JPS599345B2 - Manufacturing method of laminated packaging material - Google Patents
Manufacturing method of laminated packaging materialInfo
- Publication number
- JPS599345B2 JPS599345B2 JP50043383A JP4338375A JPS599345B2 JP S599345 B2 JPS599345 B2 JP S599345B2 JP 50043383 A JP50043383 A JP 50043383A JP 4338375 A JP4338375 A JP 4338375A JP S599345 B2 JPS599345 B2 JP S599345B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- layer
- resin layer
- laminated
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Wrappers (AREA)
Description
【発明の詳細な説明】
本発明は、塩化ビニリデン系共重合樹脂の均一厚味の薄
層を遮断層とした積層包装材の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a laminated packaging material using a thin layer of uniform thickness of a vinylidene chloride copolymer resin as a barrier layer.
従来、積層フィルム中に気体あるいは水蒸気に対する遮
断層として塩化ビニリデン系樹脂層を用いることが行な
われている。Conventionally, a vinylidene chloride resin layer has been used as a barrier layer against gas or water vapor in a laminated film.
しかしながら一般に塩化ビニリデン系樹脂は、溶融時の
粘度が低く押出時のドローダウン現象が烈しいためにこ
れを3ミクロン以下の均整した厚味に溶融押出成膜する
ことは押出ダイ設計上も至難のことである。However, in general, vinylidene chloride resin has a low viscosity when melted and the drawdown phenomenon during extrusion is severe, so it is extremely difficult to melt and extrude it into a film with a uniform thickness of 3 microns or less due to the design of the extrusion die. It is.
また他の樹脂に比較してモノマー製造工程、重合工程の
複雑さから格段に高価な塩化ビニリデン系樹脂は、これ
を成膜容易な5ミクロン以上の厚味で市場に送り出して
も、ポリプロピレン、ポリエチレン、ナイロン等の比較
的安価な樹脂フィルムと同一用途で競合させることは不
可能に近く、たとえこれにガス、水蒸気に対し高度に優
れた遮断性を有する点を加味したとしても価格の面で産
業界に受入れられることはできなかつた。したがつてこ
れを遮断層として積層されたフイルム、例えば共押出積
層フイルムまたはラミネートフイルムは物性特性面にお
いて優れた包装材であることが認められながらも、その
活用される場を見出すことはきわめて困難であつた。こ
のため従来、極薄の塩化ピニリデン系樹脂層を挟んだ積
層包装材は、塩化ビニリデン系樹脂溶液またはエマルジ
ヨンを用いたコーテイング法によつて製造されていた。
しかし、この方法では乾燥装置、溶剤回収装置等に多額
の設備資金を要するのみでなく、成膜工程とは全く別工
程で行なわれるために運転要員数、収率等の面でコスト
高は避けられないという欠点があつた。本発明の目的は
、塩化ビニリデン系樹脂層を内層とした積層包装材中の
該塩化ピニリデン系樹脂層を均一な薄層に形成する方法
を提供することである。In addition, vinylidene chloride resin, which is much more expensive than other resins due to the complexity of the monomer manufacturing process and polymerization process, is not suitable for polypropylene, polyethylene, etc. It is almost impossible to compete with relatively inexpensive resin films such as nylon in the same application, and even if you take into account the fact that it has highly excellent barrier properties against gas and water vapor, it is still difficult to compete with relatively inexpensive resin films such as nylon. I could not be accepted by the world. Therefore, although it is recognized that films laminated with this as a barrier layer, such as coextruded laminated films or laminated films, are excellent packaging materials in terms of physical properties, it is extremely difficult to find a place where they can be used. It was hot. For this reason, conventionally, laminated packaging materials sandwiching ultra-thin pinylidene chloride resin layers have been manufactured by a coating method using a vinylidene chloride resin solution or emulsion.
However, this method not only requires a large amount of capital for equipment such as drying equipment and solvent recovery equipment, but also requires high costs in terms of the number of operating personnel, yield, etc., as it is performed in a completely separate process from the film formation process. The drawback was that I couldn't do it. An object of the present invention is to provide a method for forming a vinylidene chloride resin layer into a uniform thin layer in a laminated packaging material having a vinylidene chloride resin layer as an inner layer.
本発明の別の目的は、薄層化した塩化ピニリデン系樹脂
層のガスおよび湿気遮断性を高度化する方法を提供する
ことである。本発明のさらに別の目的は、用途に応じた
表面層を臨機に選定して積層し、かつ塩化ビニリデン系
樹脂層を必要な厚味に調整した積層フイルムに作成でき
るようにする方法を提供することである。Another object of the present invention is to provide a method for enhancing the gas and moisture barrier properties of a thinned pinylidene chloride resin layer. Still another object of the present invention is to provide a method that allows laminating a surface layer by appropriately selecting a surface layer depending on the application, and making it possible to create a laminated film with a vinylidene chloride resin layer adjusted to the required thickness. That's true.
