JPS6014775B2 - Surface treatment method for molded products - Google Patents
Surface treatment method for molded productsInfo
- Publication number
- JPS6014775B2 JPS6014775B2 JP11043379A JP11043379A JPS6014775B2 JP S6014775 B2 JPS6014775 B2 JP S6014775B2 JP 11043379 A JP11043379 A JP 11043379A JP 11043379 A JP11043379 A JP 11043379A JP S6014775 B2 JPS6014775 B2 JP S6014775B2
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- JP
- Japan
- Prior art keywords
- weight
- treated
- molded
- hexane
- tert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
- Physical Vapour Deposition (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
【発明の詳細な説明】
この発明はメッキ、塗装、印刷、真空蒸着などに好適な
成形品表面を与える成形品の表面処理方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for surface treatment of a molded article, which provides a surface of the molded article suitable for plating, painting, printing, vacuum deposition, and the like.
ポリプロピレは優れた機械的性質および耐薬品性を有し
ているため繊維、フィルムなどから大型射出成形用まで
広く使用されているが、反面、優れた耐薬品性を有して
いるためメッキ、塗装、印刷、真空蒸着などの用途には
使用することができなかつた。Polypropylene has excellent mechanical properties and chemical resistance, so it is widely used for textiles, films, and large-scale injection molding. It could not be used for applications such as printing, vacuum deposition, etc.
そのため、現在はポリプロピレンの成形品の表面故買を
目的として、コロナ放電処理、フレーム処理、電子線処
理、鞍処理などが行なわれている。Therefore, corona discharge treatment, flame treatment, electron beam treatment, saddle treatment, etc. are currently being performed for the purpose of surface damage of polypropylene molded products.
しかし、これらの処理方法は成形品の形状に制限があっ
たり、処理設備が複雑になりすぎたり、後処理が大がか
り1こなりすぎるなどの欠点を有している。However, these processing methods have drawbacks such as limitations on the shape of the molded product, overly complex processing equipment, and extensive post-processing.
これらの欠点を改良するために、プロピレンとエチレン
のような他のモノマーとを共重合させる試みもなされて
いるが、この方法はポリプロピレン本来の前記物性が損
なわれるという欠点を有している。In order to improve these drawbacks, attempts have been made to copolymerize propylene with other monomers such as ethylene, but this method has the drawback that the above-mentioned physical properties inherent to polypropylene are impaired.
この出願の発明者らは、前記の欠点を有しないポリプロ
ピレンから得られる成形品の表面処理方法について研究
した結果、この発明を完成した。The inventors of this application completed this invention as a result of research into a method for surface treatment of molded articles obtained from polypropylene that does not have the above-mentioned drawbacks.
この発明は結晶性ポリプロピレンに、熱安定剤と結晶性
ポリプロピレン10の重量部当り0.02〜5重量部の
安息香酸マグネシウムとを配合した組成物を成形して得
られる成形品の表面を、低沸点脂肪族炭化水素溶剤で処
理することを特徴とする成形品の表面処理方法に関する
ものである。この発明において使用される結晶性ポリプ
ロピレンとしては、プロピレンの結晶性単独重合体や、
プロピレンと共重合体中の含有量が約15重量%以下の
他のQ−オレフィン、たとえばエチレン、ブテン−1と
のブロック共重合体や、プロピレンと共重合体中の含有
量が約5重量%以下の他のはーオレフイン、たとえばエ
チレン、ブテン−1とのランダム共重合体やそれらの混
合物、さらにはそれらにエチレンープロピレン共重合体
ラバーを約5重量%まで混合したものなどが挙げられる
。This invention improves the surface of a molded article obtained by molding a composition in which crystalline polypropylene is blended with a heat stabilizer and 0.02 to 5 parts by weight of magnesium benzoate per 10 parts by weight of crystalline polypropylene. The present invention relates to a method for surface treatment of molded articles, characterized by treatment with a boiling point aliphatic hydrocarbon solvent. The crystalline polypropylene used in this invention includes a crystalline homopolymer of propylene,
Block copolymers with propylene and other Q-olefins, such as ethylene and butene-1, whose content in the copolymer is about 15% by weight or less, or propylene and the content in the copolymer with about 5% by weight. Examples of the following other olefins include random copolymers with ethylene and butene-1, mixtures thereof, and mixtures thereof with up to about 5% by weight of ethylene-propylene copolymer rubber.
