記通常の電導塵より低い所定範囲の電導塵
に保たれる。Therefore, the electrically conductive dust in the diaphragm water in the diaphragm chamber 3b is kept at normal electrically conductive dust within the above-mentioned predetermined range, and the electrically conductive dust in the diaphragm water in the diaphragm chamber 3a is kept at a lower electrical conductivity in the predetermined range than the above-mentioned normal electrically conductive dust. kept in dust.
なお、上記複数の隔膜室3内の隔膜水の電導塵を入槽側
から段階的に高くするため、入槽側の隔膜室3aに近い
隔膜室3bにも第一図に想像線で示したように第1隔膜
水循環回路9を延ばし、この隔膜室3bには、隔膜水貯
槽11および12から隔膜水が供給されるようにして、
この内部の隔膜水の電導塵を、第1および第コ貯槽11
および12内の隔膜水の電導塵の中間の電導塵としても
よい。In addition, in order to raise the electrically conductive dust in the diaphragm water in the plurality of diaphragm chambers 3 in stages from the tank entry side, the diaphragm chamber 3b near the diaphragm chamber 3a on the entry tank side is also shown by imaginary lines in Figure 1. The first diaphragm water circulation circuit 9 is extended as shown in FIG.
The conductive dust of this internal diaphragm water is removed from the first and second storage tanks 11.
It may also be conductive dust between the conductive dust of the diaphragm water in 12 and 12.
以上説明した構造のカチオン型電着塗装装置を用いて、
次の電着条件により電着塗装を行なった場合の本発明の
実施例と、同じようにカチオン型電着塗装装置を用いて
後述の電着条件で電着塗装した場合の比較例/、2とを
第7図に示す。第り図は被塗物を搬送しながら電着槽に
浸漬していった場合の経過時間と被塗物と電極板との間
に流れる電流変化の関係を示す。Using the cationic electrodeposition coating device with the structure explained above,
An example of the present invention in which electrodeposition coating was performed under the following electrodeposition conditions, and a comparative example in which electrodeposition coating was performed under the electrodeposition conditions described below using a cationic electrodeposition coating apparatus in the same manner. is shown in FIG. Figure 2 shows the relationship between the elapsed time and the change in the current flowing between the object to be coated and the electrode plate when the object to be coated is immersed in the electrodeposition bath while being conveyed.
(1)実施例の電着条件
電着槽:長さ3 、t 、−、幅2.3m、深さxm隔
膜室:高さ2 m +厚さo、im 、幅/771(な
お、入槽側から第1番目の隔膜室の
高さは7.5mである)
片側配置の個数77個
被塗物;自動車の車体 総表面積 る0TIL2塗 料
:o’ro−tr−タコ(日本ペイント社製)電導塵
1eooμU/c1rL
温 度 27°C
濃 度 、27%
クーロン効率 33■/C
印加電圧:33θV(カチオン型)
入槽側の隔膜室中の隔膜水の電導塵 /θ0pU76
rn他の隔膜室中の隔膜水の電導塵 poθ〜500μ
TJ/cm被塗物の電着槽への全没時間 ユ・り分(
2)比較例/の電着条件
上記実施例の全部の隔膜室の電導塵を900〜!00μ
U/cIrLとしたもの。(1) Electrodeposition conditions of the example Electrodeposition tank: length 3, t, -, width 2.3 m, depth x m Diaphragm chamber: height 2 m + thickness o, im, width/771 (in addition, the (The height of the first diaphragm chamber from the tank side is 7.5 m) Number of 77 pieces arranged on one side Object to be coated: Automobile body Total surface area Paint: o'ro-tr-octopus (Nippon Paint) (manufactured by) conductive dust
1eooμU/c1rL Temperature: 27°C Concentration: 27% Coulombic efficiency: 33■/C Applied voltage: 33θV (cation type) Conductive dust in diaphragm water in the diaphragm chamber on the entry side /θ0pU76
rnConductive dust in diaphragm water in other diaphragm chambers poθ~500μ
TJ/cm Total immersion time of the object to be coated in the electrodeposition bath
2) Electrodeposition conditions for Comparative Example The electrically conductive dust in all the membrane chambers of the above example was 900~! 00μ
U/cIrL.
他の電着条件は上記実施例と同じ。Other electrodeposition conditions were the same as in the above example.
(3)比較例コの電着条件
電着槽内両側の入槽部の隔膜室を3個ずつ除去して残り
の隔膜室(片側/を個ずつ配置)の電導塵を1ioo〜
gooμC廊としたもの。(3) Electrodeposition conditions for Comparative Example 3 The diaphragm chambers on both sides of the electrodeposition tank are removed, and the remaining diaphragm chambers (one on each side) are cleaned of conductive dust of 100~
It was called gooμC gallery.
他の電着条件は上記実施例と同じ。Other electrodeposition conditions were the same as in the above example.
第1図に示すように、比較例/は被塗物の入槽時には大
きな電流が流れてノ・ツシュマークが生じた。比較例コ
は、入槽時にノ・ツシュマークは生じなかったが、被塗
物の入槽時に流れる電流は極わずかなものなので入槽時
においては塗膜を有効に形成でき力いため、所望の塗膜
を得るには所定数の隔膜室を出槽側の方へずらして配置
しなければならず電着槽が長くなるという問題がある。As shown in FIG. 1, in Comparative Example/, a large current flowed when the object to be coated was placed in the tank, resulting in scratch marks. In Comparative Example 4, no scratch marks were generated when the object was placed in the bath, but since the current that flows when the object to be coated is placed in the bath is extremely small, it is difficult to form a coating film effectively when the object is placed in the bath. In order to obtain a film, a predetermined number of diaphragm chambers must be shifted toward the outlet tank side, resulting in a problem that the electrodeposition tank becomes long.