本発明の究極の目的は塩化ビニリデン系樹脂層をもつ積
層をもつ積層材を工業上利用可能なものにする方法を提
供することである。本発明は、塩化ピニリデン系樹脂層
が中心層となり、その両側面にエチレン・ビニルアセテ
ート共重合樹脂、エチレンと不飽和カルボン酸または
(その金属塩との共重合樹脂、エチレン・不飽和カルボ
ン酸エステル共重合樹脂及びスチレン・プタジエンプロ
ツク共重合樹脂の内の一種または二種以上の混合樹脂か
らなる5〜30ミクロンの接合樹脂層が積層され、更に
一方の接合樹脂層の外表5面にポリオレフイン系樹脂、
ポリスチレン系樹脂及びポリアミド系樹脂から選ばれた
表面樹脂層が配されていて、表面樹脂層/接合樹脂層/
中心層/接合樹脂層の平板状構造をなす積層体を溶融押
出し、直ちに冷風ノズルと冷却ロールとの間を通過4さ
せてこれを無延伸のまま積層フイルムに形成し、その後
任意の時点で残りの接合樹脂層の外表面にポリオレフイ
ン系樹脂、ポリスチレン系樹脂及びポリアミド系樹脂か
ら選ばれた熱可塑性樹脂のフイルムまたは溶融物を、両
表面樹脂層の厚みの和が塩化ピニリデン系樹脂層の厚み
よりも厚くなる厚みで積層し、その積層体を加熱ゾーン
において一軸または二軸に延伸し、塩化ビニリデン系樹
脂層の厚みを3ミクロン以下にすることを特徴とする積
層包装材の製造方法である。The ultimate object of the present invention is to provide a method for making a laminate having a layer of vinylidene chloride resin industrially usable. In the present invention, a pinylidene chloride resin layer serves as the center layer, and on both sides, ethylene/vinyl acetate copolymer resin, ethylene and unsaturated carboxylic acid or
(A bonding resin of 5 to 30 microns consisting of one or more mixed resins of copolymer resins with metal salts thereof, ethylene/unsaturated carboxylic acid ester copolymer resins, and styrene/butadiene block copolymer resins) The layers are laminated, and the five outer surfaces of one of the bonded resin layers are coated with polyolefin resin,
A surface resin layer selected from polystyrene resin and polyamide resin is arranged, and the surface resin layer/bonding resin layer/
A laminate having a flat structure of the center layer/bonding resin layer is melt-extruded and immediately passed between a cold air nozzle and a cooling roll 4 to form a laminate film without being stretched. A thermoplastic resin film or melt selected from polyolefin resin, polystyrene resin, and polyamide resin is applied to the outer surface of the bonding resin layer, so that the sum of the thicknesses of both surface resin layers is less than the thickness of the pinylidene chloride resin layer. This is a method for producing a laminated packaging material, which is characterized in that the laminated material is laminated to a thickness that increases in thickness, and the laminated body is stretched uniaxially or biaxially in a heating zone to make the thickness of the vinylidene chloride resin layer 3 microns or less.
本発明において塩化ビニリデン系樹脂とは塩化ビニリデ
ンを少くとも60%(重量バーセント、以下同じ)含む
共重合、多元共重合の樹脂をいう。In the present invention, the vinylidene chloride resin refers to a copolymerized or multicomponent copolymerized resin containing at least 60% (weight percentage, same hereinafter) of vinylidene chloride.
またその両側面に配置されるエチレン・ビニルアセテー
ト共重合樹脂、エチレンと不飽和カルボン酸またはその
金属塩との共重合樹脂、エチレン・不飽和カルボン酸エ
ステル共重合樹脂、スチレン・ブタジエンプロツク共重
合樹脂はいずれも溶融状で塩化ビニリデン系樹脂並びに
ポリオレフイン系樹脂、ポリアミド系樹脂及びポリスチ
レン系樹脂と不可分に接着するものである。本発明にお
いてエチレン・ビニルアセテート共重合樹脂、エチレン
と不飽和カルボン酸またはその金属塩との共重合樹脂、
エチレン・不飽和カルボン酸エステル共重合樹脂はいず
れもエチレン含有量60〜90%のものであり、スチレ
ン・プタジエンプロツク共重合樹脂とは、スチレン含有
量30〜50%のものである。In addition, ethylene/vinyl acetate copolymer resin placed on both sides, copolymer resin of ethylene and unsaturated carboxylic acid or its metal salt, ethylene/unsaturated carboxylic acid ester copolymer resin, styrene/butadiene block copolymer resin All of the resins are molten and inseparably adhere to vinylidene chloride resins, polyolefin resins, polyamide resins, and polystyrene resins. In the present invention, an ethylene/vinyl acetate copolymer resin, a copolymer resin of ethylene and an unsaturated carboxylic acid or a metal salt thereof,
The ethylene/unsaturated carboxylic acid ester copolymer resins have an ethylene content of 60 to 90%, and the styrene/butadiene block copolymer resins have a styrene content of 30 to 50%.
本発明の製造方法においてはこの接合樹脂層の押出時積
層厚昧を5ミクロン〜30ミクロンの範囲にする。In the manufacturing method of the present invention, the lamination thickness of this bonding resin layer during extrusion is set in the range of 5 microns to 30 microns.