これらのうちでも、プロピレンの結晶性単独重合体、エ
チレン含量が15重量%以下のエチレンープロピレンブ
ロツク共重合体およびエチレン舎量が4.5重量%以下
のエチレンープロピレソランダム共重合体でメルトフロ
ーインデツクス(MIと略記する。)が1.0以上のも
のが好ましい。この発明において使用される熱安定剤と
しては、2,6ージ第三ブチル−P−クレゾール、2,
6−ジ第三ブチルフェノール、4,4′−メチレンビス
(2,6−ジ第三ブチルフヱノール),4,4′−メチ
レンビス(3−メチル−6−第三ブチルフェノール),
4,4′ービス(2,6−ジ第三ブチルフヱノール),
4,4′ーチオビス(2ーメチル−6一第三ブチルフェ
ノール),4,4′−チオピス(3−メチル−6−第三
ブチルフェノール),6−(4−ヒドロキシ−3,5−
ジ第三ブチルアニリン)−2,4−ビス(n−オクチル
チオ)一1,3,5−トリアジン,テトラキスー〔メチ
レン3一(3,5ージ第三ブチル−4−ヒドロキシフエ
ニル)プロピオネート〕メタン、オクタデシル−3−(
3,5ージ第三ブチル−4ーヒドロキシフエニル)プロ
ピオネート、1,1.3,一トリス(2−メチル一4ー
ヒドロキシー5一第三ブチルフェニル)ブタン、2,2
′ーメチレンビス(4−メチル−6−第3ブチルフェノ
ール)、4,4−ブチリデンピス(3−メチル‐6−第
三ブチルフェノール)、1,3,5−トリメチルー2,
4,6ートリス(3,5−ジ第三ブチル−4−ヒドロキ
シベンジル)ベンゼンなどのフェノール糸の抗酸化剤が
挙げられる。さらに、これらのフェノール系の抗酸化剤
とともに、ジドデシル−3,3′−チオジプロピオン酸
ェステル、ジオクタデシル−3,3′ーチオジプロピオ
ン酸ェステル、ジステアリルー3,3′ーチオジフ。ロ
ピオン酸ェステルなどのジアルキルー3,3′−チオジ
プロピオン酸ェステル、トリラウリルホスフアィト、ト
リラウリルチオホスフアイト、トリス(ノニルフェニル
)ホスフアィトなどの有機リン化合物、カルシウムステ
アレートなどの脂肪族カルポン酸の金属塩などの抗酸化
剤を併用してもよい。熱安定剤の量は成形時などに結晶
性ポリプロピレンの熱劣化を防止できる量であればよく
、通常は結晶性ポリプロピレンl0G重量部当り0.0
5〜0.5重量部である。この発明においては、結晶性
ポリプロピレン10の重量部当り0.02〜5重量部、
好ましくは0.05〜1.5重量部の安息香酸マグネシ
ウムを配合されている組成物を使用する。Among these, a crystalline propylene homopolymer, an ethylene-propylene block copolymer with an ethylene content of 15% by weight or less, and an ethylene-propylene sorandom copolymer with an ethylene content of 4.5% by weight or less are used. It is preferable that the flow index (abbreviated as MI) is 1.0 or more. Thermal stabilizers used in this invention include 2,6-di-tert-butyl-P-cresol, 2,
6-di-tert-butylphenol, 4,4'-methylenebis(2,6-di-tert-butylphenol), 4,4'-methylenebis(3-methyl-6-tert-butylphenol),
4,4'-bis(2,6-di-tert-butylphenol),
4,4'-thiobis(2-methyl-6-tert-butylphenol), 4,4'-thiopis(3-methyl-6-tert-butylphenol), 6-(4-hydroxy-3,5-
di-tert-butylaniline)-2,4-bis(n-octylthio)-1,3,5-triazine,tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane , octadecyl-3-(
3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 1,1.3,1-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 2,2
'-methylenebis(4-methyl-6-tert-butylphenol), 4,4-butylidenepis(3-methyl-6-tert-butylphenol), 1,3,5-trimethyl-2,
Examples include phenolic thread antioxidants such as 4,6 tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene. Furthermore, along with these phenolic antioxidants, didodecyl-3,3'-thiodipropionic acid ester, dioctadecyl-3,3'-thiodipropionic acid ester, and distearyl-3,3'-thiodiph. Dialkyl-3,3'-thiodipropionate esters such as lopionate esters, organic phosphorus compounds such as trilauryl phosphite, trilauryl thiophosphite, tris(nonylphenyl) phosphite, aliphatic carboxylic acids such as calcium stearate Antioxidants such as metal salts may be used in combination. The amount of heat stabilizer may be any amount that can prevent thermal deterioration of crystalline polypropylene during molding, etc., and is usually 0.0 parts by weight of crystalline polypropylene.
