JPS6013318B2 - Manufacturing method of semiconductor optical device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a semiconductor optical device equipped with an optical transmission line guide with a condensing medium.

In order to use semiconductor light-emitting devices and semiconductor light-receiving devices for optical communication, a device is used in which the light-emitting portion or light-receiving portion of these devices and an optical transmission line (hereinafter referred to as an optical fiber) are integrated with their optical axes aligned. . FIG. 1 is a sectional view showing the structure of a conventional device. 1 is a semiconductor light emitting element or a semiconductor light receiving element, 2 is a light emitting part or a light receiving part, 3 is an optical fiber, 4
is an optical fiber guide, 5 is a package, and 6 is a reinforcing tube.

The optical fiber 3 is fixed to the optical fiber guide 4 with a saddle adhesive. After the optical fiber 3 and the light emitting section or the light receiving section 2 are optically integrated, the optical fiber guide 4 and the package 5 are bonded together. The length of the optical fiber installed is generally several tens to a few inches long. Since the length of the attached fiber is short in this device, it is necessary to splice (fuse) a relatively long optical fiber in order to perform long-distance optical communication over several fibers.

Furthermore, when performing optical communications using various optical fibers, it is necessary to splice different types of fibers. At this time, if the composition of the fiber material is different, the splice will be incomplete,
Optical transmission loss increases at the splice location, and a slight kink occurs in the characteristics of the optical fiber output P and the semiconductor light emitting device current 1. Therefore, in practice, in order to manufacture the semiconductor optical device shown in FIG. 1, it is necessary to use the same type of optical fiber as the long-distance optical fiber used for optical communications. Furthermore, since different types of fibers currently on the market have different jacket (covering: not shown in FIG. 1) diameters, it is necessary to change the thickness and length of the reinforcing tube 6 depending on the optical fiber. Therefore, when manufacturing the device, each fiber must be manufactured individually, and standardization of the device and manufacturing procedure is not possible. The present invention seeks to eliminate the above-mentioned usage and manufacturing disadvantages associated with conventional devices.

FIG. 2 is a sectional view showing the structure of a semiconductor optical device manufactured by the method of the present invention. 1 is a semiconductor light-emitting element or a semiconductor light-receiving element, 2 is a light-emitting part or a light-receiving part, 4 is a guide for an optical transmission line, 5 is a package, 7 is a light-condensing medium (a ball lens is shown), 8 is an adhesive It is.

FIG. 3 is a diagram illustrating the use of the device according to the invention. 4
, 8 and 7 are corresponding parts in FIG. 2, 3 is an optical fiber, 9 is a fiber jacket, and 1 is a fiber fixing stand.

In one embodiment, the optical transmission path guide 4 is made of a hard glass tube with a length of 25 ribs and an inner diameter of 180 mm on the outer diameter 1 side, and the condensing medium 7 is a glass bulb with a diameter of 190 mm. Rate 1.
5 ball lens. The manufacturing method according to the present invention differs somewhat depending on whether the capped element is a light emitting element or a light receiving element, but since the essential points are the same, the case of a light emitting element will be described next.

First, a ball lens 7 is glued to the tip of a hard glass tube 4. If the inner diameter of the glass tube is 180 mm and the diameter of the spherical lens is 190 mm, the central axes of both will automatically be aligned and fixed. Next, a monitoring optical fiber is inserted into the glass tube 4 so that its end surface lightly contacts the fixed ball lens 7.
(Similar to Fig. 3) After that, the optical axes of the light emitting unit 2 and the ball lens 7 in the light emitting state are aligned, and when the fiber output reaches the maximum, the glass tube (optical transmission line guide) is fixed to the package. Remove fiber. The monitoring optical fiber may be of the step index (S, 1) type or the graded index (G, 1,) type. In the manufacturing method for the light receiving element, instead of measuring the maximum optical power of the monitor guide in the above manufacturing method, the optical transmission line guide is packaged in package 5 with the light receiving element output at its maximum. It should be fixed to . When using the optical device according to the present invention, a practical low-loss fiber generally has a core diameter of 60mm and a diameter of about 150mm, so when it is inserted into the guide 4, the light is about ±15mm. Axis misalignment occurs. However, for semiconductor light emitting devices, by appropriately adjusting the distance between the ball lens and the light emitting part 2, the emitted light can be narrowed down, and S,1, G,1, can be suppressed even when the optical axis is shifted by about 15 mm. In any case, the emitted light can be sufficiently coupled to the core (50% or more).
Since the light-receiving part diameter of a semiconductor light-receiving element generally has about 500 peaks, the above-mentioned optical axis deviation does not pose a practical problem for the light-receiving element. Furthermore, if the transmission line guide length is about 25 ribs, there will be almost no vibration at the fiber tip and no fluctuation in coupling efficiency will occur. In the embodiment according to the present invention, a spherical lens is used as the light-converging medium, but it is also possible to use other lens-like media such as a self-focusing cylindrical lens based on a refractive index distribution. Further, it is not necessary to use a glass tube for the guide for the optical transmission line, and it is possible to use a stainless steel tube, a resin tube, etc. that can provide similar performance. As described above, according to the method of the present invention, it is possible to construct a semiconductor optical device that is equipped with an optical transmission path guide to which a light-concentrating medium is adhered inside and is in a sealed state. It is easy to use because a fiber of any length with an exposed end face can be inserted into the transmission line guide 4.

Furthermore, it is possible to use various fibers for one set of light emitting and light receiving devices. Furthermore, since it becomes possible to standardize the device manufacturing procedure, it has various advantages, such as being advantageous for mass production compared to conventional devices.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the structure of a conventional semiconductor optical device with an optical fiber, FIG. 2 is a cross-sectional view showing the structure of a semiconductor optical device manufactured by the method of the present invention, and FIG. It is a figure showing usage. 1 is a semiconductor light emitting element or a semiconductor light receiving element, 2 is a light emitting part or a light receiving part, 3 is an optical transmission line, 4 is a guide for the optical transmission line,
5 is a package, and 7 is a light condensing medium. Note that the same reference numerals in each figure indicate the same or corresponding parts. 1st
Figure 2 Figure 3

Claims (1)

[Claims] 1. Insert a cylindrical optical transmission line guide into the through hole of the package in which the semiconductor element having the light emitting part or the light receiving part is mounted, and insert the light emitting part or the light receiving part of the semiconductor element into the inner end of the optical transmission line guide. Then, the optical transmission line is inserted into the optical transmission line guide from the outer end side, and the light emitting part or the light receiving part of the semiconductor element and the light collecting medium are bonded to each other. aligning the optical axes of the optical transmission line, bonding the optical transmission line guide to the package with the output of the optical transmission line or the light receiving output of the semiconductor element at a maximum, and then removing the optical transmission line. A method for manufacturing a semiconductor optical device characterized by: