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JPS6014680B2 - Thin film cutting device - Google Patents
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JPS6014680B2 - Thin film cutting device - Google Patents

Thin film cutting device

Info

Publication number
JPS6014680B2
JPS6014680B2 JP12075977A JP12075977A JPS6014680B2 JP S6014680 B2 JPS6014680 B2 JP S6014680B2 JP 12075977 A JP12075977 A JP 12075977A JP 12075977 A JP12075977 A JP 12075977A JP S6014680 B2 JPS6014680 B2 JP S6014680B2
Authority
JP
Japan
Prior art keywords
punch
thin film
end surface
die
control section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12075977A
Other languages
Japanese (ja)
Other versions
JPS5454385A (en
Inventor
興一 佐藤
剛 小別所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12075977A priority Critical patent/JPS6014680B2/en
Publication of JPS5454385A publication Critical patent/JPS5454385A/en
Publication of JPS6014680B2 publication Critical patent/JPS6014680B2/en
Expired legal-status Critical Current

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  • Details Of Cutting Devices (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Description

【発明の詳細な説明】 本発明は、脆性および可孫性を有する材料、たとえば暁
給前で生乾き状態の磁器材料あるいはプラスチック材料
等で成る薄膜を定寸法に切断するとともに、切断時に発
生する切粉を除去しつつ所定の容器に清浄な状態で積み
重ねて取り出す装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention cuts thin films made of brittle and malleable materials, such as porcelain materials or plastic materials that are half-dried before being fed, into a fixed size, and also eliminates the cuts that occur during cutting. This relates to a device that removes powder while stacking it in a predetermined container in a clean state and taking it out.

従来、この種の切断装置として、被切断物である薄膜に
送りを与えて薄膜を切断したのち、切断された薄膜を所
定の容器に積み重ねて取り出すという作業を精度よく清
浄な状態で自動的に連続して行なうものはなく、ポンチ
とダイスで構成される簡単な切断治具を利用して作業者
が一つ一つ切断するごとにピンセットを使って切断治具
から取り出したのち所要枚数に達するまで容器に積み重
ねていくというのが一般的な方法であった。
Conventionally, this type of cutting equipment automatically and accurately performs the work of applying feed to the thin film to be cut, cutting the thin film, stacking the cut thin film in a designated container, and taking it out in a clean state. There is no continuous cutting, but a simple cutting jig consisting of a punch and die is used, and each time the worker cuts each piece, he uses tweezers to take it out of the cutting jig and reach the required number of pieces. The common method was to stack them in containers up to the maximum.

このような従来の方法は、全て作業者の手作業によるた
めに生産は非能率的で歩留りが悪く製品が高価なものと
なる。また切断時に発生する切粉を除去するために切断
部分に圧縮空気を吹きつける等の方法が取られていたが
、切粉が飛散して製品に付着し品質を低下させる因にな
っている。また切断時に薄膜が操んでいてもそのまま切
断作業が行なわれるために寸法精度のよい製品を得られ
ない等種種の欠点があった。本発明の目的は、上述の欠
点を除去し、薄膜を精度よく切断したのち積み重ねて取
り出すことができ、また作業者が簡単に取り扱える薄膜
切断装置を提供することにある。
In such conventional methods, the production is inefficient, the yield is low, and the products are expensive because they are all done manually by workers. In addition, methods such as blowing compressed air onto the cut portion have been used to remove chips generated during cutting, but the chips scatter and adhere to the product, causing a reduction in quality. Furthermore, even if the thin film is manipulated during cutting, the cutting operation continues as is, resulting in various drawbacks such as the inability to obtain products with good dimensional accuracy. SUMMARY OF THE INVENTION An object of the present invention is to provide a thin film cutting device which eliminates the above-mentioned drawbacks, allows thin films to be stacked and taken out after cutting with high precision, and which can be easily handled by an operator.

本発明によれば、脆性および可榛性を有する薄膜を切断
する装置において、一方の端面(以下、下端面と称する
)に複数個の真空吸着孔を有し、前記下端面と同一軸上
の他端面(以下、上端面と称する)に駆動源を接続した
断面形状一定のポンチと、前記ポンチの下端面から一定
寸法隔てた垂直下方に相対向して配置し前記ポンチとの
摺動面に吸気空間を有するダイスと、前記ポンチの外周
面を滑動自在で、かつその先端が前記ポンチの下端面よ
りわずかに突出しており、内面下部に吸塵空間を有する
前記薄膜のしわ押えと、前記ダイスの下方向に前記ポン
チと相対向して配置した取出容器と、前記ポンチとダイ
スの近傍に配置した薄膜送り部と、前記ポンチの真空吸
着孔と前記ダイスの吸気空間と前記しわ押えの吸塵空間
とに連結した真空源と、前記ダイスの吸気空間に連結し
た圧縮空気源と、前記ポンチおよび薄膜送り部の動作を
制御する機構制御部と、前記真空源と圧縮空気源と機構
制御部とに接続し全体の動作を制御する中央制御部とで
構成したことを特徴とする薄膜切断装置が得られる。
According to the present invention, an apparatus for cutting brittle and flexible thin films has a plurality of vacuum suction holes on one end surface (hereinafter referred to as the lower end surface), and has a plurality of vacuum suction holes on the same axis as the lower end surface. A punch with a constant cross-sectional shape and a driving source connected to the other end surface (hereinafter referred to as the upper end surface) is arranged facing vertically downward at a fixed distance from the lower end surface of the punch, and is arranged on a sliding surface with the punch. a die having an air suction space; a wrinkle holder for the thin film that is slidable on the outer circumferential surface of the punch and whose tip protrudes slightly from the lower end surface of the punch and has a dust suction space at the lower inner surface; a take-out container disposed facing the punch in a downward direction, a thin film feeding section disposed near the punch and the die, a vacuum suction hole of the punch, an air intake space of the die, and a dust suction space of the wrinkle presser. a vacuum source connected to the die, a compressed air source connected to the intake space of the die, a mechanism control unit that controls the operation of the punch and the thin film feeding unit, and a mechanism control unit connected to the vacuum source, the compressed air source, and the mechanism control unit. There is obtained a thin film cutting device characterized in that it is configured with a central control section that controls the entire operation.

次に本発明の一実施例について図面を参照して説明する
Next, an embodiment of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す概略図、第2図は薄膜
の切断状態をわかり易く説明するための詳細図で、同図
aは作業開始状態、同図bは切断直前の状態、同図cは
切断後の状態、同図dは積み重ね後の状態、同図eは薄
膜送り後の状態を示す断面図である。
FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a detailed diagram for explaining the cutting state of the thin film in an easy-to-understand manner. Figure c is a cross-sectional view showing the state after cutting, Figure d is a cross-sectional view showing the state after stacking, and Figure e is a cross-sectional view showing the state after thin film feeding.

図において、1川ま薄膜であり、11はポンチで下端面
12に複数個の真空吸着孔13を有するとともに、上下
運動をするために上端面14は駆動源15に接続してあ
る。
In the figure, the film is a thin film, and 11 is a punch having a plurality of vacuum suction holes 13 on the lower end surface 12, and the upper end surface 14 is connected to a driving source 15 for vertical movement.

17はダイスで薄膜10を切断するためにポンチ11の
下方向に一定間隔Lで相対向して配置し、ポンチ11と
の摺動面18に、切断時に発生する薄膜10の切粉19
を真空除去するとともに薄膜送り時等に薄膜101こ浮
揚力を与える圧縮空気20を噴出するために吸気空間2
1を有する。
In order to cut the thin film 10 with a die, 17 is arranged below the punch 11 facing each other at a constant interval L, and on the sliding surface 18 with the punch 11, chips 19 of the thin film 10 generated during cutting are placed.
The intake space 2 is used to blow out compressed air 20 that vacuum removes the thin film 101 and gives a buoyancy force to the thin film 101 when feeding the thin film.
1.

23はしわ押えでポンチ11に垂下した状態でポンチ1
1の下端面12よりわずかに突出してポンチ11の外周
面24を包囲するように配置し、内面下部25に切断時
に発生する薄膜10の切粉19を真空除去するための吸
塵空間26を有する。
23 is a wrinkle presser that hangs down on punch 11, and then presses punch 1.
The punch 11 is arranged so as to slightly protrude from the lower end surface 12 of the punch 11 and surround the outer circumferential surface 24 of the punch 11, and has a dust suction space 26 in a lower inner surface 25 for vacuum removing chips 19 of the thin film 10 generated during cutting.

28は取出容器で切断された薄膜30を積み重ねるため
にダイス17の下方向にポンチ11と相対向して配置し
てある。
28 is disposed below the die 17 and facing the punch 11 in order to stack the thin films 30 cut in the take-out container.

32は薄膜送り部で薄膜10に送りを与えるために薄膜
10の両端部33を挟んで対をなしたドライブローラ3
4とピンチローラ35と、ドライブローラ34に接続し
た回転駆動源36とで構成してある。
Reference numeral 32 denotes a thin film feeding section, and drive rollers 3 are paired across both ends 33 of the thin film 10 to feed the thin film 10.
4, a pinch roller 35, and a rotational drive source 36 connected to the drive roller 34.

38は真空源でポンチ11の真空吸着孔13とダイス1
7吸気空間21としわ押え23の吸塵空間26とに連結
してある。
38 is a vacuum source that connects the vacuum suction hole 13 of the punch 11 and the die 1.
7. The suction space 21 is connected to the dust suction space 26 of the wrinkle presser 23.

39は圧縮空気源でダイスi7の吸気空間21に連結し
てある。
39 is a compressed air source connected to the intake space 21 of the die i7.

40は機構制御部で駆動源15と回転駆動源36とに接
続してある。
A mechanism control section 40 is connected to the drive source 15 and the rotary drive source 36.

41は中央制御部で全体の動作を制御するために真空源
38と圧縮空気源39と機構制御部40とにそれぞれ接
続してある。
A central control section 41 is connected to a vacuum source 38, a compressed air source 39, and a mechanism control section 40, respectively, in order to control the overall operation.

次に以上のように構成した本発明実施例の動作について
説明する。
Next, the operation of the embodiment of the present invention configured as above will be explained.

第1図および第2図aに示すごとく、中央制御部41の
指令により圧縮空気源39が作動しダイス17の吸気空
間21から圧縮空気20を噴出させることにより薄膜1
01こ浮揚力を与えて薄膜10の自重による榛みを除去
した状態で、薄膜10をポンチ11とダイス17の間に
位置決めすると、中央制御部41の指令に基ずき、機構
制御部40を介して駆動源15が作動しポンチ11が下
降を開始する。この時、ポンチ11に垂下したしわ押え
23はポンチ11と同体となって下降するので第2図b
に示すごとくしわ押え23はポンチ11の下端面12に
先行して薄膜10上に綾触し薄膜10の擬みを除去する
とともにこの状態を維持する。しわ押え23はここで停
止するがポンチ11はさらに下降を継続し第2図cに示
すごとく薄膜10を切断する。ポンチ11が薄膜10を
切断し始めると同時に中央制御部41の指令により、圧
縮空気源39の作動が停止し代わって真空源38が作動
する。真空源38が作動すると、ポンチ11の真空吸着
孔13が切断された薄膜30を真空吸着するとともに、
吸気空間21と吸塵空間26から薄膜10を切断した際
に発生した切粉19を真空吸引しながら除去する。ポン
チ11の下端面12に真空吸着された薄膜30‘ま第2
図dに示すごと〈取出容器28へ移送されると同時に真
空源38の作動が停止することによりポンチ1 1の下
端面12から分離し取出容器28に収納される。切断さ
れた薄膜30が取出容器28に収納されると、機構制御
部40の指令にて駆動源15が作動し第2図eに示すご
とくポンチ11およびポンチ11に垂下しているしわ押
え23は再び上昇する。ポンチ11およびしわ押え23
が上昇を完了すると、圧縮空気源39が作動し吸気空間
21から圧縮空気20を噴出すると同時に機構制御部4
0の指令により回転駆動源36が作動してドライブロー
ラ34とピンチローラ35とで薄膜101こ所定寸法の
送りが与えられて第1回目の切断作業が終了する。つづ
いて第2回目以降の切断作業が第1回目の切断作業と同
様に繰り返される。このようにして切断作業を継続する
が取出容器28に積み重ねるべき切断された薄膜30の
必要枚数は予めわかっているのでその値を中央制御部4
1に設定しておくことにより積み重ねた値と中央制御部
41に設定した値が合致した時点で装置は自動的に停止
し切断作業は終了する。以上説明したように、本発明に
よれば、薄膜を切断した際に発生する切粉をポンチ側と
ダイス側の双方から真空方式にて除去するとともに、薄
膜の送りは薄膜の必要部分に無接触であるために切粉が
積み重ねられた薄膜の間に混入するということなどが皆
無であり、清浄で高品質な製品が得られる。
As shown in FIGS. 1 and 2a, the compressed air source 39 is activated by a command from the central control unit 41, and the compressed air 20 is spouted from the intake space 21 of the die 17, thereby causing the thin film 1 to 1.
01 When the thin film 10 is positioned between the punch 11 and the die 17 with the buoyancy applied to it and the sagging due to its own weight removed, the mechanism control section 40 is activated based on a command from the central control section 41. Through this, the drive source 15 is activated and the punch 11 begins to descend. At this time, the wrinkle presser 23 hanging from the punch 11 descends together with the punch 11, as shown in Fig. 2b.
As shown in the figure, the wrinkle presser 23 touches the thin film 10 in advance of the lower end surface 12 of the punch 11 to remove the wrinkles on the thin film 10 and maintain this state. The wrinkle presser 23 stops at this point, but the punch 11 continues to descend further and cuts the thin film 10 as shown in FIG. 2c. At the same time as the punch 11 begins to cut the thin film 10, the compressed air source 39 stops operating and the vacuum source 38 starts operating in response to a command from the central control unit 41. When the vacuum source 38 is activated, the vacuum suction hole 13 of the punch 11 vacuum suctions the cut thin film 30, and
Chips 19 generated when cutting the thin film 10 are removed from the air suction space 21 and the dust suction space 26 by vacuum suction. The thin film 30' vacuum-adsorbed on the lower end surface 12 of the punch 11 or the second
As shown in FIG. d, the operation of the vacuum source 38 is stopped at the same time as the punch 11 is transferred to the take-out container 28, so that the punch 11 is separated from the lower end surface 12 of the punch 11 and stored in the take-out container 28. When the cut thin film 30 is stored in the take-out container 28, the drive source 15 is activated by a command from the mechanism control unit 40, and the punch 11 and the wrinkle presser 23 hanging from the punch 11 are moved as shown in FIG. 2e. rise again. Punch 11 and wrinkle presser 23
When it completes its rise, the compressed air source 39 operates and blows out the compressed air 20 from the intake space 21. At the same time, the mechanism control unit 4
In response to the command 0, the rotational drive source 36 is activated, and the drive roller 34 and pinch roller 35 feed the thin film 101 by a predetermined distance, thereby completing the first cutting operation. Subsequently, the second and subsequent cutting operations are repeated in the same manner as the first cutting operation. In this way, the cutting operation continues, but since the required number of cut thin films 30 to be stacked in the take-out container 28 is known in advance, this value is transferred to the central control unit 4.
By setting this value to 1, when the accumulated value matches the value set in the central control unit 41, the device automatically stops and the cutting operation ends. As explained above, according to the present invention, chips generated when cutting a thin film are removed by a vacuum method from both the punch side and the die side, and the thin film is fed without contacting the necessary parts of the thin film. Because of this, there is no chance of chips getting mixed in between the stacked thin films, resulting in a clean, high-quality product.