この厚昧の限定は重要である。接合樹脂層の厚味が5ミ
クロン未満であると、中心層と表面樹脂層との接着が十
分でなく特に延伸に際して中心層の伸張斑を生じ易くな
つたり、延伸後は僅かな外部衝撃を受けることによつて
も剥離を生じ易いという欠点につながり易い。またこの
厚味が30ミクロンを超えて厚いと、後段の延伸に際し
て反つて中心層の塩化ピニリデン系樹脂層が均一な伸び
をせず、部分的に厚薄となり極端な場合には部分的に亀
裂を生じて中心層を失つた部分が生じる。この理由とし
ては、強制延伸に際して厚目の表面樹脂層が主動的に伸
張し、これに従属する如く中心層が伸張するが、中心層
と表面樹脂層との接着が十分でなければ表面樹脂層の伸
張に対して中心層の追随が円滑に進まず中心層の伸張が
不均等になり易く、更に中心層と表面樹脂層との接着が
十分であつても接合樹脂層の厚昧が厚目に過ぎると表面
樹脂層の強制伸張に影響された揺動が生じて中心層が均
等に伸張され難くなるためと考えられる。これら接合樹
脂層の別の役目は、後段の積層フイルムの加熱延伸時の
結晶領域の増大がもたらす中心層からの滲出低分子可塑
剤を界面に停めることなく接合樹脂層内に分散保留する
ことである。This limitation of ambiguity is important. If the thickness of the bonding resin layer is less than 5 microns, the adhesion between the center layer and the surface resin layer will not be sufficient, and the center layer will be particularly prone to stretch unevenness during stretching, and will be subject to slight external impact after stretching. In particular, this tends to lead to the disadvantage that peeling is likely to occur. In addition, if the thickness exceeds 30 microns, the pinylidene chloride resin layer in the center layer will not stretch uniformly during the subsequent stretching process, and will become partially thick and thin, and in extreme cases may crack partially. This results in areas that have lost their central layer. The reason for this is that during forced stretching, the thick surface resin layer actively stretches, and the center layer expands accordingly, but if the adhesion between the center layer and the surface resin layer is not sufficient, the surface resin layer The center layer does not follow the elongation of the material smoothly, and the elongation of the center layer tends to be uneven.Furthermore, even if the adhesion between the center layer and the surface resin layer is sufficient, the bonding resin layer is thick. It is thought that this is because if it is too long, oscillations will occur due to the forced stretching of the surface resin layer, making it difficult for the center layer to be stretched evenly. Another role of these bonding resin layers is to disperse and retain the low-molecular plasticizer exuded from the center layer, which is caused by the increase in the crystalline region during heating and stretching of the laminated film in the subsequent stage, within the bonding resin layer without being stopped at the interface. be.
一般に塩化ビニリデン系樹脂は、溶融押出加工に際して
熱安定性、加工性が低劣であるため、樹脂中に分子量1
500以下の低分子可塑剤例えばジオクチルセバケート
、ジブチルセバケート、アセチルトリブチルサイトレー
ト、エポキシ化植物油等の添加が不可欠であるが、これ
ら可塑剤は上記溶融押出時の熱安定性、加工性を向上せ
しめる反面、塩化ビニリデン系樹脂のガス遮断性湿気遮
断性を低下せしめていることが知られている。またこれ
ら常温で液状、流動状の低分子可塑剤はフイルムとなつ
た塩化ビニリデン系樹脂の体中から経時的に、特に熱を
うけた場合に顕著にその表面に滲出する性質をもつもの
である。本発明の製造方法によれば表面樹脂層の伸張に
応じた塩化ビニリデン系樹脂層の従属伸張が、含有する
低分子可塑剤の助けも加わつて、この中心層の伸張変形
が全体に均一に進行し、延伸後の中心層の厚昧が極めて
均一性に優れガス遮断性、湿気遮断性の信頼性の高い包
装材が得られる。In general, vinylidene chloride resins have poor thermal stability and processability during melt extrusion processing, so the molecular weight of
It is essential to add low-molecular plasticizers with a molecular weight of 500 or less, such as dioctyl sebacate, dibutyl sebacate, acetyl tributyl citrate, and epoxidized vegetable oil, but these plasticizers improve the thermal stability and processability during melt extrusion. On the other hand, it is known that it reduces the gas barrier and moisture barrier properties of vinylidene chloride resins. In addition, these low-molecular plasticizers, which are liquid or fluid at room temperature, have the property of leaching out from inside the vinylidene chloride resin film to the surface over time, especially when it is exposed to heat. . According to the manufacturing method of the present invention, the dependent elongation of the vinylidene chloride resin layer in response to the elongation of the surface resin layer, with the help of the low-molecular plasticizer contained, causes the elongation deformation of the central layer to progress uniformly throughout. Moreover, the thickness of the center layer after stretching is extremely uniform, and a packaging material with high reliability in gas barrier properties and moisture barrier properties can be obtained.
更に本製造方法における加熱延伸操作によつて生じる上
記可塑剤が接合樹脂層内に分散保留される現象が付随的
に加味されて、予測をはるかに越えた遮断性を有する積
層フイルムが得られることになる。接合樹脂層の外側面
に積層する熱可塑性樹脂はポリエチレン系樹脂、ポリプ
ロピレン系樹脂等のポリオレフイン系樹脂、ポリアミド
系樹脂、ポリスチレン系樹脂である。ここでポリエチレ
ン系樹脂とはエチレンまたはこれの金属イオン架橋を持
つアイオノマーを60パーセント以上有する共重合体、
多元重合体、ブレンド重合体を含むものである。またポ
リプロピレン系樹脂、ポリアミド系樹脂とはいずれもプ
ロピレンまたはアミドを60パーセント以上有し、ポリ
スチレン系樹脂とはスチレンを40%以上有する共重合
体、多元重合体、プレンド重合体を含むものである。本
発明の製造方法においては、一方の表面は包装材の表面
層をなす樹脂で被着されているが、他の一方の表面は接
合樹脂層のままの積層フイルムをノズルから溶融押出し
、押出ノズル直下において回転する冷却ロールと冷却ロ
ールに向けて冷風を噴射しているエアーノズルとの間を
通過させ、一たん無延伸のフイルムに形成する。Furthermore, when the phenomenon in which the plasticizer is dispersed and retained in the bonded resin layer due to the heating stretching operation in the present manufacturing method is taken into account, a laminated film with barrier properties far exceeding expectations can be obtained. become. The thermoplastic resin laminated on the outer surface of the bonding resin layer is a polyolefin resin such as a polyethylene resin or a polypropylene resin, a polyamide resin, or a polystyrene resin. Here, polyethylene resin is a copolymer containing 60% or more of ethylene or its ionomer with metal ion crosslinks.