一方、本発明の実施例では被塗物である車体に電着塗装
を行なったところ、入槽時に大きな電流が流れることな
くハツシュマークのない良好な塗装面を得ることができ
た。On the other hand, in the example of the present invention, when the object to be coated, which is a car body, was electro-deposited, a good painted surface without hash marks could be obtained without a large current flowing when entering the bath.
第1図は、本発明を適用することのできるカチオン型電
着塗装装置を示す断面図、
第2図は、本発明の実施例による電着塗装装置を示す概
略図、
第3図は、隔膜水の電導塵温度特性を示すグラフ、第9
図は本発明の実施例と比較例との電着条件で被塗物を電
着槽に浸漬していった場合の経過時間と被塗物と電極板
との間に流れる電流変化の関係を示したグラフである。
1・・・・・・・・・電着槽、 3・・・・・・・・・
隔膜室、3a・・・・・・・・・入槽側の隔膜室、 3
b・・・・・・・・・他の隔膜室、 9・・・・・・・
・・第1隔膜水循環回路、10・・・・・・・・・第1
隔膜水循環回路、 11・・・・・・・・・・・・第7
隔膜水貯槽、 12・・・・・・・・・第2隔膜水貯槽
、 Co・・・・・・・・・冷却器特許出願人 東洋工
業株式会社
第1図
第3図
隔1【水の1爽(°C)
第4図
特 間 (腫)
手 続 補 正 書
5712、−2
昭和 年 月 日
特許庁長官 若 杉 和 夫 殿
1、事件の表示 昭和57年特許願第1♂2121号2
、発明の名称 電着塗装装置
3、補正をする考
事件との関係 出願人
名称(313)東洋工業株式会社
4、代理人
5、補正命令の日付 自 発
6・
8、補正の内容
明細書中、下記各個所の誤記を夫々訂正する。FIG. 1 is a sectional view showing a cationic electrodeposition coating apparatus to which the present invention can be applied, FIG. 2 is a schematic diagram showing an electrodeposition coating apparatus according to an embodiment of the present invention, and FIG. 3 is a diaphragm. Graph showing conductive dust temperature characteristics of water, No. 9
The figure shows the relationship between the elapsed time and the change in the current flowing between the object to be coated and the electrode plate when the object to be coated is immersed in the electrodeposition tank under the electrodeposition conditions of the example of the present invention and the comparative example. This is the graph shown. 1・・・・・・・・・Electrodeposition bath, 3・・・・・・・・・
Diaphragm chamber, 3a... Diaphragm chamber on the tank entry side, 3
b・・・・・・Other diaphragm chambers, 9・・・・・・・・・
...First diaphragm water circulation circuit, 10...1st
Diaphragm water circulation circuit, 11...7th
Diaphragm water storage tank, 12...Second diaphragm water storage tank, Co...Cooler patent applicant Toyo Kogyo Co., Ltd. Figure 1 Figure 3 Separation 1 [Water 1 Cooling (°C) Figure 4 Special Procedures Amendment Book 5712, -2 Date of 1939 Director-General of the Patent Office Kazuo Wakasugi 1, Indication of Case Patent Application No. 1♂2121 of 1982 2
, Title of the invention Electrodeposition coating device 3, Relationship with the case to be amended Applicant name (313) Toyo Kogyo Co., Ltd. 4, Agent 5, Date of amendment order Initiator 6. 8, Description of contents of amendment , correct the errors in the following places.
Claims (1)
て複数の隔膜室を設け、該隔膜室内にそれぞれ電極板を
配置し、この電極板と、前記電着塗料内に浸漬される被
塗物との間に通電入槽方式で直流電圧を印加して、被塗
物の表面に前記電着塗料を電着することによって塗装を
行なう電着塗装装置において、前記電着槽の入槽部側の
隔膜室に、電導度が他の隔膜室に供給される隔膜水の電
導度より低い隔膜水を循環供給するため、該隔膜水を冷
却する冷却器を備えた隔膜水循環回路を設けたことを特
徴とする電着塗装装置。A plurality of diaphragm chambers are provided along the conveyance path of the object to be coated in an electrodeposition bath filled with electrocoating paint, and an electrode plate is arranged in each of the diaphragm chambers, and between this electrode plate and the electrocoating paint, In an electrodeposition coating apparatus that performs painting by electrodepositing the electrodeposition paint on the surface of the object to be coated by applying a DC voltage between the object to be coated and the object being immersed in an energized tank, A diaphragm water circulation system equipped with a cooler to cool the diaphragm water in order to circulately supply diaphragm water whose conductivity is lower than the conductivity of the diaphragm water supplied to other diaphragm chambers to the diaphragm chamber on the entry side of the tank. An electrodeposition coating device characterized by being equipped with a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18982882A JPS5980794A (en) | 1982-10-28 | 1982-10-28 | Electrodeposition painting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18982882A JPS5980794A (en) | 1982-10-28 | 1982-10-28 | Electrodeposition painting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5980794A true JPS5980794A (en) | 1984-05-10 |
| JPH0210239B2 JPH0210239B2 (en) | 1990-03-07 |
Family
ID=16247884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18982882A Granted JPS5980794A (en) | 1982-10-28 | 1982-10-28 | Electrodeposition painting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5980794A (en) |
-
1982
- 1982-10-28 JP JP18982882A patent/JPS5980794A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0210239B2 (en) | 1990-03-07 |
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