The amount is 5 to 0.5 parts by weight. In this invention, 0.02 to 5 parts by weight per 10 parts by weight of crystalline polypropylene,
Preferably, a composition containing 0.05 to 1.5 parts by weight of magnesium benzoate is used.
安息香酸マグネシウムの量が前記下限より少なし、と、
この成形品の表面を低沸点脂肪族炭化水素溶剤で処理し
てもメッキ、塗装などに好適な成形品表面を得ることが
できず、安息香酸マグネシウムの量が前記上限より多い
と、成形品の引張強度、伸びなどの物性が低下するので
好ましくない。the amount of magnesium benzoate is less than the lower limit;
Even if the surface of the molded product is treated with a low-boiling aliphatic hydrocarbon solvent, it will not be possible to obtain a molded product surface suitable for plating, painting, etc., and if the amount of magnesium benzoate is greater than the above upper limit, the molded product will deteriorate. This is not preferred because physical properties such as tensile strength and elongation deteriorate.
結晶性ポリプロピレンに前記熱安定剤および安息香酸マ
グネシウムをそれ自体公知の配合方法により配合した組
成物をそれ自体公知の成形方法、例えば射出成形、押出
成形、ブロー成形、真空成形により種々の形状の成形品
に成形する。A composition obtained by blending the heat stabilizer and magnesium benzoate with crystalline polypropylene by a blending method known per se is molded into various shapes by a molding method known per se, such as injection molding, extrusion molding, blow molding, and vacuum forming. Form into a product.
この発明においては、前記のようにして得られる成形品
の表面を、低簸点脂肪族炭化水素溶剤で処理する。In the present invention, the surface of the molded article obtained as described above is treated with a low aliphatic hydrocarbon solvent.
この発明において使用される低沸点脂肪族炭化水素溶剤
としては、ベンタン、ヘキサン、ィソヘキサン、ヘプタ
ン、イソヘブタン、イソオクタンなどの沸点が35〜1
0ぴ0の脂肪族炭化水素が挙げらる。Examples of the low-boiling aliphatic hydrocarbon solvent used in this invention include bentane, hexane, isohexane, heptane, isohebtan, and isooctane, which have a boiling point of 35 to 1.
Examples include 0pi0 aliphatic hydrocarbons.
これらの脂肪族炭化水素のうちで、ベンタン、ヘキサン
、ィソヘキサンが好適に使用される。低沸点脂肪族炭化
水素溶剤による成形品表面の処理は、好ましくは低沸点
脂肪族炭化水素溶剤の沸点以下、特に約30〜100℃
の温度で1秒〜10分間、低沸点脂肪族炭化水素溶剤中
に成形品を浸債するなどして、低沸点脂肪族炭化水素溶
剤を成形品に接触させることによって行なうことができ
る。Among these aliphatic hydrocarbons, bentane, hexane, and isohexane are preferably used. The treatment of the surface of the molded article with a low-boiling aliphatic hydrocarbon solvent is preferably performed at a temperature below the boiling point of the low-boiling aliphatic hydrocarbon solvent, particularly at about 30 to 100°C.