It includes multicomponent polymers and blend polymers. Polypropylene resins and polyamide resins both contain 60% or more of propylene or amide, and polystyrene resins include copolymers, multicomponents, and blended polymers that contain 40% or more of styrene. In the manufacturing method of the present invention, a laminated film is melt-extruded from a nozzle, with one surface coated with a resin forming the surface layer of the packaging material and the other surface remaining as a bonded resin layer. The film is passed between a cooling roll rotating directly below and an air nozzle spraying cold air toward the cooling roll, and is then formed into a non-stretched film.
ここで積層フイルムは冷風によつて冷却ロールに押圧さ
れるが、これは中心層の塩化ビニリデン系樹脂層および
接合樹脂層の厚昧の崩れを防止するために不可欠の要件
である。前述したように溶融時にドローダウンするほど
に高い流動性を示す塩化ピニリデン系樹脂や接合樹脂層
をなす樹脂群は、これを単に冷却ロールに捲きつけたり
或いは冷却ロール間で挟圧したりしてフイルムとロール
との間に部分的にエアーの侵入を許すと、フイルムに部
分的に膨らみを生じ、これら流動性の高い樹脂がその歪
みに応じて流動しながら固化するために、厚味が不均一
になり易く、後段の延伸に際して、中心層に亀裂を生じ
る原因となる。冷却ロールの表面温度、冷風の温度、風
量、圧力は両表面樹脂層の材質、厚味等によつて調整さ
れるが、温度はO〜30℃であり、風量、風圧力はロー
ルとフイルムとの間に空気が侵入することを阻止する程
度にフイルムをロールに押圧できる範囲のものであれば
よい。また冷風温度とロール表面温度とは必らずしも同
一である必要はない。このようにして、一方の表面樹脂
層を欠いたまま一たん無延伸のフイルムに形成しておく
ことはきわめて重要なことで、これによつてはじめて、
のちにそれぞれの用途に適合した表面樹脂層を臨機に適
用することが可能となるとともに、塩化ビニリデン系樹
脂層が未延伸の状態におかれているから、それぞれの用
途に必要な遮断性と低廉性の均衡をとりながら、加熱延
伸して薄層化することができるのである。Here, the laminated film is pressed against a cooling roll by cold air, and this is an essential requirement to prevent the core vinylidene chloride resin layer and the bonding resin layer from becoming loose. As mentioned above, pinylidene chloride resins that have such high fluidity that they draw down when melted and the resins that form the bonding resin layer can be made into a film by simply winding them around cooling rolls or compressing them between cooling rolls. If air is allowed to partially enter between the roll and the film, it will partially bulge, and these highly fluid resins will flow and solidify in response to the distortion, resulting in uneven thickness. This tends to cause cracks in the center layer during subsequent stretching. The surface temperature of the cooling roll, the temperature of the cold air, the air volume, and the pressure are adjusted by the material and thickness of both surface resin layers, but the temperature is 0 to 30°C, and the air volume and wind pressure are dependent on the roll and film. Any material may be used as long as it can press the film against the roll to an extent that prevents air from entering between the rolls. Moreover, the cold air temperature and the roll surface temperature do not necessarily have to be the same. In this way, it is extremely important to form an unstretched film without one of the surface resin layers.
Later on, it becomes possible to apply a surface resin layer suitable for each application as needed, and since the vinylidene chloride resin layer is in an unstretched state, it can provide the barrier properties and low cost required for each application. It is possible to thin the layer by heating and stretching while maintaining a balance of properties.
無延伸フイルムの片面をなす接合樹脂層の上には、包装
材の表面樹脂層となるフイルムを積層するか、またはそ
の樹脂を溶融押出しつつ積層する。On top of the bonding resin layer forming one side of the unstretched film, a film that will become the surface resin layer of the packaging material is laminated, or the resin is laminated while being melt-extruded.
この表面樹脂層には、既に形成された他の一面を形成す
る樹脂群として前述した熱可塑性樹脂の中から選用され
る。またここで積層されるフイルムは無延伸のものでも
よいし積層後に行なわれる延伸が可能な範囲で一軸また
は二軸に一部分延伸されたものであつてもよい。しかし
ここで積層される表面樹脂層は、それと既に他の一面を
形成されている表面樹脂層との厚昧の和が塩化ビニリデ
ン系樹脂層の厚みよりも大となるような厚味にしなけれ
ばならない。これは後段の延伸に際して、両表面樹脂層
を主動的に伸張させ、接合樹脂層および塩化ビニリデン
系樹脂層をこの伸張に従属的に伸張させるための不可欠
の要件で、両表面樹脂層の合計厚味が塩化ビニリデン系
樹脂層の厚昧より小であると、接合樹脂層および塩化ピ
ニリデン系樹脂層に対する牽引性が低く各樹脂層ともに
伸張が部分的に不均等になり易く、亀裂を生じ易い。This surface resin layer is selected from the thermoplastic resins described above as the resin group forming the other surface already formed. The films laminated here may be unstretched or may be partially uniaxially or biaxially stretched to the extent that stretching after lamination is possible. However, the surface resin layer to be laminated here must be thick enough that the sum of its thickness and the surface resin layer already formed on the other side is greater than the thickness of the vinylidene chloride resin layer. No. This is an essential requirement in order to actively stretch both surface resin layers during the subsequent stretching, and to stretch the bonding resin layer and vinylidene chloride resin layer dependently on this stretching, and the total thickness of both surface resin layers. If the thickness is less than the thickness of the vinylidene chloride resin layer, the traction to the bonding resin layer and the pinylidene chloride resin layer will be low, and each resin layer will tend to stretch unevenly in parts, making it easy to crack.