また薄膜を切断する際には、圧縮空気の噴出、しわ押え
にて薄膜の操みが無い状態で切断するとともに、切断さ
れた薄膜を真空吸着にて移送するために位置ずれを生ず
ることなく寸法精度のよい均一な品質の製品を得ること
ができる。さらに、薄膜を送る際には下方向から圧縮空
気を噴出することにより薄膜の切断面がダイスの角に引
っ掛かることなく良好な送り作業ができ、連続的に切断
作業が行なわれるために生産は非常に能率的であり、歩
蟹りがよく製品のコストを下げることができる。したが
って本発明装置は操作が簡単であり、かつ精度のよい高
品質な製品を能率的にしかも安価に生産することができ
るので、その効果は顕著である。
In addition, when cutting the thin film, the thin film is cut with a jet of compressed air and a wrinkle press without any manipulation of the thin film, and the cut thin film is transferred by vacuum suction, so that it can be sized without any misalignment. It is possible to obtain products with high precision and uniform quality. Furthermore, when feeding the thin film, compressed air is ejected from below, which allows for good feeding without the cut surface of the thin film getting caught in the corners of the die, and because cutting is done continuously, production is extremely efficient. It is efficient and can easily reduce the cost of the product. Therefore, the apparatus of the present invention is easy to operate and can produce high-quality products with high precision efficiently and at low cost, so its effects are significant.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す概略図、第2図は薄膜
の切断状態をわかり易く説明するための詳細図で、同図
aは作業開始状態、同図bは切断直前の状態、同図cは
切断後の状態、同図dは積み重ね後の状態、同図eは薄
膜送り後の状態を示す断面図である。 図において、101ま薄膜、11はポンチ、12は下端
面、13は真空吸着孔、14は上端面、15は駆動源、
17はダイス、18は摺動面、21は吸気空間、23は
しわ押え、24は外周面、25は内面下部、26は吸塵
空間、28は取出容器、32は薄膜送り部、38は真空
源、39は圧縮空気源、4川ま機構制御部、41は中央
制御部である。 第1図 第2図
FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a detailed diagram for explaining the cutting state of the thin film in an easy-to-understand manner. Figure c is a cross-sectional view showing the state after cutting, Figure d is a cross-sectional view showing the state after stacking, and Figure e is a cross-sectional view showing the state after thin film feeding. In the figure, 101 is a thin film, 11 is a punch, 12 is a lower end surface, 13 is a vacuum suction hole, 14 is an upper end surface, 15 is a driving source,
17 is a die, 18 is a sliding surface, 21 is an intake space, 23 is a wrinkle presser, 24 is an outer peripheral surface, 25 is an inner lower part, 26 is a dust suction space, 28 is a take-out container, 32 is a thin film feeder, and 38 is a vacuum source , 39 is a compressed air source, 4 river mechanism control section, and 41 is a central control section. Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 1 脆性および可撓性を有する薄膜を切断する装置にお
いて、一方の端面(以下、下端面と称する)に複数個の
真空吸着孔を有し、前記下端面と同一軸上の他端面(以
下、上端面と称する)に駆動源を接続した断面形状一定
のポンチと、前記ポンチの下端面から一定寸法隔てた垂
直下方に相対向して配置し前記ポンチとの摺動面に吸気
空間を有するダイスと、前記ポンチの外周面を滑動自在
で、かつその先端が前記ポンチの下端面よりわずかに突
出しており、内面下部に吸塵空間を有する前記薄膜のし
わ押えと、前記ダイスの下方向に前記ポンチと相対向し
て配置した取出容器と、前記ポンチとダイスの近傍に配
置した薄膜送り部と、前記ポンチの真空吸着孔と前記ダ
イスの吸気空間と前記しわ押えの吸塵空間とに連結した
真空源と、前記ダイスの吸気空間に連結した圧縮空気源
と、前記ポンチおよび薄膜送り部の動作を制御する機構
制御部と、前記真空源と圧縮空気源と機構制御部とに接
続し全体の動作を制御する中央制御部とで構成したこと
を特徴とする薄膜切断装置。
1. An apparatus for cutting brittle and flexible thin films, which has a plurality of vacuum suction holes on one end surface (hereinafter referred to as the lower end surface), and has a plurality of vacuum suction holes on the other end surface coaxial with the lower end surface (hereinafter referred to as the lower end surface). A punch with a constant cross-sectional shape and a drive source connected to the upper end surface (referred to as the upper end surface), and a die that is arranged facing each other vertically downward at a fixed distance from the lower end surface of the punch and has an air intake space on the sliding surface with the punch. the thin film wrinkle holder, which is slidable on the outer circumferential surface of the punch, has a tip thereof slightly protruding from the lower end surface of the punch, and has a dust-collecting space in the lower inner surface; a take-out container disposed opposite to the punch, a thin film feeding section disposed near the punch and the die, and a vacuum source connected to the vacuum suction hole of the punch, the suction space of the die, and the dust suction space of the wrinkle holder. a compressed air source connected to the intake space of the die; a mechanism control section for controlling the operations of the punch and the thin film feeding section; and a mechanism control section connected to the vacuum source, the compressed air source, and the mechanism control section for controlling the overall operation. A thin film cutting device characterized by comprising a central control section for controlling the thin film.
JP12075977A 1977-10-06 1977-10-06 Thin film cutting device Expired JPS6014680B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12075977A JPS6014680B2 (en) 1977-10-06 1977-10-06 Thin film cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12075977A JPS6014680B2 (en) 1977-10-06 1977-10-06 Thin film cutting device