This can be carried out by bringing the molded article into contact with the low-boiling aliphatic hydrocarbon solvent, such as by immersing the molded article in the low-boiling aliphatic hydrocarbon solvent for 1 second to 10 minutes at a temperature of .
この発明において低沸点脂肪族炭化水素溶剤を用いるこ
とにより、成形品の表面処理後に成形品表面に残留する
溶剤を短時間で除くことができる。By using a low boiling point aliphatic hydrocarbon solvent in the present invention, the solvent remaining on the surface of the molded article after the surface treatment of the molded article can be removed in a short time.
この発明の方法によれば、任意の形状の成形品、特に複
雑な形状をもつ射出成形品から簡単な操作でメッキ、塗
装、印刷、真空蒸着などに好適な成形品表面を有する成
形品を得ることができる。According to the method of the present invention, a molded product having a surface suitable for plating, painting, printing, vacuum deposition, etc. can be obtained from a molded product of any shape, especially an injection molded product with a complicated shape, by a simple operation. be able to.
次に実施例および比較例を示す。Next, examples and comparative examples will be shown.
実施例 1
無添加のポリプロピレン(M,1,1)100重量部に
ジステアリルー3,3′−チオジプロピオン酸ェステル
0.1重量部、テトラキス−〔メチレン3−(3,5−
ジ第三ブチルー4ーヒドロキシフェニル)プロピオネー
ト〕メタン0.05重量部、力ルシゥムステアレート0
.05重量部および安息香酸マグネシウム0.1重量部
をドライブレンドし、押出機を用いて樹脂温度230℃
で3側め×5側のべレツトをつくった。Example 1 100 parts by weight of additive-free polypropylene (M,1,1), 0.1 part by weight of distearyl-3,3'-thiodipropionic acid ester, tetrakis-[methylene 3-(3,5-
Ditert-butyl-4-hydroxyphenyl)propionate] 0.05 parts by weight of methane, 0.05 parts by weight of lucium stearate
.. 0.5 parts by weight of magnesium benzoate and 0.1 parts by weight of magnesium benzoate were dry blended, and the resin temperature was adjusted to 230°C using an extruder.
I made a beret with 3 sides x 5 sides.
このべレツトから、射出成形機を用いて通常の成形条件
で2.16柵厚、10仇舷0の円板を成形した。この円
板をnーヘキサンの沸騰液に5分間浸潰して処理した後
、室温で2時間乾燥した。From this beret, a disc having a thickness of 2.16 mm and a diameter of 10 mm was molded using an injection molding machine under normal molding conditions. The disks were treated by immersing them in boiling n-hexane for 5 minutes and then dried at room temperature for 2 hours.
このn−へキサンで処理した円板に次の方法でメッキを
行なった。The disc treated with n-hexane was plated in the following manner.
メッキ工程
(前処理工程)
m 化学エッチング処理
液組成:硫酸6破き量%
リン酸1咳容量%
水3庇容量%
重クロム酸カリ15夕/そ
処理条件;65±5℃で1粉ご浸債
■センシタイジング処理
液組成;塩化第1錫10夕/そ
塩酸 15cc/そ
処理条件:室温で5分
{3} アクチイベーテイング処理
液相成;塩化パラジウム0.2夕/ク
塩酸 10cc/そ
■ 化学ニッケル処理
塩化ニッケル水溶液、室温で20分
(電気メッキ工程)
‘5} ストライクニッケルメッキ
50土5℃で2分
{61 光沢硫酸銅〆ツキ
室温で1ぴ分
【7} クロムメッキ
55℃で2分
得られたクロムメッキを行なった試験片について、手で
折り曲げた後のメッキ膜の状態を観察した結果を第1表
に示す。Plating process (pre-treatment process) Chemical etching solution composition: Sulfuric acid 6% by volume, 1% by volume from phosphoric acid, 3% by volume by water, Potassium dichromate 15% by volume, Processing conditions: 1 powder at 65±5℃ Sensitizing treatment liquid composition: 10 cc of stannous chloride/15 cc of hydrochloric acid/15 cc of hydrochloric acid Processing conditions: 5 minutes at room temperature {3} Activating liquid phase composition: 0.2 cc of palladium chloride/10 cc of hydrochloric acid Chemical nickel treatment Nickel chloride aqueous solution, 20 minutes at room temperature (electroplating process) '5} Strike nickel plating 50 Soil, 2 minutes at 5℃ {61 Bright copper sulfate, 1 minute at room temperature [7} Chrome plating 55 Table 1 shows the results of observing the condition of the plating film after hand bending the chromium-plated test piece obtained at ℃ for 2 minutes.