延伸は一対のピンチロールの前方に設けた加熱ゾーンに
おいて実施する。Stretching is performed in a heating zone provided in front of a pair of pinch rolls.
この延伸はテンタークリツプによる逐次二軸延伸、また
は二対の表面回転速度の異つたピンチロールによる縦方
向の延伸と、これにテンタークリツプを併用した二軸延
伸でもよいし、そのいずれかによる一軸延伸であつても
よい。延伸は、加熱ゾーンにおいて実施する。This stretching may be sequential biaxial stretching using tenter clips, longitudinal stretching using two pairs of pinch rolls with different surface rotation speeds, and biaxial stretching using tenter clips in combination, or uniaxial stretching using either of these methods. It may be. Stretching is carried out in a heating zone.
オーブン内温度を両表面樹脂層の内の軟化点の低い側の
樹脂の軟化点以上にする。このように加熱延伸された積
層フイルムにはオーブン温度以下の温度において収縮は
起らない。しかしその温度以上の温度での保管、使用或
いは陳列等が見込まれ、しかもフイルムが収縮してはな
らない場合には、延伸後に上記オーブン温度以上の温度
で緊張熱処理を施す。この温度は上記保管、使用、陳列
等の際にうける温度より10℃程度高目であることが好
ましい。次に本発明の実施例を示す。The temperature inside the oven is set to be equal to or higher than the softening point of the resin on the lower softening point of both surface resin layers. The laminated film heated and stretched in this manner does not shrink at temperatures below the oven temperature. However, if the film is expected to be stored, used, displayed, etc. at a temperature higher than that temperature, and the film must not shrink, it is subjected to tension heat treatment at a temperature higher than the above oven temperature after stretching. This temperature is preferably about 10° C. higher than the temperature at which the product is stored, used, displayed, etc. Next, examples of the present invention will be shown.
実施例 1
塩化ビニリデン85%と、塩化ビニール15%との共重
合樹脂100部(重量部、以下同じ)にジブチルセバケ
ート2.3部、及びアセチルトリブチルサイトレート2
,0部を添加した塩化ビニリデン系共重合樹脂からなる
10ミクロンの内層と、その両面にエチレン含有量75
%のエチレン・エチルアクリレート共重合樹脂の15ミ
クロンの層と、更にその外側片面にサーリンAl652
番の400ミクロンの層とを配してTダイより積層押出
し、20℃のエアーを噴出しているエアーノズルと、表
面温度15℃のロールとの間を通過させたのち未延伸の
ままフイルム(AJとして巻取つた。Example 1 100 parts (by weight, the same applies hereinafter) of a copolymer resin of 85% vinylidene chloride and 15% vinyl chloride, 2.3 parts of dibutyl sebacate, and 2 parts of acetyltributyl citrate.
, an inner layer of 10 microns made of vinylidene chloride copolymer resin with 0 parts added, and an ethylene content of 75% on both sides.
% ethylene/ethyl acrylate copolymer resin, and Surlyn Al652 on one outer side.
A 400 micron layer with a diameter of 400 microns is arranged and laminated and extruded from a T-die, passed between an air nozzle blowing out air at 20°C and a roll with a surface temperature of 15°C, and the film is left unstretched ( I took it up as AJ.
一方、6・ナイロン樹脂を200ミクロンの厚味のフイ
ルム状に押出し(B)、フイルム(8のエチレン・エチ
ルアクリレート樹脂層上に積層しつつ、これを90℃の
加熱ゾーンにおいて縦方向に3倍、横方向に3倍、計9
倍延伸し、ついで120℃の加熱ゾーンで緊張熱処理し
た。得られたフイルムは透明性、耐油性、耐ピンホール
性にすぐれ、フィルム(A)+(B)の未延伸積層フイ
ルムに対し1/9に薄層化されたに拘らず、その酸素透
過率は未延伸フィルムが4(CC/イ・24hr、23
℃)であるのに対して延伸フイルムでは18、またはそ
の水蒸気透過率は未延伸フイルムが1.5(7/d・2
4hI−)であるのに対して7.5ときわめて高い遮断
性を示した。On the other hand, nylon resin 6 was extruded into a film with a thickness of 200 microns (B), and while the film was laminated on the ethylene ethyl acrylate resin layer of 8, it was heated three times in the longitudinal direction in a heating zone of 90°C. , 3 times horizontally, total 9
It was stretched twice and then subjected to tension heat treatment in a heating zone at 120°C. The obtained film has excellent transparency, oil resistance, and pinhole resistance, and its oxygen permeability is 1/9th that of the unstretched laminated film of film (A) + (B). The unstretched film is 4 (CC/I・24hr, 23
℃), whereas the stretched film has a water vapor transmission rate of 18, or the unstretched film has a water vapor transmission rate of 1.5 (7/d・2
4hI-), it showed an extremely high blocking property of 7.5.
またサーリンAの層を向い合わせ、熱板温度150℃、
圧力1k9/Crii、シール時間0.5秒で行なつた
ヒートシール部の接着強度は3.0(K9/15mm巾
)という値を示した。In addition, the Surlyn A layers were placed facing each other, and the heating plate temperature was 150℃.
The adhesive strength of the heat-sealed portion, which was performed at a pressure of 1k9/Crii and a sealing time of 0.5 seconds, was 3.0 (K9/15 mm width).