Publications (2)

Publication Number Publication Date
JPS5454385A JPS5454385A (en) 1979-04-28
JPS6014680B2 true JPS6014680B2 (en) 1985-04-15

Family

ID=14794280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12075977A Expired JPS6014680B2 (en) 1977-10-06 1977-10-06 Thin film cutting device

Country Status (1)

Country Link
JP (1) JPS6014680B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188982U (en) * 1986-05-19 1987-12-01

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112599U (en) * 1983-01-18 1984-07-30 日立コンデンサ株式会社 Printed circuit board scrap removal device
JPS6244400A (en) * 1985-08-20 1987-02-26 富士通株式会社 Sheet cutter
JPH0670941B2 (en) * 1988-12-15 1994-09-07 株式会社村田製作所 Manufacturing method of multilayer capacitor
JPH0737019B2 (en) * 1991-03-08 1995-04-26 日本碍子株式会社 Inner surface cutting method for cylindrical ceramic body
EP2263839A1 (en) * 2009-06-18 2010-12-22 Amcor Tobacco Packaging Switzerland LLC Flatbed die-cutting press for cutting shapes in sheets of board material
CN105252559A (en) * 2015-09-10 2016-01-20 浙江天润包装印刷有限公司 Cutting mechanism for antioxidation decoration pinch plate film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188982U (en) * 1986-05-19 1987-12-01

Also Published As

Publication number Publication date
JPS5454385A (en) 1979-04-28

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