また、前記のメッキ工程■の光択硫酸鋼メッキ工程によ
る光択硫酸鋼をメッキ膜厚が約30叫こなるまで光択硫
酸鋼メッキを行なった試験片について、引剥し幅25(
5.4帆)引剥し速度25脚/分でメッキ膜の引剥し強
度(密着強度)を測定した結果を第1表に示す。実施例
2
円板をnーヘプタン沸騰液に5秒間浸潰して処理した他
は実施例1と同様に実施した。In addition, for the test piece obtained by plating the photo-sulfuric acid steel in the photo-selective sulfuric acid steel plating process of the plating process (①) until the plating film thickness reached approximately 30 mm, the peeling width was 25 (
5.4) Table 1 shows the results of measuring the peeling strength (adhesion strength) of the plating film at a peeling rate of 25 legs/min. Example 2 The same procedure as in Example 1 was carried out except that the disk was treated by immersing it in boiling n-heptane for 5 seconds.
クロムメッキを行なった試験片について、手で折り曲げ
た後のメッキ膜の状態を観察した結果および光択硫酸鋼
メッキを行なった試験片について、メッキ膜の引剥し強
度を測定した結果を第1表に示す。Table 1 shows the results of observing the state of the plating film after bending the chrome-plated test piece by hand, and the results of measuring the peel strength of the plating film of the photo-selective sulfuric acid steel plated test piece. Shown below.
比較例 1
無添加のポリプロピレンに安息香酸マグネシウムをブレ
ンドしなかった他は実施例1と同様に実施した。Comparative Example 1 The same procedure as in Example 1 was carried out except that magnesium benzoate was not blended with additive-free polypropylene.
結果を第1表に示す。比較例 2
円板をnーヘブタンで処理しなかった他は実施例1と同
様に実施した。The results are shown in Table 1. Comparative Example 2 The same procedure as in Example 1 was carried out except that the disks were not treated with n-hebutane.
結果を第1表に示す。第1表実施例 3
MIIの無添加ポリプロピレンに代えて、MI9の無添
加ポリプロピレンを用いた他は実施例1と同様にして2
.16肋厚,10仇仰ぐの円板を成形した。The results are shown in Table 1. Table 1 Example 3 Example 2 was carried out in the same manner as in Example 1 except that MI9 additive-free polypropylene was used instead of MII additive-free polypropylene.
.. A disk with a thickness of 16 ribs and a height of 10 ribs was molded.
この円板表面を実施例1と同様にしてnーヘキサンで処
理した。このn−へキサンで処理した円板を次の方法で
塗装した。The surface of this disk was treated with n-hexane in the same manner as in Example 1. This n-hexane treated disc was painted in the following manner.
塗装1
n−へキサンで処理した円板表面にオレフィン系1コー
トタイプ塗料(オリジン電気■製)を吹付け、10分間
セッテイング後、60℃で30分間強制乾燥させて膜厚
約10仏の塗腰を形成した。Painting 1 Spray an olefin-based one-coat type paint (manufactured by Origin Denki) on the disc surface treated with n-hexane, set it for 10 minutes, and then force dry it at 60°C for 30 minutes to form a coating with a film thickness of approximately 10 mm. Formed the waist.