また得られたフイルムをランダムな位置から1イづつ4
枚截取し、更にその各枚にランダムに測定個所10個所
を選定し、塩化ビニリデン系樹脂層の厚味測定を行つた
結果、平均1.1ミクロン、シグマ−0.03ミクロン
ときわめて均一なものであつた。Also, take the obtained film one by one from a random position.
The thickness of the vinylidene chloride resin layer was measured by cutting out a sheet, randomly selecting 10 measurement points on each sheet, and found that it was extremely uniform with an average of 1.1 microns and a sigma of -0.03 microns. It was hot.
実施例 2
塩化ビニリデン83%と塩化ビニール17%との共重合
体100部にジオクチルアジペート1.5部、及びジブ
チルセバケート2.5部を添加した塩化ビニリデン系共
重合樹脂からなる20ミクロンの内層と、その両側にビ
ニールアセテート含有量28%のエチレン・ビニールア
セテート共重合樹脂の20ミクロンの層と、更にその外
側片面にエチレン含有量5%、ランダム性指数0.45
のエチレン・プロピレンランダム共重合樹脂の150ミ
クロンの層とを配してTダイより積層押出し、押出ノズ
ル直下において15℃の冷風を噴出するノズルと、表面
温度20℃の冷却ロールとの間を通過させて無延伸のま
ま巻取つた。Example 2 A 20 micron inner layer made of a vinylidene chloride copolymer resin prepared by adding 1.5 parts of dioctyl adipate and 2.5 parts of dibutyl sebacate to 100 parts of a copolymer of 83% vinylidene chloride and 17% vinyl chloride. and a 20 micron layer of ethylene/vinyl acetate copolymer resin with a vinyl acetate content of 28% on both sides, and a 20 micron layer of ethylene/vinyl acetate copolymer resin with a vinyl acetate content of 5% and a randomness index of 0.45 on one outer side.
A 150-micron layer of ethylene/propylene random copolymer resin is arranged and laminated and extruded from a T-die, and passed between a nozzle that blows out cold air at 15°C directly below the extrusion nozzle and a cooling roll with a surface temperature of 20°C. The film was then rolled up without being stretched.
これをフイルム(0とする。一方プタジエン含有量6%
のゴム変性ポリスチレン樹脂をTダイより押出して2m
uの未延伸フィルムとして巻取つた。This is taken as a film (0. On the other hand, the putadiene content is 6%
Rubber-modified polystyrene resin is extruded from a T-die to a length of 2 m.
It was wound up as an unstretched film.
これをフイルム(自)とする。次にフイルム(Oのエチ
レン・ピニールアセテート側とフイルム(Dとを95℃
の熱圧着ロールで積層し、120℃の加熱ロール群で縦
方向に3倍に延伸し、引きつづき130℃の加熱ゾーン
において横方向に3倍、計9倍の延伸を行つた。得られ
たフイルムは腰があり、熱成形性、耐衝撃性にすぐれ、
更にフイルム(C)と(Dの未延伸積層フイルムの酸素
透過率14(CC/イ・24hr、23℃)水蒸気透過
率0.9(7/Rrl・24hr)に対し、1/9に薄
層化されたに拘らず延伸フイルムの酸素透過率31(C
C/M2・24hr、23℃)、水蒸気透過率5(7/
Trl・24hr)であつた。This is called film (self). Next, the ethylene/pineyl acetate side of the film (O) and the film (D) were heated at 95°C.
The sheets were laminated using thermocompression rolls, and stretched 3 times in the machine direction using a group of heated rolls at 120° C., and then stretched 3 times in the transverse direction in a heating zone at 130° C., for a total of 9 times. The resulting film has firmness, excellent thermoformability, and impact resistance.
Furthermore, compared to the oxygen permeability of 14 (CC/I・24hr, 23°C) and water vapor permeability of 0.9 (7/Rrl・24hr) of the unstretched laminated films of films (C) and (D), a thin layer was added to 1/9. The oxygen permeability of the stretched film is 31 (C
C/M2・24hr, 23℃), water vapor transmission rate 5 (7/
Trl・24hr).
また得られたフイルムをランダムな位置から1m2づつ
4枚截取し、更にその各枚にランダムに測定個所を10
個所選定し、塩化ビニリデン系樹脂層の厚味測定を行つ
た結果平均2.2ミクロン、シグマ−0.06ミクロン
できわめて均整なものであつた。実施例 3
塩化ビニリデン83%と塩化ビニール17%との共重合
体100部にジオクチルアジペート1.5部、及びジブ
チルセバケート2.5部を添加した塩化ビニリデン系共
重合樹脂からなる26ミクロンの内層と、その両側にス
チレン含有量40%のスチレン・ブタジエンプロツク共
重合樹脂の20ミクロンの層と、更にその外側片面にエ
チレン含有量5%、ランダム性指数0.45のエチレン
・プロピレンランダム共重合樹脂の25ミクロンの層と
を配してTダイより積層押出し、18℃のエアーを噴出
しているエアーノズルと、表面温度20℃の回転するロ
ールとの間を通過させたのち未延伸のままフイルム(E
)として巻取つた。In addition, four pieces of 1 m2 each were cut from the obtained film at random positions, and 10 measurement points were randomly placed on each piece.
