JPS6011833B2 - Cooling system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides cooling by boiling in a refrigerator, for example.
The present invention relates to a cooling device for electronic circuit components including heat generating elements such as transistors.

FIG. 1 is a sectional view showing a conventional cooling device of this type, in which 1 is a closed container, 2 and 3 are a plurality of first and second liquids having different densities sealed in the closed container 1, and The density of the first liquid 2 on the side is greater than the density of the second liquid 3 on the upper side, and the boiling points of both liquids 2 and 3 are higher than that of the first liquid 3 on the lower side.
Liquid 2 with a lower concentration is used.

Reference numeral 4 denotes an interface between the first and second liquids 2 and 3, 5 a heating element to be cooled consisting of an electronic circuit component such as a transistor, and 6 a heating element formed above the second liquid 3 to prevent temperature rise. This is a gas phase space provided to release the expansion of both liquids 2.3 caused by the above.

When the heating element 5 consisting of an electronic circuit component such as a transistor starts to generate heat in the secondary cooling system configured as described above, the first liquid that the heating element 5 is in contact with starts to generate heat. As shown in FIG. 1, vapor bubbles 7 are generated within the chamber 2 and rise one after another.

Therefore, the surface of the heating element 5 is extremely efficiently cooled by the dispersion of the first liquid 2 caused by the vapor bubbles 7 that are successively generated and separated. The rising vapor bubbles 7 then penetrate the boundary surface 4 and enter the upper second liquid 3. However, by forcibly cooling the outer wall surface of the closed container 1 with an electric fan (not shown), the second liquid 3 is cooled by exchanging heat with the inner wall surface of the closed container 1. Therefore, the vapor bubbles 7 that have entered the second liquid 3 are cooled by the second liquid 3 and condense into droplets 8 as shown in FIG. In this way, the first liquid condensed within the second liquid 3
Since the density of the liquid 2, that is, the droplet 8, is higher than that of the second liquid 3, it penetrates the boundary surface 4 due to its own weight and returns to the first liquid 02, but at this time, the second liquid 02
Since the boiling point of the liquid 3 is higher than the boiling point of the first liquid 2, boiling does not occur. As described above, in the secondary cooling device, the heat generated in the heating element 5 becomes vapor bubbles 7 in the first liquid 2 and enters the upper second liquid 3. It is condensed and releases heat into the second liquid 3.

The second liquid 3 is dissipated to the outside through the wall surface of the closed container 1. However, in the conventional cooling system described above, the steam bubbles 7 generated near the heating element 5 coalesce with each other and gradually become larger steam bubbles.
When the second liquid 3 is condensed by heat exchange, there is a drawback that the contact area between the combined vapor bubbles and the second liquid 3 becomes small, resulting in a decrease in heat exchange efficiency.

This invention was made with attention to this point, and the vapor bubbles 7 generated in the first liquid 2 and enlarged by coalescing with each other are passed through a filter to fragment the vapor bubbles and heat them. This aims to improve exchange efficiency.

That is, FIG. 2 shows one embodiment of this invention.
1 is an airtight container; 2 and 3 are a plurality of first and second liquids having different densities sealed in the airtight container 1; the density of the lower first liquid 2 is higher than that of the upper second liquid; The density of the lower first liquid 2 is higher than that of the liquid 3, and the boiling point of both liquids 2 and 3 is lower than that of the first liquid 2.

4 is an interface between the first and second liquids 2 and 3, 5 is a heating element made of an electronic circuit component such as a transistor, and 6 is formed above the second liquid 3, and as the temperature rises, A gas phase space 7 provided to release the expansion of both liquids 2 and 3 is generated within the first liquid 2 and penetrates through the boundary surface 4 to enter the upper second liquid 3. Vapor bubbles 8 are droplets formed by being cooled and condensed by the second liquid 3, and 9 are droplets 9 that span, for example, the first and second liquids 2.3 in the closed container 1. It is a filter having a plurality of small holes 9a arranged corresponding to the liquid boundary surface 4, and this filter 9 is made of, for example, a wire mesh,
Alternatively, a scale striped plate with a large number of small holes is used, and this filter 9 can be used in the first liquid 2 to
This is provided to subdivide the steam bubbles 7 that are generated near the heating element 5, rise up and coalesce into larger steam bubbles into smaller steam bubbles.

As described above, according to the present invention, in the closed container 1 containing the heating element 5, the boundary between the first and second liquids 2 and 3 having different densities and duty points is straddled. Since the filter 9 is disposed corresponding to the surface 4, the heat generated in the first liquid 2 near the heating element 5,
The steam bubbles 7 that merged with each other and became larger as they rose,
Since the small holes 9a of the filter 9 subdivide the vapor bubbles into small vapor bubbles, the area between the second liquid 3 and the vapor bubbles 7 becomes smaller and the heat exchange efficiency decreases, unlike in the conventional case. It has excellent effects without any problems.

Therefore, it is possible not only to downsize the cooling device for this type of electronic circuit component, but also to suppress the abnormal temperature rise of the heating element 5 made of the electronic circuit component.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a conventional cooling device, and FIG. 2 is a sectional view showing an embodiment of the present invention. In the drawings, 1 is a closed container, 2 is a first liquid, 3 is a second liquid, 4 is an interface, 5 is a heating element, 7 is a vapor bubble, 8 is a droplet,
9 is a filter, and 9a is a small hole. Note that the same reference numerals in the figures indicate the same or corresponding parts. Figure 1

Claims (1)

[Claims] 1. A first liquid and a second liquid having different densities and boiling points are sealed in a closed container containing a heating element at a predetermined position, and a boundary surface between these liquids is straddled between the two liquids. 1. A cooling device comprising a filter disposed corresponding to the heating element, the filter dividing vapor bubbles generated in the vicinity of the heat generating element and coalescing with each other to become larger. 2. The cooling device according to claim 1, wherein the filter is formed of a wire mesh having small holes.