得られた塗装円板に、カッターによる十印描画とマルチ
クロスカッターによるピッチ中1側,100目の碁盤目
を刻み、セロテープ(ニチバン製商品名各ェルパックN
o.24)を密着させ、460で急激に剥離して剥離試
験を行ない、塗膜と円板との密着性を調べた。密着性は
、剥離せずに残った碁盤の目の数で示す。剥離試験を2
回行なった平均値を第2表に示す。塗装2
n−へキサンで処理した円板表面にオレフィン系下塗塗
料Oil上塗料製)を吹付け、1び分間セツティング後
、ウレタン系上塗塗料Oil上塗料製)を吹付け、10
分間セッティング後、8び0で30分間強制乾燥させて
、下塗塗料膜厚約8r,上塗塗料膜厚約18〆塗膜を形
成した。On the obtained painted disk, draw a cross mark with a cutter, cut a 100th grid on the 1st side of the pitch with a multi-cross cutter, and apply cellophane tape (product name: Elpack N manufactured by Nichiban).
o. 24) was brought into close contact with the disc and then rapidly peeled off at 460°C to conduct a peel test to examine the adhesion between the coating film and the disc. Adhesion is indicated by the number of squares on the grid that remain without peeling. Peel test 2
Table 2 shows the average values of the tests. Painting 2 Spray an olefin base coat (manufactured by Oil Top Coating) on the disc surface treated with n-hexane, and after setting for 1 minute, spray a urethane-based top coat (manufactured by Oil Top Paint),
After setting for 30 minutes, it was forced to dry at 8 and 0 for 30 minutes to form an undercoat film with a thickness of about 8R and a top coat with a film thickness of about 18R.
得られた塗装円板について、前記と同様にして剥離試験
を行なった結果を第2表に示す。The obtained coated discs were subjected to a peel test in the same manner as described above, and the results are shown in Table 2.
比較例 3〜4
無添加のポリプロピレンに安息香酸マグネシウムをブレ
ンドしなかった(比較例3)か、円板をn−へキサンで
処理しなかった(比較例4)他は実施例3と同様に実施
した。Comparative Examples 3 to 4 Same as Example 3 except that magnesium benzoate was not blended with additive-free polypropylene (Comparative Example 3) or the disc was not treated with n-hexane (Comparative Example 4) carried out.
結果を第2表に示す。実施例 4
円板をn−へブタン沸騰液に5秒間浸潰して処理した他
は実施例3と同様に実施した。The results are shown in Table 2. Example 4 The same procedure as in Example 3 was carried out except that the disk was treated by immersing it in boiling n-hebutane for 5 seconds.
実施例3と同様にして得られた塗装円板について、前記
と同様にして剥離試験を行なった結果を第2表に示す。The coated disks obtained in the same manner as in Example 3 were subjected to a peel test in the same manner as described above, and the results are shown in Table 2.
比較例 5無添加のポリプロピレンに安息香酸マグネシ
ウムをブレンドしなかった他は実施例4と同様に実施し
た。Comparative Example 5 The same procedure as Example 4 was carried out except that magnesium benzoate was not blended with additive-free polypropylene.
結果を第2表に示す。実施例 5〜6
MIIの無添加ポリプロピレンに代えて、MI9,エチ
レン含量7重量%のエチレンープロピレンブロック共重
合体を用いた他は実施例1と同様にして2.16肋厚、
low帆0の円板を成形した。The results are shown in Table 2. Examples 5-6 The same procedure as in Example 1 was carried out, except that instead of the additive-free polypropylene of MII, an ethylene-propylene block copolymer with an MI of 9 and an ethylene content of 7% by weight was used, with a wall thickness of 2.16,
A disc with a low sail of 0 was molded.