The thickness of the vinylidene chloride resin layer was measured at selected locations and found to be extremely uniform with an average of 2.2 microns and a sigma of 0.06 microns. Example 3 A 26 micron inner layer made of a vinylidene chloride copolymer resin prepared by adding 1.5 parts of dioctyl adipate and 2.5 parts of dibutyl sebacate to 100 parts of a copolymer of 83% vinylidene chloride and 17% vinyl chloride. and a 20-micron layer of styrene-butadiene block copolymer resin with a styrene content of 40% on both sides, and an ethylene-propylene random copolymer resin with an ethylene content of 5% and a randomness index of 0.45 on one outer side. A 25 micron layer of resin was arranged and laminated and extruded from a T die, and after passing between an air nozzle blowing out air at 18°C and a rotating roll with a surface temperature of 20°C, it remained unstretched. Film (E
).
一方、MFl2.5、比重1.05のポリスチレン樹脂
を2200ミクロンの厚昧のフイルム状に押出し(F′
)ながら、フイルム(ト)の残されたスチレン・ブタジ
エンプロツク共重合樹脂層上に積層しつつ、これを12
0℃の加熱ロール群を用いて縦方向に3倍延伸し、つい
で130℃の加熱ゾーンにおいて横方向に3倍、計9倍
の加熱延伸を行つた。On the other hand, a polystyrene resin with an MFL of 2.5 and a specific gravity of 1.05 was extruded into a film with a thickness of 2200 microns (F'
) while laminating it on the remaining styrene-butadiene block copolymer resin layer of the film (g).
The film was stretched 3 times in the longitudinal direction using a heating roll group at 0°C, and then 3 times in the transverse direction in a heating zone at 130°C, for a total of 9 times.
得られたフィルムは腰があり、熱成形性、透明性にすぐ
れ、フイルム(ト)と(Dとを積層した未延伸フイルム
の厚昧に対し1/9に薄層化されたに拘らず、その酸素
透過率は未延伸フイルムが10(CC/TTI・24h
r、23℃)であるのに対して、延伸フイルムでは25
、またその水蒸気透過率は未延伸フイルムが1.2(y
/イ・24hI−)であるのに対し7ときわめて高い遮
断性を示した。また得られたフイルムをランダムな位置
から1m2づつ4枚採取し、更にその各枚に10個所の
測定個所をランダムに選定し、塩化ビニリデン系樹脂層
の厚味測定を行つた結果平均2.9ミクロン、シグマ−
0.06ミクロンときわめて均一なものであつた。実施
例 4
塩化ビニリデン83%と塩化ビニール17%との共重合
体100部にジオクチルアジペート1.5部及びジブチ
ルセバケート2.5部を添加した塩化ビニリデン系共重
合樹脂からなる9.8ミクロンの内層と、その両側にM
I4.O、ビニールアセテート含有量26%のエチレン
・ビニールアセテート樹脂の20ミクロンの層と、更に
その外側片面にエチレン含有量5%、ランダム性指数0
.45のエチレン・プロピレンランダム共重合樹脂の6
0ミクロンの層とを配してTダイより積層押出し、15
℃のエアーを回転ロールに向けて噴射しているエアーノ
ズルとロールとの間を通過させたのち、無延伸のままフ
イルム(G)とした。The obtained film was stiff, had excellent thermoformability and transparency, and although it was thinned to 1/9 of the thickness of an unstretched film in which films (G) and (D) were laminated, The oxygen permeability of the unstretched film is 10 (CC/TTI・24h
r, 23°C), while for stretched film it is 25°C.
, and the water vapor permeability of the unstretched film is 1.2 (y
/I・24hI-), it showed an extremely high blocking property of 7. In addition, four pieces of 1 m2 of the obtained film were taken from random positions, and 10 measurement points were randomly selected on each piece, and the thickness of the vinylidene chloride resin layer was measured. The average result was 2.9. micron, sigma
It was extremely uniform with a diameter of 0.06 microns. Example 4 A 9.8 micron film made of a vinylidene chloride copolymer resin prepared by adding 1.5 parts of dioctyl adipate and 2.5 parts of dibutyl sebacate to 100 parts of a copolymer of 83% vinylidene chloride and 17% vinyl chloride. M on the inner layer and on both sides
I4. O, 20 micron layer of ethylene-vinyl acetate resin with 26% vinyl acetate content, and one outer side with 5% ethylene content and 0 randomness index.
.. 45 ethylene propylene random copolymer resin 6
Laminated and extruded from a T-die with a layer of 0 micron, 15
After passing air between the roll and an air nozzle injecting air at a temperature of 0.degree. C. toward the rotating roll, a film (G) was obtained without stretching.
一方、MFl2.5、比重1.05のポリスチレン樹脂
をTダイより1.5m77!厚味の平板状に溶融押出し
(ロ)加熱ロール群を用いて縦方向に2.5倍に延伸し
、ついでこれをフイルム(G)のエチレン・ビニールア
セテート樹脂面に積層し、130℃の加熱ゾーンにおい
てこれを横方向に3.5倍延伸した。On the other hand, 1.5m77 of polystyrene resin with MFL2.5 and specific gravity 1.05 was made from T-die! Melt extrusion into a thick flat plate (b) Stretch it 2.5 times in the longitudinal direction using a group of heated rolls, then laminate it on the ethylene vinyl acetate resin surface of the film (G) and heat it at 130°C. It was stretched 3.5 times in the transverse direction in the zone.