この円板表面を、実施例1と同様にしてn−へキサンで
処理(実施例5)、または実施例2と同様にしてnーヘ
プタンで処理(実施例6)した。これらのnーヘキサン
で処理した円板またはnーヘプタンで処理した円板を実
施例3と同様にして塗装した。得られた塗装円板につい
て、前記と同様にして剥離試験を行なった結果を第2表
に示す。The surface of this disk was treated with n-hexane as in Example 1 (Example 5) or with n-heptane as in Example 2 (Example 6). These n-hexane-treated discs or n-heptane-treated discs were painted in the same manner as in Example 3. The obtained coated discs were subjected to a peel test in the same manner as described above, and the results are shown in Table 2.
比較例 6
無添加のエチレンープロピレンブロツク共重合体に安息
香酸マグネシウムをブレンドしなかった他は実施例5と
同様に実施した。Comparative Example 6 The same procedure as in Example 5 was carried out except that magnesium benzoate was not blended with the additive-free ethylene-propylene block copolymer.
結果を第2表に示す。実施例 7〜8
MIIの無添加ポリプロピレンに代えて、MI9,エチ
レン含量2.5重量%のエチレンープロピレンランダム
共重合体を用いた他は実施例1と同様にして2.16肋
厚、10仇舷◇の円板を成形した。The results are shown in Table 2. Examples 7 to 8 In the same manner as in Example 1, except that MI9, an ethylene-propylene random copolymer with an ethylene content of 2.5% by weight was used instead of the additive-free polypropylene of MII, a wall thickness of 2.16, and a thickness of 10 A disk for the portboard ◇ was molded.
この円板表面を、実施例1と同様にしてn−へキサンで
処理(実施例7)、または実施例2と同様にしてn−へ
ブタンで処理(実施例8)した。これらのnーヘキサン
で処理した円板またはnーヘブタンで処理した円板を実
施例3と同様にして塗装し、剥離試験を行なった。結果
を第2表に示す。比較例 7
無添加のエチレンープロピレンランダム共重合体に安息
香酸マグネシウムをブレンドしなかった他は実施例7と
同様に実施した。The surface of this disk was treated with n-hexane as in Example 1 (Example 7) or with n-hebutane as in Example 2 (Example 8). These discs treated with n-hexane or discs treated with n-hexane were painted in the same manner as in Example 3 and subjected to a peel test. The results are shown in Table 2. Comparative Example 7 The same procedure as Example 7 was carried out except that magnesium benzoate was not blended with the additive-free ethylene-propylene random copolymer.
結果を第2表に示す。第2表The results are shown in Table 2. Table 2
Claims (1)
ロピレン100重量部当り0.02〜5重量部の安息香
酸マグネシウムとを配合した組成物を成形して得られる
成形品の表面を、低沸点脂肪族炭化水素溶剤で処理する
ことを特徴とする成形品の表面処理方法。1. The surface of a molded product obtained by molding a composition in which crystalline polypropylene is blended with a heat stabilizer and 0.02 to 5 parts by weight of magnesium benzoate per 100 parts by weight of crystalline polypropylene is coated with a low-boiling aliphatic A method for surface treatment of molded products, characterized by treatment with a hydrocarbon solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11043379A JPS6014775B2 (en) | 1979-08-31 | 1979-08-31 | Surface treatment method for molded products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11043379A JPS6014775B2 (en) | 1979-08-31 | 1979-08-31 | Surface treatment method for molded products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5634731A JPS5634731A (en) | 1981-04-07 |
| JPS6014775B2 true JPS6014775B2 (en) | 1985-04-16 |
Family
ID=14535606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11043379A Expired JPS6014775B2 (en) | 1979-08-31 | 1979-08-31 | Surface treatment method for molded products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6014775B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194038A (en) * | 1986-02-17 | 1987-08-26 | Usui Internatl Ind Co Ltd | Temperature sensing, fluid type fan coupling device |
| US9045615B2 (en) * | 2011-08-24 | 2015-06-02 | Fina Technology, Inc. | Metal carboxylate additives for thermoplastics |
-
1979
- 1979-08-31 JP JP11043379A patent/JPS6014775B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5634731A (en) | 1981-04-07 |
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