得られたフイルムは腰があり、熱成形性、透明性にすぐ
れ、縦延伸したフイルム但をフイルム(G)と積層した
ままの積層フイルムの酸素透過率28(CC/イ・24
hr、23℃)、水蒸気透過率1.5(7/7TI・2
4hr)に対して酸素透過率42、水蒸気透過率3.0
ときわめて高い数値を示した。また実施例1と同様の方
法で塩化ピニリデン系樹脂層の厚味を測定したところ平
均2.8ミクロン、シグマ−0.06ミクロンときわめ
て均一なものであつた。前記の各実施例からも明らかな
ように、本発明の製造方法では、一旦積層体中の塩化ピ
ニリデン系樹脂層を均=厚昧で無延伸のままの中間製品
とすることにより、押出成膜の困難な塩化ビニリデン系
樹脂を取扱わない樹脂加エ工場等においても、これに表
面樹脂を被覆して延伸することが可能となり、これら工
場では注文に応じて包装物、包装用袋および必要遮断性
に応じた所要銘柄タイプの包装材を容易迅速に製造でき
ることとなつたもので、工業上の利用価値はきわめて大
であり、得られる積層フイルムは高価な塩化ビニリデン
系樹脂層をはさみながらこれが極めて均一な薄層として
存在させることができるため充分に市場競争に耐え、し
かも高度で信頼性のあるガス、水蒸気遮断性を得ること
ができるため汎用包装材としてきわめて有用なものとな
る。The obtained film is stiff, has excellent thermoformability and transparency, and has an oxygen permeability of 28 (CC/I・24) of the laminated film in which the longitudinally stretched film is laminated with film (G).
hr, 23℃), water vapor transmission rate 1.5 (7/7TI・2
Oxygen permeability 42, water vapor permeability 3.0 for 4hr)
showed an extremely high value. Further, when the thickness of the pinylidene chloride resin layer was measured in the same manner as in Example 1, it was found to be extremely uniform with an average of 2.8 microns and a sigma of 0.06 microns. As is clear from the above examples, in the manufacturing method of the present invention, the pinylidene chloride resin layer in the laminate is once formed into an intermediate product with a uniform thickness and no stretching, and extrusion film formation is performed. Even in resin processing factories that do not handle vinylidene chloride resin, which is difficult to process, it is now possible to coat it with surface resin and stretch it. It has become possible to easily and quickly produce the required brand type of packaging material according to the product, and its industrial value is extremely high. Because it can exist as a thin layer, it can withstand market competition sufficiently, and it can also provide high and reliable gas and water vapor barrier properties, making it extremely useful as a general-purpose packaging material.
Claims (1)
面にエチレン・ビニルアセテート共重合樹脂、エチレン
と不飽和カルボン酸またはその金属塩との共重合樹脂、
エチレン・不飽和カルボン酸エステル共重合樹脂及びス
チレン・ブタジエンブロック共重合樹脂の内の一種また
は二種以上の混合樹脂からなる5〜30ミクロンの接合
樹脂層が積層され、更に一方の接合樹脂層の外表面にポ
リオレフィン系樹脂、ポリスチレン系樹脂及びポリアミ
ド系樹脂から選ばれた表面樹脂層が配されていて、表面
樹脂層/接合樹脂層/中心層/接合樹脂層の平板状構造
をなす積層体を溶融押出し、直ちに冷風ノズルと冷却ロ
ールとの間を通過させてこれを無延伸のまま積層フィル
ムに形成し、その後任意の時点で残りの接合樹脂層の外
表面にポリオレフィン系樹脂、ポリスチレン系樹脂及び
ポリアミド系樹脂から選ばれた熱可塑性樹脂のフィルム
または溶融物を、両表面樹脂層の厚みの和が塩化ビニリ
デン系樹脂層の厚みよりも厚くなる厚みで積層し、その
積層体を加熱ゾーンにおいて一軸または二軸に延伸し、
塩化ビニリデン系樹脂層の厚みを3ミクロン以下にする
ことを特徴とする積層包装材の製造方法。1. Vinylidene chloride resin layer serves as the center layer, and on both sides thereof, ethylene/vinyl acetate copolymer resin, copolymer resin of ethylene and unsaturated carboxylic acid or its metal salt,
A bonding resin layer of 5 to 30 microns consisting of one or more mixed resins of ethylene/unsaturated carboxylic acid ester copolymer resin and styrene/butadiene block copolymer resin is laminated, and one of the bonding resin layers is further laminated. A laminate with a surface resin layer selected from polyolefin resin, polystyrene resin, and polyamide resin is arranged on the outer surface, and has a flat structure of surface resin layer/bonding resin layer/center layer/bonding resin layer. After melt extrusion, it is immediately passed between a cold air nozzle and a cooling roll to form a laminated film without stretching, and then at any time, polyolefin resin, polystyrene resin, and Films or melts of thermoplastic resins selected from polyamide resins are laminated to a thickness such that the sum of the thicknesses of both surface resin layers is greater than the thickness of the vinylidene chloride resin layer, and the laminate is uniaxially heated in a heating zone. or biaxially stretched,
A method for producing a laminated packaging material, characterized in that the thickness of the vinylidene chloride resin layer is 3 microns or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50043383A JPS599345B2 (en) | 1975-04-11 | 1975-04-11 | Manufacturing method of laminated packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50043383A JPS599345B2 (en) | 1975-04-11 | 1975-04-11 | Manufacturing method of laminated packaging material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51119083A JPS51119083A (en) | 1976-10-19 |
| JPS599345B2 true JPS599345B2 (en) | 1984-03-01 |
Family
ID=12662282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50043383A Expired JPS599345B2 (en) | 1975-04-11 | 1975-04-11 | Manufacturing method of laminated packaging material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599345B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56131135A (en) * | 1980-03-13 | 1981-10-14 | Sumitomo Bakelite Co | Package |
| JPS60111241A (en) * | 1983-11-22 | 1985-06-17 | Mitsubishi Paper Mills Ltd | Manufacture of photographic support |
-
1975
- 1975-04-11 JP JP50043383A patent/JPS599345B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51119083A (en) | 1976-10-19 |
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